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class="vector-toc-numb">2</span> <span>Origins</span> </div> </a> <ul id="toc-Origins-sublist" class="vector-toc-list"> </ul> </li> <li id="toc-Processes" class="vector-toc-list-item vector-toc-level-1 vector-toc-list-item-expanded"> <a class="vector-toc-link" href="#Processes"> <div class="vector-toc-text"> <span class="vector-toc-numb">3</span> <span>Processes</span> </div> </a> <button aria-controls="toc-Processes-sublist" class="cdx-button cdx-button--weight-quiet cdx-button--icon-only vector-toc-toggle"> <span class="vector-icon mw-ui-icon-wikimedia-expand"></span> <span>Toggle Processes subsection</span> </button> <ul id="toc-Processes-sublist" class="vector-toc-list"> <li id="toc-Substrates" class="vector-toc-list-item vector-toc-level-2"> <a class="vector-toc-link" href="#Substrates"> <div class="vector-toc-text"> <span class="vector-toc-numb">3.1</span> <span>Substrates</span> </div> </a> <ul id="toc-Substrates-sublist" class="vector-toc-list"> </ul> </li> <li id="toc-Deposition_or_growth" class="vector-toc-list-item vector-toc-level-2"> <a class="vector-toc-link" href="#Deposition_or_growth"> <div class="vector-toc-text"> <span class="vector-toc-numb">3.2</span> <span>Deposition or growth</span> </div> </a> <ul id="toc-Deposition_or_growth-sublist" class="vector-toc-list"> </ul> </li> <li id="toc-Patterning" class="vector-toc-list-item vector-toc-level-2"> <a class="vector-toc-link" href="#Patterning"> <div class="vector-toc-text"> <span class="vector-toc-numb">3.3</span> <span>Patterning</span> </div> </a> <ul id="toc-Patterning-sublist" class="vector-toc-list"> </ul> </li> <li id="toc-Etching" class="vector-toc-list-item vector-toc-level-2"> <a class="vector-toc-link" href="#Etching"> <div class="vector-toc-text"> <span class="vector-toc-numb">3.4</span> <span>Etching</span> </div> </a> <ul id="toc-Etching-sublist" class="vector-toc-list"> </ul> </li> <li id="toc-Microforming" class="vector-toc-list-item vector-toc-level-2"> <a class="vector-toc-link" href="#Microforming"> <div class="vector-toc-text"> <span class="vector-toc-numb">3.5</span> <span>Microforming</span> </div> </a> <ul id="toc-Microforming-sublist" class="vector-toc-list"> </ul> </li> <li id="toc-Other" class="vector-toc-list-item vector-toc-level-2"> <a class="vector-toc-link" href="#Other"> <div class="vector-toc-text"> <span class="vector-toc-numb">3.6</span> <span>Other</span> </div> </a> <ul id="toc-Other-sublist" class="vector-toc-list"> </ul> </li> </ul> </li> <li id="toc-Cleanliness_in_wafer_fabrication" class="vector-toc-list-item vector-toc-level-1 vector-toc-list-item-expanded"> <a class="vector-toc-link" href="#Cleanliness_in_wafer_fabrication"> <div class="vector-toc-text"> <span class="vector-toc-numb">4</span> <span>Cleanliness in wafer fabrication</span> </div> </a> <ul id="toc-Cleanliness_in_wafer_fabrication-sublist" class="vector-toc-list"> </ul> </li> <li id="toc-See_also" class="vector-toc-list-item vector-toc-level-1 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mw-list-item"><a href="https://fr.wikipedia.org/wiki/Microfabrication" title="Microfabrication – French" lang="fr" hreflang="fr" data-title="Microfabrication" data-language-autonym="Français" data-language-local-name="French" class="interlanguage-link-target"><span>Français</span></a></li><li class="interlanguage-link interwiki-ja mw-list-item"><a href="https://ja.wikipedia.org/wiki/%E5%BE%AE%E7%B4%B0%E5%8A%A0%E5%B7%A5%E6%8A%80%E8%A1%93" title="微細加工技術 – Japanese" lang="ja" hreflang="ja" data-title="微細加工技術" data-language-autonym="日本語" data-language-local-name="Japanese" class="interlanguage-link-target"><span>日本語</span></a></li><li class="interlanguage-link interwiki-pt mw-list-item"><a href="https://pt.wikipedia.org/wiki/Microfabrica%C3%A7%C3%A3o" title="Microfabricação – Portuguese" lang="pt" hreflang="pt" data-title="Microfabricação" data-language-autonym="Português" data-language-local-name="Portuguese" class="interlanguage-link-target"><span>Português</span></a></li><li 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class="mw-body-content"><div class="mw-content-ltr mw-parser-output" lang="en" dir="ltr"><div class="shortdescription nomobile noexcerpt noprint searchaux" style="display:none">Fabrication at micrometre scales and smaller</div> <figure class="mw-default-size mw-halign-right" typeof="mw:File/Thumb"><a href="/wiki/File:Siliconchip_by_shapeshifter.png" class="mw-file-description"><img src="//upload.wikimedia.org/wikipedia/commons/thumb/c/c6/Siliconchip_by_shapeshifter.png/220px-Siliconchip_by_shapeshifter.png" decoding="async" width="220" height="154" class="mw-file-element" srcset="//upload.wikimedia.org/wikipedia/commons/thumb/c/c6/Siliconchip_by_shapeshifter.png/330px-Siliconchip_by_shapeshifter.png 1.5x, //upload.wikimedia.org/wikipedia/commons/thumb/c/c6/Siliconchip_by_shapeshifter.png/440px-Siliconchip_by_shapeshifter.png 2x" data-file-width="1276" data-file-height="891" /></a><figcaption>Synthetic detail of a micromanufactured integrated circuit through four layers of planarized copper interconnect, down to the polysilicon (pink), wells (greyish) and substrate (green)</figcaption></figure> <p><b>Microfabrication</b> is the process of <a href="/wiki/Manufacturing" title="Manufacturing">fabricating</a> miniature structures of <a href="/wiki/Micrometre" title="Micrometre">micrometre</a> scales and smaller. Historically, the earliest microfabrication processes were used for <a href="/wiki/Integrated_circuit" title="Integrated circuit">integrated circuit</a> fabrication, also known as "<a href="/wiki/Semiconductor_manufacturing" class="mw-redirect" title="Semiconductor manufacturing">semiconductor manufacturing</a>" or "semiconductor device fabrication". In the last two decades, <a href="/wiki/Microelectromechanical_systems" class="mw-redirect" title="Microelectromechanical systems">microelectromechanical systems</a> (MEMS), microsystems (European usage), <a href="/wiki/Micromachinery" title="Micromachinery">micromachines</a> (Japanese terminology) and their subfields have re-used, adapted or extended microfabrication methods. These subfields include <a href="/wiki/Microfluidics" title="Microfluidics">microfluidics</a>/lab-on-a-chip, optical MEMS (also called MOEMS), RF MEMS, PowerMEMS, BioMEMS and their extension into nanoscale (for example NEMS, for nano electro mechanical systems). The production of <a href="/wiki/Flat-panel_displays" class="mw-redirect" title="Flat-panel displays">flat-panel displays</a> and solar cells also uses similar techniques. </p><p>Miniaturization of various devices presents challenges in many areas of science and engineering: <a href="/wiki/Physics" title="Physics">physics</a>, <a href="/wiki/Chemistry" title="Chemistry">chemistry</a>, <a href="/wiki/Materials_science" title="Materials science">materials science</a>, <a href="/wiki/Computer_science" title="Computer science">computer science</a>, ultra-precision engineering, fabrication processes, and equipment design. It is also giving rise to various kinds of interdisciplinary research.<sup id="cite_ref-npm_1-0" class="reference"><a href="#cite_note-npm-1"><span class="cite-bracket">[</span>1<span class="cite-bracket">]</span></a></sup> The major concepts and principles of microfabrication are <a href="/wiki/Microlithography" title="Microlithography">microlithography</a>, <a href="/wiki/Doping_(semiconductor)" title="Doping (semiconductor)">doping</a>, <a href="/wiki/Thin_films" class="mw-redirect" title="Thin films">thin films</a>, <a href="/wiki/Etching" title="Etching">etching</a>, <a href="/wiki/Wire_bonding" title="Wire bonding">bonding</a>, and <a href="/wiki/Polishing" title="Polishing">polishing</a>. </p> <figure class="mw-default-size" typeof="mw:File/Thumb"><a href="/wiki/File:CMOS_fabrication_process.svg" class="mw-file-description"><img src="//upload.wikimedia.org/wikipedia/commons/thumb/5/57/CMOS_fabrication_process.svg/220px-CMOS_fabrication_process.svg.png" decoding="async" width="220" height="935" class="mw-file-element" srcset="//upload.wikimedia.org/wikipedia/commons/thumb/5/57/CMOS_fabrication_process.svg/330px-CMOS_fabrication_process.svg.png 1.5x, //upload.wikimedia.org/wikipedia/commons/thumb/5/57/CMOS_fabrication_process.svg/440px-CMOS_fabrication_process.svg.png 2x" data-file-width="512" data-file-height="2176" /></a><figcaption>Simplified illustration of the process of fabrication of a CMOS inverter on p-type substrate in semiconductor microfabrication. Each etch step is detailed in the following image. The diagrams are not to scale, as in real devices, the gate, source, and drain contacts are not normally located in the same plane.</figcaption></figure> <figure typeof="mw:File/Thumb"><a href="/wiki/File:Photolithography_etching_process.svg" class="mw-file-description"><img src="//upload.wikimedia.org/wikipedia/commons/thumb/b/b0/Photolithography_etching_process.svg/128px-Photolithography_etching_process.svg.png" decoding="async" width="128" height="640" class="mw-file-element" srcset="//upload.wikimedia.org/wikipedia/commons/thumb/b/b0/Photolithography_etching_process.svg/192px-Photolithography_etching_process.svg.png 1.5x, //upload.wikimedia.org/wikipedia/commons/thumb/b/b0/Photolithography_etching_process.svg/256px-Photolithography_etching_process.svg.png 2x" data-file-width="512" data-file-height="2560" /></a><figcaption>Detail of an etch step.</figcaption></figure> <meta property="mw:PageProp/toc" /> <div class="mw-heading mw-heading2"><h2 id="Fields_of_use">Fields of use</h2><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Microfabrication&action=edit&section=1" title="Edit section: Fields of use"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <p>Microfabricated devices include: </p> <ul><li><a href="/wiki/Integrated_circuits" class="mw-redirect" title="Integrated circuits">integrated circuits</a> (“microchips”) (see <a href="/wiki/Semiconductor_manufacturing" class="mw-redirect" title="Semiconductor manufacturing">semiconductor manufacturing</a>)</li> <li><a href="/wiki/Microelectromechanical_systems" class="mw-redirect" title="Microelectromechanical systems">microelectromechanical systems</a> (MEMS) and <a href="/wiki/Microoptoelectromechanical_systems" title="Microoptoelectromechanical systems">microoptoelectromechanical systems</a> (MOEMS)</li> <li><a href="/wiki/Microfluidic_device" class="mw-redirect" title="Microfluidic device">microfluidic devices</a> (<a href="/wiki/Ink_jet" class="mw-redirect" title="Ink jet">ink jet</a> print heads)</li> <li><a href="/wiki/Solar_cell" title="Solar cell">solar cells</a></li> <li><a href="/wiki/Flat_panel_display" class="mw-redirect" title="Flat panel display">flat panel displays</a> (see <a href="/wiki/AMLCD" class="mw-redirect" title="AMLCD">AMLCD</a> and <a href="/wiki/Thin-film_transistor" title="Thin-film transistor">thin-film transistors</a>)</li> <li>sensors (microsensors) (<a href="/wiki/Biosensor" title="Biosensor">biosensors</a>, <a href="/wiki/Nanosensor" title="Nanosensor">nanosensors</a>)</li> <li><a href="/w/index.php?title=Power_MEMS&action=edit&redlink=1" class="new" title="Power MEMS (page does not exist)">power MEMS</a>, <a href="/wiki/Fuel_cell" title="Fuel cell">fuel cells</a>, energy harvesters/scavengers</li></ul> <div class="mw-heading mw-heading2"><h2 id="Origins">Origins</h2><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Microfabrication&action=edit&section=2" title="Edit section: Origins"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <p>Microfabrication technologies originate from the <a href="/wiki/Microelectronics" title="Microelectronics">microelectronics</a> industry, and the devices are usually made on <a href="/wiki/Silicon" title="Silicon">silicon</a> wafers even though <a href="/wiki/Glass" title="Glass">glass</a>, <a href="/wiki/Plastics" class="mw-redirect" title="Plastics">plastics</a> and many other <a href="/wiki/Wafer_(electronics)" title="Wafer (electronics)">substrate</a> are in use. Micromachining, semiconductor processing, microelectronic fabrication, <a href="/wiki/Semiconductor_fabrication" class="mw-redirect" title="Semiconductor fabrication">semiconductor fabrication</a>, <a href="/wiki/Microelectromechanical_systems" class="mw-redirect" title="Microelectromechanical systems">MEMS</a> fabrication and integrated circuit technology are terms used instead of microfabrication, but microfabrication is the broad general term. </p><p>Traditional machining techniques such as <i>electro-discharge machining</i>, <i>spark erosion machining</i>, and <i>laser drilling</i> have been scaled from the <a href="/wiki/Millimeter" class="mw-redirect" title="Millimeter">millimeter</a> size range to micrometer range, but they do not share the main idea of microelectronics-originated microfabrication: replication and parallel fabrication of hundreds or millions of identical structures. This parallelism is present in various <a href="/wiki/Printing" title="Printing">imprint</a>, <a href="/wiki/Casting" title="Casting">casting</a> and <a href="/wiki/Molding_(process)" title="Molding (process)">moulding</a> techniques which have successfully been applied in the microregime. For example, <a href="/wiki/Injection_moulding" title="Injection moulding">injection moulding</a> of DVDs involves fabrication of submicrometer-sized spots on the disc. </p> <div class="mw-heading mw-heading2"><h2 id="Processes">Processes</h2><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Microfabrication&action=edit&section=3" title="Edit section: Processes"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <p>Microfabrication is actually a collection of technologies which are utilized in making microdevices. Some of them have very old origins, not connected to <a href="/wiki/Manufacturing" title="Manufacturing">manufacturing</a>, like <a href="/wiki/Lithography" title="Lithography">lithography</a> or <a href="/wiki/Etching" title="Etching">etching</a>. <a href="/wiki/Polishing" title="Polishing">Polishing</a> was borrowed from <a href="/wiki/Optical_manufacturing_and_testing" title="Optical manufacturing and testing">optics manufacturing</a>, and many of the vacuum techniques come from <a href="/wiki/History_of_physics" title="History of physics">19th century physics research</a>. <a href="/wiki/Electroplating" title="Electroplating">Electroplating</a> is also a 19th-century technique adapted to produce <a href="/wiki/1_micrometre" class="mw-redirect" title="1 micrometre">micrometre</a> scale structures, as are various <a href="/wiki/Stamping_(metalworking)" title="Stamping (metalworking)">stamping</a> and <a href="/wiki/Embossing_(manufacturing)" title="Embossing (manufacturing)">embossing</a> techniques. </p><p>To fabricate a microdevice, many processes must be performed, one after the other, many times repeatedly. These processes typically include depositing a <a href="/wiki/Thin_film" title="Thin film">film</a>, patterning the film with the desired micro features, and removing (or <a href="/wiki/Etching_(microfabrication)" title="Etching (microfabrication)">etching</a>) portions of the film. Thin film metrology is used typically during each of these individual process steps, to ensure the film structure has the desired characteristics in terms of thickness (<i>t</i>), refractive index (<i>n</i>) and extinction coefficient (<i>k</i>),<sup id="cite_ref-Löper2015_2-0" class="reference"><a href="#cite_note-Löper2015-2"><span class="cite-bracket">[</span>2<span class="cite-bracket">]</span></a></sup> for suitable device behavior. For example, in <a href="/wiki/Integrated_circuit" title="Integrated circuit">memory chip</a> fabrication there are some 30 <a href="/wiki/Photolithography" title="Photolithography">lithography</a> steps, 10 <a href="/wiki/Redox" title="Redox">oxidation</a> steps, 20 etching steps, 10 <a href="/wiki/Doping_(semiconductor)" title="Doping (semiconductor)">doping</a> steps, and many others are performed. The complexity of microfabrication processes can be described by their <i>mask count</i>. This is the number of different <a href="/wiki/Pattern" title="Pattern">pattern</a> layers that constitute the final device. Modern microprocessors are made with 30 masks while a few masks suffice for a <a href="/wiki/Microfluidics" title="Microfluidics">microfluidic</a> device or a <a href="/wiki/Laser_diode" title="Laser diode">laser diode</a>. Microfabrication resembles <a href="/wiki/Multiple_exposure" title="Multiple exposure">multiple exposure</a> photography, with many patterns aligned to each other to create the final structure. </p> <div class="mw-heading mw-heading3"><h3 id="Substrates">Substrates</h3><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Microfabrication&action=edit&section=4" title="Edit section: Substrates"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <p>Microfabricated devices are not generally freestanding devices but are usually formed over or in a thicker support <a href="/wiki/Wafer_(electronics)" title="Wafer (electronics)">substrate</a>. For electronic applications, semiconducting substrates such as <a href="/wiki/Silicon_wafer" class="mw-redirect" title="Silicon wafer">silicon wafers</a> can be used. For optical devices or flat panel displays, transparent substrates such as glass or quartz are common. The substrate enables easy handling of the micro device through the many fabrication steps. Often many individual devices are made together on one substrate and then singulated into separated devices toward the end of fabrication. </p> <div class="mw-heading mw-heading3"><h3 id="Deposition_or_growth">Deposition or growth</h3><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Microfabrication&action=edit&section=5" title="Edit section: Deposition or growth"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <p>Microfabricated devices are typically constructed using one or more <a href="/wiki/Thin_film" title="Thin film">thin films</a> (see <a href="/wiki/Thin_film_deposition" class="mw-redirect" title="Thin film deposition">Thin film deposition</a>). The purpose of these thin films depends upon the type of device. Electronic devices may have thin films which are conductors (metals), insulators (dielectrics) or semiconductors. Optical devices may have films which are reflective, transparent, light guiding or scattering. Films may also have a chemical or mechanical purpose as well as for MEMS applications. Examples of deposition techniques include: </p> <ul><li><a href="/wiki/Thermal_oxidation" title="Thermal oxidation">Thermal oxidation</a></li> <li><a href="/wiki/LOCOS" title="LOCOS">Local oxidation of silicon</a></li> <li><a href="/wiki/Chemical_vapor_deposition" title="Chemical vapor deposition">Chemical vapor deposition</a> (CVD) <ul><li><a href="/wiki/APCVD" class="mw-redirect" title="APCVD">APCVD</a></li> <li><a href="/wiki/LPCVD" class="mw-redirect" title="LPCVD">LPCVD</a></li> <li><a href="/wiki/PECVD" class="mw-redirect" title="PECVD">PECVD</a></li></ul></li> <li><a href="/wiki/Physical_vapor_deposition" title="Physical vapor deposition">Physical vapor deposition</a> (PVD) <ul><li><a href="/wiki/Sputter_deposition" title="Sputter deposition">Sputtering</a></li> <li><a href="/wiki/Evaporative_deposition" class="mw-redirect" title="Evaporative deposition">Evaporative deposition</a></li> <li><a href="/wiki/Electron-beam_physical_vapor_deposition" title="Electron-beam physical vapor deposition">Electron beam PVD</a></li></ul></li> <li><a href="/wiki/Epitaxy" title="Epitaxy">Epitaxy</a></li></ul> <div class="mw-heading mw-heading3"><h3 id="Patterning">Patterning</h3><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Microfabrication&action=edit&section=6" title="Edit section: Patterning"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <p>It is often desirable to pattern a film into distinct features or to form openings (or vias) in some of the layers. These features are on the micrometer or nanometer scale and the patterning technology is what defines microfabrication. This patterning technique typically uses a 'mask' to define portions of the film which will be removed. Examples of patterning techniques include: </p> <ul><li><a href="/wiki/Photolithography" title="Photolithography">Photolithography</a></li> <li>Shadow masking</li></ul> <div class="mw-heading mw-heading3"><h3 id="Etching">Etching</h3><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Microfabrication&action=edit&section=7" title="Edit section: Etching"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <style data-mw-deduplicate="TemplateStyles:r1236090951">.mw-parser-output .hatnote{font-style:italic}.mw-parser-output div.hatnote{padding-left:1.6em;margin-bottom:0.5em}.mw-parser-output .hatnote i{font-style:normal}.mw-parser-output .hatnote+link+.hatnote{margin-top:-0.5em}@media print{body.ns-0 .mw-parser-output .hatnote{display:none!important}}</style><div role="note" class="hatnote navigation-not-searchable">Main article: <a href="/wiki/Etching_(microfabrication)" title="Etching (microfabrication)">Etching (microfabrication)</a></div> <p>Etching is the removal of some portion of the thin film or substrate. The substrate is exposed to an etching (such as an acid or plasma) which chemically or physically attacks the film until it is removed. Etching techniques include: </p> <ul><li>Dry etching (<a href="/wiki/Plasma_etching" title="Plasma etching">plasma etching</a>) such as <a href="/wiki/Reactive-ion_etching" title="Reactive-ion etching">reactive-ion etching</a> (RIE) or <a href="/wiki/Deep_reactive-ion_etching" title="Deep reactive-ion etching">deep reactive-ion etching</a> (DRIE)</li> <li><a href="/wiki/Etching_(microfabrication)" title="Etching (microfabrication)">Wet etching</a> or chemical etching</li></ul> <div class="mw-heading mw-heading3"><h3 id="Microforming">Microforming</h3><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Microfabrication&action=edit&section=8" title="Edit section: Microforming"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <p>Microforming is a microfabrication process of <a href="/wiki/Microsystem" title="Microsystem">microsystem</a> or <a href="/wiki/Microelectromechanical_systems" class="mw-redirect" title="Microelectromechanical systems">microelectromechanical system</a> (MEMS) "parts or structures with at least two dimensions in the submillimeter range."<sup id="cite_ref-EngelMicro02_3-0" class="reference"><a href="#cite_note-EngelMicro02-3"><span class="cite-bracket">[</span>3<span class="cite-bracket">]</span></a></sup><sup id="cite_ref-DixitMicro12_4-0" class="reference"><a href="#cite_note-DixitMicro12-4"><span class="cite-bracket">[</span>4<span class="cite-bracket">]</span></a></sup><sup id="cite_ref-RazaliARev13_5-0" class="reference"><a href="#cite_note-RazaliARev13-5"><span class="cite-bracket">[</span>5<span class="cite-bracket">]</span></a></sup> It includes techniques such as <a href="/wiki/Microextrusion" title="Microextrusion">microextrusion</a>,<sup id="cite_ref-DixitMicro12_4-1" class="reference"><a href="#cite_note-DixitMicro12-4"><span class="cite-bracket">[</span>4<span class="cite-bracket">]</span></a></sup> <a href="/wiki/Stamping_(metalworking)#Microstamping" title="Stamping (metalworking)">microstamping</a>,<sup id="cite_ref-AMPLProcc15_6-0" class="reference"><a href="#cite_note-AMPLProcc15-6"><span class="cite-bracket">[</span>6<span class="cite-bracket">]</span></a></sup> and microcutting.<sup id="cite_ref-FuMicro14_7-0" class="reference"><a href="#cite_note-FuMicro14-7"><span class="cite-bracket">[</span>7<span class="cite-bracket">]</span></a></sup> These and other microforming processes have been envisioned and researched since at least 1990,<sup id="cite_ref-EngelMicro02_3-1" class="reference"><a href="#cite_note-EngelMicro02-3"><span class="cite-bracket">[</span>3<span class="cite-bracket">]</span></a></sup> leading to the development of industrial- and experimental-grade manufacturing tools. However, as Fu and Chan pointed out in a 2013 state-of-the-art technology review, several issues must still be resolved before the technology can be implemented more widely, including <a href="/wiki/Deformation_(engineering)" title="Deformation (engineering)">deformation load and defects</a>, forming system stability, mechanical properties, and other size-related effects on the <a href="/wiki/Crystallite" title="Crystallite">crystallite</a> (grain) structure and boundaries:<sup id="cite_ref-DixitMicro12_4-2" class="reference"><a href="#cite_note-DixitMicro12-4"><span class="cite-bracket">[</span>4<span class="cite-bracket">]</span></a></sup><sup id="cite_ref-RazaliARev13_5-1" class="reference"><a href="#cite_note-RazaliARev13-5"><span class="cite-bracket">[</span>5<span class="cite-bracket">]</span></a></sup><sup id="cite_ref-FuARev13_8-0" class="reference"><a href="#cite_note-FuARev13-8"><span class="cite-bracket">[</span>8<span class="cite-bracket">]</span></a></sup> </p> <blockquote><p>In microforming, the ratio of the total surface area of <a href="/wiki/Grain_boundary" title="Grain boundary">grain boundaries</a> to the material volume decreases with the decrease of specimen size and the increase of grain size. This leads to the decrease of grain boundary strengthening effect. Surface grains have lesser constraints compared to internal grains. The change of flow stress with part geometry size is partly attributed to the change of volume fraction of surface grains. In addition, the anisotropic properties of each grain become significant with the decrease of workpiece size, which results in the inhomogeneous deformation, irregular formed geometry and the variation of deformation load. There is a critical need to establish the systematic knowledge of microforming to support the design of part, process, and tooling with the consideration of size effects.<sup id="cite_ref-FuARev13_8-1" class="reference"><a href="#cite_note-FuARev13-8"><span class="cite-bracket">[</span>8<span class="cite-bracket">]</span></a></sup></p></blockquote> <div class="mw-heading mw-heading3"><h3 id="Other">Other</h3><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Microfabrication&action=edit&section=9" title="Edit section: Other"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <p>a wide variety of other processes for cleaning, planarizing, or modifying the chemical properties of microfabricated devices can also be performed. Some examples include: </p> <ul><li><a href="/wiki/Doping_(semiconductor)" title="Doping (semiconductor)">Doping</a> by either <a href="/wiki/Molecular_diffusion" title="Molecular diffusion">thermal diffusion</a> or <a href="/wiki/Ion_implantation" title="Ion implantation">ion implantation</a></li> <li><a href="/wiki/Chemical-mechanical_planarization" class="mw-redirect" title="Chemical-mechanical planarization">Chemical-mechanical planarization</a> (CMP)</li> <li>Wafer cleaning, also known as "surface preparation" (see below)</li> <li><a href="/wiki/Wire_bonding" title="Wire bonding">Wire bonding</a></li></ul> <div class="mw-heading mw-heading2"><h2 id="Cleanliness_in_wafer_fabrication">Cleanliness in wafer fabrication</h2><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Microfabrication&action=edit&section=10" title="Edit section: Cleanliness in wafer fabrication"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <p>Microfabrication is carried out in <a href="/wiki/Cleanroom" title="Cleanroom">cleanrooms</a>, where air has been filtered of particle contamination and <a href="/wiki/Temperature" title="Temperature">temperature</a>, <a href="/wiki/Humidity" title="Humidity">humidity</a>, vibrations and electrical disturbances are under stringent control. <a href="/wiki/Smoke" title="Smoke">Smoke</a>, <a href="/wiki/Dust" title="Dust">dust</a>, <a href="/wiki/Bacteria" title="Bacteria">bacteria</a> and <a href="/wiki/Cell_(biology)" title="Cell (biology)">cells</a> are micrometers in size, and their presence will destroy the functionality of a microfabricated device. </p><p>Cleanrooms provide passive cleanliness but the wafers are also actively cleaned before every critical step. <a href="/wiki/RCA_clean" title="RCA clean">RCA-1 clean</a> in <a href="/wiki/Ammonia" title="Ammonia">ammonia</a>-peroxide solution removes organic contamination and particles; RCA-2 cleaning in <a href="/wiki/Hydrogen_chloride" title="Hydrogen chloride">hydrogen chloride</a>-peroxide mixture removes metallic impurities. <a href="/wiki/Sulfuric_acid" title="Sulfuric acid">Sulfuric acid</a>-<a href="/wiki/Peroxide" title="Peroxide">peroxide</a> mixture (a.k.a. Piranha) removes organics. Hydrogen fluoride removes native oxide from silicon surface. These are all wet cleaning steps in solutions. Dry cleaning methods include <a href="/wiki/Oxygen" title="Oxygen">oxygen</a> and <a href="/wiki/Argon" title="Argon">argon</a> plasma treatments to remove unwanted surface layers, or <a href="/wiki/Hydrogen" title="Hydrogen">hydrogen</a> bake at elevated temperature to remove native oxide before <a href="/wiki/Epitaxy" title="Epitaxy">epitaxy</a>. Pre-gate cleaning is the most critical cleaning step in CMOS fabrication: it ensures that the ca. 2 nm thick oxide of a MOS transistor can be grown in an orderly fashion. <a href="/wiki/Oxidation" class="mw-redirect" title="Oxidation">Oxidation</a>, and all high temperature steps are very sensitive to contamination, and cleaning steps must precede high temperature steps. </p><p>Surface preparation is just a different viewpoint, all the steps are the same as described above: it is about leaving the wafer surface in a controlled and well known state before you start processing. Wafers are contaminated by previous process steps (e.g. metals bombarded from chamber walls by energetic ions during <a href="/wiki/Ion_implantation" title="Ion implantation">ion implantation</a>), or they may have gathered <a href="/wiki/Polymer" title="Polymer">polymers</a> from wafer boxes, and this might be different depending on wait time. </p><p>Wafer cleaning and surface preparation work similarly to the machines in a <a href="/wiki/Bowling_alley" title="Bowling alley">bowling alley</a>: first they remove all unwanted bits and pieces, and then they reconstruct the desired pattern so that the game can go on. </p> <div class="mw-heading mw-heading2"><h2 id="See_also">See also</h2><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Microfabrication&action=edit&section=11" title="Edit section: See also"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <style data-mw-deduplicate="TemplateStyles:r1266661725">.mw-parser-output .portalbox{padding:0;margin:0.5em 0;display:table;box-sizing:border-box;max-width:175px;list-style:none}.mw-parser-output .portalborder{border:1px solid var(--border-color-base,#a2a9b1);padding:0.1em;background:var(--background-color-neutral-subtle,#f8f9fa)}.mw-parser-output .portalbox-entry{display:table-row;font-size:85%;line-height:110%;height:1.9em;font-style:italic;font-weight:bold}.mw-parser-output .portalbox-image{display:table-cell;padding:0.2em;vertical-align:middle;text-align:center}.mw-parser-output .portalbox-link{display:table-cell;padding:0.2em 0.2em 0.2em 0.3em;vertical-align:middle}@media(min-width:720px){.mw-parser-output .portalleft{margin:0.5em 1em 0.5em 0}.mw-parser-output .portalright{clear:right;float:right;margin:0.5em 0 0.5em 1em}}</style><ul role="navigation" aria-label="Portals" class="noprint portalbox portalborder portalright"> <li class="portalbox-entry"><span class="portalbox-image"><span class="noviewer" typeof="mw:File"><a href="/wiki/File:Noun-manufacturing-7481278.svg" class="mw-file-description"><img alt="icon" src="//upload.wikimedia.org/wikipedia/commons/thumb/c/c1/Noun-manufacturing-7481278.svg/27px-Noun-manufacturing-7481278.svg.png" decoding="async" width="27" height="28" class="mw-file-element" srcset="//upload.wikimedia.org/wikipedia/commons/thumb/c/c1/Noun-manufacturing-7481278.svg/40px-Noun-manufacturing-7481278.svg.png 1.5x, //upload.wikimedia.org/wikipedia/commons/thumb/c/c1/Noun-manufacturing-7481278.svg/53px-Noun-manufacturing-7481278.svg.png 2x" data-file-width="101" data-file-height="106" /></a></span></span><span class="portalbox-link"><a href="/wiki/Portal:Manufacturing" title="Portal:Manufacturing">Manufacturing portal</a></span></li></ul> <ul><li><a href="/wiki/3D_microfabrication" title="3D microfabrication">3D microfabrication</a></li> <li><a href="/wiki/Nanofabrication" class="mw-redirect" title="Nanofabrication">Nanofabrication</a></li> <li><a href="/wiki/Semiconductor_fabrication" class="mw-redirect" title="Semiconductor fabrication">Semiconductor fabrication</a></li></ul> <div class="mw-heading mw-heading2"><h2 id="References">References</h2><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Microfabrication&action=edit&section=12" title="Edit section: References"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <div class="mw-references-wrap"><ol class="references"> <li id="cite_note-npm-1"><span class="mw-cite-backlink"><b><a href="#cite_ref-npm_1-0">^</a></b></span> <span class="reference-text">Nitaigour Premchand Mahalik (2006) "Micromanufacturing and Nanotechnology", Springer, <style data-mw-deduplicate="TemplateStyles:r1238218222">.mw-parser-output cite.citation{font-style:inherit;word-wrap:break-word}.mw-parser-output .citation q{quotes:"\"""\"""'""'"}.mw-parser-output .citation:target{background-color:rgba(0,127,255,0.133)}.mw-parser-output .id-lock-free.id-lock-free a{background:url("//upload.wikimedia.org/wikipedia/commons/6/65/Lock-green.svg")right 0.1em center/9px no-repeat}.mw-parser-output .id-lock-limited.id-lock-limited a,.mw-parser-output .id-lock-registration.id-lock-registration a{background:url("//upload.wikimedia.org/wikipedia/commons/d/d6/Lock-gray-alt-2.svg")right 0.1em center/9px no-repeat}.mw-parser-output .id-lock-subscription.id-lock-subscription a{background:url("//upload.wikimedia.org/wikipedia/commons/a/aa/Lock-red-alt-2.svg")right 0.1em center/9px no-repeat}.mw-parser-output .cs1-ws-icon a{background:url("//upload.wikimedia.org/wikipedia/commons/4/4c/Wikisource-logo.svg")right 0.1em center/12px no-repeat}body:not(.skin-timeless):not(.skin-minerva) .mw-parser-output .id-lock-free a,body:not(.skin-timeless):not(.skin-minerva) .mw-parser-output .id-lock-limited a,body:not(.skin-timeless):not(.skin-minerva) .mw-parser-output .id-lock-registration a,body:not(.skin-timeless):not(.skin-minerva) .mw-parser-output .id-lock-subscription a,body:not(.skin-timeless):not(.skin-minerva) .mw-parser-output .cs1-ws-icon a{background-size:contain;padding:0 1em 0 0}.mw-parser-output .cs1-code{color:inherit;background:inherit;border:none;padding:inherit}.mw-parser-output .cs1-hidden-error{display:none;color:var(--color-error,#d33)}.mw-parser-output .cs1-visible-error{color:var(--color-error,#d33)}.mw-parser-output .cs1-maint{display:none;color:#085;margin-left:0.3em}.mw-parser-output .cs1-kern-left{padding-left:0.2em}.mw-parser-output .cs1-kern-right{padding-right:0.2em}.mw-parser-output .citation .mw-selflink{font-weight:inherit}@media screen{.mw-parser-output .cs1-format{font-size:95%}html.skin-theme-clientpref-night .mw-parser-output .cs1-maint{color:#18911f}}@media screen and (prefers-color-scheme:dark){html.skin-theme-clientpref-os .mw-parser-output .cs1-maint{color:#18911f}}</style><a href="/wiki/ISBN_(identifier)" class="mw-redirect" title="ISBN (identifier)">ISBN</a> <a href="/wiki/Special:BookSources/3-540-25377-7" title="Special:BookSources/3-540-25377-7">3-540-25377-7</a></span> </li> <li id="cite_note-Löper2015-2"><span class="mw-cite-backlink"><b><a href="#cite_ref-Löper2015_2-0">^</a></b></span> <span class="reference-text"><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite id="CITEREFLöperStuckelbergerNiesenWerner2015" class="citation journal cs1">Löper, Philipp; Stuckelberger, Michael; Niesen, Bjoern; Werner, Jérémie; Filipič, Miha; Moon, Soo-Jin; Yum, Jun-Ho; Topič, Marko; De Wolf, Stefaan; Ballif, Christophe (2015). <a rel="nofollow" class="external text" href="https://doi.org/10.1021/jz502471h">"Complex Refractive Index Spectra of CH3NH3PbI3 Perovskite Thin Films Determined by Spectroscopic Ellipsometry and Spectrophotometry"</a>. <i>The Journal of Physical Chemistry Letters</i>. <b>6</b> (1): <span class="nowrap">66–</span>71. <a href="/wiki/Doi_(identifier)" class="mw-redirect" title="Doi (identifier)">doi</a>:<a rel="nofollow" class="external text" href="https://doi.org/10.1021%2Fjz502471h">10.1021/jz502471h</a>. <a href="/wiki/PMID_(identifier)" class="mw-redirect" title="PMID (identifier)">PMID</a> <a rel="nofollow" class="external text" href="https://pubmed.ncbi.nlm.nih.gov/26263093">26263093</a><span class="reference-accessdate">. Retrieved <span class="nowrap">2021-11-16</span></span>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.jtitle=The+Journal+of+Physical+Chemistry+Letters&rft.atitle=Complex+Refractive+Index+Spectra+of+CH3NH3PbI3+Perovskite+Thin+Films+Determined+by+Spectroscopic+Ellipsometry+and+Spectrophotometry&rft.volume=6&rft.issue=1&rft.pages=%3Cspan+class%3D%22nowrap%22%3E66-%3C%2Fspan%3E71&rft.date=2015&rft_id=info%3Adoi%2F10.1021%2Fjz502471h&rft_id=info%3Apmid%2F26263093&rft.aulast=L%C3%B6per&rft.aufirst=Philipp&rft.au=Stuckelberger%2C+Michael&rft.au=Niesen%2C+Bjoern&rft.au=Werner%2C+J%C3%A9r%C3%A9mie&rft.au=Filipi%C4%8D%2C+Miha&rft.au=Moon%2C+Soo-Jin&rft.au=Yum%2C+Jun-Ho&rft.au=Topi%C4%8D%2C+Marko&rft.au=De+Wolf%2C+Stefaan&rft.au=Ballif%2C+Christophe&rft_id=https%3A%2F%2Fdoi.org%2F10.1021%2Fjz502471h&rfr_id=info%3Asid%2Fen.wikipedia.org%3AMicrofabrication" class="Z3988"></span></span> </li> <li id="cite_note-EngelMicro02-3"><span class="mw-cite-backlink">^ <a href="#cite_ref-EngelMicro02_3-0"><sup><i><b>a</b></i></sup></a> <a href="#cite_ref-EngelMicro02_3-1"><sup><i><b>b</b></i></sup></a></span> <span class="reference-text"><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite id="CITEREFEngel,_U.Eckstein,_R.2002" class="citation journal cs1 cs1-prop-long-vol">Engel, U.; Eckstein, R. (2002). "Microforming - From Basic research to its realization". <i>Journal of Materials Processing Technology</i>. <span class="nowrap">125–</span>126 (2002): <span class="nowrap">35–</span>44. <a href="/wiki/Doi_(identifier)" class="mw-redirect" title="Doi (identifier)">doi</a>:<a rel="nofollow" class="external text" href="https://doi.org/10.1016%2FS0924-0136%2802%2900415-6">10.1016/S0924-0136(02)00415-6</a>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.jtitle=Journal+of+Materials+Processing+Technology&rft.atitle=Microforming+-+From+Basic+research+to+its+realization&rft.volume=125%E2%80%93126&rft.issue=2002&rft.pages=%3Cspan+class%3D%22nowrap%22%3E35-%3C%2Fspan%3E44&rft.date=2002&rft_id=info%3Adoi%2F10.1016%2FS0924-0136%2802%2900415-6&rft.au=Engel%2C+U.&rft.au=Eckstein%2C+R.&rfr_id=info%3Asid%2Fen.wikipedia.org%3AMicrofabrication" class="Z3988"></span></span> </li> <li id="cite_note-DixitMicro12-4"><span class="mw-cite-backlink">^ <a href="#cite_ref-DixitMicro12_4-0"><sup><i><b>a</b></i></sup></a> <a href="#cite_ref-DixitMicro12_4-1"><sup><i><b>b</b></i></sup></a> <a href="#cite_ref-DixitMicro12_4-2"><sup><i><b>c</b></i></sup></a></span> <span class="reference-text"><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite id="CITEREFDixit,_U.S.Das,_R.2012" class="citation book cs1">Dixit, U.S.; Das, R. (2012). <a rel="nofollow" class="external text" href="https://books.google.com/books?id=JYlJbKw_azEC&pg=PA264">"Chapter 15: Microextrusion"</a>. In Jain, V.K. (ed.). <i>Micromanufacturing Processes</i>. CRC Press. pp. <span class="nowrap">263–</span>282. <a href="/wiki/ISBN_(identifier)" class="mw-redirect" title="ISBN (identifier)">ISBN</a> <a href="/wiki/Special:BookSources/9781439852903" title="Special:BookSources/9781439852903"><bdi>9781439852903</bdi></a>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=bookitem&rft.atitle=Chapter+15%3A+Microextrusion&rft.btitle=Micromanufacturing+Processes&rft.pages=%3Cspan+class%3D%22nowrap%22%3E263-%3C%2Fspan%3E282&rft.pub=CRC+Press&rft.date=2012&rft.isbn=9781439852903&rft.au=Dixit%2C+U.S.&rft.au=Das%2C+R.&rft_id=https%3A%2F%2Fbooks.google.com%2Fbooks%3Fid%3DJYlJbKw_azEC%26pg%3DPA264&rfr_id=info%3Asid%2Fen.wikipedia.org%3AMicrofabrication" class="Z3988"></span></span> </li> <li id="cite_note-RazaliARev13-5"><span class="mw-cite-backlink">^ <a href="#cite_ref-RazaliARev13_5-0"><sup><i><b>a</b></i></sup></a> <a href="#cite_ref-RazaliARev13_5-1"><sup><i><b>b</b></i></sup></a></span> <span class="reference-text"><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite id="CITEREFRazali,_A.R.Qin,_Y.2013" class="citation journal cs1">Razali, A.R.; Qin, Y. (2013). <a rel="nofollow" class="external text" href="http://strathprints.strath.ac.uk/55851/">"A review on micro-manufacturing, micro-forming and their key issues"</a>. <i>Procedia Engineering</i>. <b>53</b> (2013): <span class="nowrap">665–</span>672. <a href="/wiki/Doi_(identifier)" class="mw-redirect" title="Doi (identifier)">doi</a>:<span class="id-lock-free" title="Freely accessible"><a rel="nofollow" class="external text" href="https://doi.org/10.1016%2Fj.proeng.2013.02.086">10.1016/j.proeng.2013.02.086</a></span>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.jtitle=Procedia+Engineering&rft.atitle=A+review+on+micro-manufacturing%2C+micro-forming+and+their+key+issues&rft.volume=53&rft.issue=2013&rft.pages=%3Cspan+class%3D%22nowrap%22%3E665-%3C%2Fspan%3E672&rft.date=2013&rft_id=info%3Adoi%2F10.1016%2Fj.proeng.2013.02.086&rft.au=Razali%2C+A.R.&rft.au=Qin%2C+Y.&rft_id=http%3A%2F%2Fstrathprints.strath.ac.uk%2F55851%2F&rfr_id=info%3Asid%2Fen.wikipedia.org%3AMicrofabrication" class="Z3988"></span></span> </li> <li id="cite_note-AMPLProcc15-6"><span class="mw-cite-backlink"><b><a href="#cite_ref-AMPLProcc15_6-0">^</a></b></span> <span class="reference-text"><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite id="CITEREFAdvanced_Manufacturing_Processes_Laboratory2015" class="citation web cs1">Advanced Manufacturing Processes Laboratory (2015). <a rel="nofollow" class="external text" href="http://ampl.mech.northwestern.edu/facilities/facilities-micro-stamping.html">"Process Analysis and Variation Control in Micro-stamping"</a>. Northwestern University<span class="reference-accessdate">. Retrieved <span class="nowrap">18 March</span> 2016</span>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=unknown&rft.btitle=Process+Analysis+and+Variation+Control+in+Micro-stamping&rft.pub=Northwestern+University&rft.date=2015&rft.au=Advanced+Manufacturing+Processes+Laboratory&rft_id=http%3A%2F%2Fampl.mech.northwestern.edu%2Ffacilities%2Ffacilities-micro-stamping.html&rfr_id=info%3Asid%2Fen.wikipedia.org%3AMicrofabrication" class="Z3988"></span></span> </li> <li id="cite_note-FuMicro14-7"><span class="mw-cite-backlink"><b><a href="#cite_ref-FuMicro14_7-0">^</a></b></span> <span class="reference-text"><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite id="CITEREFFu,_M.W.Chan,_W.L.2014" class="citation book cs1">Fu, M.W.; Chan, W.L. (2014). "Chapter 4: Microforming Processes". <i>Micro-scaled Products Development via Microforming: Deformation Behaviours, Processes, Tooling and its Realization</i>. Springer Science & Business Media. pp. <span class="nowrap">73–</span>130. <a href="/wiki/ISBN_(identifier)" class="mw-redirect" title="ISBN (identifier)">ISBN</a> <a href="/wiki/Special:BookSources/9781447163268" title="Special:BookSources/9781447163268"><bdi>9781447163268</bdi></a>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=bookitem&rft.atitle=Chapter+4%3A+Microforming+Processes&rft.btitle=Micro-scaled+Products+Development+via+Microforming%3A+Deformation+Behaviours%2C+Processes%2C+Tooling+and+its+Realization&rft.pages=%3Cspan+class%3D%22nowrap%22%3E73-%3C%2Fspan%3E130&rft.pub=Springer+Science+%26+Business+Media&rft.date=2014&rft.isbn=9781447163268&rft.au=Fu%2C+M.W.&rft.au=Chan%2C+W.L.&rfr_id=info%3Asid%2Fen.wikipedia.org%3AMicrofabrication" class="Z3988"></span></span> </li> <li id="cite_note-FuARev13-8"><span class="mw-cite-backlink">^ <a href="#cite_ref-FuARev13_8-0"><sup><i><b>a</b></i></sup></a> <a href="#cite_ref-FuARev13_8-1"><sup><i><b>b</b></i></sup></a></span> <span class="reference-text"><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite id="CITEREFFu,_M.W.Chan,_W.L.2013" class="citation journal cs1">Fu, M.W.; Chan, W.L. (2013). "A review on the state-of-the-art microforming technologies". <i>International Journal of Advanced Manufacturing Technology</i>. <b>67</b> (9): <span class="nowrap">2411–</span>2437. <a href="/wiki/Doi_(identifier)" class="mw-redirect" title="Doi (identifier)">doi</a>:<a rel="nofollow" class="external text" href="https://doi.org/10.1007%2Fs00170-012-4661-7">10.1007/s00170-012-4661-7</a>. <a href="/wiki/S2CID_(identifier)" class="mw-redirect" title="S2CID (identifier)">S2CID</a> <a rel="nofollow" class="external text" href="https://api.semanticscholar.org/CorpusID:110879846">110879846</a>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.jtitle=International+Journal+of+Advanced+Manufacturing+Technology&rft.atitle=A+review+on+the+state-of-the-art+microforming+technologies&rft.volume=67&rft.issue=9&rft.pages=%3Cspan+class%3D%22nowrap%22%3E2411-%3C%2Fspan%3E2437&rft.date=2013&rft_id=info%3Adoi%2F10.1007%2Fs00170-012-4661-7&rft_id=https%3A%2F%2Fapi.semanticscholar.org%2FCorpusID%3A110879846%23id-name%3DS2CID&rft.au=Fu%2C+M.W.&rft.au=Chan%2C+W.L.&rfr_id=info%3Asid%2Fen.wikipedia.org%3AMicrofabrication" class="Z3988"></span></span> </li> </ol></div> <div class="mw-heading mw-heading2"><h2 id="Further_reading">Further reading</h2><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Microfabrication&action=edit&section=13" title="Edit section: Further reading"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <p><b>Journals</b> </p> <ul><li><a rel="nofollow" class="external text" href="https://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=84">Journal of Microelectromechanical Systems</a> (J.MEMS)</li> <li><a rel="nofollow" class="external text" href="https://www.sciencedirect.com/journal/sensors-and-actuators-a-physical">Sensors and Actuators A: Physical</a></li> <li><a rel="nofollow" class="external text" href="https://www.sciencedirect.com/journal/sensors-and-actuators-b-chemical">Sensors and Actuators B: Chemical</a></li> <li><a href="/wiki/Journal_of_Micromechanics_and_Microengineering" title="Journal of Micromechanics and Microengineering">Journal of Micromechanics and Microengineering</a></li> <li><a rel="nofollow" class="external text" href="https://pubs.rsc.org/en/journals/journalissues/lc">Lab on a Chip</a></li> <li><a rel="nofollow" class="external text" href="https://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=16">IEEE Transactions of Electron Devices</a></li> <li><a rel="nofollow" class="external text" href="https://pubs.aip.org/avs/jva">Journal of Vacuum Science and Technology A</a>: Vacuum, Surfaces, Films</li> <li><a rel="nofollow" class="external text" href="https://pubs.aip.org/avs/jvb">Journal of Vacuum Science and Technology B</a>: Microelectronics and Nanometer Structures: Processing, Measurement, and Phenomena</li></ul> <p><b>Books</b> </p> <style data-mw-deduplicate="TemplateStyles:r1239549316">.mw-parser-output .refbegin{margin-bottom:0.5em}.mw-parser-output .refbegin-hanging-indents>ul{margin-left:0}.mw-parser-output .refbegin-hanging-indents>ul>li{margin-left:0;padding-left:3.2em;text-indent:-3.2em}.mw-parser-output .refbegin-hanging-indents ul,.mw-parser-output .refbegin-hanging-indents ul li{list-style:none}@media(max-width:720px){.mw-parser-output .refbegin-hanging-indents>ul>li{padding-left:1.6em;text-indent:-1.6em}}.mw-parser-output .refbegin-columns{margin-top:0.3em}.mw-parser-output .refbegin-columns ul{margin-top:0}.mw-parser-output .refbegin-columns li{page-break-inside:avoid;break-inside:avoid-column}@media screen{.mw-parser-output .refbegin{font-size:90%}}</style><div class="refbegin" style=""> <ul><li><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite id="CITEREFFranssila2010" class="citation book cs1">Franssila, S. (2010). <a rel="nofollow" class="external text" href="https://books.google.com/books?id=TzL5aUslKDUC&pg=PR5"><i>Introduction to Microfabrication</i></a> (2nd ed.). Wiley. <a href="/wiki/Doi_(identifier)" class="mw-redirect" title="Doi (identifier)">doi</a>:<a rel="nofollow" class="external text" href="https://doi.org/10.1002%2F9781119990413">10.1002/9781119990413</a>. <a href="/wiki/ISBN_(identifier)" class="mw-redirect" title="ISBN (identifier)">ISBN</a> <a href="/wiki/Special:BookSources/978-1-119-99041-3" title="Special:BookSources/978-1-119-99041-3"><bdi>978-1-119-99041-3</bdi></a>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=book&rft.btitle=Introduction+to+Microfabrication&rft.edition=2nd&rft.pub=Wiley&rft.date=2010&rft_id=info%3Adoi%2F10.1002%2F9781119990413&rft.isbn=978-1-119-99041-3&rft.aulast=Franssila&rft.aufirst=S.&rft_id=https%3A%2F%2Fbooks.google.com%2Fbooks%3Fid%3DTzL5aUslKDUC%26pg%3DPR5&rfr_id=info%3Asid%2Fen.wikipedia.org%3AMicrofabrication" class="Z3988"></span></li> <li><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite id="CITEREFMadou2002" class="citation book cs1">Madou, M.J. (2002). <a rel="nofollow" class="external text" href="https://books.google.com/books?id=90ZZDwAAQBAJ&pg=PP16"><i>Fundamentals of Microfabrication</i></a> (2nd ed.). CRC Press. <a href="/wiki/Doi_(identifier)" class="mw-redirect" title="Doi (identifier)">doi</a>:<a rel="nofollow" class="external text" href="https://doi.org/10.1201%2F9781482274004">10.1201/9781482274004</a>. <a href="/wiki/ISBN_(identifier)" class="mw-redirect" title="ISBN (identifier)">ISBN</a> <a href="/wiki/Special:BookSources/0-8493-0826-7" title="Special:BookSources/0-8493-0826-7"><bdi>0-8493-0826-7</bdi></a>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=book&rft.btitle=Fundamentals+of+Microfabrication&rft.edition=2nd&rft.pub=CRC+Press&rft.date=2002&rft_id=info%3Adoi%2F10.1201%2F9781482274004&rft.isbn=0-8493-0826-7&rft.aulast=Madou&rft.aufirst=M.J.&rft_id=https%3A%2F%2Fbooks.google.com%2Fbooks%3Fid%3D90ZZDwAAQBAJ%26pg%3DPP16&rfr_id=info%3Asid%2Fen.wikipedia.org%3AMicrofabrication" class="Z3988"></span></li> <li><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite id="CITEREFKovacs1998" class="citation book cs1">Kovacs, G.T.A. (1998). <a rel="nofollow" class="external text" href="http://catalog.hathitrust.org/api/volumes/oclc/38218159.html"><i>Micromachined Transducers Sourcebook</i></a>. McGraw-Hill. <a href="/wiki/ISBN_(identifier)" class="mw-redirect" title="ISBN (identifier)">ISBN</a> <a href="/wiki/Special:BookSources/0-07-290722-3" title="Special:BookSources/0-07-290722-3"><bdi>0-07-290722-3</bdi></a>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=book&rft.btitle=Micromachined+Transducers+Sourcebook&rft.pub=McGraw-Hill&rft.date=1998&rft.isbn=0-07-290722-3&rft.aulast=Kovacs&rft.aufirst=G.T.A.&rft_id=http%3A%2F%2Fcatalog.hathitrust.org%2Fapi%2Fvolumes%2Foclc%2F38218159.html&rfr_id=info%3Asid%2Fen.wikipedia.org%3AMicrofabrication" class="Z3988"></span></li> <li><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite id="CITEREFBrodieMuray1982" class="citation book cs1">Brodie, I.; Muray, J.J. (1982). <i>The Physics of Microfabrication</i>. Plenum Press. <a href="/wiki/Doi_(identifier)" class="mw-redirect" title="Doi (identifier)">doi</a>:<a rel="nofollow" class="external text" href="https://doi.org/10.1007%2F978-1-4899-2160-4">10.1007/978-1-4899-2160-4</a>. <a href="/wiki/ISBN_(identifier)" class="mw-redirect" title="ISBN (identifier)">ISBN</a> <a href="/wiki/Special:BookSources/1-4899-2160-5" title="Special:BookSources/1-4899-2160-5"><bdi>1-4899-2160-5</bdi></a>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=book&rft.btitle=The+Physics+of+Microfabrication&rft.pub=Plenum+Press&rft.date=1982&rft_id=info%3Adoi%2F10.1007%2F978-1-4899-2160-4&rft.isbn=1-4899-2160-5&rft.aulast=Brodie&rft.aufirst=I.&rft.au=Muray%2C+J.J.&rfr_id=info%3Asid%2Fen.wikipedia.org%3AMicrofabrication" class="Z3988"></span></li> <li><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite id="CITEREFMahalik2006" class="citation book cs1">Mahalik, N.P. (2006). <i>Micromanufacturing and Nanotechnology</i>. Springer. <a href="/wiki/Doi_(identifier)" class="mw-redirect" title="Doi (identifier)">doi</a>:<a rel="nofollow" class="external text" href="https://doi.org/10.1007%2F3-540-29339-6">10.1007/3-540-29339-6</a>. <a href="/wiki/ISBN_(identifier)" class="mw-redirect" title="ISBN (identifier)">ISBN</a> <a href="/wiki/Special:BookSources/3-540-25377-7" title="Special:BookSources/3-540-25377-7"><bdi>3-540-25377-7</bdi></a>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=book&rft.btitle=Micromanufacturing+and+Nanotechnology&rft.pub=Springer&rft.date=2006&rft_id=info%3Adoi%2F10.1007%2F3-540-29339-6&rft.isbn=3-540-25377-7&rft.aulast=Mahalik&rft.aufirst=N.P.&rfr_id=info%3Asid%2Fen.wikipedia.org%3AMicrofabrication" class="Z3988"></span></li> <li><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite id="CITEREFWidmannMaderFriedrich2000" class="citation book cs1">Widmann, D.; Mader, H.; Friedrich, H. (2000). <i>Technology of Integrated Circuits</i>. Springer. <a href="/wiki/Doi_(identifier)" class="mw-redirect" title="Doi (identifier)">doi</a>:<a rel="nofollow" class="external text" href="https://doi.org/10.1007%2F978-3-662-04160-4">10.1007/978-3-662-04160-4</a>. <a href="/wiki/ISBN_(identifier)" class="mw-redirect" title="ISBN (identifier)">ISBN</a> <a href="/wiki/Special:BookSources/978-3-662-04160-4" title="Special:BookSources/978-3-662-04160-4"><bdi>978-3-662-04160-4</bdi></a>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=book&rft.btitle=Technology+of+Integrated+Circuits&rft.pub=Springer&rft.date=2000&rft_id=info%3Adoi%2F10.1007%2F978-3-662-04160-4&rft.isbn=978-3-662-04160-4&rft.aulast=Widmann&rft.aufirst=D.&rft.au=Mader%2C+H.&rft.au=Friedrich%2C+H.&rfr_id=info%3Asid%2Fen.wikipedia.org%3AMicrofabrication" class="Z3988"></span></li> <li><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite id="CITEREFPlummerDealGriffin2012" class="citation book cs1">Plummer, J.D.; Deal, M.D.; Griffin, P.B. (2012). <i>Silicon VLSI Technology</i> (2nd ed.). Prentice Hall. <a href="/wiki/ISBN_(identifier)" class="mw-redirect" title="ISBN (identifier)">ISBN</a> <a href="/wiki/Special:BookSources/978-0-13-614156-3" title="Special:BookSources/978-0-13-614156-3"><bdi>978-0-13-614156-3</bdi></a>. <a href="/wiki/OCLC_(identifier)" class="mw-redirect" title="OCLC (identifier)">OCLC</a> <a rel="nofollow" class="external text" href="https://search.worldcat.org/oclc/753300108">753300108</a>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=book&rft.btitle=Silicon+VLSI+Technology&rft.edition=2nd&rft.pub=Prentice+Hall&rft.date=2012&rft_id=info%3Aoclcnum%2F753300108&rft.isbn=978-0-13-614156-3&rft.aulast=Plummer&rft.aufirst=J.D.&rft.au=Deal%2C+M.D.&rft.au=Griffin%2C+P.B.&rfr_id=info%3Asid%2Fen.wikipedia.org%3AMicrofabrication" class="Z3988"></span></li> <li><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite id="CITEREFMaySze2004" class="citation book cs1">May, G.S.; Sze, S.S. (2004). <i>Fundamentals of Semiconductor Processing</i>. Wiley. <a href="/wiki/ISBN_(identifier)" class="mw-redirect" title="ISBN (identifier)">ISBN</a> <a href="/wiki/Special:BookSources/978-0-471-23279-7" title="Special:BookSources/978-0-471-23279-7"><bdi>978-0-471-23279-7</bdi></a>. <a href="/wiki/OCLC_(identifier)" class="mw-redirect" title="OCLC (identifier)">OCLC</a> <a rel="nofollow" class="external text" href="https://search.worldcat.org/oclc/52333554">52333554</a>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=book&rft.btitle=Fundamentals+of+Semiconductor+Processing&rft.pub=Wiley&rft.date=2004&rft_id=info%3Aoclcnum%2F52333554&rft.isbn=978-0-471-23279-7&rft.aulast=May&rft.aufirst=G.S.&rft.au=Sze%2C+S.S.&rfr_id=info%3Asid%2Fen.wikipedia.org%3AMicrofabrication" class="Z3988"></span></li> <li><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite id="CITEREFvan_Zant2014" class="citation book cs1">van Zant, P. (2014). <i>Microchip Fabrication</i> (6th ed.). McGraw-Hill. p. 1302905242. <a href="/wiki/ISBN_(identifier)" class="mw-redirect" title="ISBN (identifier)">ISBN</a> <a href="/wiki/Special:BookSources/978-0-07-182101-8" title="Special:BookSources/978-0-07-182101-8"><bdi>978-0-07-182101-8</bdi></a>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=book&rft.btitle=Microchip+Fabrication&rft.pages=1302905242&rft.edition=6th&rft.pub=McGraw-Hill&rft.date=2014&rft.isbn=978-0-07-182101-8&rft.aulast=van+Zant&rft.aufirst=P.&rfr_id=info%3Asid%2Fen.wikipedia.org%3AMicrofabrication" class="Z3988"></span></li> <li><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite id="CITEREFJaeger2002" class="citation book cs1">Jaeger, R.C. (2002). <i>Introduction to Microelectronic Fabrication</i> (2nd ed.). Prentice Hall. <a href="/wiki/ISBN_(identifier)" class="mw-redirect" title="ISBN (identifier)">ISBN</a> <a href="/wiki/Special:BookSources/0-201-44494-1" title="Special:BookSources/0-201-44494-1"><bdi>0-201-44494-1</bdi></a>. <a href="/wiki/OCLC_(identifier)" class="mw-redirect" title="OCLC (identifier)">OCLC</a> <a rel="nofollow" class="external text" href="https://search.worldcat.org/oclc/48226051">48226051</a>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=book&rft.btitle=Introduction+to+Microelectronic+Fabrication&rft.edition=2nd&rft.pub=Prentice+Hall&rft.date=2002&rft_id=info%3Aoclcnum%2F48226051&rft.isbn=0-201-44494-1&rft.aulast=Jaeger&rft.aufirst=R.C.&rfr_id=info%3Asid%2Fen.wikipedia.org%3AMicrofabrication" class="Z3988"></span></li> <li><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite id="CITEREFWolfTauber2000" class="citation book cs1">Wolf, S.; Tauber, R.N. (2000). <a rel="nofollow" class="external text" href="http://catalog.hathitrust.org/api/volumes/oclc/43698493.html"><i>Process technology</i></a>. Silicon Processing for the VLSI Era. Vol. 1. Lattice Press. <a href="/wiki/ISBN_(identifier)" class="mw-redirect" title="ISBN (identifier)">ISBN</a> <a href="/wiki/Special:BookSources/0-9616721-6-1" title="Special:BookSources/0-9616721-6-1"><bdi>0-9616721-6-1</bdi></a>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=book&rft.btitle=Process+technology&rft.series=Silicon+Processing+for+the+VLSI+Era&rft.pub=Lattice+Press&rft.date=2000&rft.isbn=0-9616721-6-1&rft.aulast=Wolf&rft.aufirst=S.&rft.au=Tauber%2C+R.N.&rft_id=http%3A%2F%2Fcatalog.hathitrust.org%2Fapi%2Fvolumes%2Foclc%2F43698493.html&rfr_id=info%3Asid%2Fen.wikipedia.org%3AMicrofabrication" class="Z3988"></span></li> <li><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite id="CITEREFCampbell2001" class="citation book cs1">Campbell, S.A. (2001). <i>The Science and Engineering of Microelectronic Fabrication</i> (2nd ed.). Oxford University Press. <a href="/wiki/ISBN_(identifier)" class="mw-redirect" title="ISBN (identifier)">ISBN</a> <a href="/wiki/Special:BookSources/0-19-513605-5" title="Special:BookSources/0-19-513605-5"><bdi>0-19-513605-5</bdi></a>. <a href="/wiki/OCLC_(identifier)" class="mw-redirect" title="OCLC (identifier)">OCLC</a> <a rel="nofollow" class="external text" href="https://search.worldcat.org/oclc/45209102">45209102</a>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=book&rft.btitle=The+Science+and+Engineering+of+Microelectronic+Fabrication&rft.edition=2nd&rft.pub=Oxford+University+Press&rft.date=2001&rft_id=info%3Aoclcnum%2F45209102&rft.isbn=0-19-513605-5&rft.aulast=Campbell&rft.aufirst=S.A.&rfr_id=info%3Asid%2Fen.wikipedia.org%3AMicrofabrication" class="Z3988"></span></li> <li><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite id="CITEREFHattori2011" class="citation book cs1">Hattori, T. (2011). <i>Ultraclean Surface Processing of Silicon Wafers: Secrets of VLSI Manufacturing</i>. Springer. <a href="/wiki/ISBN_(identifier)" class="mw-redirect" title="ISBN (identifier)">ISBN</a> <a href="/wiki/Special:BookSources/978-3-642-08272-6" title="Special:BookSources/978-3-642-08272-6"><bdi>978-3-642-08272-6</bdi></a>. <a href="/wiki/OCLC_(identifier)" class="mw-redirect" title="OCLC (identifier)">OCLC</a> <a rel="nofollow" class="external text" href="https://search.worldcat.org/oclc/751530070">751530070</a>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=book&rft.btitle=Ultraclean+Surface+Processing+of+Silicon+Wafers%3A+Secrets+of+VLSI+Manufacturing&rft.pub=Springer&rft.date=2011&rft_id=info%3Aoclcnum%2F751530070&rft.isbn=978-3-642-08272-6&rft.aulast=Hattori&rft.aufirst=T.&rfr_id=info%3Asid%2Fen.wikipedia.org%3AMicrofabrication" class="Z3988"></span></li> <li><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite id="CITEREFGeschkeKlankTelleman2004" class="citation book cs1">Geschke, O.; Klank, H.; Telleman, P., eds. (2004). <a rel="nofollow" class="external text" href="https://books.google.com/books?id=EMyGfH5IgkkC&pg=PR5"><i>Microsystem Engineering of Lab-on-a-chip Devices</i></a>. Wiley. <a href="/wiki/Doi_(identifier)" class="mw-redirect" title="Doi (identifier)">doi</a>:<a rel="nofollow" class="external text" href="https://doi.org/10.1002%2F3527601651">10.1002/3527601651</a>. <a href="/wiki/ISBN_(identifier)" class="mw-redirect" title="ISBN (identifier)">ISBN</a> <a href="/wiki/Special:BookSources/3-527-30733-8" title="Special:BookSources/3-527-30733-8"><bdi>3-527-30733-8</bdi></a>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=book&rft.btitle=Microsystem+Engineering+of+Lab-on-a-chip+Devices&rft.pub=Wiley&rft.date=2004&rft_id=info%3Adoi%2F10.1002%2F3527601651&rft.isbn=3-527-30733-8&rft_id=https%3A%2F%2Fbooks.google.com%2Fbooks%3Fid%3DEMyGfH5IgkkC%26pg%3DPR5&rfr_id=info%3Asid%2Fen.wikipedia.org%3AMicrofabrication" class="Z3988"></span></li> <li><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite id="CITEREFMeyrueisSakodaVan_de_Voorde2017" class="citation book cs1">Meyrueis, P.; Sakoda, K.; Van de Voorde, M., eds. (2017). <a rel="nofollow" class="external text" href="https://books.google.com/books?id=5cCnDgAAQBAJ&pg=PT1"><i>Micro- and Nanophotonic Technologies</i></a>. Wiley. <a href="/wiki/Doi_(identifier)" class="mw-redirect" title="Doi (identifier)">doi</a>:<a rel="nofollow" class="external text" href="https://doi.org/10.1002%2F9783527800728">10.1002/9783527800728</a>. <a href="/wiki/ISBN_(identifier)" class="mw-redirect" title="ISBN (identifier)">ISBN</a> <a href="/wiki/Special:BookSources/978-3-527-34037-8" title="Special:BookSources/978-3-527-34037-8"><bdi>978-3-527-34037-8</bdi></a>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=book&rft.btitle=Micro-+and+Nanophotonic+Technologies&rft.pub=Wiley&rft.date=2017&rft_id=info%3Adoi%2F10.1002%2F9783527800728&rft.isbn=978-3-527-34037-8&rft_id=https%3A%2F%2Fbooks.google.com%2Fbooks%3Fid%3D5cCnDgAAQBAJ%26pg%3DPT1&rfr_id=info%3Asid%2Fen.wikipedia.org%3AMicrofabrication" class="Z3988"></span></li></ul> </div> <div class="mw-heading mw-heading2"><h2 id="External_links">External links</h2><span class="mw-editsection"><span 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typeof="mw:File"><a href="/wiki/File:Wikibooks-logo-en-noslogan.svg" class="mw-file-description"><img alt="" src="//upload.wikimedia.org/wikipedia/commons/thumb/d/df/Wikibooks-logo-en-noslogan.svg/40px-Wikibooks-logo-en-noslogan.svg.png" decoding="async" width="40" height="40" class="mw-file-element" srcset="//upload.wikimedia.org/wikipedia/commons/thumb/d/df/Wikibooks-logo-en-noslogan.svg/60px-Wikibooks-logo-en-noslogan.svg.png 1.5x, //upload.wikimedia.org/wikipedia/commons/thumb/d/df/Wikibooks-logo-en-noslogan.svg/80px-Wikibooks-logo-en-noslogan.svg.png 2x" data-file-width="400" data-file-height="400" /></a></span></div> <div class="side-box-text plainlist">Wikibooks has a book on the topic of: <i><b><a href="https://en.wikibooks.org/wiki/Microtechnology" class="extiw" title="wikibooks:Microtechnology">Microtechnology</a></b></i></div></div> </div> <ul><li><a rel="nofollow" class="external text" href="http://www.memsuniverse.com/?p=1156">Videos and animations on microfabrication 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transducer">Interdigital transducer</a></li> <li><a href="/wiki/Cantilever#In_microelectromechanical_systems" title="Cantilever">Cantilever</a></li> <li><a href="/wiki/Microchannel_(microtechnology)" title="Microchannel (microtechnology)">Microchannel</a></li></ul> </div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%">Applications</th><td class="navbox-list-with-group navbox-list navbox-odd" style="width:100%;padding:0"><div style="padding:0 0.25em"></div><table class="nowraplinks navbox-subgroup" style="border-spacing:0"><tbody><tr><th scope="row" class="navbox-group" style="width:7em"><a href="/wiki/Sensor" title="Sensor">Sensors</a></th><td class="navbox-list-with-group navbox-list navbox-even" style="padding:0"><div style="padding:0 0.25em"> <ul><li><a href="/wiki/Microbolometer" title="Microbolometer">Microbolometer</a></li></ul> </div></td></tr><tr><th scope="row" class="navbox-group" style="width:7em"><a href="/wiki/Actuator" title="Actuator">Actuators</a></th><td class="navbox-list-with-group navbox-list navbox-odd" style="padding:0"><div style="padding:0 0.25em"> <ul><li><a href="/wiki/Comb_drive" title="Comb drive">Comb drive</a></li> <li><a href="/wiki/Scratch_drive_actuator" title="Scratch drive actuator">Scratch drive actuator</a></li> <li><a href="/wiki/MEMS_thermal_actuator" class="mw-redirect" title="MEMS thermal actuator">Thermal actuator</a></li></ul> </div></td></tr><tr><th scope="row" class="navbox-group" style="width:7em"><a href="/wiki/Switch" title="Switch">Switches</a></th><td class="navbox-list-with-group navbox-list navbox-even" style="padding:0"><div style="padding:0 0.25em"> <ul><li><a href="/wiki/Digital_micromirror_device" title="Digital micromirror device">Digital micromirror device</a></li> <li><a href="/wiki/Optical_switch" class="mw-redirect" title="Optical switch">Optical switch</a></li></ul> </div></td></tr><tr><th scope="row" class="navbox-group" style="width:7em">Other</th><td class="navbox-list-with-group navbox-list navbox-odd" style="padding:0"><div style="padding:0 0.25em"> <ul><li><a href="/wiki/Millipede_memory" title="Millipede memory">Millipede memory</a></li> <li><a href="/wiki/Radio-frequency_microelectromechanical_system" title="Radio-frequency microelectromechanical system">Radio-frequency microelectromechanical systems</a></li> <li><a href="/wiki/Microoptoelectromechanical_systems" title="Microoptoelectromechanical systems">Microoptoelectromechanical systems</a></li> <li><a href="/wiki/Microphotonics" title="Microphotonics">Microphotonics</a></li> <li><a href="/wiki/Bio-MEMS" title="Bio-MEMS">Biological microelectromechanical systems</a></li> <li><a href="/wiki/Category:Microfluidics" title="Category:Microfluidics">Microfluidics</a></li> <li><a href="/wiki/Micropower" title="Micropower">Micropower</a></li></ul> </div></td></tr></tbody></table><div></div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%">Processes</th><td class="navbox-list-with-group navbox-list navbox-odd" style="width:100%;padding:0"><div style="padding:0 0.25em"></div><table class="nowraplinks navbox-subgroup" style="border-spacing:0"><tbody><tr><th scope="row" class="navbox-group" style="width:7em">General</th><td class="navbox-list-with-group navbox-list navbox-even" style="padding:0"><div style="padding:0 0.25em"> <ul><li><a href="/wiki/Surface_micromachining" title="Surface micromachining">Surface micromachining</a></li> <li><a href="/wiki/Bulk_micromachining" title="Bulk micromachining">Bulk micromachining</a></li> <li><a href="/wiki/Microelectromechanical_systems#High_aspect_ratio_(HAR)_micromachining" class="mw-redirect" title="Microelectromechanical systems">HAR micromachining</a></li> <li><a href="/wiki/Category:Thin_film_deposition" title="Category:Thin film deposition">Deposition</a></li> <li><a href="/wiki/Category:Lithography_(microfabrication)" title="Category:Lithography (microfabrication)">Lithography</a></li> <li><a href="/wiki/Category:Etching_(microfabrication)" title="Category:Etching (microfabrication)">Etching</a></li> <li><a href="/wiki/Wire_bonding" title="Wire bonding">Wire bonding</a></li> <li><a href="/wiki/3D_microfabrication" title="3D microfabrication">3D microfabrication</a></li></ul> </div></td></tr><tr><th scope="row" class="navbox-group" style="width:7em">Specific</th><td class="navbox-list-with-group navbox-list navbox-odd" style="padding:0"><div style="padding:0 0.25em"> <ul><li><a href="/wiki/LOCOS" title="LOCOS">LOCOS</a></li> <li><a href="/wiki/Shallow_trench_isolation" title="Shallow trench isolation">Shallow trench isolation</a></li> <li><a href="/wiki/LIGA" title="LIGA">LIGA</a></li> <li><a href="/wiki/Lift-off_(microtechnology)" title="Lift-off (microtechnology)">Lift-off</a></li> <li><a href="/wiki/Photolithography" title="Photolithography">Photolithography</a></li> <li><a href="/wiki/Silicon_on_insulator" title="Silicon on insulator">Silicon on insulator</a></li> <li><a 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