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id="title">中机新材——团聚金刚石技术,赋能晶圆减薄新高度</h1> <div class="info"> <span style="padding-right:1em">日期:2024-10-31</span> <span id="hits">阅读:307</span> </div> <div class="introduce">核心提示:团聚金刚石技术是中机新材在金刚石减薄砂轮领域的一大创新。通过这一技术,能够有效地解决微粉磨料的软团聚问题,提高混料的均匀性。</div><div id="content"><div class="content" id="article"><p><strong>一、团聚金刚石,开启晶圆磨抛新时代——中机新材技术引领</strong></p> <p>在晶圆磨抛的道路上,中机新材始终走在前列。我们深知,技术是推动行业发展的关键。因此,中机新材不断投入研发,创新性地发展了团聚金刚石技术,为晶圆减薄砂轮的性能提升注入了新的活力。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202410/31/104008651.png" width="668" height="414" alt="" /></p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202410/31/104016301.png" width="668" height="377" alt="" /></p> <p><strong>二、团聚技术,优势显著</strong></p> <p>团聚金刚石技术是中机新材在金刚石减薄砂轮领域的一大创新。通过这一技术,我们能够有效地解决微粉磨料的软团聚问题,提高混料的均匀性。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202410/31/104209811.jpg" width="668" height="667" alt="" /></p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202410/31/104234251.jpg" width="668" height="668" alt="" /></p> <p>同时,团聚金刚石还具有更高的硬度和强度,能够更好地满足晶圆减薄过程中对磨削能力的需求。这一技术的应用,使得中机新材的金刚石减薄砂轮在加工效率、加工质量和使用寿命上均取得了显著提升。</p> <p><strong>三、工艺精湛,品质卓越</strong></p> <p>除了团聚金刚石技术外,结合日本住友工艺来生产晶圆减薄砂轮。这一工艺确保了砂轮组织结构的均匀性和批次稳定性,为产品的卓越品质提供了有力保障。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202410/31/104332221.jpg" width="668" height="646" alt="" /></p> <p>中机新材的晶圆减薄用陶瓷金刚石砂轮系列,涵盖了600#、800#、1000#、2000#、8000#等多种粒度,能够满足不同客户的加工需求。、</p> <p>公司还具备生产30000#砂轮的技术能力,为更精细的加工提供了可能。特殊的制程工艺,加上金刚石砂轮硬度高、强度大、研削能力强的性能,可以做到其他金刚石磨料无法达到的表面质量。</p> <p>且产品应用范围也很广泛,但主要用于研削硬质合金、非金属材料等硬脆材料,尤其碳化硅、单晶硅材质。</p> <p><strong>四、SiC减薄工艺中的关键因素与砂轮选择</strong></p> <p>在SiC减薄工艺中,主轴减薄转速和进给速率对于去除速率和减薄质量有着一定影响。而砂轮参数则对于SiC减薄具有决定性的影响。为了获得理想的减薄效果,需要平衡砂轮的锋利度(稳定性)和寿命的关系。合适的砂轮孔隙率和烧结工艺决定了砂轮是否可以有效去除SiC,同时减少减薄过程中的砂轮损耗和保持其稳定性。</p> <p>针对不同能力的机台,可以根据机台主轴功率、最大转速和进给速率,选择合适的砂轮来兼顾生产效率、生产质量和砂轮损耗。在采用砂轮工艺进行SiC减薄时,控制砂轮稳定性和提高砂轮寿命往往是一对矛盾的关系。为了开发新的减薄砂轮,中机新材会根据客户端的设备和工艺参数,进行一系列的测试和调整,来平衡稳定性和寿命的问题,确保为客户提供最合适的耗材和解决方案。</p> <p><strong>五、产品多样,服务广泛</strong></p> <p>中机新材的金刚石减薄砂轮系列涵盖了多种粒度和结合剂类型,能够满足不同客户的加工需求。无论是SiC晶圆还是其他硬脆材料的加工,我们都能提供合适的研磨抛光解决方案。同时,我们还提供专业的技术支持和售后跟踪服务,确保客户在使用过程中得到最全面的支持。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202410/31/104345881.png" width="668" height="376" alt="" /></p> <p>展望未来,中机新材将继续深耕金刚石减薄砂轮领域,不断推出更多创新技术和优质产品,为半导体产业的发展贡献更多力量。</p> <p> (来源:中机新材)</p></div> </div> <div class="award"><div onclick="Go('http://www.casmita.com/member/award.php?mid=21&itemid=17041');">打赏</div></div><div id="comment" style="display:;"> <div class="block-head"><a href="http://www.casmita.com/comment/index.php?mid=21&itemid=17041"><b id="comment_count" class="px16 f_red">0</b> 条评论</a></div> <div id="comment_main"><div></div></div> </div> <script type="text/javascript" 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