Search results for: J. Meireles

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Meireles</title> <meta name="description" content="Search results for: J. Meireles"> <meta name="keywords" content="J. Meireles"> <meta name="viewport" content="width=device-width, initial-scale=1, minimum-scale=1, maximum-scale=1, user-scalable=no"> <meta charset="utf-8"> <link href="https://cdn.waset.org/favicon.ico" type="image/x-icon" rel="shortcut icon"> <link href="https://cdn.waset.org/static/plugins/bootstrap-4.2.1/css/bootstrap.min.css" rel="stylesheet"> <link href="https://cdn.waset.org/static/plugins/fontawesome/css/all.min.css" rel="stylesheet"> <link href="https://cdn.waset.org/static/css/site.css?v=150220211555" rel="stylesheet"> </head> <body> <header> <div class="container"> <nav class="navbar navbar-expand-lg navbar-light"> <a class="navbar-brand" href="https://waset.org"> <img src="https://cdn.waset.org/static/images/wasetc.png" alt="Open Science Research Excellence" title="Open Science Research Excellence" /> </a> <button class="d-block d-lg-none navbar-toggler ml-auto" type="button" data-toggle="collapse" data-target="#navbarMenu" aria-controls="navbarMenu" aria-expanded="false" aria-label="Toggle navigation"> <span class="navbar-toggler-icon"></span> </button> <div class="w-100"> <div class="d-none d-lg-flex flex-row-reverse"> <form method="get" action="https://waset.org/search" class="form-inline my-2 my-lg-0"> <input class="form-control mr-sm-2" type="search" placeholder="Search Conferences" value="J. 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Meireles"> <input type="submit" class="btn_search" value="Search"> </div> </div> </form> </div> </div> <div class="row mt-3"> <div class="col-sm-3"> <div class="card"> <div class="card-body"><strong>Commenced</strong> in January 2007</div> </div> </div> <div class="col-sm-3"> <div class="card"> <div class="card-body"><strong>Frequency:</strong> Monthly</div> </div> </div> <div class="col-sm-3"> <div class="card"> <div class="card-body"><strong>Edition:</strong> International</div> </div> </div> <div class="col-sm-3"> <div class="card"> <div class="card-body"><strong>Paper Count:</strong> 2</div> </div> </div> </div> <h1 class="mt-3 mb-3 text-center" style="font-size:1.6rem;">Search results for: J. Meireles</h1> <div class="card publication-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">2</span> Monitorization of Junction Temperature Using a Thermal-Test-Device</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/search?q=B.%20Arzhanov">B. Arzhanov</a>, <a href="https://publications.waset.org/search?q=A.%20Correia"> A. Correia</a>, <a href="https://publications.waset.org/search?q=P.%20Delgado"> P. Delgado</a>, <a href="https://publications.waset.org/search?q=J.%20Meireles"> J. Meireles</a> </p> <p class="card-text"><strong>Abstract:</strong></p> <p>Due to the higher power loss levels in electronic components, the thermal design of PCBs (Printed Circuit Boards) of an assembled device becomes one of the most important quality factors in electronics. Nonetheless, some of leading causes of the microelectronic component failures are due to higher temperatures, the leakages or thermal-mechanical stress, which is a concern, is the reliability of microelectronic packages. This article presents an experimental approach to measure the junction temperature of exposed pad packages. The implemented solution is in a prototype phase, using a temperature-sensitive parameter (TSP) to measure temperature directly on the die, validating the numeric results provided by the Mechanical APDL (<em>Ansys</em> Parametric Design Language) under same conditions. The physical device-under-test is composed by a Thermal Test Chip (TTC-1002) and assembly in a QFN cavity, soldered to a test-board according to JEDEC Standards. Monitoring the voltage drop across a forward-biased diode, is an indirectly method but accurate to obtain the junction temperature of QFN component with an applied power range between 0,3W to 1.5W. The temperature distributions on the PCB test-board and QFN cavity surface were monitored by an infra-red thermal camera (Goby-384) controlled and images processed by the <em>Xeneth</em> software. The article provides a set-up to monitorize in real-time the junction temperature of ICs, namely devices with the exposed pad package (i.e. QFN). Presenting the PCB layout parameters that the designer should use to improve thermal performance, and evaluate the impact of voids in solder interface in the device junction temperature.</p> <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/search?q=Quad%20Flat%20No-Lead%20packages" title="Quad Flat No-Lead packages">Quad Flat No-Lead packages</a>, <a href="https://publications.waset.org/search?q=exposed%20pads" title=" exposed pads"> exposed pads</a>, <a href="https://publications.waset.org/search?q=junction%20temperature" title=" junction temperature"> junction temperature</a>, <a href="https://publications.waset.org/search?q=thermal%20management" title=" thermal management"> thermal management</a>, <a href="https://publications.waset.org/search?q=measurements." title=" measurements."> measurements.</a> </p> <a href="https://publications.waset.org/10003904/monitorization-of-junction-temperature-using-a-thermal-test-device" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/10003904/apa" target="_blank" rel="nofollow" class="btn btn-primary btn-sm">APA</a> <a href="https://publications.waset.org/10003904/bibtex" target="_blank" rel="nofollow" class="btn btn-primary btn-sm">BibTeX</a> <a href="https://publications.waset.org/10003904/chicago" target="_blank" rel="nofollow" class="btn btn-primary btn-sm">Chicago</a> <a href="https://publications.waset.org/10003904/endnote" target="_blank" rel="nofollow" class="btn btn-primary btn-sm">EndNote</a> <a href="https://publications.waset.org/10003904/harvard" target="_blank" rel="nofollow" class="btn btn-primary btn-sm">Harvard</a> <a href="https://publications.waset.org/10003904/json" target="_blank" rel="nofollow" class="btn btn-primary btn-sm">JSON</a> <a href="https://publications.waset.org/10003904/mla" target="_blank" rel="nofollow" class="btn btn-primary btn-sm">MLA</a> <a href="https://publications.waset.org/10003904/ris" target="_blank" rel="nofollow" class="btn btn-primary btn-sm">RIS</a> <a href="https://publications.waset.org/10003904/xml" target="_blank" rel="nofollow" class="btn btn-primary btn-sm">XML</a> <a href="https://publications.waset.org/10003904/iso690" target="_blank" rel="nofollow" class="btn btn-primary btn-sm">ISO 690</a> <a href="https://publications.waset.org/10003904.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">1711</span> </span> </div> </div> <div class="card publication-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">1</span> Thermal Evaluation of Printed Circuit Board Design Options and Voids in Solder Interface by a Simulation Tool</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/search?q=B.%20Arzhanov">B. Arzhanov</a>, <a href="https://publications.waset.org/search?q=A.%20Correia"> A. Correia</a>, <a href="https://publications.waset.org/search?q=P.%20Delgado"> P. Delgado</a>, <a href="https://publications.waset.org/search?q=J.%20Meireles"> J. Meireles</a> </p> <p class="card-text"><strong>Abstract:</strong></p> Quad Flat No-Lead (QFN) packages have become very popular for turners, converters and audio amplifiers, among others applications, needing efficient power dissipation in small footprints. Since semiconductor junction temperature (T<sub>J</sub>) is a critical parameter in the product quality. And to ensure that <em>die</em> temperature does not exceed the maximum allowable T<sub>J</sub>, a thermal analysis conducted in an earlier development phase is essential to avoid repeated re-designs process with huge losses in cost and time. A simulation tool capable to estimate <em>die</em> temperature of components with QFN package was developed. Allow establish a non-empirical way to define an acceptance criterion for amount of voids in solder interface between its exposed pad and Printed Circuit Board (PCB) to be applied during industrialization process, and evaluate the impact of PCB designs parameters. Targeting PCB layout designer as an end user for the application, a user-friendly interface (GUI) was implemented allowing user to introduce design parameters in a convenient and secure way and hiding all the complexity of finite element simulation process. This cost effective tool turns transparent a simulating process and provides useful outputs after acceptable time, which can be adopted by PCB designers, preventing potential risks during the design stage and make product economically efficient by not oversizing it. This article gathers relevant information related to the design and implementation of the developed tool, presenting a parametric study conducted with it. The simulation tool was experimentally validated using a Thermal-Test-Chip (TTC) in a QFN open-cavity, in order to measure junction temperature (T<sub>J</sub>) directly on the <em>die</em> under controlled and knowing conditions. Providing a short overview about standard thermal solutions and impacts in exposed pad packages (i.e. QFN), accurately describe the methods and techniques that the system designer should use to achieve optimum thermal performance, and demonstrate the effect of system-level constraints on the thermal performance of the design. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/search?q=Quad%20Flat%20No-Lead%20packages" title="Quad Flat No-Lead packages">Quad Flat No-Lead packages</a>, <a href="https://publications.waset.org/search?q=exposed%20pads" title=" exposed pads"> exposed pads</a>, <a href="https://publications.waset.org/search?q=junction%20temperature" title=" junction temperature"> junction temperature</a>, <a href="https://publications.waset.org/search?q=thermal%20management%20and%20measurements." title=" thermal management and measurements."> thermal management and measurements.</a> </p> <a href="https://publications.waset.org/10003817/thermal-evaluation-of-printed-circuit-board-design-options-and-voids-in-solder-interface-by-a-simulation-tool" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/10003817/apa" target="_blank" rel="nofollow" class="btn btn-primary btn-sm">APA</a> <a href="https://publications.waset.org/10003817/bibtex" target="_blank" rel="nofollow" class="btn btn-primary btn-sm">BibTeX</a> <a href="https://publications.waset.org/10003817/chicago" target="_blank" rel="nofollow" class="btn btn-primary btn-sm">Chicago</a> <a href="https://publications.waset.org/10003817/endnote" target="_blank" rel="nofollow" class="btn btn-primary btn-sm">EndNote</a> <a href="https://publications.waset.org/10003817/harvard" target="_blank" rel="nofollow" class="btn btn-primary btn-sm">Harvard</a> <a href="https://publications.waset.org/10003817/json" target="_blank" rel="nofollow" class="btn btn-primary btn-sm">JSON</a> <a 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Search results for: J. Meireles