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class="cdx-button cdx-button--weight-quiet cdx-button--icon-only vector-toc-toggle"> <span class="vector-icon mw-ui-icon-wikimedia-expand"></span> <span>Toggle Design, manufacturing, and reliability challenges subsection</span> </button> <ul id="toc-Design,_manufacturing,_and_reliability_challenges-sublist" class="vector-toc-list"> <li id="toc-Design_and_manufacturing" class="vector-toc-list-item vector-toc-level-2"> <a class="vector-toc-link" href="#Design_and_manufacturing"> <div class="vector-toc-text"> <span class="vector-toc-numb">4.1</span> <span>Design and manufacturing</span> </div> </a> <ul id="toc-Design_and_manufacturing-sublist" class="vector-toc-list"> </ul> </li> <li id="toc-Reliability" class="vector-toc-list-item vector-toc-level-2"> <a class="vector-toc-link" href="#Reliability"> <div class="vector-toc-text"> <span class="vector-toc-numb">4.2</span> <span>Reliability</span> </div> </a> <ul id="toc-Reliability-sublist" class="vector-toc-list"> </ul> </li> </ul> </li> <li id="toc-Comparison_to_other_packages" class="vector-toc-list-item vector-toc-level-1 vector-toc-list-item-expanded"> <a class="vector-toc-link" href="#Comparison_to_other_packages"> <div class="vector-toc-text"> <span class="vector-toc-numb">5</span> <span>Comparison to other packages</span> </div> </a> <ul id="toc-Comparison_to_other_packages-sublist" class="vector-toc-list"> </ul> </li> <li id="toc-Variants" class="vector-toc-list-item vector-toc-level-1 vector-toc-list-item-expanded"> <a class="vector-toc-link" href="#Variants"> <div class="vector-toc-text"> <span class="vector-toc-numb">6</span> <span>Variants</span> </div> </a> <ul id="toc-Variants-sublist" class="vector-toc-list"> </ul> </li> <li id="toc-See_also" class="vector-toc-list-item vector-toc-level-1 vector-toc-list-item-expanded"> <a class="vector-toc-link" href="#See_also"> <div class="vector-toc-text"> <span class="vector-toc-numb">7</span> <span>See also</span> </div> </a> <ul id="toc-See_also-sublist" class="vector-toc-list"> </ul> </li> <li id="toc-References" class="vector-toc-list-item vector-toc-level-1 vector-toc-list-item-expanded"> <a class="vector-toc-link" href="#References"> <div class="vector-toc-text"> <span class="vector-toc-numb">8</span> <span>References</span> </div> </a> <ul id="toc-References-sublist" class="vector-toc-list"> </ul> </li> <li id="toc-External_links" class="vector-toc-list-item vector-toc-level-1 vector-toc-list-item-expanded"> <a class="vector-toc-link" href="#External_links"> <div class="vector-toc-text"> <span class="vector-toc-numb">9</span> <span>External links</span> </div> </a> <ul id="toc-External_links-sublist" class="vector-toc-list"> </ul> </li> </ul> </div> </div> </nav> </div> </div> <div class="mw-content-container"> <main id="content" class="mw-body"> <header class="mw-body-header vector-page-titlebar"> <nav aria-label="Contents" class="vector-toc-landmark"> <div id="vector-page-titlebar-toc" class="vector-dropdown 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class="interlanguage-link interwiki-pt mw-list-item"><a href="https://pt.wikipedia.org/wiki/Quad_Flat_No_leads" title="Quad Flat No leads – Portuguese" lang="pt" hreflang="pt" data-title="Quad Flat No leads" data-language-autonym="Português" data-language-local-name="Portuguese" class="interlanguage-link-target"><span>Português</span></a></li><li class="interlanguage-link interwiki-ru mw-list-item"><a href="https://ru.wikipedia.org/wiki/QFN" title="QFN – Russian" lang="ru" hreflang="ru" data-title="QFN" data-language-autonym="Русский" data-language-local-name="Russian" class="interlanguage-link-target"><span>Русский</span></a></li> </ul> <div class="after-portlet after-portlet-lang"><span class="wb-langlinks-edit wb-langlinks-link"><a href="https://www.wikidata.org/wiki/Special:EntityPage/Q2121809#sitelinks-wikipedia" title="Edit interlanguage links" class="wbc-editpage">Edit links</a></span></div> </div> </div> </div> </header> <div class="vector-page-toolbar"> <div 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No-leads package</a>)</span></div></div> <div id="mw-content-text" class="mw-body-content"><div class="mw-content-ltr mw-parser-output" lang="en" dir="ltr"><div class="shortdescription nomobile noexcerpt noprint searchaux" style="display:none">Integrated circuit package with contacts on all 4 sides, on the underside of the package</div> <style data-mw-deduplicate="TemplateStyles:r1236090951">.mw-parser-output .hatnote{font-style:italic}.mw-parser-output div.hatnote{padding-left:1.6em;margin-bottom:0.5em}.mw-parser-output .hatnote i{font-style:normal}.mw-parser-output .hatnote+link+.hatnote{margin-top:-0.5em}@media print{body.ns-0 .mw-parser-output .hatnote{display:none!important}}</style><div role="note" class="hatnote navigation-not-searchable">"QFN" redirects here. For the airport, see <a href="/wiki/Narsaq_Kujalleq_Heliport" title="Narsaq Kujalleq Heliport">Narsaq Kujalleq Heliport</a>.</div> <figure class="mw-halign-right" typeof="mw:File/Thumb"><a href="/wiki/File:28_pin_MLP_integrated_circuit.jpg" class="mw-file-description"><img src="//upload.wikimedia.org/wikipedia/commons/thumb/2/23/28_pin_MLP_integrated_circuit.jpg/200px-28_pin_MLP_integrated_circuit.jpg" decoding="async" width="200" height="200" class="mw-file-element" srcset="//upload.wikimedia.org/wikipedia/commons/thumb/2/23/28_pin_MLP_integrated_circuit.jpg/300px-28_pin_MLP_integrated_circuit.jpg 1.5x, //upload.wikimedia.org/wikipedia/commons/thumb/2/23/28_pin_MLP_integrated_circuit.jpg/400px-28_pin_MLP_integrated_circuit.jpg 2x" data-file-width="772" data-file-height="772" /></a><figcaption>28-pin QFN, upside down to show contacts and thermal/ground pad</figcaption></figure> <p><b>Flat no-leads</b> packages such as <b>quad-flat no-leads</b> (<b>QFN</b>)<a rel="nofollow" class="external autonumber" href="https://anysilicon.com/ultimate-guide-qfn-package/">[1]</a> and <b>dual-flat no-leads</b> (<b>DFN</b>) physically and electrically connect <a href="/wiki/Integrated_circuit" title="Integrated circuit">integrated circuits</a> to <a href="/wiki/Printed_circuit_board" title="Printed circuit board">printed circuit boards</a>. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a <a href="/wiki/Surface-mount_technology" title="Surface-mount technology">surface-mount technology</a>, one of several package technologies that connect <a href="/wiki/Integrated_circuit" title="Integrated circuit">ICs</a> to the <i>surfaces</i> of <a href="/wiki/Printed_circuit_board" title="Printed circuit board">PCBs</a> without <a href="/wiki/Through-hole_technology" title="Through-hole technology">through-holes</a>. Flat no-lead is a near <a href="/wiki/Chip_scale_package" class="mw-redirect" title="Chip scale package">chip scale</a> plastic encapsulated package made with a planar <a href="/wiki/Copper_conductor" title="Copper conductor">copper</a> lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the <a href="/wiki/Printed_circuit_board" title="Printed circuit board">PCB</a>.<sup id="cite_ref-1" class="reference"><a href="#cite_note-1"><span class="cite-bracket">[</span>1<span class="cite-bracket">]</span></a></sup> Flat no-lead packages usually, but not always, include an exposed <a href="/wiki/Thermally_conductive_pad" title="Thermally conductive pad">thermally conductive pad</a> to improve heat transfer out of the <a href="/wiki/Integrated_circuit" title="Integrated circuit">IC</a> (into the PCB). Heat transfer can be further facilitated by metal <a href="/wiki/Via_(electronics)" title="Via (electronics)">vias</a> in the thermal pad.<sup id="cite_ref-2" class="reference"><a href="#cite_note-2"><span class="cite-bracket">[</span>2<span class="cite-bracket">]</span></a></sup> The QFN package is similar to the <a href="/wiki/Quad-flat_package" class="mw-redirect" title="Quad-flat package">quad-flat package</a> (QFP), and a <a href="/wiki/Ball_grid_array" title="Ball grid array">ball grid array</a> (BGA). </p> <meta property="mw:PageProp/toc" /> <div class="mw-heading mw-heading2"><h2 id="Flat_no-lead_cross-section">Flat no-lead cross-section</h2><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Flat_no-leads_package&action=edit&section=1" title="Edit section: Flat no-lead cross-section"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <figure class="mw-default-size" typeof="mw:File/Thumb"><a href="/wiki/File:QFN_sideview.svg" class="mw-file-description"><img src="//upload.wikimedia.org/wikipedia/commons/thumb/d/da/QFN_sideview.svg/220px-QFN_sideview.svg.png" decoding="async" width="220" height="131" class="mw-file-element" srcset="//upload.wikimedia.org/wikipedia/commons/thumb/d/da/QFN_sideview.svg/330px-QFN_sideview.svg.png 1.5x, //upload.wikimedia.org/wikipedia/commons/thumb/d/da/QFN_sideview.svg/440px-QFN_sideview.svg.png 2x" data-file-width="450" data-file-height="267" /></a><figcaption>QFN side view.</figcaption></figure> <p>The figure shows the cross section of a flat no-lead package with a <a href="/wiki/Lead_frame" title="Lead frame">lead frame</a> and <a href="/wiki/Wire_bonding" title="Wire bonding">wire bonding</a>. There are two types of body designs, <i>punch singulation</i> and <i>saw singulation</i>.<sup id="cite_ref-3" class="reference"><a href="#cite_note-3"><span class="cite-bracket">[</span>3<span class="cite-bracket">]</span></a></sup> Saw singulation cuts a large set of packages in parts. In punch singulation, a single package is moulded into shape. The cross section shows a saw-singulated body with an attached thermal head pad. The lead frame is made of copper alloy and a thermally conductive adhesive is used for attaching the silicon die to the thermal pad. The silicon die is electrically connected to the lead frame by 1–2 <a href="/wiki/Thousandth_of_an_inch" title="Thousandth of an inch">thou</a> diameter <a href="/wiki/Wire_bonding" title="Wire bonding">gold wires</a>. </p><p>The pads of a saw-singulated package can either be completely under the <a href="/wiki/List_of_electronic_component_packaging_types" title="List of electronic component packaging types">package</a>, or they can fold around the edge of the package. </p> <div class="mw-heading mw-heading2"><h2 id="Different_types">Different types</h2><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Flat_no-leads_package&action=edit&section=2" title="Edit section: Different types"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <p>Two types of QFN packages are common: <b>air-cavity QFNs</b>, with an air cavity designed into the package, and <b>plastic-moulded QFNs</b> with air in the package minimized. </p><p>Less-expensive plastic-moulded QFNs are usually limited to applications up to ~2–3 GHz. It is usually composed of just 2 parts, a plastic compound and copper lead frame, and does not come with a lid. </p><p>In contrast, the air-cavity QFN is usually made up of three parts; a copper leadframe, plastic-moulded body (open, and not sealed), and either a ceramic or plastic lid. It is usually more expensive due to its construction, and can be used for microwave applications up to 20–25 GHz. </p><p>QFN packages can have a single row of contacts or a double row of contacts. </p> <div class="mw-heading mw-heading2"><h2 id="Advantages">Advantages</h2><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Flat_no-leads_package&action=edit&section=3" title="Edit section: Advantages"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <p>This package offers a variety of benefits including reduced lead inductance, a small sized "near chip scale" footprint, thin profile and low weight. It also uses perimeter I/O pads to ease PCB trace routing, and the exposed copper die-pad technology offers good thermal and electrical performance. These features make the QFN an ideal choice for many new applications where size, weight, thermal and electrical performance are important. </p> <div class="mw-heading mw-heading2"><h2 id="Design,_manufacturing,_and_reliability_challenges"><span id="Design.2C_manufacturing.2C_and_reliability_challenges"></span>Design, manufacturing, and reliability challenges</h2><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Flat_no-leads_package&action=edit&section=4" title="Edit section: Design, manufacturing, and reliability challenges"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <p>Improved packaging technologies and component miniaturization can often lead to new or unexpected design, manufacturing, and reliability issues. This has been the case with QFN packages, especially when it comes to adoption by new non-consumer electronic <a href="/wiki/OEM" class="mw-redirect" title="OEM">OEMs</a>. </p> <div class="mw-heading mw-heading3"><h3 id="Design_and_manufacturing">Design and manufacturing</h3><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Flat_no-leads_package&action=edit&section=5" title="Edit section: Design and manufacturing"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <p>Some key QFN design considerations are pad and stencil design. When it comes to bond pad design two approaches can be taken: <a href="/wiki/Solder_mask" title="Solder mask">solder mask</a> defined (SMD) or non-solder mask defined (NSMD). A NSMD approach typically leads to more reliable joints, since the <a href="/wiki/Solder" title="Solder">solder</a> is able to bond to both the top and sides of the copper pad.<sup id="cite_ref-4" class="reference"><a href="#cite_note-4"><span class="cite-bracket">[</span>4<span class="cite-bracket">]</span></a></sup> The copper etching process also generally has tighter control than the solder masking process, resulting in more consistent joints.<sup id="cite_ref-5" class="reference"><a href="#cite_note-5"><span class="cite-bracket">[</span>5<span class="cite-bracket">]</span></a></sup> This does have the potential to affect the thermal and electrical performance of the joints, so it can be helpful to consult the package manufacturer for optimal performance parameters. SMD pads can be used to reduce the chances of <a href="/wiki/Solder_bridging" class="mw-redirect" title="Solder bridging">solder bridging</a>, however this may affect overall reliability of the joints. Stencil design is another key parameter in QFN design process. Proper aperture design and stencil thickness can help produce more consistent joints (i.e. minimal voiding, outgassing, and floating parts) with proper thickness, leading to improved reliability.<sup id="cite_ref-6" class="reference"><a href="#cite_note-6"><span class="cite-bracket">[</span>6<span class="cite-bracket">]</span></a></sup> </p><p>There are also issues on the manufacturing side. For larger QFN components, moisture absorption during <a href="/wiki/Reflow_Soldering" class="mw-redirect" title="Reflow Soldering">solder reflow</a> can be a concern. If there is a large amount of moisture absorption into the package then heating during reflow can lead to excessive component warpage. This often results in the corners of the component lifting off the <a href="/wiki/Printed_circuit_board" title="Printed circuit board">printed circuit board</a>, causing improper joint formation. To reduce the risk of warpage issues during reflow a <a href="/wiki/Moisture_sensitivity_level" title="Moisture sensitivity level">moisture sensitivity level</a> of 3 or higher is recommended.<sup id="cite_ref-RelQFN_7-0" class="reference"><a href="#cite_note-RelQFN-7"><span class="cite-bracket">[</span>7<span class="cite-bracket">]</span></a></sup> Several other issues with QFN manufacturing include: part floating due to excessive solder paste under the center thermal pad, large solder voiding, poor reworkable characteristics, and optimization of the solder reflow profile.<sup id="cite_ref-8" class="reference"><a href="#cite_note-8"><span class="cite-bracket">[</span>8<span class="cite-bracket">]</span></a></sup> </p> <div class="mw-heading mw-heading3"><h3 id="Reliability">Reliability</h3><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Flat_no-leads_package&action=edit&section=6" title="Edit section: Reliability"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <p>Component packaging is often driven by the consumer electronics market with less consideration given to higher reliability industries such as automotive and aviation. It can therefore be challenging to integrate component package families, such as the QFN, into high reliability environments. QFN components are known to be susceptible to <a href="/wiki/Solder_fatigue" title="Solder fatigue">solder fatigue</a> issues, especially thermomechanical fatigue due to <a href="/wiki/Temperature_cycling" title="Temperature cycling">thermal cycling</a>. The significantly lower standoff in QFN packages can lead to higher thermomechanical strains due to <a href="/wiki/Coefficient_of_thermal_expansion" class="mw-redirect" title="Coefficient of thermal expansion">coefficient of thermal expansion</a> (CTE) mismatch as compared to leaded packages. For example, under accelerated thermal cycling conditions between -40 °C to 125 °C, various <a href="/wiki/Quad_flat_package" title="Quad flat package">quad flat package</a> (QFP) components can last over 10,000 thermal cycles whereas QFN components tend to fail at around 1,000-3,000 cycles.<sup id="cite_ref-RelQFN_7-1" class="reference"><a href="#cite_note-RelQFN-7"><span class="cite-bracket">[</span>7<span class="cite-bracket">]</span></a></sup> </p><p>Historically, reliability testing has been mainly driven by <a href="/wiki/JEDEC" title="JEDEC">JEDEC</a>,<sup id="cite_ref-9" class="reference"><a href="#cite_note-9"><span class="cite-bracket">[</span>9<span class="cite-bracket">]</span></a></sup><sup id="cite_ref-10" class="reference"><a href="#cite_note-10"><span class="cite-bracket">[</span>10<span class="cite-bracket">]</span></a></sup><sup id="cite_ref-11" class="reference"><a href="#cite_note-11"><span class="cite-bracket">[</span>11<span class="cite-bracket">]</span></a></sup><sup id="cite_ref-12" class="reference"><a href="#cite_note-12"><span class="cite-bracket">[</span>12<span class="cite-bracket">]</span></a></sup> however this has primarily focused on die and 1st level interconnects. <a href="/wiki/IPC_(electronics)" title="IPC (electronics)">IPC</a>-9071A<sup id="cite_ref-13" class="reference"><a href="#cite_note-13"><span class="cite-bracket">[</span>13<span class="cite-bracket">]</span></a></sup> attempted to address this by focusing on 2nd level interconnects (i.e. package to PCB substrate). The challenge with this standard is that it has been more adopted by OEMs than component manufacturers, who tend to view it as an application-specific issue. As a result there has been much experimental testing and <a href="/wiki/Finite_element_method" title="Finite element method">finite element analysis</a> across various QFN package variants to characterize their reliability and <a href="/wiki/Solder_fatigue" title="Solder fatigue">solder fatigue</a> behavior.<sup id="cite_ref-14" class="reference"><a href="#cite_note-14"><span class="cite-bracket">[</span>14<span class="cite-bracket">]</span></a></sup><sup id="cite_ref-15" class="reference"><a href="#cite_note-15"><span class="cite-bracket">[</span>15<span class="cite-bracket">]</span></a></sup><sup id="cite_ref-16" class="reference"><a href="#cite_note-16"><span class="cite-bracket">[</span>16<span class="cite-bracket">]</span></a></sup><sup id="cite_ref-17" class="reference"><a href="#cite_note-17"><span class="cite-bracket">[</span>17<span class="cite-bracket">]</span></a></sup><sup id="cite_ref-18" class="reference"><a href="#cite_note-18"><span class="cite-bracket">[</span>18<span class="cite-bracket">]</span></a></sup><sup id="cite_ref-19" class="reference"><a href="#cite_note-19"><span class="cite-bracket">[</span>19<span class="cite-bracket">]</span></a></sup><sup id="cite_ref-20" class="reference"><a href="#cite_note-20"><span class="cite-bracket">[</span>20<span class="cite-bracket">]</span></a></sup> </p><p>Serebreni et al.<sup id="cite_ref-21" class="reference"><a href="#cite_note-21"><span class="cite-bracket">[</span>21<span class="cite-bracket">]</span></a></sup> proposed a semi-analytical model to assess the reliability QFN solder joints under thermal cycling. This model generates effective mechanical properties for the QFN package, and calculates the <a href="/wiki/Shear_stress" title="Shear stress">shear stress</a> and <a href="/wiki/Deformation_(mechanics)" class="mw-redirect" title="Deformation (mechanics)">strain</a> using a model proposed by Chen and Nelson.<sup id="cite_ref-22" class="reference"><a href="#cite_note-22"><span class="cite-bracket">[</span>22<span class="cite-bracket">]</span></a></sup> The dissipated strain energy density is then determined from these values and used to predict characteristic cycles to failure using a 2-parameter <a href="/wiki/Weibull_distribution" title="Weibull distribution">Weibull curve</a>. </p> <div class="mw-heading mw-heading2"><h2 id="Comparison_to_other_packages">Comparison to other packages</h2><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Flat_no-leads_package&action=edit&section=7" title="Edit section: Comparison to other packages"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <p>The QFN package is similar to the <a href="/wiki/Quad_flat_package" title="Quad flat package">quad flat package</a>, but the leads do not extend out from the package sides. It is hence difficult to hand-solder a QFN package, inspect solder joint quality, or probe lead(s). </p> <div class="mw-heading mw-heading2"><h2 id="Variants">Variants</h2><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Flat_no-leads_package&action=edit&section=8" title="Edit section: Variants"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <p>Different manufacturers use different names for this package: ML (micro-leadframe) versus FN (flat no-lead), in addition there are versions with pads on all four sides (quad) and pads on just two sides (dual), thickness varying between 0.9–1.0 mm for normal packages and 0.4 mm for extremely thin. Abbreviations include: </p> <table class="wikitable sortable"> <tbody><tr> <th>Package</th> <th>Description</th> <th>Manufacturer </th></tr> <tr> <td>DFN</td> <td>dual flat no-lead package</td> <td>Atmel, ROHM Semiconductor </td></tr> <tr> <td>DQFN</td> <td>dual quad flat no-lead package</td> <td>Atmel </td></tr> <tr> <td>cDFN</td> <td></td> <td><a href="https://de.wikipedia.org/wiki/IC-Haus" class="extiw" title="de:IC-Haus">iC-Haus</a> </td></tr> <tr> <td>TDFN</td> <td>thin dual flat no-lead package</td> <td> </td></tr> <tr> <td>UTDFN</td> <td>ultra-thin dual flat no-lead package</td> <td> </td></tr> <tr> <td>XDFN</td> <td>extremely thin dual flat no-lead package</td> <td> </td></tr> <tr> <td>QFN</td> <td>quad flat no-lead package</td> <td><a href="/wiki/Amkor_Technology" title="Amkor Technology">Amkor Technology</a> </td></tr> <tr> <td>QFN-TEP</td> <td>quad flat no-lead package with top-exposed pad</td> <td> </td></tr> <tr> <td>TQFN</td> <td>thin quad flat no-lead package</td> <td> </td></tr> <tr> <td>LLP</td> <td>leadless leadframe package</td> <td><a href="/wiki/National_Semiconductor" title="National Semiconductor">National Semiconductor</a> </td></tr> <tr> <td>LPCC</td> <td>leadless plastic chip carrier</td> <td>ASAT Holdings </td></tr> <tr> <td>MLF</td> <td>micro-leadframe</td> <td>Amkor Technology and Atmel </td></tr> <tr> <td>MLPD</td> <td>micro-leadframe package dual</td> <td> </td></tr> <tr> <td>MLPM</td> <td>micro-leadframe package micro</td> <td> </td></tr> <tr> <td>MLPQ</td> <td>micro-leadframe package quad</td> <td> </td></tr> <tr> <td>DRMLF</td> <td>dual-row micro-leadframe package</td> <td><a href="/wiki/Amkor_Technology" title="Amkor Technology">Amkor Technology</a> </td></tr> <tr> <td>DRQFN </td> <td>dual-row quad flat no-lead </td> <td><a href="/wiki/Microchip_Technology" title="Microchip Technology">Microchip Technology</a> </td></tr> <tr> <td>VQFN/WQFN</td> <td>very thin quad flat no-lead</td> <td><a href="/wiki/Texas_Instruments" title="Texas Instruments">Texas Instruments</a> and others (such as Atmel, ROHM Semiconductor) </td></tr> <tr> <td>HVQFN </td> <td>Heatsink Very-thin Quad Flat package </td> <td> </td></tr> <tr> <td>UDFN</td> <td>ultra dual flat no-lead</td> <td><a href="/wiki/Microchip_Technology" title="Microchip Technology">Microchip Technology</a> </td></tr> <tr> <td>UQFN</td> <td>ultrathin quad flat no-lead</td> <td><a href="/wiki/Texas_Instruments" title="Texas Instruments">Texas Instruments</a> and <a href="/wiki/Microchip_Technology" title="Microchip Technology">Microchip Technology</a> </td></tr></tbody></table> <figure class="mw-default-size mw-halign-right" typeof="mw:File/Thumb"><a href="/wiki/File:Ic-package-MLP-28L.svg" class="mw-file-description"><img src="//upload.wikimedia.org/wikipedia/commons/thumb/3/32/Ic-package-MLP-28L.svg/220px-Ic-package-MLP-28L.svg.png" decoding="async" width="220" height="220" class="mw-file-element" srcset="//upload.wikimedia.org/wikipedia/commons/thumb/3/32/Ic-package-MLP-28L.svg/330px-Ic-package-MLP-28L.svg.png 1.5x, //upload.wikimedia.org/wikipedia/commons/thumb/3/32/Ic-package-MLP-28L.svg/440px-Ic-package-MLP-28L.svg.png 2x" data-file-width="100" data-file-height="100" /></a><figcaption>Micro lead frame package</figcaption></figure> <p><b>Micro lead frame package</b> (MLP) is a family of <a href="/wiki/Integrated_circuit" title="Integrated circuit">integrated circuit</a> QFN packages, used in <a href="/wiki/Surface_mount_technology" class="mw-redirect" title="Surface mount technology">surface mounted</a> <a href="/wiki/Electronics" title="Electronics">electronic</a> circuits designs. It is available in 3 versions which are MLPQ (Q stands for <i>quad</i>), MLPM (M stands for <i>micro</i>), and MLPD (D stands for <i>dual</i>). These package generally have an exposed die attach pad to improve thermal performance. This package is similar to <a href="/wiki/Chip_scale_package" class="mw-redirect" title="Chip scale package">chip scale packages</a> (CSP) in construction. MLPD are designed to provide a footprint-compatible replacement for <a href="/wiki/Small-outline_integrated_circuit" class="mw-redirect" title="Small-outline integrated circuit">small-outline integrated circuit</a> (SOIC) packages. </p><p><b>Micro lead frame</b> (MLF) is a near <a href="/wiki/Chip_scale_package" class="mw-redirect" title="Chip scale package">CSP</a> plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the <a href="/wiki/Printed_circuit_board" title="Printed circuit board">printed circuit board</a>. The die attach paddle is exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the circuit board. This also enables stable ground by use of down bonds or by electrical connection through a conductive die attach material. </p><p>A more recent design variation which allows for higher density connections is the <i>dual row micro lead frame</i> (DRMLF) package. This is an MLF package with two rows of lands for devices requiring up to 164 I/O. Typical applications include hard disk drives, USB controllers, and wireless LAN. </p> <div class="mw-heading mw-heading2"><h2 id="See_also">See also</h2><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Flat_no-leads_package&action=edit&section=9" title="Edit section: See also"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <ul><li><a href="/wiki/Chip_carrier" title="Chip carrier">Chip carrier</a> Chip packaging and package types list</li> <li><a href="/wiki/Quad_flat_package" title="Quad flat package">Quad flat package</a></li></ul> <div class="mw-heading mw-heading2"><h2 id="References">References</h2><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Flat_no-leads_package&action=edit&section=10" title="Edit section: References"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <style data-mw-deduplicate="TemplateStyles:r1239543626">.mw-parser-output .reflist{margin-bottom:0.5em;list-style-type:decimal}@media screen{.mw-parser-output .reflist{font-size:90%}}.mw-parser-output .reflist .references{font-size:100%;margin-bottom:0;list-style-type:inherit}.mw-parser-output .reflist-columns-2{column-width:30em}.mw-parser-output .reflist-columns-3{column-width:25em}.mw-parser-output .reflist-columns{margin-top:0.3em}.mw-parser-output .reflist-columns ol{margin-top:0}.mw-parser-output .reflist-columns li{page-break-inside:avoid;break-inside:avoid-column}.mw-parser-output .reflist-upper-alpha{list-style-type:upper-alpha}.mw-parser-output .reflist-upper-roman{list-style-type:upper-roman}.mw-parser-output .reflist-lower-alpha{list-style-type:lower-alpha}.mw-parser-output .reflist-lower-greek{list-style-type:lower-greek}.mw-parser-output .reflist-lower-roman{list-style-type:lower-roman}</style><div class="reflist"> <div class="mw-references-wrap mw-references-columns"><ol class="references"> <li id="cite_note-1"><span class="mw-cite-backlink"><b><a href="#cite_ref-1">^</a></b></span> <span class="reference-text"> <style data-mw-deduplicate="TemplateStyles:r1238218222">.mw-parser-output cite.citation{font-style:inherit;word-wrap:break-word}.mw-parser-output .citation q{quotes:"\"""\"""'""'"}.mw-parser-output .citation:target{background-color:rgba(0,127,255,0.133)}.mw-parser-output .id-lock-free.id-lock-free a{background:url("//upload.wikimedia.org/wikipedia/commons/6/65/Lock-green.svg")right 0.1em center/9px no-repeat}.mw-parser-output .id-lock-limited.id-lock-limited a,.mw-parser-output .id-lock-registration.id-lock-registration a{background:url("//upload.wikimedia.org/wikipedia/commons/d/d6/Lock-gray-alt-2.svg")right 0.1em center/9px no-repeat}.mw-parser-output .id-lock-subscription.id-lock-subscription a{background:url("//upload.wikimedia.org/wikipedia/commons/a/aa/Lock-red-alt-2.svg")right 0.1em center/9px no-repeat}.mw-parser-output .cs1-ws-icon a{background:url("//upload.wikimedia.org/wikipedia/commons/4/4c/Wikisource-logo.svg")right 0.1em center/12px no-repeat}body:not(.skin-timeless):not(.skin-minerva) .mw-parser-output .id-lock-free a,body:not(.skin-timeless):not(.skin-minerva) .mw-parser-output .id-lock-limited a,body:not(.skin-timeless):not(.skin-minerva) .mw-parser-output .id-lock-registration a,body:not(.skin-timeless):not(.skin-minerva) .mw-parser-output .id-lock-subscription a,body:not(.skin-timeless):not(.skin-minerva) .mw-parser-output .cs1-ws-icon a{background-size:contain;padding:0 1em 0 0}.mw-parser-output .cs1-code{color:inherit;background:inherit;border:none;padding:inherit}.mw-parser-output .cs1-hidden-error{display:none;color:var(--color-error,#d33)}.mw-parser-output .cs1-visible-error{color:var(--color-error,#d33)}.mw-parser-output .cs1-maint{display:none;color:#085;margin-left:0.3em}.mw-parser-output .cs1-kern-left{padding-left:0.2em}.mw-parser-output .cs1-kern-right{padding-right:0.2em}.mw-parser-output .citation .mw-selflink{font-weight:inherit}@media screen{.mw-parser-output .cs1-format{font-size:95%}html.skin-theme-clientpref-night .mw-parser-output .cs1-maint{color:#18911f}}@media screen and (prefers-color-scheme:dark){html.skin-theme-clientpref-os .mw-parser-output .cs1-maint{color:#18911f}}</style><cite class="citation cs2"><i>Design requirements for outlines of solid state and related products, JEDEC PUBLICATION 95, DESIGN GUIDE 4.23</i></cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=book&rft.btitle=Design+requirements+for+outlines+of+solid+state+and+related+products%2C+JEDEC+PUBLICATION+95%2C+DESIGN+GUIDE+4.23&rfr_id=info%3Asid%2Fen.wikipedia.org%3AFlat+no-leads+package" class="Z3988"></span></span> </li> <li id="cite_note-2"><span class="mw-cite-backlink"><b><a href="#cite_ref-2">^</a></b></span> <span class="reference-text">Bonnie C. Baker, <a rel="nofollow" class="external text" href="http://ww1.microchip.com/downloads/en/DeviceDoc/adn005.pdf"><i>Smaller Packages = Bigger Thermal Challenges</i></a>, Microchip Technology Inc.</span> </li> <li id="cite_note-3"><span class="mw-cite-backlink"><b><a href="#cite_ref-3">^</a></b></span> <span class="reference-text"><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://web.archive.org/web/20060828221201/http://www.freescale.com/files/analog/doc/app_note/AN1902.pdf">"Archived copy"</a> <span class="cs1-format">(PDF)</span>. Archived from <a rel="nofollow" class="external text" href="http://www.freescale.com/files/analog/doc/app_note/AN1902.pdf">the original</a> <span class="cs1-format">(PDF)</span> on 2006-08-28<span class="reference-accessdate">. Retrieved <span class="nowrap">2008-09-26</span></span>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=unknown&rft.btitle=Archived+copy&rft_id=http%3A%2F%2Fwww.freescale.com%2Ffiles%2Fanalog%2Fdoc%2Fapp_note%2FAN1902.pdf&rfr_id=info%3Asid%2Fen.wikipedia.org%3AFlat+no-leads+package" class="Z3988"></span><span class="cs1-maint citation-comment"><code class="cs1-code">{{<a href="/wiki/Template:Cite_web" title="Template:Cite web">cite web</a>}}</code>: CS1 maint: archived copy as title (<a href="/wiki/Category:CS1_maint:_archived_copy_as_title" title="Category:CS1 maint: archived copy as title">link</a>)</span></span> </li> <li id="cite_note-4"><span class="mw-cite-backlink"><b><a href="#cite_ref-4">^</a></b></span> <span class="reference-text"><a rel="nofollow" class="external free" href="http://www.dfrsolutions.com/hubfs/Resources/services/Manufacturing-and-Reliability-Challenges-With-QFN.pdf?t=1503583170559">http://www.dfrsolutions.com/hubfs/Resources/services/Manufacturing-and-Reliability-Challenges-With-QFN.pdf?t=1503583170559</a> <sup class="noprint Inline-Template" style="white-space:nowrap;">[<i><a href="/wiki/Wikipedia:Bare_URLs" title="Wikipedia:Bare URLs"><span title="A full citation of this PDF document is required to prevent link rot. (March 2022)">bare URL PDF</span></a></i>]</sup></span> </li> <li id="cite_note-5"><span class="mw-cite-backlink"><b><a href="#cite_ref-5">^</a></b></span> <span class="reference-text"><a rel="nofollow" class="external free" href="https://www.microsemi.com/document-portal/doc_view/130006-qfn-an">https://www.microsemi.com/document-portal/doc_view/130006-qfn-an</a> <sup class="noprint Inline-Template" style="white-space:nowrap;">[<i><a href="/wiki/Wikipedia:Bare_URLs" title="Wikipedia:Bare URLs"><span title="A full citation of this PDF document is required to prevent link rot. (March 2022)">bare URL PDF</span></a></i>]</sup></span> </li> <li id="cite_note-6"><span class="mw-cite-backlink"><b><a href="#cite_ref-6">^</a></b></span> <span class="reference-text"><a rel="nofollow" class="external free" href="http://www.dfrsolutions.com/hubfs/Resources/services/Understanding-Criticality-of-Stencil-Aperture-Design-and-Implementation-QFN-Package.pdf">http://www.dfrsolutions.com/hubfs/Resources/services/Understanding-Criticality-of-Stencil-Aperture-Design-and-Implementation-QFN-Package.pdf</a> <sup class="noprint Inline-Template" style="white-space:nowrap;">[<i><a href="/wiki/Wikipedia:Bare_URLs" title="Wikipedia:Bare URLs"><span title="A full citation of this PDF document is required to prevent link rot. (March 2022)">bare URL PDF</span></a></i>]</sup></span> </li> <li id="cite_note-RelQFN-7"><span class="mw-cite-backlink">^ <a href="#cite_ref-RelQFN_7-0"><sup><i><b>a</b></i></sup></a> <a href="#cite_ref-RelQFN_7-1"><sup><i><b>b</b></i></sup></a></span> <span class="reference-text"><a rel="nofollow" class="external free" href="http://www.dfrsolutions.com/hubfs/Resources/services/The-Reliability-Challenges-of-QFN-Packaging.pdf?t=1502980151115">http://www.dfrsolutions.com/hubfs/Resources/services/The-Reliability-Challenges-of-QFN-Packaging.pdf?t=1502980151115</a> <sup class="noprint Inline-Template" style="white-space:nowrap;">[<i><a href="/wiki/Wikipedia:Bare_URLs" title="Wikipedia:Bare URLs"><span title="A full citation of this PDF document is required to prevent link rot. (March 2022)">bare URL PDF</span></a></i>]</sup></span> </li> <li id="cite_note-8"><span class="mw-cite-backlink"><b><a href="#cite_ref-8">^</a></b></span> <span class="reference-text"><a rel="nofollow" class="external free" href="http://www.aimsolder.com/sites/default/files/overcoming_the_challenges_of_the_qfn_package_rev_2013.pdf">http://www.aimsolder.com/sites/default/files/overcoming_the_challenges_of_the_qfn_package_rev_2013.pdf</a>, Seelig, K., and Pigeon, K. "Overcoming the Challenges of the QFN Package," Proceedings of SMTAI, October, 2011.</span> </li> <li id="cite_note-9"><span class="mw-cite-backlink"><b><a href="#cite_ref-9">^</a></b></span> <span class="reference-text">JEDEC JESD22-A104D, May 2005, Temperature Cycling</span> </li> <li id="cite_note-10"><span class="mw-cite-backlink"><b><a href="#cite_ref-10">^</a></b></span> <span class="reference-text">JEDEC JESD22-A105C, January 2011, Power and Temperature Cycling</span> </li> <li id="cite_note-11"><span class="mw-cite-backlink"><b><a href="#cite_ref-11">^</a></b></span> <span class="reference-text">JEDEC JESD22-A106B, June 2004, Thermal Shock</span> </li> <li id="cite_note-12"><span class="mw-cite-backlink"><b><a href="#cite_ref-12">^</a></b></span> <span class="reference-text">JEDEC JESD22B113, March 2006, Board Level Cycling Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products</span> </li> <li id="cite_note-13"><span class="mw-cite-backlink"><b><a href="#cite_ref-13">^</a></b></span> <span class="reference-text">IPC IPC-9701A, February 2006, Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments</span> </li> <li id="cite_note-14"><span class="mw-cite-backlink"><b><a href="#cite_ref-14">^</a></b></span> <span class="reference-text">Syed, A. and Kang, W. "Board level assembly and reliability considerations for QFN type packages." SMTA International Conference, 2003</span> </li> <li id="cite_note-15"><span class="mw-cite-backlink"><b><a href="#cite_ref-15">^</a></b></span> <span class="reference-text">Yan Tee, T., et al. "Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages." Microelectronics Reliability 43 (2003): 1329–1338.</span> </li> <li id="cite_note-16"><span class="mw-cite-backlink"><b><a href="#cite_ref-16">^</a></b></span> <span class="reference-text">Vianco, P. and Neilsen, M. K. "Thermal mechanical fatigue of a 56 I/O plastic quad-flat nolead (PQFN) package." SMTA International Conference, 2015.</span> </li> <li id="cite_note-17"><span class="mw-cite-backlink"><b><a href="#cite_ref-17">^</a></b></span> <span class="reference-text">Wilde, J., and Zukowski, E. "Comparative Analysis for μBGA and QFN Reliability." 8th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2007 IEEE, 2007.</span> </li> <li id="cite_note-18"><span class="mw-cite-backlink"><b><a href="#cite_ref-18">^</a></b></span> <span class="reference-text">De Vries, J., et al. "Solder-joint reliability of HVQFN-packages subjected to thermal cycling." Microelectronics Reliability 49 (2009): 331-339.</span> </li> <li id="cite_note-19"><span class="mw-cite-backlink"><b><a href="#cite_ref-19">^</a></b></span> <span class="reference-text">17. Li, L. et al. "Board level reliability and assembly process of advanced QFN packages." SMTA International Conference, 2012.</span> </li> <li id="cite_note-20"><span class="mw-cite-backlink"><b><a href="#cite_ref-20">^</a></b></span> <span class="reference-text">Birzer, C., et al. "Reliability Investigations of Leadless QFN Packages until End-of-Life with Application-Specific Board-Level Stress Tests." Electronics Components and Technology Conference, 2006.</span> </li> <li id="cite_note-21"><span class="mw-cite-backlink"><b><a href="#cite_ref-21">^</a></b></span> <span class="reference-text">Serebreni, M., Blattau, N., Sharon, G., Hillman, C., Mccluskey, P. "Semi-analytical fatigue life model for reliability assessment of solder joints in qfn packages under thermal cycling". SMTA ICSR, 2017. Toronto, ON.</span> </li> <li id="cite_note-22"><span class="mw-cite-backlink"><b><a href="#cite_ref-22">^</a></b></span> <span class="reference-text">Chen, W. T., and C. W. Nelson. "Thermal stress in bonded joints." IBM Journal of Research and Development 23.2 (1979): 179-188.</span> </li> </ol></div></div> <div class="mw-heading mw-heading2"><h2 id="External_links">External links</h2><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=Flat_no-leads_package&action=edit&section=11" title="Edit section: External links"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <ul><li><a rel="nofollow" class="external text" href="http://www.onsemi.com/pub/Collateral/AND8086-D.PDF">Board mounting notes for QFN packages</a></li> <li><a rel="nofollow" class="external text" href="https://amkor.com/packaging/leadframe/microleadframe/">MicroLeadFrame®</a> from <a href="/wiki/Amkor_Technology" title="Amkor Technology">Amkor Technology</a></li> <li><a rel="nofollow" class="external text" href="https://amkor.com/technology/edge-protection/">Edge Protection Technology for QFN Packages</a> from <a href="/wiki/Amkor_Technology" title="Amkor Technology">Amkor Technology</a></li> <li><a rel="nofollow" class="external text" href="http://www.chipscalereview.com/issues/0107/index.php">ChipScale Review</a> <a rel="nofollow" class="external text" href="https://web.archive.org/web/20110930184744/http://www.chipscalereview.com/issues/0107/index.php">Archived</a> 2011-09-30 at the <a href="/wiki/Wayback_Machine" title="Wayback Machine">Wayback Machine</a> magazine, July - August 2000.]</li> <li><a rel="nofollow" class="external text" href="http://cds.linear.com/docs/en/packaging/Carsem%20MLP%20users%20guide.pdf">Linear Technology - QFN Package Users Guide</a></li></ul> <div class="navbox-styles"><style data-mw-deduplicate="TemplateStyles:r1129693374">.mw-parser-output .hlist dl,.mw-parser-output .hlist ol,.mw-parser-output .hlist ul{margin:0;padding:0}.mw-parser-output .hlist dd,.mw-parser-output .hlist dt,.mw-parser-output .hlist li{margin:0;display:inline}.mw-parser-output .hlist.inline,.mw-parser-output .hlist.inline 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href="/w/index.php?title=DO-201&action=edit&redlink=1" class="new" title="DO-201 (page does not exist)">DO-201</a> (DO-27)</li> <li><a href="/wiki/DO-204" title="DO-204">DO-204</a> (DO-7 / DO-26 / DO-35 / DO-41)</li> <li><a href="/wiki/Metal_electrode_leadless_face" title="Metal electrode leadless face">DO-213</a> (MELF / SOD-80 / LL34)</li> <li><a href="/wiki/DO-214" title="DO-214">DO-214</a> (SMA / SMB / SMC)</li> <li><a href="/wiki/Small_Outline_Diode" title="Small Outline Diode">SOD</a> (SOD-123 / SOD-323 / SOD-523 / SOD-923)</li></ul> </div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%;text-align:left;"><a href="/wiki/Semiconductor_device" title="Semiconductor device">3...5-pin</a></th><td class="navbox-list-with-group navbox-list navbox-even hlist" style="width:100%;padding:0"><div style="padding:0 0.25em"> <ul><li><a href="/wiki/Small-outline_transistor" title="Small-outline transistor">SOT / TSOT</a></li> <li><a href="/wiki/TO-3" title="TO-3">TO-3</a> (TH / Panel)</li> <li><a href="/wiki/TO-5" title="TO-5">TO-5</a> (TH)</li> <li><a href="/wiki/TO-8" title="TO-8">TO-8</a> (TH)</li> <li><a href="/wiki/TO-18" title="TO-18">TO-18</a> (TH)</li> <li><a href="/wiki/TO-39" class="mw-redirect" title="TO-39">TO-39</a> (TH)</li> <li><a href="/wiki/TO-66" title="TO-66">TO-66</a> (TH / Panel)</li> <li><a href="/wiki/TO-92" title="TO-92">TO-92</a> (TH)</li> <li><a href="/wiki/TO-126" title="TO-126">TO-126</a> (TH / Panel)</li> <li><a href="/w/index.php?title=TO-202&action=edit&redlink=1" class="new" title="TO-202 (page does not exist)">TO-202</a> (TH / Panel)</li> <li><a href="/wiki/TO-220" title="TO-220">TO-220</a> (TH / Panel)</li> <li><a href="/w/index.php?title=TO-247&action=edit&redlink=1" class="new" title="TO-247 (page does not exist)">TO-247</a> (TH / Panel)</li> <li><a href="/w/index.php?title=TO-251&action=edit&redlink=1" class="new" title="TO-251 (page does not exist)">TO-251</a> (IPAK) (SMT)</li> <li><a href="/wiki/TO-252" title="TO-252">TO-252</a> (DPAK) (SMT)</li> <li><a href="/w/index.php?title=TO-262&action=edit&redlink=1" class="new" title="TO-262 (page does not exist)">TO-262</a> (I2PAK) (SMT)</li> <li><a href="/wiki/TO-263" title="TO-263">TO-263</a> (D2PAK) (SMT)</li> <li><a href="/w/index.php?title=TO-268&action=edit&redlink=1" class="new" title="TO-268 (page does not exist)">TO-268</a> (D3PAK) (SMT)</li> <li><a href="/w/index.php?title=TO-273&action=edit&redlink=1" class="new" title="TO-273 (page does not exist)">TO-273</a> (Super-220) (SMT)</li> <li><a href="/w/index.php?title=TO-274&action=edit&redlink=1" class="new" title="TO-274 (page does not exist)">TO-274</a> (Super-247) (SMT)</li> <li><a href="/w/index.php?title=TO-277&action=edit&redlink=1" class="new" title="TO-277 (page does not exist)">TO-277</a> (SMPC, SM-7) (SMT)</li></ul> </div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%;text-align:left;">Single row</th><td class="navbox-list-with-group navbox-list navbox-odd hlist" style="width:100%;padding:0"><div style="padding:0 0.25em"> <ul><li><a href="/wiki/Single_in-line_package" class="mw-redirect" title="Single in-line package">SIP / SIL</a></li></ul> </div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%;text-align:left;">Dual row</th><td class="navbox-list-with-group navbox-list navbox-even hlist" style="width:100%;padding:0"><div style="padding:0 0.25em"> <ul><li><a href="/wiki/Quad_Flat_No-leads_package" class="mw-redirect" title="Quad Flat No-leads package">DFN</a></li> <li><a href="/wiki/Dual_in-line_package" title="Dual in-line package">DIP / DIL</a></li> <li><a href="/wiki/Flatpack_(electronics)" title="Flatpack (electronics)">Flat Pack</a></li> <li><a href="/wiki/Mini_Small_Outline_Package" title="Mini Small Outline Package">MSOP</a></li> <li><a href="/wiki/Small_Outline_Integrated_Circuit" class="mw-redirect" title="Small Outline Integrated Circuit">SO / SOIC</a></li> <li><a href="/wiki/Small_Outline_Integrated_Circuit#SOP_(JEITA/EIAJ)" class="mw-redirect" title="Small Outline Integrated Circuit">SOP / SSOP</a></li> <li><a href="/wiki/Thin_small_outline_package" title="Thin small outline package">TSOP / HTSOP</a></li> <li><a href="/wiki/Thin_shrink_small_outline_package" title="Thin shrink small outline package">TSSOP / HTSSOP</a></li> <li><a href="/wiki/Zig-zag_in-line_package" title="Zig-zag in-line package">ZIP</a></li></ul> </div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%;text-align:left;">Quad row</th><td class="navbox-list-with-group navbox-list navbox-odd hlist" style="width:100%;padding:0"><div style="padding:0 0.25em"> <ul><li>LCC</li> <li><a href="/wiki/Quad_in-line_package" title="Quad in-line package">QIP / QIL</a></li> <li><a href="/wiki/Plastic_leaded_chip_carrier" class="mw-redirect" title="Plastic leaded chip carrier">PLCC</a></li> <li><a href="/wiki/Quad_Flat_No-leads_package" class="mw-redirect" title="Quad Flat No-leads package">QFN</a></li> <li><a href="/wiki/Quad_Flat_Package" class="mw-redirect" title="Quad Flat Package">QFP</a></li> <li>QUIP / QUIL</li></ul> </div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%;text-align:left;">Grid array</th><td class="navbox-list-with-group navbox-list navbox-even hlist" style="width:100%;padding:0"><div style="padding:0 0.25em"> <ul><li><a href="/wiki/Ball_grid_array" title="Ball grid array">BGA</a></li> <li><a href="/wiki/Embedded_Wafer_Level_Ball_Grid_Array" class="mw-redirect" title="Embedded Wafer Level Ball Grid Array">eWLB</a></li> <li><a href="/wiki/Land_grid_array" title="Land grid array">LGA</a></li> <li><a href="/wiki/Pin_grid_array" title="Pin grid array">PGA</a></li></ul> </div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%;text-align:left;"><a href="/wiki/Wafer_(electronics)" title="Wafer (electronics)">Wafer</a></th><td class="navbox-list-with-group navbox-list navbox-odd hlist" style="width:100%;padding:0"><div style="padding:0 0.25em"> <ul><li>COB</li> <li>COF</li> <li>COG</li> <li><a href="/wiki/Chip-scale_package" title="Chip-scale package">CSP</a></li> <li><a href="/wiki/Flip_chip" title="Flip chip">Flip Chip</a></li> <li><a href="/wiki/Package_on_package" class="mw-redirect" title="Package on package">PoP</a></li> <li><a href="/wiki/Quilt_packaging" title="Quilt packaging">QP</a></li> <li><a href="/wiki/Universal_Integrated_Circuit_Card" class="mw-redirect" title="Universal Integrated Circuit Card">UICC</a></li> <li><a href="/wiki/Wafer-level_packaging" title="Wafer-level packaging">WL-CSP / WLP</a></li></ul> </div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%;text-align:left;">Related topics</th><td class="navbox-list-with-group navbox-list navbox-even hlist" style="width:100%;padding:0"><div style="padding:0 0.25em"> <ul><li><a href="/wiki/Electronic_packaging" title="Electronic packaging">Electronic packaging</a></li> <li><a href="/wiki/Integrated_circuit_packaging" title="Integrated circuit packaging">Integrated circuit packaging</a></li> <li><a href="/wiki/List_of_electronic_component_packaging_types" title="List of electronic component packaging types">List of electronic component packaging types</a></li> <li><a href="/wiki/Printed_circuit_board" title="Printed circuit board">Printed circuit board</a></li> <li><a href="/wiki/Surface-mount_technology" title="Surface-mount technology">Surface-mount technology</a></li> <li><a href="/wiki/Through-hole_technology" title="Through-hole technology">Through-hole technology</a></li></ul> </div></td></tr><tr><td class="navbox-abovebelow" colspan="2"><div>It is relatively common to find packages that contain other components than their designated ones, such as diodes or <a href="/wiki/Voltage_regulator" title="Voltage regulator">voltage regulators</a> in transistor packages, etc.</div></td></tr></tbody></table></div>    </div><noscript><img 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