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padding: 15px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; border-style: solid; border-width: 2px; border-color: rgb(0, 0, 0); border-radius: 0px;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; letter-spacing: 2px; font-size: 14px; color: rgb(85, 85, 85);"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; line-height: 1.6em; box-sizing: border-box !important; overflow-wrap: break-word !important;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; color: rgb(0, 82, 255);"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important;">摘要：</strong></span><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; color: rgb(123, 12, 0);"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important;">在当今科技飞速发展的时代，汽车电子和 IGBT 技术的不断进步对材料性能提出了更高的要求。而新型焊锡烧结银的出现，正为这两个领域带来了革命性的变革。汽车电子系统的复杂性日益增加，对于连接材料的可靠性和稳定性要求愈发严苛。传统的焊锡材料在高温、高功率的工作环境下，往往容易出现性能下降、连接失效等问题。而新型焊锡烧结银凭借其卓越的性能，成为了解决这些难题的理想选择。在IGBT（绝缘栅双极型晶体管）领域，新型焊锡烧结银同样发挥着重要作用。IGBT作为电力电子领域的核心器件，工作时会产生大量的热量。烧结银的高热导率能够确保IGBT在高频、高功率切换时保持良好的性能，降低了热损耗，提高了能源转换效率。</strong></span></span><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: center; line-height: 1.6em;"><img class="rich_pages wxw-img" data-galleryid="" data-imgfileid="502160365" data-ratio="0.6685185185185185" data-s="300,640" data-src="https://mmbiz.qpic.cn/sz_mmbiz_jpg/qsPy1ThB6IRsMq0ZoFfEA9PKtQ63Pia973dDPfiaFibpFmmVylFhc9eHLibAuEvfECUmIWUu9M0J2OISqEwGXekEvw/640?wx_fmt=jpeg&from=appmsg" data-type="jpeg" data-w="1080" data-original-style="" data-index="1" src="/d/file/jszc/2024-07-18/a0f419df6eef81fc821f9bd60c2f7c77.jpg" _width="677px" __sec_open_place_holder__="true" crossorigin="anonymous" alt="图片" data-fail="0" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; vertical-align: bottom; height: auto !important; visibility: visible !important; width: 643.444px !important;" /></section></section></section></section><span style="display:none">fKQSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p> <span style="display:none">fKQSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p><section data-id="2365" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; font-size: 17px; letter-spacing: 0.544px; text-align: justify; box-sizing: border-box !important; overflow-wrap: break-word !important;"><section style="margin: 10px auto; padding: 0px; outline: 0px; max-width: 100%; width: 677px; height: 40px; border-bottom: 1px solid rgb(246, 246, 246); overflow: hidden; color: inherit; background-color: rgb(251, 251, 251); line-height: 1.6em; box-sizing: border-box !important; overflow-wrap: break-word !important;"><section data-width="auto" style="margin: 0px 0px 0px -10px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; display: inline-block; width: auto; height: 40px; border-radius: 0px 0px 10px; transform: skew(-30deg); color: rgb(255, 255, 255); background-color: rgb(255, 129, 36);"><section style="margin: 0px; padding: 0px 30px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 16px; line-height: 40px; color: inherit; transform: skew(30deg);"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; letter-spacing: 2px;">关键词：烧结银技术；汽车电子；IGBT。</span></strong></span></section></section></section></section><section style="margin: 0px 0px 10px; padding: 0px; outline: 0px; max-width: 100%; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; font-size: 17px; letter-spacing: 0.544px; text-align: center; visibility: visible; box-sizing: border-box !important; overflow-wrap: break-word !important;"><section style="margin: 0px; padding: 2px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; border-width: 1px; border-style: solid; border-color: rgb(144, 173, 221); visibility: visible;"><section style="margin: 0px; padding: 15px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible;"><section deep="9" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important;"><section data-role="outer" label="Powered by 135editor.com" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; letter-spacing: 0.544px; visibility: visible;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible; text-align: justify; line-height: 1.6em;"><section style="margin: 0px; padding: 0px 0px 2px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; display: inline-block; border-bottom: 1.5px solid rgb(0, 176, 240); border-top-color: rgb(0, 176, 240); border-right-color: rgb(0, 176, 240); border-left-color: rgb(0, 176, 240); visibility: visible;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; border-width: 0px; border-style: none; border-color: initial; display: flex; justify-content: flex-start; align-items: flex-end; visibility: visible;"><section data-original-title="" placeholder="1" title="" style="margin: 0px 8px 0px 0px; padding: 4px 10px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 16px; color: rgb(255, 255, 254); float: left; line-height: 20px; background-color: rgb(0, 176, 240); visibility: visible;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible; font-size: 14px;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible;">01</strong></span></section><section data-brushtype="text" hm_fix="208:342" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; color: rgb(128, 100, 162); visibility: visible; font-size: 14px;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible;">新</strong></span></section><section data-brushtype="text" hm_fix="208:342" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible;"><br style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important;" /> </section><section data-brushtype="text" hm_fix="208:342" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; color: rgb(128, 100, 162); visibility: visible; font-size: 14px;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible;">型焊锡烧结银技术概述</strong></span></section></section></section></section></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><br style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important;" /> </section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important;">1.1 定义与原理</strong></span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">    新型焊锡烧结银技术是一种先进的连接技术，它使用银粉或银膏作为中间层材料，在特定的温度、压力和时间条件下，通过固态扩散或液态烧结的方式实现芯片与基板之间的冶金结合。与传统的焊接技术相比，烧结银技术具有更高的熔点、更低的电阻率、更好的热稳定性和优异的导热性能。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">烧结银技术的原理主要包括以下几个步骤：</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important;">●银粉或银膏的制备：选用高纯度的银粉，通过添加适量的有机载体和</span><span class="wx_search_keyword_wrap" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; color: var(--weui-LINK); cursor: default;">分散剂</span><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important;">，制备成具有一定流动性和黏度的银膏。</span></span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">●芯片与基板的预处理：对芯片和基板的连接表面进行清洁、除油和粗化处理，以提高银膏与连接表面的润湿性和结合强度。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">●银膏的涂覆与定位：将制备好的银膏均匀涂覆在芯片或基板的连接表面上，并通过精确定位确保芯片与基板的准确对位。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">●烧结过程：将涂覆好银膏的芯片与基板组装在一起，置于烧结炉中，在一定的温度和压力下进行烧结，形成致密的银层，实现芯片与基板的冶金结合。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important;">1.2 技术发展历程</strong></span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">    烧结银技术的发展经历了从实验室研究到工业应用的转变。最初，该技术由于其高性能特点在电子封装领域受到关注。随着电子设备向小型化、高性能方向发展，对连接材料的要求也越来越高，烧结银技术因其卓越的导电导热性能和可靠性而逐渐成为研究热点。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">    近年来，随着新能源汽车和功率电子器件的快速发展，烧结银技术在汽车电子和IGBT模块中的应用日益增多。电子材料行业也有一些相关的公司在烧结银材料的研发与生产方面走在行业前沿，推出了多款产品以适应不同的封装需求，其热膨胀系数更加接近于碳化硅芯片，满足了碳化硅功率模块封装的需求。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">    烧结银技术的应用前景备受关注，特别是在800V高压快充技术普及和新能源汽车市场持续扩张的背景下，烧结银技术为汽车电力电子产品封装提供了革命性的解决方案。根据Yole预测，到2029年，功率模块封装材料的市场规模将翻倍增长，其中烧结银技术将占据重要份额。</span></section> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; clear: both; min-height: 1em; text-align: justify;"> <span style="display:none">fKQSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <section data-role="outer" label="Powered by 135editor.com" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; letter-spacing: 0.544px; visibility: visible;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible; text-align: justify; line-height: 1.6em;"><section style="margin: 0px; padding: 0px 0px 2px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; display: inline-block; border-bottom: 1.5px solid rgb(0, 176, 240); border-top-color: rgb(0, 176, 240); border-right-color: rgb(0, 176, 240); border-left-color: rgb(0, 176, 240); visibility: visible;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; border-width: 0px; border-style: none; border-color: initial; display: flex; justify-content: flex-start; align-items: flex-end; visibility: visible;"><section data-original-title="" placeholder="1" title="" style="margin: 0px 8px 0px 0px; padding: 4px 10px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 16px; color: rgb(255, 255, 254); float: left; line-height: 20px; background-color: rgb(0, 176, 240); visibility: visible;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible; font-size: 14px;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible;">02</strong></span></section><section data-brushtype="text" hm_fix="208:342" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; color: rgb(0, 176, 240); visibility: visible;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; color: rgb(128, 100, 162); visibility: visible; font-size: 14px;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible;">汽车电子领域应用分析</strong></span></section></section></section></section></section> <h3 style="margin: 0px; padding: 0px; outline: 0px; font-weight: 400; font-size: 16px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; border-width: 0px; border-style: initial; border-color: initial; list-style: none; color: rgb(50, 50, 50); font-family: Arial, Verdana, 微软雅黑, 宋体; letter-spacing: normal; text-align: justify; line-height: 1.6em;"> </h3> <section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important;">2.1 汽车电子对材料性能的要求</strong></span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; font-size: 14px; letter-spacing: 0.544px; caret-color: rgba(0, 0, 0, 0); box-sizing: border-box !important; overflow-wrap: break-word !important;">    电动汽车的蓬勃发展带动了功率模块封装技术的更新迭代。汽车电子对功率模块的要求主要包括高可靠性、高功率密度和成本优势。高可靠性：银烧结技术能够显著提高汽车电子中IGBT模块的可靠性，这对于汽车的安全性和稳定性至关重要。高功率密度：银烧结技术有助于实现更紧凑的封装设计，满足汽车电子对于空间的严格要求。成本效益：虽然银材料成本较高，但通过优化工艺和提高生产效率，银烧结技术在汽车电子中的应用可以实现更好的成本效益比。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">    汽车电子系统对材料性能有着严格的要求，特别是在高可靠性、高热导率和高工作温度等方面。随着新能源汽车和自动驾驶技术的发展，对电子器件的性能要求不断提升。烧结银作为一种新型材料，在汽车电子领域的应用日益受到重视。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">高可靠性：汽车电子系统的稳定性直接关系到车辆的安全性能。烧结银以其高熔点、低蠕变倾向等特性，提供了更高的连接可靠性。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">高热导率：功率电子模块在工作时产生大量热量，需要高效的散热材料。烧结银的热导率远高于传统焊料，有助于提高散热效率。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">高工作温度：随着芯片工作温度的提升，连接材料需要承受更高的温度。烧结银可承受高达300℃甚至更高的工作温度，满足严苛的工作环境需求。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important;">2.2 烧结银技术在汽车电子中的应用案例</strong></span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">    烧结银技术在汽车电子领域的应用案例主要集中在功率模块封装、传感器、执行器等关键部件。以下是一些具体的应用实例：</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">    功率模块封装：烧结银技术被广泛应用于碳化硅（SiC）功率模块的封装，这些模块是电动汽车主驱逆变器的核心部件。烧结银技术提供了比传统焊料更低的热阻和更高的工作温度，显著提升了模块的散热性能和长期可靠性。电池管理系统（BMS）：在电池管理系统中，烧结银技术用于连接电池监控芯片和基板，确保了系统的高精度和高稳定性。传感器和执行器：在温度、压力等传感器以及电机驱动等执行器中，烧结银技术提供了优异的电导性和热导性，保证了信号传输的准确性和系统的快速响应。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">    烧结银技术的应用不仅提升了汽车电子产品的性能，也为新能源汽车的安全性、能效和驾驶体验带来了显著改进。随着技术的不断成熟和成本的降低，预计烧结银技术在汽车电子领域的应用将越来越广泛。</span> </section> <h6><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; line-height: 1.6em; box-sizing: border-box !important; overflow-wrap: break-word !important;"><img class="rich_pages wxw-img" data-backh="282" data-backw="542" data-galleryid="" data-imgfileid="502160366" data-ratio="0.5194444444444445" data-s="300,640" data-src="https://mmbiz.qpic.cn/sz_mmbiz_png/qsPy1ThB6IRsMq0ZoFfEA9PKtQ63Pia976F3ApU4YYoDia2Zyiarq7GqWgkSmNsibCUusRMCB74c3YMLdBejjlp7wg/640?wx_fmt=png&from=appmsg" data-type="png" data-w="1080" data-original-style="width: 100%;height: auto;" data-index="0" src="/d/file/jszc/2024-07-18/2619ef8793faf042f256c014b1814269.jpg" _width="100%" __sec_open_place_holder__="true" crossorigin="anonymous" alt="图片" data-fail="0" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; vertical-align: bottom; height: auto !important; width: 641.222px !important; visibility: visible !important;" /></section></h6> <section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; line-height: 1.6em; box-sizing: border-box !important; overflow-wrap: break-word !important;"></section><section data-role="outer" label="Powered by 135editor.com" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; letter-spacing: 0.544px; visibility: visible; box-sizing: border-box !important; overflow-wrap: break-word !important;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible; text-align: justify; line-height: 1.6em;"><section style="margin: 0px; padding: 0px 0px 2px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; display: inline-block; border-bottom: 1.5px solid rgb(0, 176, 240); border-top-color: rgb(0, 176, 240); border-right-color: rgb(0, 176, 240); border-left-color: rgb(0, 176, 240); visibility: visible;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; border-width: 0px; border-style: none; border-color: initial; display: flex; justify-content: flex-start; align-items: flex-end; visibility: visible;"><section data-original-title="" placeholder="1" title="" style="margin: 0px 8px 0px 0px; padding: 4px 10px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 16px; color: rgb(255, 255, 254); float: left; line-height: 20px; background-color: rgb(0, 176, 240); visibility: visible;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible; font-size: 14px;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible;">03</strong></span></section><section data-brushtype="text" hm_fix="208:342" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; color: rgb(0, 176, 240); visibility: visible;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; color: rgb(128, 100, 162); visibility: visible; font-size: 14px;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible;">IGBT模块深度应用</strong></span></section></section></section></section> </section> <section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important;">3.1 IGBT模块技术要求</strong></span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; letter-spacing: 0.544px; text-align: justify; line-height: 1.6em; box-sizing: border-box !important; overflow-wrap: break-word !important;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">    IGBT模块作为电力电子装置的“CPU”，在电力转换与能源管理领域扮演着越来越重要的角色。随着IGBT功率等级的提升和封装尺寸的缩小，传统的焊接技术已经难以满足IGBT模块日益严苛的可靠性要求。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; letter-spacing: 0.544px; text-align: justify; line-height: 1.6em; box-sizing: border-box !important; overflow-wrap: break-word !important;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">    <span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; letter-spacing: 0.544px;">提高可靠性：银烧结技术形成的冶金结合层具有更高的强度和更好的耐热循环性能，能够有效抵抗IGBT模块在工作过程中产生的热应力和机械应力。降低热阻：银具有优异的导热性能，采用银烧结技术替代传统的焊接技术，可以显著降低IGBT模块内部的热阻，提高模块的散热性能。小型化封装：银烧结技术可以实现更薄的连接层厚度，从而减小IGBT模块的封装尺寸，提高模块的功率密度和集成度。</span></span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important;">    </strong><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; letter-spacing: 0.544px;">IGBT模块作为电力电子领域的核心器件，其技术要求主要围绕以下几个关键点：</span></span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">    高功率密度：随着电动汽车等应用对功率密度要求的提升，IGBT模块需要在更小的体积内实现更高的功率转换效率。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">高可靠性：IGBT模块在汽车电子等严苛环境下工作，要求具备长期的稳定性和耐用性。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">    良好的热管理：有效的散热设计是保证IGBT模块长期稳定工作的关键，需要通过封装技术和材料选择实现优秀的热传导性能。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">    快速开关特性：IGBT模块需要具备快速的开关响应时间，以满足现代电力电子系统的高频开关需求。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important;">3.2 烧结银技术在IGBT模块中的优势与挑战</strong></span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">    烧结银技术作为一种新型的互连技术，在IGBT模块中的应用具有显著的优势，同时也面临一些挑战。</span></section>  <p> <span style="display:none">fKQSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <h6><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><img class="rich_pages wxw-img" data-backh="275" data-backw="542" data-galleryid="" data-imgfileid="502160364" data-ratio="0.5074074074074074" data-s="300,640" data-src="https://mmbiz.qpic.cn/sz_mmbiz_png/qsPy1ThB6IRsMq0ZoFfEA9PKtQ63Pia97nBSajkiaT9EpEianYSyo8BnVBtpdHELtNllicKc60vwO77sE157o0snCg/640?wx_fmt=png&from=appmsg" data-type="png" data-w="1080" data-original-style="font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif;letter-spacing: 0.544px;text-align: center;text-wrap: wrap;background-color: rgb(255, 255, 255);width: 100%;height: auto;" data-index="1" src="/d/file/jszc/2024-07-18/0dc4031fbd526826222a3028701dc255.jpg" _width="100%" __sec_open_place_holder__="true" crossorigin="anonymous" alt="图片" data-fail="0" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; vertical-align: bottom; letter-spacing: 0.544px; text-align: center; box-sizing: border-box !important; overflow-wrap: break-word !important; height: auto !important; width: 641.222px !important; visibility: visible !important;" /></section></h6> <p> <span style="display:none">fKQSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; letter-spacing: 0.544px;">烧结银技术优势</span></strong><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; letter-spacing: 0.544px;">表现在以下几个方面：</span></span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">高熔点：烧结银的熔点高达961℃，远高于传统焊料，有助于在高温环境下保持连接的稳定性。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">优异的导电导热性能：银本身具有极佳的导电和导热性能，烧结银技术能够提供更低的电阻率和更高的热导率，有助于提升IGBT模块的电气性能和散热效率。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">环境友好：烧结银技术不含有铅等有害物质，符合当前环保要求。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">高可靠性：烧结银形成的冶金结合具有更高的强度和耐热循环性能，显著提高IGBT模块的可靠性。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important;">面临的挑战：</strong></span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">成本问题：银材料的成本相对较高，可能会增加IGBT模块的整体制造成本。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">工艺控制：烧结银工艺对温度、压力和时间的控制要求较为严格，对生产设备的精度和稳定性提出了更高要求。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">热膨胀系数匹配：银与IGBT芯片及基板材料的热膨胀系数差异可能引起热应力问题，需要通过材料选择和设计优化来缓解。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">技术成熟度：作为一种新兴技术，烧结银在大规模生产中的应用还需要进一步验证和优化，以确保其在不同工作条件下的稳定性和一致性。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">    通过不断的技术进步和工艺优化，烧结银技术有望在IGBT模块中得到更广泛的应用，为电力电子技术的发展提供强有力的支持。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><br style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important;" /> </section><section data-role="outer" label="Powered by 135editor.com" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; letter-spacing: 0.544px; visibility: visible; box-sizing: border-box !important; overflow-wrap: break-word !important;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible; text-align: justify; line-height: 1.6em;"><section style="margin: 0px; padding: 0px 0px 2px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; display: inline-block; border-bottom: 1.5px solid rgb(0, 176, 240); border-top-color: rgb(0, 176, 240); border-right-color: rgb(0, 176, 240); border-left-color: rgb(0, 176, 240); visibility: visible;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; border-width: 0px; border-style: none; border-color: initial; display: flex; justify-content: flex-start; align-items: flex-end; visibility: visible;"><section data-original-title="" placeholder="1" title="" style="margin: 0px 8px 0px 0px; padding: 4px 10px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 16px; color: rgb(255, 255, 254); float: left; line-height: 20px; background-color: rgb(0, 176, 240); visibility: visible;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible; font-size: 14px;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible;">04</strong></span></section><section data-brushtype="text" hm_fix="208:342" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; color: rgb(0, 176, 240); visibility: visible;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; color: rgb(128, 100, 162); visibility: visible; font-size: 14px;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible;">市场前景与发展趋势</strong></span></section></section></section></section> </section> <section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important;">4.1 市场需求分析</strong></span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">    新型焊锡烧结银在汽车电子领域的应用正迅速扩大，特别是在电动汽车（EV）和混合动力汽车（HEV）的快速发展背景下。根据市场研究数据，随着对高效率和高可靠性需求的增加，预计到2025年，烧结银的市场需求将以年复合增长率（CAGR）超过15%的速度增长。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">    电动汽车对功率模块的高性能需求：电动汽车中的主逆变器、车载充电器（OBC）和DC-DC转换器等关键部件对功率模块的性能有极高要求，烧结银因其高工作温度、高热导率和高可靠性成为理想的连接材料。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">    碳化硅（SiC）功率模块的兴起：SiC技术因其在高温、高频率和高效率下的性能优势而逐渐取代硅（Si）基技术，烧结银技术与SiC功率模块的结合为汽车电子带来了革命性的改进。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important;">4.2 技术发展趋势与预测</strong></span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">    烧结银技术的发展正朝着更高的性能和更广泛的应用领域迈进。以下是技术发展趋势的几个关键点：高温耐受性：随着电动汽车和工业应用对功率模块的工作温度要求不断提高，烧结银技术正在向更高的耐温性能发展，预计未来几年内，烧结银的工作温度将达到350℃甚至更高。热管理性能：为了满足功率模块对散热的严格要求，烧结银技术正在改进其热导率，以更有效地导出芯片产生的热量，提高整个模块的功率密度和效率。环保和可持续性：随着全球对环保和可持续发展的重视，烧结银作为一种无铅、环保的焊接材料，其市场需求和技术发展将持续增长。</span></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">    预测显示，烧结银技术将在以下领域实现突破：在SiC功率模块的封装中占据主导地位，特别是在800V及以上的高电压应用中。在新能源汽车的车载充电器和DC-DC转换器中得到广泛应用，以应对快速充电和高效率转换的需求。在工业自动化和智能制造中，作为高可靠性和长寿命的连接解决方案，特别是在机器人、伺服电机和可再生能源系统中。随着技术的不断进步和市场需求的增长，烧结银在汽车电子和IGBT应用中的前景十分广阔，预计将成为未来电力电子封装材料市场的重要力量。</span> </section> <h6><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; text-align: justify; line-height: 1.6em;"></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; line-height: 1.6em; box-sizing: border-box !important; overflow-wrap: break-word !important;"><img class="rich_pages wxw-img" data-backh="306" data-backw="542" data-galleryid="" data-imgfileid="502160368" data-ratio="0.5637065637065637" data-s="300,640" data-src="https://mmbiz.qpic.cn/sz_mmbiz_jpg/qsPy1ThB6IRsMq0ZoFfEA9PKtQ63Pia97ZaRedCNtFjlYv5WRukrChddoicdWWJ7G0CbNHuoRoUUR1Ug2fh6J1UQ/640?wx_fmt=jpeg&from=appmsg" data-type="jpeg" data-w="1036" data-original-style="width: 100%;height: auto;" data-index="2" src="/d/file/jszc/2024-07-18/72cacfdc16aa16123683e14d1fa4d9c8.jpg" _width="100%" __sec_open_place_holder__="true" crossorigin="anonymous" alt="图片" data-fail="0" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; 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padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; border-width: 0px; border-style: none; border-color: initial; display: flex; justify-content: flex-start; align-items: flex-end; visibility: visible;"><section data-original-title="" placeholder="1" title="" style="margin: 0px 8px 0px 0px; padding: 4px 10px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 16px; color: rgb(255, 255, 254); float: left; line-height: 20px; background-color: rgb(0, 176, 240); visibility: visible;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible; font-size: 14px;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible;">05</strong></span></section><section data-brushtype="text" hm_fix="208:342" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; color: rgb(0, 176, 240); visibility: visible;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; color: rgb(128, 100, 162); visibility: visible; font-size: 14px;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; visibility: visible;">未来展望</strong></span></section></section></section></section></section> <h3 style="margin: 0px; padding: 0px; outline: 0px; font-weight: 400; font-size: 16px; max-width: 100%; border-width: 0px; border-style: initial; border-color: initial; list-style: none; color: rgb(50, 50, 50); font-family: Arial, Verdana, 微软雅黑, 宋体; letter-spacing: normal; text-align: justify; line-height: 1.6em; box-sizing: border-box !important; overflow-wrap: break-word !important;"> </h3> <h3 style="margin: 0px; padding: 0px; outline: 0px; font-weight: 400; font-size: 16px; max-width: 100%; border-width: 0px; border-style: initial; border-color: initial; list-style: none; color: rgb(50, 50, 50); font-family: Arial, Verdana, 微软雅黑, 宋体; letter-spacing: normal; text-align: justify; line-height: 1.6em; box-sizing: border-box !important; overflow-wrap: break-word !important;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-size: 14px;">    银烧结技术的工艺参数控制较为严格，需要精确控制烧结温度、压力和时间等参数以确保连接质量。<span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word !important; font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; letter-spacing: 0.544px; text-align: center; color: rgba(0, 0, 0, 0.9);">随着新材料、新技术的不断涌现，银烧结技术将与其他连接技术相互补充、共同发展，为IGBT行业的进步提供有力支持。随着银烧结技术的不断研究和优化，其工艺稳定性和成本问题有望得到解决。同时，我们也期待这两种工艺能够在更广泛的领域得到应用和推广，为电力电子技术的发展做出更大的贡献。</span></span></h3> </section></section></section></section><span style="display:none">fKQSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <center><img src="/AD/SMTfgx.gif"/ "/AD/smtjscn.jpg"/></center> <p><br> </p> <style> #cyPoll .vote_txtlist dd{ left: 50%; 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