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class="introduce">核心提示：论坛期间的“第四届车用半导体创新合作峰会”上，安世半导体中国区SiC战略及业务负责人王骏跃，株洲中车时代电气股份有限公司中车科学家、功率半导体与集成技术全国重点实验室副主任刘国友，杭州士兰微电子股份有限公司功率系统应用技术高级经理朱晓慧，广东芯聚能半导体有限公司总裁周晓阳，英飞凌科技（中国）有限公司主任工程师张浩，长城汽车投资总监耿伟等专家们齐聚分享精彩报告，共同探讨新的发展趋势下，车用半导体创新合作发展。</div><div id="content"><div class="content" id="article"><p> 随着电动汽车和智能网联汽车的进一步普及，先进驾驶辅助系统（ADAS）和自动驾驶技术的发展、汽车电气化趋势的加速，以及消费者对车载信息娱乐系统和车联网功能的需求增加，驱动车用半导体的市场需求持续增长。在功率半导体、传感器、处理器和通信芯片等领域，车用半导体技术不断进步。 </p> <p>近日，由苏州实验室、第三代半导体产业技术创新战略联盟（CASA）、中关村半导体照明工程研发及产业联盟（CSA）主办的第十届国际第三代半导体论坛&第二十一届中国国际半导体照明论坛（IFWS&SSLCHINA2024）在苏州召开。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/25/161146311.jpg" alt="现场图2" width="668" height="445" /></p> <p>论坛期间的“第四届车用半导体创新合作峰会”上，安世半导体中国区SiC战略及业务负责人王骏跃，株洲中车时代电气股份有限公司中车科学家、功率半导体与集成技术全国重点实验室副主任刘国友，杭州士兰微电子股份有限公司功率系统应用技术高级经理朱晓慧，广东芯聚能半导体有限公司总裁周晓阳，英飞凌科技（中国）有限公司主任工程师张浩，长城汽车投资总监耿伟等专家们齐聚分享精彩报告，共同探讨新的发展趋势下，车用半导体创新合作发展。<span style="text-indent: 2em; background-image: initial; background-position: initial; background-size: initial; background-repeat: initial; background-attachment: initial; background-origin: initial; background-clip: initial; font-size: 10.5pt; font-family: Arial; color: rgb(51, 51, 51); letter-spacing: 0pt;">广东芯聚能半导体有限公司总裁周晓阳</span><span style="text-indent: 2em; background-image: initial; background-position: initial; background-size: initial; background-repeat: initial; background-attachment: initial; background-origin: initial; background-clip: initial; font-size: 10.5pt; font-family: 宋体; color: rgb(51, 51, 51); letter-spacing: 0pt;">，</span><span style="text-indent: 2em; background-image: initial; background-position: initial; background-size: initial; background-repeat: initial; background-attachment: initial; background-origin: initial; background-clip: initial; font-size: 10.5pt; font-family: Arial; color: rgb(51, 51, 51); letter-spacing: 0pt;">株洲中车时代电气股份有限公司中车科学家、功率半导体与集成技术全国重点实验室副主任刘国友</span><span style="text-indent: 2em; background-image: initial; background-position: initial; background-size: initial; background-repeat: initial; background-attachment: initial; background-origin: initial; background-clip: initial; font-size: 10.5pt; font-family: 宋体; color: rgb(51, 51, 51); letter-spacing: 0pt;">共同主持峰会。</span></p> <p class="MsoNormal"><span style="font-family: Arial; color: rgb(51, 51, 51); letter-spacing: 0pt; font-size: 10.5pt; background-image: initial; background-position: initial; background-size: initial; background-repeat: initial; background-attachment: initial; background-origin: initial; background-clip: initial;"><o:p></o:p></span></p> <p style="text-align: center;"> <img src="http://www.casmita.com/file/upload/202411/25/161159951.jpg" alt="王骏跃" width="668" height="445" /></p> <p align="center">王骏跃</p> <p align="center">安世半导体中国区SiC战略及业务负责人</p> <p>安世半导体中国区SiC战略及业务负责人王骏跃做了“安世碳化硅，超高性能赋能电气化和绿色节能的美好未来”的主题报告，结合中国SiC器件市场的分析，分享了安世半导体的产品组合与发展策略。报告指出，当前MOSFET领域，国内在工业级上逐渐发力，依靠价值竞争力争取试错机会，车规级开展验证，大批量生产需要耐心。但也面临价格战、大批量车规级稳定性，资本市场遇冷，政治风险对供应链影响等隐患。碳化硅分立器件市场和客户在技术、价格、供应/本土供应链、头部客户认可等方面都有相应的需求。安世半导体拥有多种产品组合。安世投资2亿美元在德国汉堡建设SiC（8英寸，沟槽工艺）和GaN生产线，以满足高功率半导体日益增长的市场需求。目标是打造下一代宽带半导体IP（SiC和GaN）并建立生产基础设施。</p> <p style="text-align: center;"> <img src="http://www.casmita.com/file/upload/202411/25/161213771.jpg" alt="刘国友1" width="668" height="445" /></p> <p align="center">刘国友</p> <p align="center">株洲中车时代电气股份有限公司中车科学家、功率半导体与集成技术全国重点实验室副主任 </p> <p>株洲中车时代电气股份有限公司中车科学家、功率半导体与集成技术全国重点实验室副主任刘国友做了“轨道交通SiC功率器件研究与应用进展”的主题报告，分享了交通领域的电力设备，SiC器件在铁路中的应用以及新一代3.3kV全碳化硅模块。介绍了当前功率器件在电力机车和动车组中的广泛应用，满足PET在下一代轨道牵引系统中的应用需求所需的更高电压和更大电流的SiC器件（IGBT）。报告指出，SiC器件在电动机械车辆中的应用前景广阔，但在材料、制造和封装方面还有很长的路要走。</p> <p style="text-align: center;"> <img src="http://www.casmita.com/file/upload/202411/25/161333181.jpg" alt="朱晓慧" width="668" height="445" /></p> <p align="center">朱晓慧</p> <p align="center">杭州士兰微电子股份有限公司功率系统应用技术高级经理</p> <p>近年来新能源汽车取得了巨大发展，在世界范围内销量持续增长。杭州士兰微电子股份有限公司功率系统应用技术高级经理朱晓慧带来了“士兰微高性能SiC解决方案 赋能新一代主驱应用”的主题报告。报告指出，主驱逆变器作为新能源汽车核心部件，其性能对车辆续航里程、效率、可靠性、成本具有重大影响。主驱逆变器呈现出更高效率、 800V平台、更高功率密度、安全&成本的发展趋势。在电池和主驱逆变器之间加入Boost电路，可以提升系统效率和功率输出；提升电机效率；降低电池成本。在主驱逆变器中，目前硅基IGBT是主流的解决方案。随着SiC的广泛应用，主驱正在从如今的400V架构往800V架构加速转变 。随着系统对电机功率需求不断上升，新能源汽车电机功率不断上升，单电机功率超过300KW甚至400KW。保证主驱逆变器安全可靠工作，是新能源车厂最关注的重点之一。新能源汽车厂商需要持续降低整车成本来扩张市场，必然对作为核心部件的主驱逆变器降价有强烈的需求。</p> <p style="text-align: center;"> <img src="http://www.casmita.com/file/upload/202411/25/161401191.jpg" alt="周晓阳报告" width="668" height="445" /></p> <p align="center">周晓阳</p> <p align="center">广东芯聚能半导体有限公司总裁</p> <p align="justify">广东芯聚能半导体有限公司总裁周晓阳做了“碳化硅产业的机遇及挑战”的主题报告。分享了SiC在新能源汽车上的应用、在工商业储能PCS的应用、充电桩的应用、智能电网的应用等。报告指出，碳化硅芯片和器件将会以惊人的速度降低成本，在三年内达到硅基IGBT的1.5倍以下。碳化硅主驱将成为中高档电动汽车的主流。碳化硅器件和模块会以较快的速度渗透到储能，光伏，电源等领域。</p> <p style="text-align: center;"> <img src="http://www.casmita.com/file/upload/202411/25/161415691.jpg" alt="张浩" width="668" height="445" /></p> <p align="center">张浩</p> <p align="center">英飞凌科技（中国）有限公司主任工程师</p> <p align="justify">‌<a href="https://www.baidu.com/s?rsv_dl=re_dqa_generate&sa=re_dqa_generate&wd=%E8%8B%B1%E9%A3%9E%E5%87%8C&rsv_pq=d24f82b0004005aa&oq=%E8%8B%B1%E9%A3%9E%E5%87%8C%E8%BD%A6%E8%A7%84SiC%E5%8F%91%E5%B1%95%E6%8F%8F%E8%BF%B0&rsv_t=f2e7TYmDHCqUiWRBMv0qc9EAEbxYLW6JiCb3smqXQJIL9Meo4RvHkJqnWT8&tn=baidu&ie=utf-8">英飞凌</a>在车规<a href="https://www.baidu.com/s?rsv_dl=re_dqa_generate&sa=re_dqa_generate&wd=SiC&rsv_pq=d24f82b0004005aa&oq=%E8%8B%B1%E9%A3%9E%E5%87%8C%E8%BD%A6%E8%A7%84SiC%E5%8F%91%E5%B1%95%E6%8F%8F%E8%BF%B0&rsv_t=f2e7TYmDHCqUiWRBMv0qc9EAEbxYLW6JiCb3smqXQJIL9Meo4RvHkJqnWT8&tn=baidu&ie=utf-8">SiC</a>（碳化硅）领域的发展非常迅速，其SiC技术在电动汽车市场中的应用非常广泛，特别是在电力驱动系统中具有显著的性能优势。英飞凌科技（中国）有限公司主任工程师张浩分享了英飞凌最新车规SiC产品与应用。分享了带有嵌入式SBD的SiC MOSFET，采用HPD Gen2封装的英飞凌Si/SiC融合电源模块。英飞凌先进的转换控制栅极驱动器。用于OBC PFC应用的英飞凌Si/SiC混合分立D2PAK封装。</p> <p style="text-align: center;"><b> </b><img src="http://www.casmita.com/file/upload/202411/25/161426561.jpg" alt="耿伟" width="668" height="445" /></p> <p align="center">耿伟</p> <p align="center">长城汽车投资总监</p> <p>长城汽车投资总监耿伟带来了“国产化芯片机会和长城汽车布局”的主题报告。当前，国产车规芯片应用存在着国产车规芯片使用率低，产品覆盖率与实际上车率存在差异的难点。</p> <p>从数量上看，我国主流车企单车等芯片数量需求一般超过400颗，但平均实际可使用的国产芯片在几十颗左右，国产替代率 10-15%；类型上，国产车规芯片的品类较多，其中以功率类芯片上车进展较快，但MCU、控制类芯片的国产化率不足5%。我国通过推荐清单鼓励整车企使用国产芯片，从战略层面上鼓励国产芯片品类的丰富性和可替代性；而车企需要在国产化、可靠性、性价比之间寻求平衡。车规级MCU是汽车芯片国产化的突破口，车载MCU国产化取得进展，但上车率仍低。报告指出，整车E/E架构向中央服务网关发展，带来新的芯片需求。整车E/E架构向中央服务网关发展，带来新的芯片需求。传统汽车E/E架构是分布式的，有众多的ECU（电子控制器单元）分布在汽车中，处理网关功能的芯片是MCU。新的中央控制架构采用面向服务的网关，以整车为平台，软件更复杂、代码量提升，从而需要更强算力的SoC芯片。服务型网关芯片的设计开发需要对新一代的汽车架构有深刻的理解，才能精准定义出符合市场需求的产品。基于传统汽车开发经验的积累，海外芯片仍处于行业主导。整车架构的变革，给了国产化芯片更广阔的发展空间。 </p> <p>（根据现场资料整理，仅供参考）</p></div> </div> <div class="award"><div onclick="Go('http://www.casmita.com/member/award.php?mid=21&itemid=17245');">打赏</div></div><div id="comment" style="display:;"> <div class="block-head"><a 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