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Mohd Zapi、上海特易信息科技有限公司副总经理马爱玲等嘉宾带来主题分享,并进行深度度对话探讨。</p> <p style="text-align: center;">&nbsp;<img src="http://www.casmita.com/file/upload/202411/21/120847301.jpg" width="668" height="445" alt="" /></p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/21/120916451.jpg" alt="冯亚东" width="668" height="445" /></p> <p align="center">第三代半导体产业技术创新战略联盟副秘书长冯亚东主持</p> <p align="center"><img src="http://www.casmita.com/file/upload/202411/21/120945951.jpg" alt="徐天辰" width="668" height="445" />&nbsp;&nbsp;</p> <p align="center">经济学人智库高级经济学家 徐天辰</p> <p>经济学人智库高级经济学家徐天辰分享了《迎接波动:重点区域、国别政治经济形势展望》的主题报告。从全球市场视角来看,中美直接联系还将逐渐脱钩,还有有限的合作机会。第三方国家最受益,但与特朗普1.0时代或有不同。东南亚仍是最佳去处。墨西哥机遇不多,但南美值得开拓。中东机遇集中在沙特、阿联酋,海合会其他四国也是安全的选择。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/21/121003191.jpg" alt="Steven Cheng" width="668" height="445" />&nbsp;</p> <p align="center">马来西亚投资发展局(MIDA) 上海办公室主任Steven Cheng</p> <p>马来西亚投资发展局(MIDA) 上海办公室主任Steven Cheng分享了《目前环境下投资马来西亚的机会与风险》的主题报告,介绍了马来西亚投资发展局的情况,分享了当前投资趋势,政策,投资机遇及主要优惠措施。马来西亚有亲商投资政策,保护知识产权和投资保障协定,已与60多国签订了投资保障协定。外资在制造业及部分服务业领域可享有100%独资,资本、利息、分红等可自由汇回来源国。主要的奖励涉及新兴工业地位,投资赋税减免,再投资奖励,免进口税等。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/21/121016221.jpg" alt="Mohd zapi" width="668" height="445" />&nbsp;</p> <p align="center">马来西亚雪兰莪州CSSB-CEO En. Mohd Zapi</p> <p>雪兰莪是通往东盟的门户,马来西亚雪兰莪州CSSB分享了《中马数字与绿色科技园初步方案》的主题报告,分享了相关的建设构想、资源基础、推进计划。根据马来西亚中央政府以及雪兰莪州政府的总体发展规划,以科技创新带动产业聚集和产城融合发展为理念,对科技园进行总体规划设计。作为ICM集团国际化战略主体的Asia ICM Resources Sdn.Bhd公司与中关村半导体照明工程研发及产业联盟(CSA)达成战略合作,引进CSA旗下中国国家重点实验室,在马来西亚共建研发平台,推动半导体技术的创新和应用。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/21/121029131.jpg" alt="马爱玲" width="668" height="445" />&nbsp;</p> <p align="center">&nbsp;</p> <p align="center">上海特易信息科技有限公司副总经理</p> <p align="center">《以数据赋能外贸行业,为中国企业出海保驾护航》</p> <p>当前国内外环境错综复杂,我国外贸发展也面临一些挑战。上海特易信息科技有限公司副总经理马爱玲分享了《以数据赋能外贸行业,为中国企业出海保驾护航》的主题报告。报告指出,一带一路、新兴市场需求攀升,科技升级和转型,数字化、智能化技术的变革和引入带来贸易的新机遇。全球贸易增速回升、 &ldquo;一带一路&rdquo; 、新兴市场需求攀升。大数据、人工智能等技术整合进外贸流程中,从供应链管理到客户服务将更高效、透明,外贸企业迎来降本提效、结构性调整机会 由粗放成长到精细化发展,市场定位、产品创新、品牌营销、供应链优化、个性化服务等各环节蕴含机会。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/21/121103751.jpg" width="668" height="445" alt="" /></p> <p>主题报告之后,现场专家们围绕着&ldquo;出海&rdquo;主题,展开深度对话,深入交流,互通信息,现场互动氛围非常热烈。</p> <p>&nbsp;</p> <p><b>投融资角度看产业企业发展</b></p> <p>在&ldquo;投融资与信贷&rdquo;主题环节,由第三代半导体产业技术创新战略联盟副秘书长耿博主持。</p> <p>中科创星董事总经理张思申,中信银行苏州分行投资银行部主管李梦龙,元旭半导体科技股份有限公司董事长助理杨帆,芯三代半导体科技(苏州)股份有限公司执行总监韩跃斌分享主题报告,并进行现场交流探讨对话。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/21/121149211.jpg" alt="座谈" width="668" height="445" />&nbsp;</p> <p align="center">对话现场</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/21/121207231.jpg" alt="耿总" width="668" height="445" />&nbsp;</p> <p align="center">第三代半导体产业技术创新战略联盟副秘书长耿博主持</p> <p align="center"><img src="http://www.casmita.com/file/upload/202411/21/121233891.jpg" alt="张思申" />&nbsp;</p> <p align="center">中科创星董事总经理 张思申</p> <p>中科创星董事总经理张思申分享了《硬科技早期投资逻辑》的主题报告。分享了硬科技的早期投资逻辑,以及核心投资策略。报告指出,硬科技就是对产业贡献巨大的根技术,长期坚持对社会有价值的产业,才是投资的最优解。</p> <p style="text-align: center;">&nbsp;<img src="http://www.casmita.com/file/upload/202411/21/121248831.jpg" alt="李梦龙" width="668" height="445" />&nbsp;</p> <p align="center">中信银行苏州分行投资银行部主管 李梦龙</p> <p>中信银行苏州分行投资银行部主管李梦龙分享了《综合金融服务 助力半导体企业发展突破》的主题报告,分享了中信集团的协同优势、中信银行综合服务方案,以及并购融资案例。</p> <p style="text-align: center;">&nbsp;<img src="http://www.casmita.com/file/upload/202411/21/121309841.jpg" alt="杨帆" width="668" height="445" /></p> <p align="center">元旭半导体科技股份有限公司董事长助理 杨帆</p> <p>元旭半导体科技股份有限公司董事长助理杨帆分享了《从芯到屏,垂直整合 开启Micro-LED智慧显示时代》的主题报告。分享了元旭半导体公司介绍及未来发展规划。报告指出,新一代Micro-LED技术突破,强势打开商业显示和消费电子市场,迎来行业爆发式增长。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/21/121325191.jpg" alt="韩跃斌" width="668" height="445" />&nbsp;</p> <p align="center">芯三代半导体科技(苏州)股份有限公司执行总监 韩跃斌</p> <p>芯三代半导体科技(苏州)股份有限公司执行总监韩跃斌带来了《基于超高温CVD技术的第三代半导体碳化硅外延设备的研发和产业化》的主题报告,分享了碳化硅产业及市场的发展状况及芯三代的核心竞争力,芯三代已实现垂直气流8英寸和6英寸设备大批量销售。&nbsp;</p> <p><b>知识产权的风险与应对策略</b><b><span><br /> 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