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<p><b>“出海”的机遇与挑战</b></p> <p>“海外业务拓展与贸易风险”主题环节,由第三代半导体产业技术创新战略联盟副秘书长冯亚东主持。经济学人智库高级经济学家徐天辰、马来西亚投资发展局(MIDA) 上海办公室主任Steven Cheng、马来西亚雪兰莪州(CSSB)CEO En. Mohd Zapi、上海特易信息科技有限公司副总经理马爱玲等嘉宾带来主题分享,并进行深度度对话探讨。</p> <p style="text-align: center;"> <img src="http://www.casmita.com/file/upload/202411/21/120847301.jpg" width="668" height="445" alt="" /></p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/21/120916451.jpg" alt="冯亚东" width="668" height="445" /></p> <p align="center">第三代半导体产业技术创新战略联盟副秘书长冯亚东主持</p> <p align="center"><img src="http://www.casmita.com/file/upload/202411/21/120945951.jpg" alt="徐天辰" width="668" height="445" /> </p> <p align="center">经济学人智库高级经济学家 徐天辰</p> <p>经济学人智库高级经济学家徐天辰分享了《迎接波动:重点区域、国别政治经济形势展望》的主题报告。从全球市场视角来看,中美直接联系还将逐渐脱钩,还有有限的合作机会。第三方国家最受益,但与特朗普1.0时代或有不同。东南亚仍是最佳去处。墨西哥机遇不多,但南美值得开拓。中东机遇集中在沙特、阿联酋,海合会其他四国也是安全的选择。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/21/121003191.jpg" alt="Steven Cheng" width="668" height="445" /> </p> <p align="center">马来西亚投资发展局(MIDA) 上海办公室主任Steven Cheng</p> <p>马来西亚投资发展局(MIDA) 上海办公室主任Steven Cheng分享了《目前环境下投资马来西亚的机会与风险》的主题报告,介绍了马来西亚投资发展局的情况,分享了当前投资趋势,政策,投资机遇及主要优惠措施。马来西亚有亲商投资政策,保护知识产权和投资保障协定,已与60多国签订了投资保障协定。外资在制造业及部分服务业领域可享有100%独资,资本、利息、分红等可自由汇回来源国。主要的奖励涉及新兴工业地位,投资赋税减免,再投资奖励,免进口税等。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/21/121016221.jpg" alt="Mohd zapi" width="668" height="445" /> </p> <p align="center">马来西亚雪兰莪州CSSB-CEO En. Mohd Zapi</p> <p>雪兰莪是通往东盟的门户,马来西亚雪兰莪州CSSB分享了《中马数字与绿色科技园初步方案》的主题报告,分享了相关的建设构想、资源基础、推进计划。根据马来西亚中央政府以及雪兰莪州政府的总体发展规划,以科技创新带动产业聚集和产城融合发展为理念,对科技园进行总体规划设计。作为ICM集团国际化战略主体的Asia ICM Resources Sdn.Bhd公司与中关村半导体照明工程研发及产业联盟(CSA)达成战略合作,引进CSA旗下中国国家重点实验室,在马来西亚共建研发平台,推动半导体技术的创新和应用。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/21/121029131.jpg" alt="马爱玲" width="668" height="445" /> </p> <p align="center"> </p> <p align="center">上海特易信息科技有限公司副总经理</p> <p align="center">《以数据赋能外贸行业,为中国企业出海保驾护航》</p> <p>当前国内外环境错综复杂,我国外贸发展也面临一些挑战。上海特易信息科技有限公司副总经理马爱玲分享了《以数据赋能外贸行业,为中国企业出海保驾护航》的主题报告。报告指出,一带一路、新兴市场需求攀升,科技升级和转型,数字化、智能化技术的变革和引入带来贸易的新机遇。全球贸易增速回升、 “一带一路” 、新兴市场需求攀升。大数据、人工智能等技术整合进外贸流程中,从供应链管理到客户服务将更高效、透明,外贸企业迎来降本提效、结构性调整机会 由粗放成长到精细化发展,市场定位、产品创新、品牌营销、供应链优化、个性化服务等各环节蕴含机会。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/21/121103751.jpg" width="668" height="445" alt="" /></p> <p>主题报告之后,现场专家们围绕着“出海”主题,展开深度对话,深入交流,互通信息,现场互动氛围非常热烈。</p> <p> </p> <p><b>投融资角度看产业企业发展</b></p> <p>在“投融资与信贷”主题环节,由第三代半导体产业技术创新战略联盟副秘书长耿博主持。</p> <p>中科创星董事总经理张思申,中信银行苏州分行投资银行部主管李梦龙,元旭半导体科技股份有限公司董事长助理杨帆,芯三代半导体科技(苏州)股份有限公司执行总监韩跃斌分享主题报告,并进行现场交流探讨对话。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/21/121149211.jpg" alt="座谈" width="668" height="445" /> </p> <p align="center">对话现场</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/21/121207231.jpg" alt="耿总" width="668" height="445" /> </p> <p align="center">第三代半导体产业技术创新战略联盟副秘书长耿博主持</p> <p align="center"><img src="http://www.casmita.com/file/upload/202411/21/121233891.jpg" alt="张思申" /> </p> <p align="center">中科创星董事总经理 张思申</p> <p>中科创星董事总经理张思申分享了《硬科技早期投资逻辑》的主题报告。分享了硬科技的早期投资逻辑,以及核心投资策略。报告指出,硬科技就是对产业贡献巨大的根技术,长期坚持对社会有价值的产业,才是投资的最优解。</p> <p style="text-align: center;"> <img src="http://www.casmita.com/file/upload/202411/21/121248831.jpg" alt="李梦龙" width="668" height="445" /> </p> <p align="center">中信银行苏州分行投资银行部主管 李梦龙</p> <p>中信银行苏州分行投资银行部主管李梦龙分享了《综合金融服务 助力半导体企业发展突破》的主题报告,分享了中信集团的协同优势、中信银行综合服务方案,以及并购融资案例。</p> <p style="text-align: center;"> <img src="http://www.casmita.com/file/upload/202411/21/121309841.jpg" alt="杨帆" width="668" height="445" /></p> <p align="center">元旭半导体科技股份有限公司董事长助理 杨帆</p> <p>元旭半导体科技股份有限公司董事长助理杨帆分享了《从芯到屏,垂直整合 开启Micro-LED智慧显示时代》的主题报告。分享了元旭半导体公司介绍及未来发展规划。报告指出,新一代Micro-LED技术突破,强势打开商业显示和消费电子市场,迎来行业爆发式增长。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/21/121325191.jpg" alt="韩跃斌" width="668" height="445" /> </p> <p align="center">芯三代半导体科技(苏州)股份有限公司执行总监 韩跃斌</p> <p>芯三代半导体科技(苏州)股份有限公司执行总监韩跃斌带来了《基于超高温CVD技术的第三代半导体碳化硅外延设备的研发和产业化》的主题报告,分享了碳化硅产业及市场的发展状况及芯三代的核心竞争力,芯三代已实现垂直气流8英寸和6英寸设备大批量销售。 </p> <p><b>知识产权的风险与应对策略</b><b><span><br /> </span></b>在“知识产权与专利运营”主题环节,由第三代半导体产业技术创新战略联盟副秘书长高伟主持,北京北方华创微电子装备有限公司合规副总裁宋巧丽,北京熙说信息科技有限公司博士、研究员马志勇,北京芯创智源知识产权咨询服务有限公司咨询业务总监徐俊,天启黑马信息科技有限公司资深检索分析师张纵纵等围绕着知识产权的风险与应对相关内容,参与主题分享和深度对话。</p> <p style="text-align: center;"><img 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