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ICMESP 2025 : International Conference on Microelectronic Engineering and Semiconductor Physics

ICMESP 2025 : International Conference on Microelectronic Engineering and Semiconductor Physics

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The ICMESP 2025 : International Conference on Microelectronic Engineering and Semiconductor Physics covers topics such as: Semiconductors for microelectronics and photonics, Microelectronics, electromagnetics and photonics, Microelectronics, photonics and nanotechnology, Microelectronics and photonics, Engineered materials, Photonics, micro-electronics, and materials, Microelectronics, Micro- and nanotechnology, Microelectronics processing and materials, Photonics, Nanoelectronic and photonic devices and their fabrication, Micro-/nano-engineering / fabrication / technology / manufacturing, Microfluidics, life science devices /sensors, as well as integrated lab-on-a-chip and their fabrication, Microsystems, microdevices (e.g., sensors and nanoenergy devices) and their fabrication, Optical lithography, Nanolithography and nanopatterning, X-ray optical methods and systems, Electron optical methods and systems, Limits of nanolithography, Resists, Euv lithography and masks, Nanoimprint lithography, Nanoimprint lithography techniques and templates, Charged particle based lithography and patterning, Emerging nanopatterning methods, Maskless lithography, Pattern transfer, Limits of nanopatterning, Plasma processing, Ion technology, Plasma etching, Transfer of pattern with other methods, Plasma / beam nanopatterning, Plasma nanotechnology, Wet transfer methods, Plasma surface modification of devices, Metallization and barrier materials, Materials, Dielectrics (low k and high k), Silicon on insulators, New resist materials, Interconnects, Block copolymers, Nanomaterials for device fabrication, Layered (2d) materials and related transferring techniques, Polymers and flexible substrates, Electron beam testers, Nanometrology, inspection and testing, Signal and image processing, Laser probes, Afm and scanning probe measurements, Nanometrology, Process integration, Advanced processing and nanofabrication, Other / emerging manufacturing and fabrication techniques, Three dimensional integration, Rapid thermal processing, 3d printing, Equipment modelling, Process modelling and simulation, Top-down / bottom-up (self-assembly) nanofabrication, Laser assisted processing, Plasma deposition, Growth, planarization, cleaning techniques for devices, Other growth techniques, Mbe, Advanced nanoelectronic, photonic, sensing, energy harvesting, and fluidic devices, Planarization and cleaning techniques, Memristive devices for neuromorphic computing, Nanoelectronic, optoelectronic and photonic devices, Photonic devices, Steep slope or fast switching devices, Dimension-sensitive device properties, Optoelectronic devices, Magnetic and spintronic devices, Memory devices, Vacuum nanoelectronics, Advanced mos devices, Organic and molecular electronics, Flexible / organic / molecular electronics, Wearable electronics, Flexible electronics, Printed electronics, Paper electronics, Physical sensors and actuators, Microdevices, energy harvesting devices and sensors, Micro- and nanofluidics, Energy harvesting devices, Pumping devices, Valving devices, Separation devices, Mixing devices, Biosensors, Other miniaturized devices for biology, chemistry, and medicine (sensors and biosensors), Biomimetic properties incorporated into devices, Chemical sensors, Micro / nano / bio interface and interconnection devices, Bioelectronic devices, Electro-mechanical systems (mems, nems), Advanced fabrication and characterization for heterogeneous micro and nano systems, Rf mems, Power mems, Magnetic mems, Moems, Fluidic systems, Optical and photonic systems, Microreactors, Pumping / valving systems, Biosystems, Fluidic interfaces and integration, Cell on chip, Dna / protein chips, Biomimetic properties incorporated into systems, Organ on chip, Bioanalytic, diagnostic systems, Lab-on-a-chip, On-chip detection systems, Microseparation, pretreatment systems, Research and advances in nanoelectronics, nanofabrication, micro-nano systems, and applications, Environmental and food monitoring systems

Profile Details
Full Name
ICMESP 2025 : International Conference on Microelectronic Engineering and Semiconductor Physics
Start Date
2025-06-13
End Date
2025-06-14
Place Name
Barcelona
Street
City
Barcelona
Region
Country
ES
Address
Barcelona, Spain
Organization
WASET - World Academy of Science, Engineering and Technology
Performers
Speakers or Exhibitors
Industry
Electronics & Electrical

The ICMESP 2025 : International Conference on Microelectronic Engineering and Semiconductor Physics covers topics such as:

  • Semiconductors for microelectronics and photonics
  • Microelectronics, electromagnetics and photonics
  • Microelectronics, photonics and nanotechnology
  • Microelectronics and photonics
  • Engineered materials
  • Photonics, micro-electronics, and materials
  • Microelectronics
  • Micro- and nanotechnology
  • Microelectronics processing and materials
  • Photonics
  • Nanoelectronic and photonic devices and their fabrication
  • Micro-/nano-engineering / fabrication / technology / manufacturing
  • Microfluidics, life science devices /sensors, as well as integrated lab-on-a-chip and their fabrication
  • Microsystems, microdevices (e.g., sensors and nanoenergy devices) and their fabrication
  • Optical lithography
  • Nanolithography and nanopatterning
  • X-ray optical methods and systems
  • Electron optical methods and systems
  • Limits of nanolithography
  • Resists
  • Euv lithography and masks
  • Nanoimprint lithography
  • Nanoimprint lithography techniques and templates
  • Charged particle based lithography and patterning
  • Emerging nanopatterning methods
  • Maskless lithography
  • Pattern transfer
  • Limits of nanopatterning
  • Plasma processing
  • Ion technology
  • Plasma etching
  • Transfer of pattern with other methods
  • Plasma / beam nanopatterning
  • Plasma nanotechnology
  • Wet transfer methods
  • Plasma surface modification of devices
  • Metallization and barrier materials
  • Materials
  • Dielectrics (low k and high k)
  • Silicon on insulators
  • New resist materials
  • Interconnects
  • Block copolymers
  • Nanomaterials for device fabrication
  • Layered (2d) materials and related transferring techniques
  • Polymers and flexible substrates
  • Electron beam testers
  • Nanometrology, inspection and testing
  • Signal and image processing
  • Laser probes
  • Afm and scanning probe measurements
  • Nanometrology
  • Process integration
  • Advanced processing and nanofabrication
  • Other / emerging manufacturing and fabrication techniques
  • Three dimensional integration
  • Rapid thermal processing
  • 3d printing
  • Equipment modelling
  • Process modelling and simulation
  • Top-down / bottom-up (self-assembly) nanofabrication
  • Laser assisted processing
  • Plasma deposition
  • Growth, planarization, cleaning techniques for devices
  • Other growth techniques
  • Mbe
  • Advanced nanoelectronic, photonic, sensing, energy harvesting, and fluidic devices
  • Planarization and cleaning techniques
  • Memristive devices for neuromorphic computing
  • Nanoelectronic, optoelectronic and photonic devices
  • Photonic devices
  • Steep slope or fast switching devices
  • Dimension-sensitive device properties
  • Optoelectronic devices
  • Magnetic and spintronic devices
  • Memory devices
  • Vacuum nanoelectronics
  • Advanced mos devices
  • Organic and molecular electronics
  • Flexible / organic / molecular electronics
  • Wearable electronics
  • Flexible electronics
  • Printed electronics
  • Paper electronics
  • Physical sensors and actuators
  • Microdevices, energy harvesting devices and sensors
  • Micro- and nanofluidics
  • Energy harvesting devices
  • Pumping devices
  • Valving devices
  • Separation devices
  • Mixing devices
  • Biosensors
  • Other miniaturized devices for biology, chemistry, and medicine (sensors and biosensors)
  • Biomimetic properties incorporated into devices
  • Chemical sensors
  • Micro / nano / bio interface and interconnection devices
  • Bioelectronic devices
  • Electro-mechanical systems (mems, nems)
  • Advanced fabrication and characterization for heterogeneous micro and nano systems
  • Rf mems
  • Power mems
  • Magnetic mems
  • Moems
  • Fluidic systems
  • Optical and photonic systems
  • Microreactors
  • Pumping / valving systems
  • Biosystems
  • Fluidic interfaces and integration
  • Cell on chip
  • Dna / protein chips
  • Biomimetic properties incorporated into systems
  • Organ on chip
  • Bioanalytic, diagnostic systems
  • Lab-on-a-chip
  • On-chip detection systems
  • Microseparation, pretreatment systems
  • Research and advances in nanoelectronics, nanofabrication, micro-nano systems, and applications
  • Environmental and food monitoring systems

The ICMESP 2025 : International Conference on Microelectronic Engineering and Semiconductor Physics might be held in Barcelona, Spain in 13-14 Jun 2025.

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ICMESP 2025 : International Conference on Microelectronic Engineering and Semiconductor Physics - 13-14 Jun 2025, Barcelona, Spain
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