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CASICON 2023 西安站| 2023功率与光电半导体器件设计及集成应用论坛_CASICON 2023 西安站| 2023功率与光电半导体器件设计及集成应用论坛_CASICON 2023·西安站

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href="http://www.casmita.com/news/202307/26/12720.html" target="_blank" class="lis-tit-img_thumb"><img src="http://www.casmita.com/file/upload/202307/26/201750151.jpg" border="0"></a> <div class="lis-tit-img_desc"><a href="http://www.casmita.com/news/202307/26/12720.html" target="_blank" class="lis-tit-img_tit"><span style="color:#0000FF">2023功率与光电半导体器件设计及集成应用论坛在西安召开</span></a><p class="lis-tit-img_txt"><p><span style="color: rgb(51, 51, 51); font-family: " microsoft="" font-size:="" text-indent:="">2023年7月26日,&ldquo;2023功率与光电半导体器件设计及集成应用论坛&rdquo;在西安开幕。</span><span style="color: rgb(51, 51, 51); font-family: " microsoft="" font-size:="">来自30多所高校科研院所的专家学者代表和数十家企业的近300位代表出席本次论坛。</span></p></p></div> </div> </div> <div class="grid_1"> <div class="lis-tit-img"> <a href="http://www.casmita.com/news/202307/28/12728.html" target="_blank" class="lis-tit-img_thumb"><img src="http://www.casmita.com/file/upload/202307/28/085228351.jpg" border="0"></a> <div class="lis-tit-img_desc"><a href="http://www.casmita.com/news/202307/28/12728.html" target="_blank" class="lis-tit-img_tit"><span style="color:#0000FF">CASICON 2023 西安站精彩继续 焦点平行论坛深度互动</span></a><p class="lis-tit-img_txt"><p><span style="color: rgb(51, 51, 51); font-family: " microsoft="" font-size:="" text-indent:="">27日,两大平行论坛热烈继续,近50位国内科研院所专家学者、产业链知名企业高管专题聚焦,围绕光电子器件与功率半导体器件的设计、测试评价及应用、关键材料与制备工艺等重点方向,分享前沿主题报告,追踪最新技术进展,深入探讨互动交流。</span></p></p></div> </div> </div> <div class="grid_1"> <div class="lis-tit-img"> <a href="http://www.casmita.com/news/202307/28/12729.html" target="_blank" class="lis-tit-img_thumb"><img src="http://www.casmita.com/file/upload/202307/28/155018821.jpg" border="0"></a> <div class="lis-tit-img_desc"><a href="http://www.casmita.com/news/202307/28/12729.html" target="_blank" class="lis-tit-img_tit"><span style="color:#0000FF">CASICON 2023 西安站实地走访篇:西安和其光电科技股份有限公司</span></a><p class="lis-tit-img_txt"><p><span style="color: rgb(51, 51, 51); font-family: " microsoft="" font-size:="" text-indent:="">论坛期间,组织安排嘉宾代表们走访西安和其光电科技股份有限公司,实地了解交流高端传感器及测量系统的研发、光电量测技术解决方案等,探讨更多的合作可能。</span></p></p></div> </div> </div> </div> </div> <div class="block"> <h2 class="b-title">大会报告</h2> <div class="b-box clearfix"> <div class="grid_1"> <div class="lis-tit-img"> <a href="http://www.casmita.com/news/202307/27/12721.html" target="_blank" class="lis-tit-img_thumb"><img src="http://www.casmita.com/file/upload/202307/27/084052521.jpg" border="0"></a> <div class="lis-tit-img_desc"><a href="http://www.casmita.com/news/202307/27/12721.html" target="_blank" class="lis-tit-img_tit"><span style="color:#0000FF">西电副校长张进成教授:宽禁带半导体射频和功率器件技术新进展</span></a><p class="lis-tit-img_txt"><p><span style="color: rgb(51, 51, 51); font-family: " microsoft="" font-size:="" text-indent:="">西安电子科技大学副校长、教授张进成做了题为&ldquo;宽禁带半导体射频和功率器件技术新进展&rdquo;的主题报告</span></p></p></div> </div> </div> <div class="grid_1"> <div class="lis-tit-img"> <a href="http://www.casmita.com/news/202307/27/12722.html" target="_blank" class="lis-tit-img_thumb"><img src="http://www.casmita.com/file/upload/202307/27/085229501.jpg" border="0"></a> <div class="lis-tit-img_desc"><a href="http://www.casmita.com/news/202307/27/12722.html" target="_blank" class="lis-tit-img_tit"><span style="color:#0000FF">厦门大学张保平教授:宽禁带光电子半导体发展现状及趋势</span></a><p class="lis-tit-img_txt"><p><span style="color: rgb(51, 51, 51); font-family: " microsoft="" font-size:="" text-indent:="">厦门大学电子科学与技术学院(微电子学院)副院长、教授张保平做了题为&ldquo;宽禁带光电子半导体发展现状及趋势&rdquo;的主题报告</span></p></p></div> </div> </div> <div class="grid_1"> <div class="lis-tit-img"> <a href="http://www.casmita.com/news/202307/27/12723.html" target="_blank" class="lis-tit-img_thumb"><img src="http://www.casmita.com/file/upload/202307/27/085506561.jpg" border="0"></a> <div class="lis-tit-img_desc"><a href="http://www.casmita.com/news/202307/27/12723.html" target="_blank" class="lis-tit-img_tit"><span style="color:#0000FF">香港科技大学(广州)系统枢纽院李世玮教授:高功率芯片三维堆叠封装热管理的新思路</span></a><p class="lis-tit-img_txt"><p><span style="color: rgb(51, 51, 51); font-family: " microsoft="" font-size:="" text-indent:="">香港科技大学(广州)系统枢纽院长、智能制造学域讲座教授李世玮带来了&ldquo;高功率芯片三维堆叠封装热管理的新思路&rdquo;的主题报告</span></p></p></div> </div> </div> <div class="grid_1"> <div class="lis-tit-img"> <a href="http://www.casmita.com/news/202307/27/12724.html" target="_blank" class="lis-tit-img_thumb"><img src="http://www.casmita.com/file/upload/202307/27/094223291.jpg" border="0"></a> <div class="lis-tit-img_desc"><a href="http://www.casmita.com/news/202307/27/12724.html" target="_blank" class="lis-tit-img_tit"><span style="color:#0000FF">西安交通大学杨旭教授:宽禁带器件应用与集成化研究进展</span></a><p class="lis-tit-img_txt"><p><span style="color: rgb(51, 51, 51); font-family: " microsoft="" font-size:="" text-indent:="">西安交通大学电气学院教授/副院长杨旭带来了《宽禁带器件应用与集成化研究进展》的主题报告。</span></p></p></div> </div> </div> <div class="grid_1"> <div class="lis-tit-img"> <a href="http://www.casmita.com/news/202307/27/12726.html" target="_blank" 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