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margin-bottom: 12px; line-height: 1.8; font-family: 微软雅黑; text-align: justify; color: rgb(43, 43, 43); text-indent: 0px;"><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">碳化硅（</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">SiC</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">）陶瓷结构件在各类新应用场景的需求正在逐渐增多，其中包括核工业领域的大尺寸复杂形状</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">SiC</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">陶瓷核反应堆芯；集成电路制造关键装备光刻机的</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">SiC</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">陶瓷工件台、导轨、反射镜、陶瓷吸盘、手臂等；新能源锂电池生产配套的中高端精密</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">SiC</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">陶瓷结构件；光伏行业生产用扩散炉配套高端精密</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">SiC</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">陶瓷结构件和电子半导体高端芯片生产制程用精密高纯</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">SiC</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">陶瓷结构件。但是由于</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">SiC </span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">是</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">Si-C</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">键很强的共价键化合物，硬度仅次于金刚石，具有极高的硬度和显著的脆性，精密加工难度大。因此，大尺寸、复杂异形中空结构精密</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">SiC </span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">结构件的制备难度较高，限制了</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">SiC </span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">陶瓷在诸如集成电路这类的高端装备制造领域中的广泛应用，</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">3D</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">打印技术可以有效解决这一难题。</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">3D</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">打印</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">SiC</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">陶瓷制备技术已成为目前</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">SiC</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">陶瓷研究和应用的主要发展方向之一。目前</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">3D</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">打印</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">SiC</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">陶瓷主要为反应烧结</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">SiC</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">陶瓷，大多数密度低于</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">2.95g·cm<sup>-3</sup></span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">，硅含量通常大于</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">30vol%</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">，甚至高达</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">50vol%</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">，由于硅熔点低于</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">1410</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">℃，导致其使用温度较低，大大限制了</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">3D</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">打印</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">SiC</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">陶瓷在半导体领域（如</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">LPCVD</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">）的应用场景。</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;"><o:p></o:p></span> </p> <p style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-family: 微软雅黑; text-align: justify; color: rgb(43, 43, 43); text-indent: 0px;">　　<span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">中国科学院上海硅酸盐研究所黄政仁研究员团队陈健研究员在前期提出高温熔融沉积结合反应烧结</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">3D</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">打印</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">SiC</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">陶瓷的基础上（</span><i><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">additive manufacturing</span></i><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">，</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">2022</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">，</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">58,102944</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">），进一步将陶瓷打印体等效碳密度从</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">0.80 g·cm<sup>-3</sup></span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">提高至接近理论等效碳密度</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">0.91 g·cm<sup>-3</sup></span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">，<span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">等效碳密度的增加导致渗硅难度呈指数级提升，直接液相渗硅容易阻塞通道导致渗硅失效。近期研究团队提出了气相与液相渗硅联用逐次渗硅方法，通过气相熔渗反应形成多孔</span></span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">SiC</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">壳层，避免高碳密度的陶瓷打印体在液相渗硅初期发生快速剧烈反应，同时限制液态硅与固体碳的接触面积，</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">这样不会发生熔渗通道的堵塞，<span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">使得后续的液相反应能够缓慢且持续地进行。最终制备的</span></span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">SiC</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">陶瓷密度可达</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">3.12 g·cm<sup>-3</sup></span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">，硅含量降低至</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">10vol%</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">左右，抗弯强度和弹性模量分别达到了</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">465MPa</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">和</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">426GPa</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">，力学性能与常压固相</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">烧结</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">SiC</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">陶瓷相当，可以极大提高</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">SiC</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">陶瓷环境使用温度。<span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">相关研究成果发表在</span></span><i><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">J. Eur. Ceram. Soc.</span></i><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">（</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">doi.org/10.1016/j.jeurceramsoc.2023.09.059</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">），申请中国发明专利</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">2</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">项，其中</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">1</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">项已授权（</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">ZL202211260158.3</span><span style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-size: 10.5pt;">），论文第一作者为上海硅酸盐所硕士毕业生李凡凡和博士毕业生祝明，通讯作者为陈健研究员和黄政仁研究员。相关研究得到国家重点研发计划、国家自然科学基金面上、上海市自然科学基金面上等项目的资助和支持。</span> </p> <p style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-family: 微软雅黑; text-align: center; color: rgb(43, 43, 43); text-indent: 0px;"><img src="http://www.casmita.com/file/upload/202310/07/161829682.png" width="660" alt="" oldsrc="W020230927819898521214.png" style="border-width: 0px;" /></p> <p style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-family: 微软雅黑; text-align: center; color: rgb(43, 43, 43); text-indent: 0px;">3D打印SiC陶瓷示意图 </p> <p style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-family: 微软雅黑; text-align: center; color: rgb(43, 43, 43); text-indent: 0px;"><img src="http://www.casmita.com/file/upload/202310/07/161829892.png" width="600" alt="" oldsrc="W020230927819898873501.png" style="border-width: 0px;" /></p> <p style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-family: 微软雅黑; text-align: center; color: rgb(43, 43, 43); text-indent: 0px;">气相渗硅形成的多孔SiC壳层 </p> <p style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-family: 微软雅黑; text-align: center; color: rgb(43, 43, 43); text-indent: 0px;"><img src="http://www.casmita.com/file/upload/202310/07/161829292.png" width="500" alt="" oldsrc="W020230927819899217590.png" style="border-width: 0px;" /></p> <p style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-family: 微软雅黑; text-align: center; color: rgb(43, 43, 43); text-indent: 0px;">采用气相和液相联用渗硅得到的SiC陶瓷力学性能 </p> <p style="margin-top: 0px; margin-bottom: 12px; line-height: 1.8; font-family: 微软雅黑; text-align: center; color: rgb(43, 43, 43); text-indent: 0px;">来源：<span style="text-align: justify;">中国科学院上海硅酸盐研究所</span></p> <div class="dpu8C _2kCxD " style="max-width: 100%; overflow-x: visible; font-size: 18px; line-height: 30px; color: rgb(34, 34, 34); margin-top: 28px; font-family: arial;"> </div></div> </div> <div class="award"><div 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