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IFWS:第二届车用半导体创新合作峰会召开_产业_新闻资讯_半导体产业网

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class="share-weibo" href="http://service.weibo.com/share/share.php?title=IFWS%EF%BC%9A%E7%AC%AC%E4%BA%8C%E5%B1%8A%E8%BD%A6%E7%94%A8%E5%8D%8A%E5%AF%BC%E4%BD%93%E5%88%9B%E6%96%B0%E5%90%88%E4%BD%9C%E5%B3%B0%E4%BC%9A%E5%8F%AC%E5%BC%80&url=http%3A%2F%2Fwww.casmita.com%2Fnews%2F202302%2F13%2F11058.html&pic=" target="_blank"><i class="icon icon-weibo"></i><span>微博</span></a> <a class="share-qzone" href="https://sns.qzone.qq.com/cgi-bin/qzshare/cgi_qzshare_onekey?url=http%3A%2F%2Fwww.casmita.com%2Fnews%2F202302%2F13%2F11058.html&title=IFWS%EF%BC%9A%E7%AC%AC%E4%BA%8C%E5%B1%8A%E8%BD%A6%E7%94%A8%E5%8D%8A%E5%AF%BC%E4%BD%93%E5%88%9B%E6%96%B0%E5%90%88%E4%BD%9C%E5%B3%B0%E4%BC%9A%E5%8F%AC%E5%BC%80" target="_blank"><i class="icon icon-qzone"></i><span>Qzone</span></a> <a class="share-wechat"><i class="icon icon-wechat"></i><span>微信</span></a> </div> <div class="content-box"> <h1 class="title" id="title">IFWS:第二届车用半导体创新合作峰会召开</h1> <div class="info"> <span style="padding-right:1em">日期:2023-02-13</span> <span style="padding-right:1em">来源:半导体产业网</span><span id="hits">阅读:1370</span> </div> <div class="introduce">核心提示:汽车是半导体的重要应用领域,汽车级半导体要求高于工业级和消费级半导体。汽车半导体除了汽车行业通用的规范外,还有更严苛的车</div><div id="content"><div class="content" id="article"><p>&nbsp;<span style="text-indent: 2em;">汽车是半导体的重要应用领域,汽车级半导体要求高于工业级和消费级半导体。汽车半导体除了汽车行业通用的规范外,还有更严苛的车规级认证标准。汽车半导体具有技术壁垒高与需求旺盛的特点。汽车电动化、网联化、智能化发展趋势中,电动化最受益的是功率器件,尤其是IGBT。智能化的快速发展,自动驾驶、智能座舱等对汽车感知器件、运算能力、数据量需求日益提升,汽车控制芯片、存储芯片等成长空间广阔。</span></p> <p>近日,第八届国际第三代半导体论坛(IFWS)&amp;第十九届中国国际半导体照明论坛(SSLCHINA)于苏州胜利召开。本届论坛是在国家科学技术部高新技术司、国家科学技术部国际合作司、国家工业与信息化部原材料工业司、 国家节能中心、国家新材料产业发展专家咨询委员会、江苏省科学技术厅、苏州市科学技术局、苏州工业园区管理委员会的大力支持下,由第三代半导体产业技术创新战略联盟(CASA)、中关村半导体照明工程研发及产业联盟(CSA)、国家第三代半导体技术创新中心(苏州)联合主办。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202302/21/180447201.jpg" alt="车用" width="668" height="445" /></p> <p>期间,&ldquo;第二届车用半导体创新合作峰会&rdquo;如期召开。该论坛得到英诺赛科、北京一径科技有限公司、上海瞻芯电子科技有限公司、深圳市先进连接科技有限公司、宁波升谱光电股份有限公司等单位的协办支持。车用半导体创新合作峰会关注智能驾驶时代下第三代半导体材料的技术进步给电动车电驱电控系统和电源系统带来的新的技术进展,以及其他汽车半导体共性问题,力求联动上下游资源,为汽车半导体产业链和供应链提供生态机遇。会上,国家电网全球能源互联网研究院原院长、厦门大学讲座教授邱宇峰和复旦大学上海碳化硅功率器件工程技术研究中心主任张清纯教授联袂主持。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202302/21/180506691.jpg" alt="邱宇峰" width="668" height="445" /></p> <p style="text-align: center;">国家电网全球能源互联网研究院原院长、厦门大学讲座教授邱宇峰主持论坛</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202302/21/180546741.jpg" alt="张清纯2" width="668" height="445" /></p> <p style="text-align: center;">复旦大学上海碳化硅功率器件工程技术研究中心主任张清纯教授主持论坛</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202302/21/175806451.jpg" alt="会议现场" width="668" height="445" /></p> <p>会上,国家新能源汽车技术创新中心总师刘朝辉、北京一径科技有限公司副总裁邵嘉平、甬江实验室研究员王文博、深圳市先进连接科技有限公司总经理吴昊、南瑞联研半导体有限责任公司产品研发中心碳化硅技术总监田亮,中科芯集成电路有限公司MCU事业部副总经理傅建军,英诺赛科产品应用主任工程师孟无忌,中汽创智科技有限公司硬件系统开发部-芯片开发郭小川,清纯半导体研发经理史文华,星宇研究院功率器件工程师李玉清等精英专家们带来精彩报告,分享前沿研究成果。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202302/21/151320951.jpg" alt="刘朝辉" width="600" height="400" /></p> <p style="text-align: center;">国家新能源汽车技术创新中心总师刘朝辉做了题为&ldquo;基于SiC功率芯片的高功率密度电驱系统&rdquo;的主题报告</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202302/21/151342341.jpg" alt="邵嘉平" width="600" height="400" /></p> <p style="text-align: center;">北京一径科技有限公司副总裁邵嘉平介绍了ZVISION MEMS激光雷达的相关研究进展,包括独特的垂直ROI,超长感知范围,全水平FOV-ROI等</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202302/21/151406621.jpg" alt="瞻芯电子林其峰" width="600" height="400" /></p> <p>上海瞻芯电子科技有限公司市场经理林其锋做了题为&ldquo;车规级SiC功率器件及驱动IC的研发和应用&rdquo;的主题报告,介绍了单管及模块驱动IC的开发,碳化硅模块和专用驱动优化系统设计,碳化硅在预充电路上的应用、多管并联及多管芯并联的參数筛选等实践成果,涉及电驱驱动IC的开发,高密车载电动压缩机和OBC应用,多管并联动态均流驱动和參数筛选等。报告指出,瞻芯电子已稳步迈向IDM,专注碳化硅及配套驱动IC开发,确立单管并联和多管芯并联的筛选标准,努力提供车载变换器一站式解决方案。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202302/21/151424121.jpg" alt="王文博" width="600" height="400" /></p> <p>氮化镓材料特性优异,器件在消费电子、数据中心等应用领域已开始渗透。甬江实验室研究员王文博做了题为&ldquo;异质集成氮化镓功率模块(制造工艺)研究&rdquo;的主题报告,分享了集成GaN(电源)模块和异质集成GaN(电源)模块的研究成果,报告指出氮化镓功率器件在被正确使用的条件下,可以实现高频(MHz)、低损耗;氮化镓应用需要根据器件特点和应用场景定制化设计有源和无源功率模块;异质集成氮化镓模块需要开发适配的制造工艺。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202302/21/151442751.jpg" alt="吴昊2" width="600" height="400" /></p> <p>相比于其他的金属材料,银具有更高的导热性和低电阻率,且因其较高的强度硬度和较低的弹性模量,会具备更好的机械性能和应用可靠性。深圳市先进连接科技有限公司总经理吴昊做了题为&ldquo;功率半导体国产银烧结整体解决方案&rdquo;的主题报告,分享了烧结银的特性、烧结焊点的可靠性、材料性能、DTC工艺、AS系列烧结机及应用案例,报告指出,未来银烧结新工艺,涉及双面烧结,clip,引线框架。烧结铜膏方面,有降低成本的需求,可靠性问题方面,缺少有效分析模型。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202302/21/151501951.jpg" alt="田亮1" width="600" height="400" /></p> <p>电动汽车产业是先进制造业+战略性新兴产业的重要组成部分,充电桩不只是独立、物理的存在,背后涉及5G、大数据、工业互联网等&ldquo;新基建&rdquo;领域,智能充电网也是智慧城市的组成部分,云端平台的建设运维、大数据的分析管理至关重要。南瑞联研半导体有限责任公司产品研发中心碳化硅技术总监田亮做了题为&ldquo;碳化硅技术在充电桩及电网中的应用&rdquo;的主题报告,介绍了碳化硅器件在充电桩中的应用,碳化硅在电网中的应用。报告指出,规模化运营,车桩互补良性发展。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202302/21/151516151.jpg" alt="孟无忌" width="600" height="400" /></p> <p>GaN功率器件在智能汽车中的应用涉及双向DC/DC、自动驾驶核心电源、PD快充、车载充电器(OBC)、激光雷达、LED驱动、音响Class-D功放、能量管理系统(BMS)、电机驱动等环节。英诺赛科产品应用主任工程师孟无忌做了题为&ldquo;GaN在新能源汽车的探索与实践&rdquo;的主题报告,介绍了相关的实践成果与方案,报告指出,自动驾驶使处理器供电需求增大,GaN使高性能自动驾驶激光雷达成为可能。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202302/21/151531921.jpg" alt="傅建军" width="600" height="400" /></p> <p>电动化、网联化、智能化、共享化已进入全新发展阶段,正在引领汽车产业变革,提升车辆智能化水平是我国自主汽车品牌提升产品力和竞争力的关键,新基建推动智能汽车电子产品应用推广。中科芯集成电路有限公司MCU事业部副总经理傅建军做了题为&ldquo;国产IGBT芯片,助推新能源汽车高质量发展&rdquo;的主题报告,分享了汽车电子产业基础以及相关产业布局。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202302/21/151544601.jpg" alt="郭小川" width="600" height="400" /></p> <p>中汽创智科技有限公司硬件系统开发部-芯片开发郭小川做了题为&rdquo;碳化硅功率模块设计优化的多物理模拟&ldquo;的主题报告,介绍了功率模块多物理场的设计目标、电源模块电子模型、功率模块热机械模型、功率模块热模型、功率模块模具流动分析、综合多物理仿真平台等研究进展与成果。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202302/21/151603221.jpg" alt="史文华" width="600" height="400" /></p> <p>SiC器件具有很多优势,比如功耗降低 60%~80%, 效率提升 1%~3%, 续航提升约 10%。在多项工况测试下, SiC MOSFET相比 Si-IGBT 在功耗和效率上优势显著。清纯半导体研发经理史文华做了题为&ldquo;AECQ-101车规级认证的高性能1200V SiC MOS器件&rdquo;的主题报告,介绍了车规认证标准及体系以及1200V SiC MOS AECQ-101车规平台,报告指出,新能源汽车市场将带动碳化硅器件的不断发展;车规级的认证标准及体系,对碳化硅器件提出更高的要求。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202302/21/151618261.jpg" alt="李玉清" width="600" height="400" /></p> <p>星宇研究院功率器件工程师李玉清做了题为&rdquo;车载微芯片(MCU)应用失效案例分析研究&ldquo;的主题报告,报告建议,在电路设计中,可以增加电容或其他保护装置,以提高静电敏感能力静电放电电路,另一方面,当涉及到电子器件的制造时,除了ESD的形成之外保护措施和要求,公司应组建ESD优化团队,由所有人参与部门成员,对组件和PCBA进行分级保护,定期审查,优化和改进应持续不断地努力减少静电对产品的影响。在这种情况下,故障过程中有许多地方需要改进,特别是对于不同的静电模型和不同静电模型对芯片的影响以及实验产品的老化试验可以进一步研究和讨论静电损伤。(备注:以上信息未逐一请报告嘉宾确认,如有出入敬请谅解!)</p></div> </div> <div class="award"><div onclick="Go('http://www.casmita.com/member/award.php?mid=21&itemid=11058');">打赏</div></div><div id="comment" style="display:;"> <div class="block-head"><a href="http://www.casmita.com/comment/index.php?mid=21&itemid=11058"><b id="comment_count" class="px16 f_red">0</b> 条评论</a></div> <div id="comment_main"><div></div></div> </div> <script type="text/javascript" src="http://www.casmita.com/file/script/comment.js"></script> <div class="related"> <a href="http://www.casmita.com/news/search.php?kw="></a><a href="http://www.casmita.com/news/index.php?catid=6"></a> <div class="bui-box single-mode"> <div 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