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href="http://service.weibo.com/share/share.php?title=%E9%9D%92%E7%A6%BE%E6%99%B6%E5%85%83%E9%82%80%E6%82%A8%E5%90%8C%E8%81%9AIFWS%26SSLCHINA2024&url=http%3A%2F%2Fwww.casmita.com%2Fnews%2F202411%2F14%2F17210.html&pic=" target="_blank"><i class="icon icon-weibo"></i><span>微博</span></a> <a class="share-qzone" href="https://sns.qzone.qq.com/cgi-bin/qzshare/cgi_qzshare_onekey?url=http%3A%2F%2Fwww.casmita.com%2Fnews%2F202411%2F14%2F17210.html&title=%E9%9D%92%E7%A6%BE%E6%99%B6%E5%85%83%E9%82%80%E6%82%A8%E5%90%8C%E8%81%9AIFWS%26SSLCHINA2024" target="_blank"><i class="icon icon-qzone"></i><span>Qzone</span></a> <a class="share-wechat"><i class="icon icon-wechat"></i><span>微信</span></a> </div> <div class="content-box"> <h1 class="title" id="title">青禾晶元邀您同聚IFWS&SSLCHINA2024</h1> <div class="info"> <span style="padding-right:1em">日期：2024-11-14</span> <span id="hits">阅读：313</span> </div> <div class="introduce">核心提示：青禾晶元诚邀产业同仁共聚论坛，莅临B19号展位参观交流、洽谈合作。</div><div id="content"><div class="content" id="article"><p> 2024年11月18-21日，第十届国际第三代半导体论坛（IFWS2024）&第二十一届中国国际半导体照明论坛（SSLCHINA2024）、先进半导体技术应用创新展（CASTAS）将在苏州国际博览中心G馆举办。</p> <p>北京青禾晶元半导体科技有限责任公司将亮相此次展会。诚挚邀请第三代半导体产业同仁共聚论坛，莅临B19号展位参观交流、洽谈合作。同时，北京青禾晶元半导体科技有限责任公司董事长兼总经理母凤文将于“Mini/Micro-LED技术产业应用峰会”上，分享“面向Micro-LED封装的先进半导体键合集成技术”的主题报告，敬请关注！</p> <p><b>嘉宾简介</b></p> <p style="text-align: center;"><b><img src="http://www.casmita.com/file/upload/202411/14/101306821.jpg" alt="母凤文" width="239" height="308" /></b></p> <p align="center">母凤文</p> <p align="center">北京青禾晶元半导体科技有限责任公司董事长兼总经理</p> <p>母凤文博士长期专注于先进异质集成技术与装备的研究与开发，精通化合物半导体先进材料制备、器件低成本制造及后端封装整套工艺流程，原中科院微电子所研究员，中科院海外高层次人才，先后主持、参与日本总务省 5G 技术研究项目、日本学术振兴会项目、北京市科委重大专项、国家自然科学基金委项目及多项知名产业界公司合作研究项目。以第一、通讯作者身份在顶级及重要 SCI 期刊上发表文章 30 余篇，授权专利 100 余项，相关结果受到国外媒体广泛报道，多次国际学会邀请报告。曾获日本东京大学工学院院长奖、 2019 年教育部科技奖二等奖等。</p> <p><b>演讲报告：</b>面向Micro-LED封装的先进半导体键合集成技术</p> <p><b>演讲场次：</b>Mini/Micro-LED技术产业应用峰会</p> <p><b>公司简介</b></p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/14/101724231.jpg" width="230" height="153" alt="" /></p> <p>青禾晶元集团定位为先进键合技术与方案提供商，致力于将国际最前沿的半导体材料复合技术及核心键合设备国产化。采用具有自主知识产权的先进技术，实现半导体及相关产业的材料同质/异质集成和芯片同构/异构集成。公司在国内率先开展先进键合集成技术的落地及产业化，投资建成国内首条复合衬底量产线及高端键合装备量产基地，赢得了国内外众多知名产业集团及投资机构的广泛认可与信赖。</p> <p>在高端装备领域，面向Chiplet集成、器件制作（MEMS、射频、功率）、复合衬底制造和Micro-LED集成及显示面板封装等应用，公司可提供先进晶圆键合机、先进封装用芯片-芯片/晶圆键合机、功率模块用低温烧结键合机及表面处理等设备；在复合衬底领域，公司可提供Emerald-SiC、Obsidian-POI、SiCOl和SOI等产品。 </p> <p>iSABers is a premier provider of advanced bo<em></em>nding technologies and solutions, committed to the localization of cutting-edge semico<em></em>nductor material bo<em></em>nding technologies and pivotal bo<em></em>nding equipment. By leveraging advanced technologies with independent intellectual property rights, iSABers facilitates both homogeneous and heterogeneous integration of materials and chips within the semico<em></em>nductor and related industries. iSABers has blazed a trail in implementing and industrializing advanced bo<em></em>nding integration technology in China, establishing the inaugural factory for composite substrates and high-end bo<em></em>nding equipment, thereby earning widespread recognition and trust from numerous esteemed industrial groups and investment institutions.</p> <p>In the domain of high-end equipment, iSABers offers state-of-the-art wafer bonding, C2C/C2W bonding, low-temperature sintering, surface processing for a variety of applications including Chiplet integration, device manufacturing (including MEMS, RF, power devices), composite substrate fabrication, Micro LED integration, and display panel packaging. Regarding composite substrates specifically, iSABers provides products including Emerald-SiC, Obsidian-POI, SiCOl ,and SOI.</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/14/101739941.jpg" alt="广告页" width="536" height="800" /></p> <p> <strong>参会联系</strong></p> <p style="text-align: center;"><strong><img src="http://www.casmita.com/file/upload/202411/14/103027961.jpg" alt="分会" width="668" height="987" /></strong></p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/14/102359241.jpg" alt="大会日程总览1114" width="668" height="939" /></p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/14/101808841.jpg" alt="注册参会" width="668" height="694" /></p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/14/101816831.jpg" alt="贾在前" width="668" height="890" /></p></div> </div> <div class="award"><div 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