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class="share-wechat"><i class="icon icon-wechat"></i><span>微信</span></a> </div> <div class="content-box"> <h1 class="title" id="title">荣耀“封装芯片结构及其加工方法、和电子设备”专利获授权</h1> <div class="info"> <span style="padding-right:1em">日期:2024-10-29</span> <span id="hits">阅读:245</span> </div> <div class="introduce">核心提示:天眼查显示,荣耀终端有限公司近日取得一项名为封装芯片结构及其加工方法、和电子设备的专利,授权公告号为CN117133724B,授权公</div><div id="content"><div class="content" id="article"><p>天眼查显示,荣耀终端有限公司近日取得一项名为“封装芯片结构及其加工方法、和电子设备”的专利,授权公告号为CN117133724B,授权公告日为2024年10月1日,申请日为2023年3月20日。</p> <p>本申请提供一种封装芯片结构及其加工方法、和电子设备,涉及电子设备技术领域。该封装芯片结构具有导磁层和塑封屏蔽层,具有多层抗磁干扰的能力,有利于提高芯片的工作可靠性,同时封装芯片结构的体积小。</p></div> </div> <div class="award"><div onclick="Go('http://www.casmita.com/member/award.php?mid=21&itemid=16996');">打赏</div></div><div id="comment" style="display:;"> <div class="block-head"><a href="http://www.casmita.com/comment/index.php?mid=21&itemid=16996"><b id="comment_count" class="px16 f_red">0</b> 条评论</a></div> <div id="comment_main"><div></div></div> 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