Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications | J. Electron. Packag.

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Electron. Packag" /><meta name="citation_volume" content="127" /><meta name="citation_issue" content="1" /><meta name="citation_publication_date" content="2005/03/01" /><meta name="citation_issn" content="1043-7398" /><meta name="citation_publisher" content="American Society of Mechanical Engineers Digital Collection" /><meta name="citation_reference" content="citation_title=A Study of Process-Indeced Residual Stress in PBGA Packages; citation_author=Wu Z.; citation_author=Lu J.; citation_author=Guo Y.; ASME J. Electron. Packag.; citation_year=2000; citation_volume=122; citation_pages=262-266; " /><meta name="citation_reference" content="citation_title=Predicted Bow of Plastic Packages Due to the Nonuniform Through Thickness Distribution of Temperature; citation_author=Suhir E.; citation_author=Manzione L. T.; ASME J. Electron. 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Am.; citation_year=1925; citation_volume=11; citation_pages=233-255; " /><meta name="citation_reference" content="citation_title=Internal Stress of Epoxy Resin Modified With Acrylic Core-Shell Particles Prepared by Seeded Emulsion Polymerization; citation_author=Nakamura Y.; citation_author=Tabata H.; citation_author=Suzuki H.; citation_author=Iko K.; citation_author=Okube M.; citation_author=Matsumoto T.; J. Appl. Polym. Sci.; citation_year=1986; citation_volume=32; citation_pages=4865-4871; " /><meta name="citation_pdf_url" content="https://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/127/1/47/5883879/47_1.pdf" /><meta name="dc.identifier" content="10.1115/1.1849232" /> <meta name="citation_xml_url" content="https://asmedigitalcollection.asme.org/electronicpackaging/article-xml/127/1/47/461219" /> <meta name="description" content="Polymeric encapsulant is widely used to protect the integrated circuit chips and thus to enhance the reliability of electronic packages. Residual stresses"> <link rel="canonical" href="https://asmedigitalcollection.asme.org/electronicpackaging/article/127/1/47/461219/Experiment-and-Numerical-Analysis-of-the-Residual" /> <script type="application/ld+json"> {"@context":"https://schema.org","@type":"ScholarlyArticle","@id":"https://asmedigitalcollection.asme.org/electronicpackaging/article/127/1/47/461219/Experiment-and-Numerical-Analysis-of-the-Residual","name":"Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications","about":["Temperature","Residual stresses","Stress","Finite element analysis","Numerical analysis","Resins","Strips"],"datePublished":"2005-03-21","hasPart":[{"@type":"WebPageElement","isAccessibleForFree":false,"cssSelector":".paywall"}],"isPartOf":{"@id":"https://asmedigitalcollection.asme.org/electronicpackaging/issue/127/1","@type":"PublicationIssue","issueNumber":"1","datePublished":"2005-03-01","isPartOf":{"@id":"https://asmedigitalcollection.asme.org/electronicpackaging","@type":"Periodical","name":"Journal of Electronic Packaging","issn":["1528-9044"]}},"url":"https://dx.doi.org/10.1115/1.1849232","keywords":["Temperature","Residual stresses","Stress","Finite element analysis","Numerical analysis","Resins","Strips","resins","polymers","strips","integrated circuit packaging","integrated circuit reliability","plastic packaging","flip-chip devices","internal stresses","stress analysis","thermal expansion","failure analysis","elastic moduli","encapsulation","bending","shrinkage","finite element analysis","Residual Stress","Underfill Resins","Bi-Material Strip Bending (BMSB)","Finite Element Method"],"inLanguage":"en","copyrightHolder":"ASME","copyrightYear":"2024","publisher":"","author":[{"name":"Sham, Man-Lung ","affiliation":"Department of Mechanical Engineering, Hong Kong University of Science & Technology, Clear Water Bay, Kowloon, Hong Kong","@type":"Person"},{"name":"Kim, Jang-Kyo ","affiliation":"Department of Mechanical Engineering, Hong Kong University of Science & Technology, Clear Water Bay, Kowloon, Hong Kong","@type":"Person"}],"description":"Polymeric encapsulant is widely used to protect the integrated circuit chips and thus to enhance the reliability of electronic packages. Residual stresses are introduced in the plastic package when the polymer is cooled from the curing temperature to ambient, from which many reliability issues arise, including warpage of the package, premature interfacial failure, and degraded interconnections. Bimaterial strip bending experiment has been employed successfully to monitor the evolution of the residual stresses in underfrill resins for flip chip applications. A numerical analysis is developed to predict the residual stresses, which agree well with the experimental measurements. The changes of material properties, such as flexural modulus and coefficient of thermal expansion, of the resins with temperature are taken into account in the finite element analysis.","pageStart":"47","pageEnd":"51","siteName":"ASME Digital Collection","thumbnailURL":"//asmedc.silverchair-cdn.com/data/SiteBuilderAssets/Live/Images/electronicpackaging/electronicpackaging-625229447.jpg","headline":"Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications","image":"//asmedc.silverchair-cdn.com/data/SiteBuilderAssets/Live/Images/electronicpackaging/electronicpackaging-625229447.jpg","image:alt":"","isAccessibleForFree":false} </script> <meta property="og:site_name" content="ASME Digital Collection" /> <meta property="og:title" content="Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications" /> <meta property="og:description" content="Polymeric encapsulant is widely used to protect the integrated circuit chips and thus to enhance the reliability of electronic packages. Residual stresses are introduced in the plastic package when the polymer is cooled from the curing temperature to ambient, from which many reliability issues arise, including warpage of the package, premature interfacial failure, and degraded interconnections. Bimaterial strip bending experiment has been employed successfully to monitor the evolution of the residual stresses in underfrill resins for flip chip applications. A numerical analysis is developed to predict the residual stresses, which agree well with the experimental measurements. The changes of material properties, such as flexural modulus and coefficient of thermal expansion, of the resins with temperature are taken into account in the finite element analysis." /> <meta property="og:type" content="article" /> <meta property="og:url" content="https://dx.doi.org/10.1115/1.1849232" /> <meta property="og:updated_time" content="" /> <meta property="og:image" content="https://asmedc.silverchair-cdn.com/data/SiteBuilderAssets/Live/Images/electronicpackaging/electronicpackaging-625229447.jpg" /> <meta property="og:image:url" content="https://asmedc.silverchair-cdn.com/data/SiteBuilderAssets/Live/Images/electronicpackaging/electronicpackaging-625229447.jpg" /> <meta property="og:image:secure_url" content="https://asmedc.silverchair-cdn.com/data/SiteBuilderAssets/Live/Images/electronicpackaging/electronicpackaging-625229447.jpg" /> <meta property="og:image:alt" content="" /> <script type="text/javascript" async="async" 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class="module-widget article-top-widget content-metadata_wrap"> <div class="article-groups left-flag"> <span class="article-client_type">Article</span> </div> <div class="widget-items"> <h1 class="wi-article-title article-title-main"> Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications <i class='icon-availability_cart' title='Available to Purchase' ></i> </h1> <div class="wi-authors"> <div class="al-authors-list"> <div class="al-author-name">  <a class="linked-name js-linked-name stats-author-info-trigger" href="javascript:;">Man-Lung Sham</a><span class="al-author-delim">, </span> <div class="al-author-info-wrap arrow-up stats-author-info-panel"> <div class="info-card-author authorInfo_ArticleTopInfo_Abstract"> <div class="name-role-wrap"> <div class="info-card-name"> Man-Lung Sham </div> </div> <div class="info-card-affilitation"> <div class="aff"><div class="institution">Department of Mechanical Engineering, Hong Kong University of Science & Technology, Clear Water Bay, Kowloon, Hong Kong</div></div> </div> <div class="info-card-search-label"> Search for other works by this author on: </div> <div class="info-card-search info-card-search-internal"> <a href="/search-results?f_AllAuthors=Man-Lung++Sham" rel="nofollow">This Site</a> </div> <div class="info-card-search info-card-search-pubmed"> <a href="http://www.ncbi.nlm.nih.gov/pubmed?cmd=search&term=Man-Lung Sham">PubMed</a> </div> <div class="info-card-search info-card-search-google"> <a href="http://scholar.google.com/scholar?q=author:"Man-Lung Sham"">Google Scholar</a> </div> </div> </div> </div> <div class="al-author-name"> <a class="linked-name js-linked-name stats-author-info-trigger" href="javascript:;">Jang-Kyo Kim</a> <div class="al-author-info-wrap arrow-up stats-author-info-panel"> <div class="info-card-author authorInfo_ArticleTopInfo_Abstract"> <div class="name-role-wrap"> <div class="info-card-name"> Jang-Kyo Kim </div> </div> <div class="info-card-affilitation"> <div class="aff"><div class="institution">Department of Mechanical Engineering, Hong Kong University of Science & Technology, Clear Water Bay, Kowloon, Hong Kong</div></div> </div> <div class="info-card-search-label"> Search for other works by this author on: </div> <div class="info-card-search info-card-search-internal"> <a href="/search-results?f_AllAuthors=Jang-Kyo++Kim" rel="nofollow">This Site</a> </div> <div class="info-card-search info-card-search-pubmed"> <a href="http://www.ncbi.nlm.nih.gov/pubmed?cmd=search&term=Jang-Kyo Kim">PubMed</a> </div> <div class="info-card-search info-card-search-google"> <a href="http://scholar.google.com/scholar?q=author:"Jang-Kyo Kim"">Google Scholar</a> </div> </div> </div> </div> </div> </div> <div class="wi-crossmark-button"> <script src="https://crossmark-cdn.crossref.org/widget/v2.0/widget.js"></script> <a href="javascript:;" class="stats-crossmark-updates" data-target="crossmark"> <img 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class="author-affiliation"> <div class="aff"><div class="institution">Department of Mechanical Engineering, Hong Kong University of Science & Technology, Clear Water Bay, Kowloon, Hong Kong</div></div> </div> </div> </div> <div class="wi-footnotes"> <div> <div class="article-footnote"> <p>Manuscript received March 9, 2004; revision received August 4, 2004. Review conducted by: Y. C. Chan. </p> </div> </div> </div> </div> <div class="pub-history-wrap clearfix"> <div class="pub-history-row clearfix"> <div class="ww-citation-primary"><em>J. Electron. Packag</em>. Mar 2005, 127(1): 47-51 (5 pages)</div> </div> <div class="ww-citation-legacy-id"> <a class="ww-doi-link" href="https://doi.org/10.1115/1.1849232">https://doi.org/10.1115/1.1849232</a> </div> <div class="pub-history-row clearfix"> <div class="ww-publish-date-wrap"> <span class="publish-date-label"><b>Published Online:</b> March 21, 2005 </span> </div> <div class="ww-citation-history-wrap js-history-dropdown-wrap"> <a href="javascript:;" class="history-label js-history-dropdown-trigger"> <span>Article history</span><i class="icon-history-small"></i> </a> <div class="ww-history js-history-entries-wrap"> <div class="history-entry"> <div class="wi-state">Received:</div> <div class="wi-date">March 9, 2004</div> </div> <div class="history-entry"> <div class="wi-state">Revised:</div> <div class="wi-date">August 4, 2004</div> </div> <div class="history-entry"> <div class="wi-state">Online:</div> <div class="wi-date">March 21, 2005</div> </div> </div> </div> </div> </div> </div> </div> <script> 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Residual stresses are introduced in the plastic package when the polymer is cooled from the curing temperature to ambient, from which many reliability issues arise, including warpage of the package, premature interfacial failure, and degraded interconnections. Bimaterial strip bending experiment has been employed successfully to monitor the evolution of the residual stresses in underfrill resins for flip chip applications. A numerical analysis is developed to predict the residual stresses, which agree well with the experimental measurements. The changes of material properties, such as flexural modulus and coefficient of thermal expansion, of the resins with temperature are taken into account in the finite element analysis.</p></section> </div> <div class="article-metadata-panel clearfix rs_skip"> <div class="widget-SolrResourceMetadata widget-instance-ContentMetadata_ArticleFulltext_Article"> <div class="content-metadata-keywords"> <div class="content-metadata-keywords-title">Keywords:</div> <a href="/electronicpackaging/search-results?qb={"Keywords1":"resins"}">resins</a><span>,</span> <a href="/electronicpackaging/search-results?qb={"Keywords1":"polymers"}">polymers</a><span>,</span> <a href="/electronicpackaging/search-results?qb={"Keywords1":"strips"}">strips</a><span>,</span> <a href="/electronicpackaging/search-results?qb={"Keywords1":"integrated+circuit+packaging"}">integrated circuit packaging</a><span>,</span> <a href="/electronicpackaging/search-results?qb={"Keywords1":"integrated+circuit+reliability"}">integrated circuit reliability</a><span>,</span> <a href="/electronicpackaging/search-results?qb={"Keywords1":"plastic+packaging"}">plastic packaging</a><span>,</span> <a href="/electronicpackaging/search-results?qb={"Keywords1":"flip-chip+devices"}">flip-chip devices</a><span>,</span> <a href="/electronicpackaging/search-results?qb={"Keywords1":"internal+stresses"}">internal stresses</a><span>,</span> <a href="/electronicpackaging/search-results?qb={"Keywords1":"stress+analysis"}">stress analysis</a><span>,</span> <a href="/electronicpackaging/search-results?qb={"Keywords1":"thermal+expansion"}">thermal expansion</a><span>,</span> <a href="/electronicpackaging/search-results?qb={"Keywords1":"failure+analysis"}">failure analysis</a><span>,</span> <a href="/electronicpackaging/search-results?qb={"Keywords1":"elastic+moduli"}">elastic moduli</a><span>,</span> <a href="/electronicpackaging/search-results?qb={"Keywords1":"encapsulation"}">encapsulation</a><span>,</span> <a href="/electronicpackaging/search-results?qb={"Keywords1":"bending"}">bending</a><span>,</span> <a href="/electronicpackaging/search-results?qb={"Keywords1":"shrinkage"}">shrinkage</a><span>,</span> <a href="/electronicpackaging/search-results?qb={"Keywords1":"finite+element+analysis"}">finite element analysis</a><span>,</span> <a href="/electronicpackaging/search-results?qb={"Keywords1":"Residual+Stress"}">Residual Stress</a><span>,</span> <a href="/electronicpackaging/search-results?qb={"Keywords1":"Underfill+Resins"}">Underfill Resins</a><span>,</span> <a href="/electronicpackaging/search-results?qb={"Keywords1":"Bi-Material+Strip+Bending+(BMSB)"}">Bi-Material Strip Bending (BMSB)</a><span>,</span> <a href="/electronicpackaging/search-results?qb={"Keywords1":"Finite+Element+Method"}">Finite Element Method</a> </div> <div class="content-metadata-topics"> <div class="content-metadata-topics-title">Topics:</div> <a href="/electronicpackaging/search-results?f_SemanticFilterTopics=Residual stresses">Residual stresses</a><span>,</span> <a href="/electronicpackaging/search-results?f_SemanticFilterTopics=Resins">Resins</a><span>,</span> <a href="/electronicpackaging/search-results?f_SemanticFilterTopics=Strips">Strips</a><span>,</span> <a href="/electronicpackaging/search-results?f_SemanticFilterTopics=Numerical analysis">Numerical analysis</a><span>,</span> <a href="/electronicpackaging/search-results?f_SemanticFilterTopics=Temperature">Temperature</a><span>,</span> <a href="/electronicpackaging/search-results?f_SemanticFilterTopics=Finite element analysis">Finite element analysis</a><span>,</span> <a href="/electronicpackaging/search-results?f_SemanticFilterTopics=Stress">Stress</a> </div> </div> </div> <div id="21791327" class="article-section-wrapper js-article-section js-content-section " data-section-parent-id="0"> <div class="ref-list js-splitview-ref-list"><div data-content-id="r1" xmlns:helper="urn:XsltStringHelper"><div class="ref false"><div data-modal-id="r1" class="ref-content "><div class="label"><span>1. </span></div><div class="citation mixed-citation">Okura, J. 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Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications | J. Electron. Packag. | ASME Digital Collection