{"title":"Overview of Multi-Chip Alternatives for 2.5D and 3D Integrated Circuit Packagings","authors":"Ching-Feng Chen, Ching-Chih Tsai","volume":202,"journal":"International Journal of Electronics and Communication Engineering","pagesStart":225,"pagesEnd":234,"ISSN":"1307-6892","URL":"https:\/\/publications.waset.org\/pdf\/10013272","abstract":"<p>With the size of the transistor gradually approaching the physical limit, it challenges the persistence of Moore\u2019s Law due to such issues of the short channel effect and the development of the high numerical aperture (NA) lithography equipment. In the context of the ever-increasing technical requirements of portable devices and high-performance computing (HPC), relying on the law continuation to enhance the chip density will no longer support the prospects of the electronics industry. Weighing the chip\u2019s power consumption-performance-area-cost-cycle time to market (PPACC) is an updated benchmark to drive the evolution of the advanced wafer nanometer (nm). The advent of two and half- and three-dimensional (2.5 and 3D)- Very-Large-Scale Integration (VLSI) packaging based on Through Silicon Via (TSV) technology has updated the traditional die assembly methods and provided the solution. This overview investigates the up-to-date and cutting-edge packaging technologies for 2.5D and 3D integrated circuits (IC) based on the updated transistor structure and technology nodes. We conclude that multi-chip solutions for 2.5D and 3D IC packaging can prolong Moore\u2019s Law.<\/p>","references":"[1]\tMoore, G.E., Cramming more components onto integrated circuits. Electronics, 38, (1965)\r\n[2]\tMoore, G.E., The microprocessor: engine of the technology revolution. 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