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font-family: 微软雅黑; white-space: normal; word-spacing: 0px; text-transform: none; font-weight: normal; color: rgb(51,51,51); padding-bottom: 0px; font-style: normal; text-align: justify; padding-top: 0px; padding-left: 0px; margin: 14px 0px; orphans: 2; widows: 2; letter-spacing: normal; padding-right: 0px; text-indent: 1em; font-variant-ligatures: normal; font-variant-caps: normal; -webkit-text-stroke-width: 0px">   近日，合肥高新区与华进<a class="hotlinkmode" target="_blank" onmousedown="return hcclick('?screen_tracelog=end_articalHotword_372')" style="font-size: 14px; text-decoration: none; font-family: 微软雅黑; border-bottom: rgb(15,119,244) 1px dotted; font-weight: normal; color: rgb(15,119,244); padding-bottom: 0px; padding-top: 0px; padding-left: 0px; margin: 0px; line-height: 32px; padding-right: 0px" href="http://info.ec.hc360.com/list/bandaoti_cpcs.shtml">半导体</a>就晶圆级扇出型封装产业化项目举行签约仪式。工委委员、管委会副主任吕长富会见华进半导体董事长于燮康一行并出席签约仪式，创业服务中心主任周国祥，华进半导体合肥项目负责人姚大平，分别代表高新区与华进半导体签署协议。经贸局、财政局、高新股份等单位负责人见证签约仪式。<span style="display:none">uXwSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="font-size: 14px; font-family: 微软雅黑; white-space: normal; word-spacing: 0px; text-transform: none; font-weight: normal; color: rgb(51,51,51); padding-bottom: 0px; font-style: normal; text-align: justify; padding-top: 0px; padding-left: 0px; margin: 14px 0px; orphans: 2; widows: 2; letter-spacing: normal; padding-right: 0px; text-indent: 1em; font-variant-ligatures: normal; font-variant-caps: normal; -webkit-text-stroke-width: 0px">    华进半导体是由中国科学院微<a class="hotlinkmode" target="_blank" onmousedown="return hcclick('?screen_tracelog=end_articalHotword_372')" style="font-size: 14px; text-decoration: none; font-family: 微软雅黑; border-bottom: rgb(15,119,244) 1px dotted; font-weight: normal; color: rgb(15,119,244); padding-bottom: 0px; padding-top: 0px; padding-left: 0px; margin: 0px; line-height: 32px; padding-right: 0px" href="http://www.ec.hc360.com/">电子</a>研究所、<a class="hotlinkmode" target="_blank" onmousedown="return hcclick('?screen_tracelog=end_articalHotword_372')" style="font-size: 14px; text-decoration: none; font-family: 微软雅黑; border-bottom: rgb(15,119,244) 1px dotted; font-weight: normal; color: rgb(15,119,244); padding-bottom: 0px; padding-top: 0px; padding-left: 0px; margin: 0px; line-height: 32px; padding-right: 0px" href="http://info.ec.hc360.com/zt/2012top10/index.shtml">长电科技</a>、通富微电、华天科技、中芯国际等多家国内半导体封装、制造上市公司联合投资组成的国家级研发中心，旨在研发和先进封装成果转换，为中国半导体先进封装工艺的发展提供产业化基础和输出技术的平台。<span style="display:none">uXwSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="font-size: 14px; font-family: 微软雅黑; white-space: normal; word-spacing: 0px; text-transform: none; font-weight: normal; color: rgb(51,51,51); padding-bottom: 0px; font-style: normal; text-align: center; padding-top: 0px; padding-left: 0px; margin: 14px 0px; orphans: 2; widows: 2; letter-spacing: normal; padding-right: 0px; text-indent: 1em; font-variant-ligatures: normal; font-variant-caps: normal; -webkit-text-stroke-width: 0px"><img border="0" alt="大陆首条半导体晶圆级扇出型封装项目落户" width="600" height="400" style="font-size: 14px; border-top: 0px; font-family: 微软雅黑; border-right: 0px; vertical-align: middle; border-bottom: 0px; color: rgb(51,51,51); padding-bottom: 0px; padding-top: 0px; padding-left: 0px; margin: 0px; border-left: 0px; padding-right: 0px" src="http://img04.hc360.com/ec/201709/201709210950273484.jpg" /><span style="display:none">uXwSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="font-size: 14px; font-family: 微软雅黑; white-space: normal; word-spacing: 0px; text-transform: none; font-weight: normal; color: rgb(51,51,51); padding-bottom: 0px; font-style: normal; text-align: justify; padding-top: 0px; padding-left: 0px; margin: 14px 0px; orphans: 2; widows: 2; letter-spacing: normal; padding-right: 0px; text-indent: 1em; font-variant-ligatures: normal; font-variant-caps: normal; -webkit-text-stroke-width: 0px">    <a class="hotlinkmode" target="_blank" onmousedown="return hcclick('?screen_tracelog=end_articalHotword_372')" style="font-size: 14px; text-decoration: none; font-family: 微软雅黑; border-bottom: rgb(15,119,244) 1px dotted; font-weight: normal; color: rgb(15,119,244); padding-bottom: 0px; padding-top: 0px; padding-left: 0px; margin: 0px; line-height: 32px; padding-right: 0px" href="http://info.ec.hc360.com/zt/2012top10/index.shtml">芯片</a>封装是指将晶圆加工得到独立芯片的过程，是<a class="hotlinkmode" target="_blank" onmousedown="return hcclick('?screen_tracelog=end_articalHotword_372')" style="font-size: 14px; text-decoration: none; font-family: 微软雅黑; border-bottom: rgb(15,119,244) 1px dotted; font-weight: normal; color: rgb(15,119,244); padding-bottom: 0px; padding-top: 0px; padding-left: 0px; margin: 0px; line-height: 32px; padding-right: 0px" href="http://info.ec.hc360.com/list/zl_jcdl.shtml">集成电路</a>芯片制造完成后不可缺少的一道工序，是器件到系统的桥梁。晶圆级扇出型封装技术可以实现在单芯片的封装中做到更高的集成度，并拥有更好的<a class="hotlinkmode" target="_blank" onmousedown="return hcclick('?screen_tracelog=end_articalHotword_372')" style="font-size: 14px; text-decoration: none; font-family: 微软雅黑; border-bottom: rgb(15,119,244) 1px dotted; font-weight: normal; color: rgb(15,119,244); padding-bottom: 0px; padding-top: 0px; padding-left: 0px; margin: 0px; line-height: 32px; padding-right: 0px" href="http://www.electric.hc360.com/">电气</a>属性，从而能降低封装成本，而且计算速度更快，产生的功耗也更小。<span style="display:none">uXwSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="font-size: 14px; font-family: 微软雅黑; white-space: normal; word-spacing: 0px; text-transform: none; font-weight: normal; color: rgb(51,51,51); padding-bottom: 0px; font-style: normal; text-align: justify; padding-top: 0px; padding-left: 0px; margin: 14px 0px; orphans: 2; widows: 2; letter-spacing: normal; padding-right: 0px; text-indent: 1em; font-variant-ligatures: normal; font-variant-caps: normal; -webkit-text-stroke-width: 0px">    华进半导体将在高新区投资建设国内最先进的晶圆级扇出型封装生产线，项目一期总投资为23.3亿元人民币，未来年产产能将达到120万片，以及初期将建设办公、基础设施、仓储等配套区域。<span style="display:none">uXwSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="font-size: 14px; font-family: 微软雅黑; white-space: normal; word-spacing: 0px; text-transform: none; font-weight: normal; color: rgb(51,51,51); padding-bottom: 0px; font-style: normal; text-align: justify; padding-top: 0px; padding-left: 0px; margin: 14px 0px; orphans: 2; widows: 2; letter-spacing: normal; padding-right: 0px; text-indent: 1em; font-variant-ligatures: normal; font-variant-caps: normal; -webkit-text-stroke-width: 0px">    会见中于燮康表示合肥近几年集成电路产业发展突飞猛进，并且拥有完善的产业链、广阔的市场前景和丰富的科教资源。华进半导体与合肥高新区此次签约，将助力高新区发展高端封装产业，促进高新区集成电路产业链升级。<span style="display:none">uXwSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="font-size: 14px; font-family: 微软雅黑; white-space: normal; word-spacing: 0px; text-transform: none; font-weight: normal; color: rgb(51,51,51); padding-bottom: 0px; font-style: normal; text-align: justify; padding-top: 0px; padding-left: 0px; margin: 14px 0px; orphans: 2; widows: 2; letter-spacing: normal; padding-right: 0px; text-indent: 1em; font-variant-ligatures: normal; font-variant-caps: normal; -webkit-text-stroke-width: 0px">    吕长富表示华进半导体晶圆级扇出型封装产业化项目的建设不仅符合国家产业政策，而且能够满足市场需求，迅速提高我国芯片封装技术水平。高新区将立足于高新区集成电路产业发展的基础上打造良好的投资环境，帮助企业在高新区发展壮大。<span style="display:none">uXwSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <center><img src="/AD/SMTfgx.gif"/ "/AD/smtjscn.jpg"/></center> <p><br> </p> <style> #cyPoll .vote_txtlist dd{ left: 50%; 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