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etching</title> <meta name="description" content="Search results for: acid etching"> <meta name="keywords" content="acid etching"> <meta name="viewport" content="width=device-width, initial-scale=1, minimum-scale=1, maximum-scale=1, user-scalable=no"> <meta charset="utf-8"> <link href="https://cdn.waset.org/favicon.ico" type="image/x-icon" rel="shortcut icon"> <link href="https://cdn.waset.org/static/plugins/bootstrap-4.2.1/css/bootstrap.min.css" rel="stylesheet"> <link href="https://cdn.waset.org/static/plugins/fontawesome/css/all.min.css" rel="stylesheet"> <link href="https://cdn.waset.org/static/css/site.css?v=150220211555" rel="stylesheet"> </head> <body> <header> <div class="container"> <nav class="navbar navbar-expand-lg navbar-light"> <a class="navbar-brand" href="https://waset.org"> <img src="https://cdn.waset.org/static/images/wasetc.png" alt="Open Science Research Excellence" title="Open Science Research Excellence" /> </a> <button class="d-block d-lg-none navbar-toggler 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id="custom-search-input"> <div class="input-group"> <i class="fas fa-search"></i> <input type="text" class="search-query" name="q" placeholder="Author, Title, Abstract, Keywords" value="acid etching"> <input type="submit" class="btn_search" value="Search"> </div> </div> </form> </div> </div> <div class="row mt-3"> <div class="col-sm-3"> <div class="card"> <div class="card-body"><strong>Commenced</strong> in January 2007</div> </div> </div> <div class="col-sm-3"> <div class="card"> <div class="card-body"><strong>Frequency:</strong> Monthly</div> </div> </div> <div class="col-sm-3"> <div class="card"> <div class="card-body"><strong>Edition:</strong> International</div> </div> </div> <div class="col-sm-3"> <div class="card"> <div class="card-body"><strong>Paper Count:</strong> 3415</div> </div> </div> </div> <h1 class="mt-3 mb-3 text-center" style="font-size:1.6rem;">Search results for: acid etching</h1> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3415</span> SEM Analysis of the Effectiveness of the Acid Etching on Cat Enamel</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=C.%20Gallottini">C. Gallottini</a>, <a href="https://publications.waset.org/abstracts/search?q=W.%20Di%20Mari"> W. Di Mari</a>, <a href="https://publications.waset.org/abstracts/search?q=C.%20De%20Carolis"> C. De Carolis</a>, <a href="https://publications.waset.org/abstracts/search?q=A.%20Dolci"> A. Dolci</a>, <a href="https://publications.waset.org/abstracts/search?q=G.%20Dolci"> G. Dolci</a>, <a href="https://publications.waset.org/abstracts/search?q=L.%20Gallottini"> L. Gallottini</a>, <a href="https://publications.waset.org/abstracts/search?q=G.%20Barraco"> G. Barraco</a>, <a href="https://publications.waset.org/abstracts/search?q=S.%20Eramo"> S. Eramo </a> </p> <p class="card-text"><strong>Abstract:</strong></p> The aim of this paper is to summarize the literature on micromorphology and composition of the enamel of the cat and present an original experiment by SEM on how it responds to the etching with ortophosphoric acid for the time recommended in the veterinary literature (30", 45", 60"), derived from research and experience on human enamel; 21 teeth of cat were randomly divided into three groups of 7 (A, B, C): Group A was subjected to etching for 30 seconds by means of orthophosphoric acid to 40% on a circular area with diameter of about 2mm of the enamel coronal; the Groups B and C had the same treatment but, respectively, for 45 and 60 seconds. The samples obtained were observed by SEM to constant magnification of 1000x framing, in particular, the border area between enamel exposed and not exposed to etching to highlight differences. The images were subjected to the analysis of three blinded experienced operators in electron microscopy. In the enamel of the cat the etching for the times considered is not optimally effective for the purpose adhesives and the presence of a thick prismless layer could explain this situation. To improve this condition may clinically in the likeness of what is proposed for the enamel of human deciduous teeth: a bevel or a chamfer of 1 mm on the contour of the cavity to discover the prismatic enamel and increase the bonding surface. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=cat%20enamel" title="cat enamel">cat enamel</a>, <a href="https://publications.waset.org/abstracts/search?q=SEM" title=" SEM"> SEM</a>, <a href="https://publications.waset.org/abstracts/search?q=veterinary%20dentistry" title=" veterinary dentistry"> veterinary dentistry</a>, <a href="https://publications.waset.org/abstracts/search?q=acid%20etching" title=" acid etching"> acid etching</a> </p> <a href="https://publications.waset.org/abstracts/1802/sem-analysis-of-the-effectiveness-of-the-acid-etching-on-cat-enamel" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/1802.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">307</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3414</span> Silicon Nanostructure Based on Metal-Nanoparticle-Assisted Chemical Etching for Photovoltaic Application </h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=B.%20Bouktif">B. Bouktif</a>, <a href="https://publications.waset.org/abstracts/search?q=M.%20Gaidi"> M. Gaidi</a>, <a href="https://publications.waset.org/abstracts/search?q=M.%20Benrabha"> M. Benrabha</a> </p> <p class="card-text"><strong>Abstract:</strong></p> Metal-nano particle-assisted chemical etching is an extraordinary developed wet etching method of producing uniform semiconductor nanostructure (nanowires) from the patterned metallic film on the crystalline silicon surface. The metal films facilitate the etching in HF and H2O2 solution and produce silicon nanowires (SiNWs). Creation of different SiNWs morphologies by changing the etching time and its effects on optical and optoelectronic properties was investigated. Combination effect of formed SiNWs and stain etching treatment in acid (HF/HNO3/H2O) solution on the surface morphology of Si wafers as well as on the optical and optoelectronic properties are presented in this paper. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=semiconductor%20nanostructure" title="semiconductor nanostructure">semiconductor nanostructure</a>, <a href="https://publications.waset.org/abstracts/search?q=chemical%20etching" title=" chemical etching"> chemical etching</a>, <a href="https://publications.waset.org/abstracts/search?q=optoelectronic%20property" title=" optoelectronic property"> optoelectronic property</a>, <a href="https://publications.waset.org/abstracts/search?q=silicon%20surface" title=" silicon surface"> silicon surface</a> </p> <a href="https://publications.waset.org/abstracts/19048/silicon-nanostructure-based-on-metal-nanoparticle-assisted-chemical-etching-for-photovoltaic-application" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/19048.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">388</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3413</span> Silicon Surface Treatment Effect on the Structural, Optical, and Optoelectronic Properties for Solar Cell Applications</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=Lotfi%20Hedi%20Khezami">Lotfi Hedi Khezami</a>, <a href="https://publications.waset.org/abstracts/search?q=Mohamed%20Ben%20Rabha"> Mohamed Ben Rabha</a>, <a href="https://publications.waset.org/abstracts/search?q=N.%20Sboui"> N. Sboui</a>, <a href="https://publications.waset.org/abstracts/search?q=Mounir%20Gaidi"> Mounir Gaidi</a>, <a href="https://publications.waset.org/abstracts/search?q=B.%20Bessais"> B. Bessais</a> </p> <p class="card-text"><strong>Abstract:</strong></p> Metal-nano particle-assisted Chemical Etching is an extraordinary developed wet etching method of producing uniform semiconductor nano structure (nano wires) from patterned metallic film on crystalline silicon surface. The metal films facilitate the etching in HF and H2O2 solution and produce silicon nanowires (SiNWs). Creation of different SiNWs morphologies by changing the etching time and its effects on optical and opto electronic properties was investigated. Combination effect of formed SiNWs and stain etching treatment in acid (HF/HNO3/H2O) solution on the surface morphology of Si wafers as well as on the optical and opto electronic properties are presented in this paper. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=stain%20etching" title="stain etching">stain etching</a>, <a href="https://publications.waset.org/abstracts/search?q=porous%20silicon" title=" porous silicon"> porous silicon</a>, <a href="https://publications.waset.org/abstracts/search?q=silicon%20nanowires" title=" silicon nanowires"> silicon nanowires</a>, <a href="https://publications.waset.org/abstracts/search?q=reflectivity" title=" reflectivity"> reflectivity</a>, <a href="https://publications.waset.org/abstracts/search?q=lifetime" title=" lifetime"> lifetime</a>, <a href="https://publications.waset.org/abstracts/search?q=solar%20cells" title=" solar cells"> solar cells</a> </p> <a href="https://publications.waset.org/abstracts/17930/silicon-surface-treatment-effect-on-the-structural-optical-and-optoelectronic-properties-for-solar-cell-applications" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/17930.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">448</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3412</span> A Design of Anisotropic Wet Etching System to Reduce Hillocks on Etched Surface of Silicon Substrate</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=Alonggot%20Limcharoen%20Kaeochotchuangkul">Alonggot Limcharoen Kaeochotchuangkul</a>, <a href="https://publications.waset.org/abstracts/search?q=Pathomporn%20Sawatchai"> Pathomporn Sawatchai</a> </p> <p class="card-text"><strong>Abstract:</strong></p> This research aims to design and build a wet etching system, which is suitable for anisotropic wet etching, in order to reduce etching time, to reduce hillocks on the etched surface (to reduce roughness), and to create a 45-degree wall angle (micro-mirror). This study would start by designing a wet etching system. There are four main components in this system: an ultrasonic cleaning, a condenser, a motor and a substrate holder. After that, an ultrasonic machine was modified by applying a condenser to maintain the consistency of the solution concentration during the etching process and installing a motor for improving the roughness. This effect on the etch rate and the roughness showed that the etch rate increased and the roughness was reduced. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=anisotropic%20wet%20etching" title="anisotropic wet etching">anisotropic wet etching</a>, <a href="https://publications.waset.org/abstracts/search?q=wet%20etching%20system" title=" wet etching system"> wet etching system</a>, <a href="https://publications.waset.org/abstracts/search?q=hillocks" title=" hillocks"> hillocks</a>, <a href="https://publications.waset.org/abstracts/search?q=ultrasonic%20cleaning" title=" ultrasonic cleaning"> ultrasonic cleaning</a> </p> <a href="https://publications.waset.org/abstracts/109308/a-design-of-anisotropic-wet-etching-system-to-reduce-hillocks-on-etched-surface-of-silicon-substrate" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/109308.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">115</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3411</span> Forecasting Etching Behavior Silica Sand Using the Design of Experiments Method</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=Kefaifi%20Aissa">Kefaifi Aissa</a>, <a href="https://publications.waset.org/abstracts/search?q=Sahraoui%20Tahar"> Sahraoui Tahar</a>, <a href="https://publications.waset.org/abstracts/search?q=Kheloufi%20Abdelkrim"> Kheloufi Abdelkrim</a>, <a href="https://publications.waset.org/abstracts/search?q=Anas%20Sabiha"> Anas Sabiha</a>, <a href="https://publications.waset.org/abstracts/search?q=Hannane%20Farouk"> Hannane Farouk</a> </p> <p class="card-text"><strong>Abstract:</strong></p> The aim of this study is to show how the Design of Experiments Method (DOE) can be put into use as a practical approach for silica sand etching behavior modeling during its primary step of leaching. In the present work, we have studied etching effect on particle size during a primary step of leaching process on Algerian silica sand with florid acid (HF) at 20% and 30 % during 4 and 8 hours. Therefore, a new purity of the sand is noted depending on the time of leaching. This study was expanded by a numerical approach using a method of experiment design, which shows the influence of each parameter and the interaction between them in the process and approved the obtained experimental results. This model is a predictive approach using hide software. Based on the measured parameters experimentally in the interior of the model, the use of DOE method can make it possible to predict the outside parameters of the model in question and can give us the optimize response without making the experimental measurement. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=acid%20leaching" title="acid leaching">acid leaching</a>, <a href="https://publications.waset.org/abstracts/search?q=design%20of%20experiments%20method%28DOE%29" title=" design of experiments method(DOE)"> design of experiments method(DOE)</a>, <a href="https://publications.waset.org/abstracts/search?q=purity%20silica" title=" purity silica"> purity silica</a>, <a href="https://publications.waset.org/abstracts/search?q=silica%20etching" title=" silica etching"> silica etching</a> </p> <a href="https://publications.waset.org/abstracts/46244/forecasting-etching-behavior-silica-sand-using-the-design-of-experiments-method" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/46244.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">286</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3410</span> Enhancement and Characterization of Titanium Surfaces with Sandblasting and Acid Etching for Dental Implants</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=Busra%20Balli">Busra Balli</a>, <a href="https://publications.waset.org/abstracts/search?q=Tuncay%20Dikici"> Tuncay Dikici</a>, <a href="https://publications.waset.org/abstracts/search?q=Mustafa%20Toparli"> Mustafa Toparli</a> </p> <p class="card-text"><strong>Abstract:</strong></p> Titanium and its alloys have been used extensively over the past 25 years as biomedical materials in orthopedic and dental applications because of their good mechanical properties, corrosion resistance, and biocompatibility. It is known that the surface properties of titanium implants can enhance the cellular response and play an important role in Osseo integration. The rate and quality of Osseo integration in titanium implants are related to their surface properties. The purpose of this investigation was to evaluate the effect of sandblasting and acid etching on surface morphology, roughness, the wettability of titanium. The surface properties will be characterized by scanning electron microscopy and contact angle and roughness measurements. The results show that surface morphology, roughness, and wettability were changed and enhanced by these treatments. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=dental%20implant" title="dental implant">dental implant</a>, <a href="https://publications.waset.org/abstracts/search?q=etching" title=" etching"> etching</a>, <a href="https://publications.waset.org/abstracts/search?q=surface%20modifications" title=" surface modifications"> surface modifications</a>, <a href="https://publications.waset.org/abstracts/search?q=surface%20morphology" title=" surface morphology"> surface morphology</a>, <a href="https://publications.waset.org/abstracts/search?q=surface%20roughness" title=" surface roughness"> surface roughness</a> </p> <a href="https://publications.waset.org/abstracts/17922/enhancement-and-characterization-of-titanium-surfaces-with-sandblasting-and-acid-etching-for-dental-implants" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/17922.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">491</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3409</span> Comparing the Gap Formation around Composite Restorations in Three Regions of Tooth Using Optical Coherence Tomography (OCT)</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=Rima%20Zakzouk">Rima Zakzouk</a>, <a href="https://publications.waset.org/abstracts/search?q=Yasushi%20Shimada"> Yasushi Shimada</a>, <a href="https://publications.waset.org/abstracts/search?q=Yuan%20Zhou"> Yuan Zhou</a>, <a href="https://publications.waset.org/abstracts/search?q=Yasunori%20Sumi"> Yasunori Sumi</a>, <a href="https://publications.waset.org/abstracts/search?q=Junji%20Tagami"> Junji Tagami</a> </p> <p class="card-text"><strong>Abstract:</strong></p> Background and Purpose: Swept source optical coherence tomography (OCT) is an interferometric imaging technique that has been recently used in cariology. In spite of progress made in adhesive dentistry, the composite restoration has been failing due to secondary caries which occur due to environmental factors in oral cavities. Therefore, a precise assessment to effective marginal sealing of restoration is highly required. The aim of this study was evaluating gap formation at composite/cavity walls interface with or without phosphoric acid etching using SS-OCT. Materials and Methods: Round tapered cavities (2×2 mm) were prepared in three locations, mid-coronal, cervical, and root of bovine incisors teeth in two groups (SE and PA Groups). While self-etching adhesive (Clearfil SE Bond) was applied for the both groups, Group PA had been already pretreated with phosphoric acid etching (K-Etchant gel). Subsequently, both groups were restored by Estelite Flow Quick Flowable Composite Resin. Following 5000 thermal cycles, three cross-sectionals were obtained from each cavity using OCT at 1310-nm wavelength at 0°, 60°, 120° degrees. Scanning was repeated after two months to monitor the gap progress. Then the average percentage of gap length was calculated using image analysis software, and the difference of mean between both groups was statistically analyzed by t-test. Subsequently, the results were confirmed by sectioning and observing representative specimens under Confocal Laser Scanning Microscope (CLSM). Results: The results showed that pretreatment with phosphoric acid etching, Group PA, led to significantly bigger gaps in mid-coronal and cervical compared to SE group, while in the root cavity no significant difference was observed between both groups. On the other hand, the gaps formed in root’s cavities were significantly bigger than those in mid-coronal and cervical within the same group. This study investigated the effect of phosphoric acid on gap length progress on the composite restorations. In conclusions, phosphoric acid etching treatment did not reduce the gap formation even in different regions of the tooth. Significance: The cervical region of tooth was more exposing to gap formation than mid-coronal region, especially when we added pre-etching treatment. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=image%20analysis" title="image analysis">image analysis</a>, <a href="https://publications.waset.org/abstracts/search?q=optical%20coherence%20tomography" title=" optical coherence tomography"> optical coherence tomography</a>, <a href="https://publications.waset.org/abstracts/search?q=phosphoric%20acid%20etching" title=" phosphoric acid etching"> phosphoric acid etching</a>, <a href="https://publications.waset.org/abstracts/search?q=self-etch%20adhesives" title=" self-etch adhesives"> self-etch adhesives</a> </p> <a href="https://publications.waset.org/abstracts/61117/comparing-the-gap-formation-around-composite-restorations-in-three-regions-of-tooth-using-optical-coherence-tomography-oct" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/61117.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">221</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3408</span> A Study on the Etching Characteristics of High aspect ratio Oxide Etching Using C4F6 Plasma in Inductively Coupled Plasma with Low Frequency Bias</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=ByungJun%20Woo">ByungJun Woo</a> </p> <p class="card-text"><strong>Abstract:</strong></p> In this study, high-aspect-ratio (HAR) oxide etching characteristics in inductively coupled plasma were investigated using low frequency (2 MHz) bias power with C4F6 gas. An experiment was conducted using CF4/C4F6/He as the mixed gas. A 100 nm (etch area)/500 nm (mask area) line patterns were used, and the etch cross-section and etch selectivity of the amorphous carbon layer thin film were derived using a scanning electron microscope. Ion density was extracted using a double Langmuir probe, and CFx and F neutral species were observed via optical emission spectroscopy. Based on these results, the possibility for HAR oxide etching using C4F6 gas chemistry was suggested in this work. These etching results also indicate that the use of C4F6 gas can significantly contribute to the development of next-generation HAR oxide etching. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=plasma" title="plasma">plasma</a>, <a href="https://publications.waset.org/abstracts/search?q=etching" title=" etching"> etching</a>, <a href="https://publications.waset.org/abstracts/search?q=C4F6" title=" C4F6"> C4F6</a>, <a href="https://publications.waset.org/abstracts/search?q=high%20aspect%20ratio" title=" high aspect ratio"> high aspect ratio</a>, <a href="https://publications.waset.org/abstracts/search?q=inductively%20coupled%20plasma" title=" inductively coupled plasma"> inductively coupled plasma</a> </p> <a href="https://publications.waset.org/abstracts/183420/a-study-on-the-etching-characteristics-of-high-aspect-ratio-oxide-etching-using-c4f6-plasma-in-inductively-coupled-plasma-with-low-frequency-bias" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/183420.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">73</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3407</span> Study of Fast Etching of Silicon for the Fabrication of Bulk Micromachined MEMS Structures </h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=V.%20Swarnalatha">V. Swarnalatha</a>, <a href="https://publications.waset.org/abstracts/search?q=A.%20V.%20Narasimha%20Rao"> A. V. Narasimha Rao</a>, <a href="https://publications.waset.org/abstracts/search?q=P.%20Pal"> P. Pal</a> </p> <p class="card-text"><strong>Abstract:</strong></p> The present research reports the investigation of fast etching of silicon for the fabrication of microelectromechanical systems (MEMS) structures using silicon wet bulk micromachining. Low concentration tetramethyl-ammonium hydroxide (TMAH) and hydroxylamine (NH<sub>2</sub>OH) are used as main etchant and additive, respectively. The concentration of NH<sub>2</sub>OH is varied to optimize the composition to achieve best etching characteristics such as high etch rate, significantly high undercutting at convex corner for the fast release of the microstructures from the substrate, and improved etched surface morphology. These etching characteristics are studied on Si{100} and Si{110} wafers as they are most widely used in the fabrication of MEMS structures as wells diode, transistors and integrated circuits. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=KOH" title="KOH">KOH</a>, <a href="https://publications.waset.org/abstracts/search?q=MEMS" title=" MEMS"> MEMS</a>, <a href="https://publications.waset.org/abstracts/search?q=micromachining" title=" micromachining"> micromachining</a>, <a href="https://publications.waset.org/abstracts/search?q=silicon" title=" silicon"> silicon</a>, <a href="https://publications.waset.org/abstracts/search?q=TMAH" title=" TMAH"> TMAH</a>, <a href="https://publications.waset.org/abstracts/search?q=wet%20anisotropic%20etching" title=" wet anisotropic etching"> wet anisotropic etching</a> </p> <a href="https://publications.waset.org/abstracts/65235/study-of-fast-etching-of-silicon-for-the-fabrication-of-bulk-micromachined-mems-structures" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/65235.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">202</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3406</span> Silicon Carbide (SiC) Crystallization Obtained as a Side Effect of SF6 Etching Process</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=N.%20K.%20A.%20M.%20Galv%C3%A3o">N. K. A. M. Galvão</a>, <a href="https://publications.waset.org/abstracts/search?q=A.%20Godoy%20Jr."> A. Godoy Jr.</a>, <a href="https://publications.waset.org/abstracts/search?q=A.%20L.%20J.%20Pereira"> A. L. J. Pereira</a>, <a href="https://publications.waset.org/abstracts/search?q=G.%20V.%20Martins"> G. V. Martins</a>, <a href="https://publications.waset.org/abstracts/search?q=R.%20S.%20Pessoa"> R. S. Pessoa</a>, <a href="https://publications.waset.org/abstracts/search?q=H.%20S.%20Maciel"> H. S. Maciel</a>, <a href="https://publications.waset.org/abstracts/search?q=M.%20A.%20Fraga"> M. A. Fraga</a> </p> <p class="card-text"><strong>Abstract:</strong></p> Silicon carbide (SiC) is a wide band-gap semiconductor material with very attractive properties, such as high breakdown voltage, chemical inertness, and high thermal and electrical stability, which makes it a promising candidate for several applications, including microelectromechanical systems (MEMS) and electronic devices. In MEMS manufacturing, the etching process is an important step. It has been proved that wet etching of SiC is not feasible due to its high bond strength and high chemical inertness. In view of this difficulty, the plasma etching technique has been applied with paramount success. However, in most of these studies, only the determination of the etching rate and/or morphological characterization of SiC, as well as the analysis of the reactive ions present in the plasma, are lowly explored. There is a lack of results in the literature on the chemical and structural properties of SiC after the etching process [4]. In this work, we investigated the etching process of sputtered amorphous SiC thin films on Si substrates in a reactive ion etching (RIE) system using sulfur hexafluoride (SF6) gas under different RF power. The results of the chemical and structural analyses of the etched films revealed that, for all conditions, a SiC crystallization occurred, in addition to fluoride contamination. In conclusion, we observed that SiC crystallization is a side effect promoted by structural, morphological and chemical changes caused by RIE SF6 etching process. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=plasma%20etching" title="plasma etching">plasma etching</a>, <a href="https://publications.waset.org/abstracts/search?q=plasma%20deposition" title=" plasma deposition"> plasma deposition</a>, <a href="https://publications.waset.org/abstracts/search?q=Silicon%20Carbide" title=" Silicon Carbide"> Silicon Carbide</a>, <a href="https://publications.waset.org/abstracts/search?q=microelectromechanical%20systems" title=" microelectromechanical systems"> microelectromechanical systems</a> </p> <a href="https://publications.waset.org/abstracts/158558/silicon-carbide-sic-crystallization-obtained-as-a-side-effect-of-sf6-etching-process" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/158558.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">75</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3405</span> Rapid Generation of Octagonal Pyramids on Silicon Wafer for Photovoltaics by Swift Anisotropic Chemical Etching Process</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=Sami%20Iqbal">Sami Iqbal</a>, <a href="https://publications.waset.org/abstracts/search?q=Azam%20Hussain"> Azam Hussain</a>, <a href="https://publications.waset.org/abstracts/search?q=Weiping%20Wu"> Weiping Wu</a>, <a href="https://publications.waset.org/abstracts/search?q=Guo%20Xinli"> Guo Xinli</a>, <a href="https://publications.waset.org/abstracts/search?q=Tong%20Zhang"> Tong Zhang</a> </p> <p class="card-text"><strong>Abstract:</strong></p> A novel octagonal upright micro-pyramid structure was generated by wet chemical anisotropic etching on a monocrystalline silicon wafer (100). The primary objectives are to reduce front surface reflectance of silicon wafers, improve wettability, enhance surface morphology, and maximize the area coverage by generated octagonal pyramids. Under rigorous control and observation, the etching process' response time was maintained precisely. The experimental outcomes show a significant decrease in the optical surface reflectance of silicon wafers, with the lowest reflectance of 8.98%, as well as enhanced surface structure, periodicity, and surface area coverage of more than 85%. The octagonal silicon pyramid was formed with a high etch rate of 0.41 um/min and a much shorter reaction time with the addition of hydrofluoric acid coupled with magnetic stirring (mechanical agitation) at 300 rpm. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=octagonal%20pyramids" title="octagonal pyramids">octagonal pyramids</a>, <a href="https://publications.waset.org/abstracts/search?q=rapid%20etching" title=" rapid etching"> rapid etching</a>, <a href="https://publications.waset.org/abstracts/search?q=solar%20cells" title=" solar cells"> solar cells</a>, <a href="https://publications.waset.org/abstracts/search?q=surface%20engineering" title=" surface engineering"> surface engineering</a>, <a href="https://publications.waset.org/abstracts/search?q=surface%20reflectance" title=" surface reflectance"> surface reflectance</a> </p> <a href="https://publications.waset.org/abstracts/167589/rapid-generation-of-octagonal-pyramids-on-silicon-wafer-for-photovoltaics-by-swift-anisotropic-chemical-etching-process" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/167589.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">101</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3404</span> The Effect of Enamel Surface Preparation on the Self-Etch Bonding of Orthodontic Tubes: An in Vitro Study</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=Fernandes%20A.%20C.%20B.%20C.%20J.">Fernandes A. C. B. C. J.</a>, <a href="https://publications.waset.org/abstracts/search?q=de%20Jesus%20V.%20C."> de Jesus V. C.</a>, <a href="https://publications.waset.org/abstracts/search?q=Sepideh%20N."> Sepideh N.</a>, <a href="https://publications.waset.org/abstracts/search?q=Vilela%20OFGG"> Vilela OFGG</a>, <a href="https://publications.waset.org/abstracts/search?q=Somarin%20K.%20K."> Somarin K. K.</a>, <a href="https://publications.waset.org/abstracts/search?q=Fran%C3%A7a%20R."> França R.</a>, <a href="https://publications.waset.org/abstracts/search?q=Pinheiro%20F.%20H.%20S.%20L."> Pinheiro F. H. S. L.</a> </p> <p class="card-text"><strong>Abstract:</strong></p> Objective: The purpose of this study was to look at the effect of pre-treatment of enamel with pumice and/or 37% phosphoric acid on the shear bond strength (SBS) of orthodontic tubes bonded to enamel while simultaneously evaluating the efficacy of orthodontic tubes bonded by self-etch primer (SEP). Materials and Methods: 39 of the crown halves were divided into 3 groups at random. Group, I was the control group utilizing both prophy paste and the conventional double etching pre-treatment method. Group II excluded the use of prophy paste prior to double etching. Group III excluded the use of both prophy paste and double etching and only utilized SEP. Bond strength of the orthodontic tubes was measured by SBS. One way ANOVA and Tukey’s HSD test were used to compare SBS values between the three groups. The statistical significance was set to p<0.05. Results: The difference in SBS values of groups I (36.672 ± 9.315 Mpa), II (34.242 ± 9.986 Mpa), and III (39.055 ± 5.565) were not statistically significant (P<0.05). Conclusion: This study suggested that the use of prophy paste or pre-acid etch of the enamel surface did not provide a statistically significant difference in SBS between the three groups. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=shear%20bond%20strength" title="shear bond strength">shear bond strength</a>, <a href="https://publications.waset.org/abstracts/search?q=orthodontic%20bracket" title=" orthodontic bracket"> orthodontic bracket</a>, <a href="https://publications.waset.org/abstracts/search?q=self-etch%20primer" title=" self-etch primer"> self-etch primer</a>, <a href="https://publications.waset.org/abstracts/search?q=pumice" title=" pumice"> pumice</a>, <a href="https://publications.waset.org/abstracts/search?q=prophy" title=" prophy"> prophy</a> </p> <a href="https://publications.waset.org/abstracts/142849/the-effect-of-enamel-surface-preparation-on-the-self-etch-bonding-of-orthodontic-tubes-an-in-vitro-study" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/142849.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">178</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3403</span> Cyclic Etching Process Using Inductively Coupled Plasma for Polycrystalline Diamond on AlGaN/GaN Heterostructure</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=Haolun%20Sun">Haolun Sun</a>, <a href="https://publications.waset.org/abstracts/search?q=Ping%20Wang"> Ping Wang</a>, <a href="https://publications.waset.org/abstracts/search?q=Mei%20Wu"> Mei Wu</a>, <a href="https://publications.waset.org/abstracts/search?q=Meng%20Zhang"> Meng Zhang</a>, <a href="https://publications.waset.org/abstracts/search?q=Bin%20Hou"> Bin Hou</a>, <a href="https://publications.waset.org/abstracts/search?q=Ling%20Yang"> Ling Yang</a>, <a href="https://publications.waset.org/abstracts/search?q=Xiaohua%20Ma"> Xiaohua Ma</a>, <a href="https://publications.waset.org/abstracts/search?q=Yue%20Hao"> Yue Hao</a> </p> <p class="card-text"><strong>Abstract:</strong></p> Gallium nitride (GaN) is an attractive material for next-generation power devices. It is noted that the performance of GaN-based high electron mobility transistors (HEMTs) is always limited by the self-heating effect. In response to the problem, integrating devices with polycrystalline diamond (PCD) has been demonstrated to be an efficient way to alleviate the self-heating issue of the GaN-based HEMTs. Among all the heat-spreading schemes, using PCD to cap the epitaxial layer before the HEMTs process is one of the most effective schemes. Now, the mainstream method of fabricating the PCD-capped HEMTs is to deposit the diamond heat-spreading layer on the AlGaN surface, which is covered by a thin nucleation dielectric/passivation layer. To achieve the pattern etching of the diamond heat spreader and device preparation, we selected SiN as the hard mask for diamond etching, which was deposited by plasma-enhanced chemical vapor deposition (PECVD). The conventional diamond etching method first uses F-based etching to remove the SiN from the special window region, followed by using O₂/Ar plasma to etch the diamond. However, the results of the scanning electron microscope (SEM) and focused ion beam microscopy (FIB) show that there are lots of diamond pillars on the etched diamond surface. Through our study, we found that it was caused by the high roughness of the diamond surface and the existence of the overlap between the diamond grains, which makes the etching of the SiN hard mask insufficient and leaves micro-masks on the diamond surface. Thus, a cyclic etching method was proposed to solve the problem of the residual SiN, which was left in the F-based etching. We used F-based etching during the first step to remove the SiN hard mask in the specific region; then, the O₂/Ar plasma was introduced to etch the diamond in the corresponding region. These two etching steps were set as one cycle. After the first cycle, we further used cyclic etching to clear the pillars, in which the F-based etching was used to remove the residual SiN, and then the O₂/Ar plasma was used to etch the diamond. Whether to take the next cyclic etching depends on whether there are still SiN micro-masks left. By using this method, we eventually achieved the self-terminated etching of the diamond and the smooth surface after the etching. These results demonstrate that the cyclic etching method can be successfully applied to the integrated preparation of polycrystalline diamond thin films and GaN HEMTs. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=AlGaN%2FGaN%20heterojunction" title="AlGaN/GaN heterojunction">AlGaN/GaN heterojunction</a>, <a href="https://publications.waset.org/abstracts/search?q=O%E2%82%82%2FAr%20plasma" title=" O₂/Ar plasma"> O₂/Ar plasma</a>, <a href="https://publications.waset.org/abstracts/search?q=cyclic%20etching" title=" cyclic etching"> cyclic etching</a>, <a href="https://publications.waset.org/abstracts/search?q=polycrystalline%20diamond" title=" polycrystalline diamond"> polycrystalline diamond</a> </p> <a href="https://publications.waset.org/abstracts/159880/cyclic-etching-process-using-inductively-coupled-plasma-for-polycrystalline-diamond-on-algangan-heterostructure" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/159880.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">134</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3402</span> Nano-Texturing of Single Crystalline Silicon via Cu-Catalyzed Chemical Etching</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=A.%20A.%20Abaker%20Omer">A. A. Abaker Omer</a>, <a href="https://publications.waset.org/abstracts/search?q=H.%20B.%20Mohamed%20Balh"> H. B. Mohamed Balh</a>, <a href="https://publications.waset.org/abstracts/search?q=W.%20Liu"> W. Liu</a>, <a href="https://publications.waset.org/abstracts/search?q=A.%20Abas"> A. Abas</a>, <a href="https://publications.waset.org/abstracts/search?q=J.%20Yu"> J. Yu</a>, <a href="https://publications.waset.org/abstracts/search?q=S.%20Li"> S. Li</a>, <a href="https://publications.waset.org/abstracts/search?q=W.%20Ma"> W. Ma</a>, <a href="https://publications.waset.org/abstracts/search?q=W.%20El%20Kolaly"> W. El Kolaly</a>, <a href="https://publications.waset.org/abstracts/search?q=Y.%20Y.%20Ahmed%20Abuker"> Y. Y. Ahmed Abuker</a> </p> <p class="card-text"><strong>Abstract:</strong></p> We have discovered an important technical solution that could make new approaches in the processing of wet silicon etching, especially in the production of photovoltaic cells. During its inferior light-trapping and structural properties, the inverted pyramid structure outperforms the conventional pyramid textures and black silicone. The traditional pyramid textures and black silicon can only be accomplished with more advanced lithography, laser processing, etc. Importantly, our data demonstrate the feasibility of an inverted pyramidal structure of silicon via one-step Cu-catalyzed chemical etching (CCCE) in Cu (NO<sub>3</sub>)<sub>2</sub>/HF/H<sub>2</sub>O<sub>2</sub>/H<sub>2</sub>O solutions. The effects of etching time and reaction temperature on surface geometry and light trapping were systematically investigated. The conclusion shows that the inverted pyramid structure has ultra-low reflectivity of ~4.2% in the wavelength of 300~1000 nm; introduce of Cu particles can significantly accelerate the dissolution of the silicon wafer. The etching and the inverted pyramid structure formation mechanism are discussed. Inverted pyramid structure with outstanding anti-reflectivity includes useful applications throughout the manufacture of semi-conductive industry-compatible solar cells, and can have significant impacts on industry colleagues and populations. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=Cu-catalyzed%20chemical%20etching" title="Cu-catalyzed chemical etching">Cu-catalyzed chemical etching</a>, <a href="https://publications.waset.org/abstracts/search?q=inverted%20pyramid%20nanostructured" title=" inverted pyramid nanostructured"> inverted pyramid nanostructured</a>, <a href="https://publications.waset.org/abstracts/search?q=reflection" title=" reflection"> reflection</a>, <a href="https://publications.waset.org/abstracts/search?q=solar%20cells" title=" solar cells"> solar cells</a> </p> <a href="https://publications.waset.org/abstracts/118084/nano-texturing-of-single-crystalline-silicon-via-cu-catalyzed-chemical-etching" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/118084.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">154</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3401</span> A Dissolution Mechanism of the Silicon Carbide in HF/K₂Cr₂O₇ Solutions</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=Karima%20Bourenane">Karima Bourenane</a>, <a href="https://publications.waset.org/abstracts/search?q=Aissa%20Keffous"> Aissa Keffous</a> </p> <p class="card-text"><strong>Abstract:</strong></p> In this paper, we present an experimental method on the etching reaction of p-type 6H-SiC, etching that was carried out in HF/K₂Cr₂O₇ solutions. The morphology of the etched surface was examined with varying K₂Cr₂O₇ concentrations, etching time and temperature solution. The surfaces of the etched samples were analyzed using Scanning electron microscopy (SEM), Fourier transform infrared spectroscopy (FT-IR) and Photoluminescence. The surface morphology of samples etched in HF/K₂Cr₂O₇ is shown to depend on the solution composition and bath temperature. The investigation of the HF/K₂Cr₂O₇ solutions on 6H-SiC surface shows that as K₂Cr₂O₇ concentration increases, the etch rate increases to reach a maximum value at about 0.75 M and then decreases. Similar behavior has been observed when the temperature of the solution is increased. The maximum etch rate is found for 80 °C. Taking into account the result, a polishing etching solution of 6H-SiC has been developed. In addition, the result is very interesting when, to date, no chemical polishing solution has been developed on silicon carbide (SiC). Finally, we have proposed a dissolution mechanism of the silicon carbide in HF/K₂Cr₂O₇ solutions. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=silicon%20carbide" title="silicon carbide">silicon carbide</a>, <a href="https://publications.waset.org/abstracts/search?q=dissolution" title=" dissolution"> dissolution</a>, <a href="https://publications.waset.org/abstracts/search?q=Chemical%20etching" title=" Chemical etching"> Chemical etching</a>, <a href="https://publications.waset.org/abstracts/search?q=mechanism" title=" mechanism"> mechanism</a> </p> <a href="https://publications.waset.org/abstracts/184641/a-dissolution-mechanism-of-the-silicon-carbide-in-hfk2cr2o7-solutions" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/184641.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">52</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3400</span> Optical Assessment of Marginal Sealing Performance around Restorations Using Swept-Source Optical Coherence Tomography</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=Rima%20Zakzouk">Rima Zakzouk</a>, <a href="https://publications.waset.org/abstracts/search?q=Yasushi%20Shimada"> Yasushi Shimada</a>, <a href="https://publications.waset.org/abstracts/search?q=Yasunori%20Sumi"> Yasunori Sumi</a>, <a href="https://publications.waset.org/abstracts/search?q=Junji%20Tagami"> Junji Tagami</a> </p> <p class="card-text"><strong>Abstract:</strong></p> Background and purpose: The resin composite has become the main material for the restorations of caries in recent years due to aesthetic characteristics, especially with the development of the adhesive techniques. The quality of adhesion to tooth structures is depending on an exchange process between inorganic tooth material and synthetic resin and a micromechanical retention promoted by resin infiltration in partially demineralized dentin. Optical coherence tomography (OCT) is a noninvasive diagnostic method for obtaining cross-sectional images that produce high-resolution of the biological tissue at the micron scale. The aim of this study was to evaluate the gap formation at adhesive/tooth interface of two-step self-etch adhesives that are preceded with or without phosphoric acid pre-etching in different regions of teeth using SS-OCT. Materials and methods: Round tapered cavities (2×2 mm) were prepared in cervical part of bovine incisors teeth and divided into 2 groups (n=10): first group self-etch adhesive (Clearfil SE Bond) was applied for SE group and second group treated with acid etching before applying the self-etch adhesive for PA group. Subsequently, both groups were restored with Estelite Flow Quick Flowable Composite Resin and observed under OCT. Following 5000 thermal cycles, the same section was obtained again for each cavity using OCT at 1310-nm wavelength. Scanning was repeated after two months to monitor the gap progress. Then the gap length was measured using image analysis software, and the statistics analysis were done between both groups using SPSS software. After that, the cavities were sectioned and observed under Confocal Laser Scanning Microscope (CLSM) to confirm the result of OCT. Results: Gaps formed at the bottom of the cavity was longer than the gap formed at the margin and dento-enamel junction in both groups. On the other hand, pre-etching treatment led to damage the DEJ regions creating longer gap. After 2 months the results showed almost progress in the gap length significantly at the bottom regions in both groups. In conclusions, phosphoric acid etching treatment did not reduce the gap lrngth in most regions of the cavity. Significance: The bottom region of tooth was more exposed to gap formation than margin and DEJ regions, The DEJ damaged with phosphoric acid treatment. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=optical%20coherence%20tomography" title="optical coherence tomography">optical coherence tomography</a>, <a href="https://publications.waset.org/abstracts/search?q=self-etch%20adhesives" title=" self-etch adhesives"> self-etch adhesives</a>, <a href="https://publications.waset.org/abstracts/search?q=bottom" title=" bottom"> bottom</a>, <a href="https://publications.waset.org/abstracts/search?q=dento%20enamel%20junction" title=" dento enamel junction"> dento enamel junction</a> </p> <a href="https://publications.waset.org/abstracts/82390/optical-assessment-of-marginal-sealing-performance-around-restorations-using-swept-source-optical-coherence-tomography" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/82390.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">227</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3399</span> Control of Oxide and Silicon Loss during Exposure of Silicon Waveguide</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=Gu%20Zhonghua">Gu Zhonghua</a> </p> <p class="card-text"><strong>Abstract:</strong></p> Control method of bulk silicon dioxide etching process to approach then expose silicon waveguide has been developed. It has been demonstrated by silicon waveguide of photonics devices. It is also able to generalize other applications. Use plasma dry etching to etch bulk silicon dioxide and approach oxide-silicon interface accurately, then use dilute HF wet etching to etch silicon dioxide residue layer to expose the silicon waveguide as soft landing. Plasma dry etch macro loading effect and endpoint technology was used to determine dry etch time accurately with a low wafer expose ratio. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=waveguide" title="waveguide">waveguide</a>, <a href="https://publications.waset.org/abstracts/search?q=etch" title=" etch"> etch</a>, <a href="https://publications.waset.org/abstracts/search?q=control" title=" control"> control</a>, <a href="https://publications.waset.org/abstracts/search?q=silicon%20loss" title=" silicon loss"> silicon loss</a> </p> <a href="https://publications.waset.org/abstracts/34993/control-of-oxide-and-silicon-loss-during-exposure-of-silicon-waveguide" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/34993.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">414</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3398</span> Micro-Electrical Discharge Machining (µEDM): Effect of the Electrochemical Etching Parameters on the Fabrication of Cylindrical Tungsten Micro-Tools</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=Asmae%20Tafraouti">Asmae Tafraouti</a>, <a href="https://publications.waset.org/abstracts/search?q=Yasmina%20Layouni"> Yasmina Layouni</a> </p> <p class="card-text"><strong>Abstract:</strong></p> The fabrication of cylindrical Tungsten micro-tools with a high aspect ratio is a real challenge because of several constraints that come into during their manufacture. In this paper, we will describe the process used to fabricate these micro-tools. It consists of using electrochemical etching. We will also present the optimal protocol that makes it possible to fabricate micro-tools with a high aspect ratio in a reproducible way. Next, we will show the limit of the experimental parameters chosen to manufacture micro-tools from a wire with an initial diameter of Φ_0=250µm. The protocol used allows obtaining an average diameter of Φ=88µm ±1 µm over a length of L=3.5mm. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=drop-off%20effect" title="drop-off effect">drop-off effect</a>, <a href="https://publications.waset.org/abstracts/search?q=electrochemical%20etching" title=" electrochemical etching"> electrochemical etching</a>, <a href="https://publications.waset.org/abstracts/search?q=micro-electrical%20discharge%20machining" title=" micro-electrical discharge machining"> micro-electrical discharge machining</a>, <a href="https://publications.waset.org/abstracts/search?q=tungsten%20micro-tools" title=" tungsten micro-tools"> tungsten micro-tools</a> </p> <a href="https://publications.waset.org/abstracts/140730/micro-electrical-discharge-machining-edm-effect-of-the-electrochemical-etching-parameters-on-the-fabrication-of-cylindrical-tungsten-micro-tools" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/140730.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">190</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3397</span> New Restoration Reagent for Development of Erased Serial Number on Copper Metal Surface</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=Lav%20Kesharwani">Lav Kesharwani</a>, <a href="https://publications.waset.org/abstracts/search?q=Nalini%20Shankar"> Nalini Shankar</a>, <a href="https://publications.waset.org/abstracts/search?q=A.%20K.%20Gupta"> A. K. Gupta</a> </p> <p class="card-text"><strong>Abstract:</strong></p> A serial number is a unique code assigned for identification of a single unit. Serial number are present on many objects. In an attempt to hide the identity of the numbered item, the numbers are often obliterated or removed by mechanical methods. The present work was carried out with an objective to develop less toxic, less time consuming, more result oriented chemical etching reagent for restoration of serial number on the copper metal plate. Around nine different reagents were prepared using different combination of reagent along with standard reagent and it was applied over 50 erased samples of copper metal and compared it with the standard reagent for restoration of erased marks. After experiment, it was found that the prepared Etching reagent no. 3 (10 g FeCl3 + 20 ml glacial acetic acid + 100 ml distilled H2O) showed the best result for restoration of erased serial number on the copper metal plate .The reagent was also less toxic and less time consuming as compared to standard reagent (19 g FeCl3 + 6 ml cans. HCl + 100 ml distilled H2O). <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=serial%20number%20restoration" title="serial number restoration">serial number restoration</a>, <a href="https://publications.waset.org/abstracts/search?q=copper%20plate" title=" copper plate"> copper plate</a>, <a href="https://publications.waset.org/abstracts/search?q=obliteration" title=" obliteration"> obliteration</a>, <a href="https://publications.waset.org/abstracts/search?q=chemical%20method" title=" chemical method"> chemical method</a> </p> <a href="https://publications.waset.org/abstracts/29117/new-restoration-reagent-for-development-of-erased-serial-number-on-copper-metal-surface" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/29117.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">556</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3396</span> Nanoprofiling of GaAs Surface in a Combined Low-Temperature Plasma for Microwave Devices</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=Victor%20S.%20Klimin">Victor S. Klimin</a>, <a href="https://publications.waset.org/abstracts/search?q=Alexey%20A.%20Rezvan"> Alexey A. Rezvan</a>, <a href="https://publications.waset.org/abstracts/search?q=Maxim%20S.%20Solodovnik"> Maxim S. Solodovnik</a>, <a href="https://publications.waset.org/abstracts/search?q=Oleg%20A.%20Ageev"> Oleg A. Ageev</a> </p> <p class="card-text"><strong>Abstract:</strong></p> In this paper, the problems of existing methods of profiling and surface modification of nanoscale arsenide-gallium structures are analyzed. The use of a combination of methods of local anodic oxidation and plasma chemical etching to solve this problem is considered. The main features that make this technology one of the promising areas of modification and profiling of near-surface layers of solids are demonstrated. In this paper, we studied the effect of formation stress and etching time on the geometrical parameters of the etched layer and the roughness of the etched surface. Experimental dependences of the thickness of the etched layer on the time and stress of formation were obtained. The surface analysis was carried out using atomic force microscopy methods, the corresponding profilograms were constructed from the obtained images, and the roughness of the etched surface was studied accordingly. It was shown that at high formation voltage, the depth of the etched surface increased, this is due to an increase in the number of active particles (oxygen ions and hydroxyl groups) formed as a result of the decomposition of water molecules in an electric field, during the formation of oxide nanostructures on the surface of gallium arsenide. Oxide layers were used as negative masks for subsequent plasma chemical etching by the STE ICPe68 unit. BCl₃ was chosen as the chlorine-containing gas, which differs from analogs in some parameters for the effect of etching of nanostructures based on gallium arsenide in the low-temperature plasma. The gas mixture of reaction chamber consisted of a buffer gas NAr = 100 cm³/min and a chlorine-containing gas NBCl₃ = 15 cm³/min at a pressure P = 2 Pa. The influence of these methods modes, which are formation voltage and etching time, on the roughness and geometric parameters, and corresponding dependences are demonstrated. Probe nanotechnology was used for surface analysis. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=nanostructures" title="nanostructures">nanostructures</a>, <a href="https://publications.waset.org/abstracts/search?q=GaAs" title=" GaAs"> GaAs</a>, <a href="https://publications.waset.org/abstracts/search?q=plasma%20chemical%20etching" title=" plasma chemical etching"> plasma chemical etching</a>, <a href="https://publications.waset.org/abstracts/search?q=modification%20structures" title=" modification structures"> modification structures</a> </p> <a href="https://publications.waset.org/abstracts/106770/nanoprofiling-of-gaas-surface-in-a-combined-low-temperature-plasma-for-microwave-devices" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/106770.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">145</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3395</span> Microstructures of Si Surfaces Fabricated by Electrochemical Anodic Oxidation with Agarose Stamps</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=Hang%20Zhou">Hang Zhou</a>, <a href="https://publications.waset.org/abstracts/search?q=Limin%20Zhu"> Limin Zhu</a> </p> <p class="card-text"><strong>Abstract:</strong></p> This paper investigates the fabrication of microstructures on Si surfaces by using electrochemical anodic oxidation with agarose stamps. The fabricating process is based on a selective anodic oxidation reaction that occurs in the contact area between a stamp and a Si substrate. The stamp which is soaked in electrolyte previously acts as a current flow channel. After forming the oxide patterns as an etching mask, a KOH aqueous is used for the wet etching of Si. A complicated microstructure array of 1 cm2 was fabricated by the method with high accuracy. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=microstructures" title="microstructures">microstructures</a>, <a href="https://publications.waset.org/abstracts/search?q=anodic%20oxidation" title=" anodic oxidation"> anodic oxidation</a>, <a href="https://publications.waset.org/abstracts/search?q=silicon" title=" silicon"> silicon</a>, <a href="https://publications.waset.org/abstracts/search?q=agarose%20stamps" title=" agarose stamps"> agarose stamps</a> </p> <a href="https://publications.waset.org/abstracts/57259/microstructures-of-si-surfaces-fabricated-by-electrochemical-anodic-oxidation-with-agarose-stamps" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/57259.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">305</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3394</span> Effects of Surface Roughness on a Unimorph Piezoelectric Micro-Electro-Mechanical Systems Vibrational Energy Harvester Using Finite Element Method Modeling </h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=Jean%20Marriz%20M.%20Manzano">Jean Marriz M. Manzano</a>, <a href="https://publications.waset.org/abstracts/search?q=Marc%20D.%20Rosales"> Marc D. Rosales</a>, <a href="https://publications.waset.org/abstracts/search?q=Magdaleno%20R.%20Vasquez%20Jr."> Magdaleno R. Vasquez Jr.</a>, <a href="https://publications.waset.org/abstracts/search?q=Maria%20Theresa%20G.%20De%20Leon"> Maria Theresa G. De Leon</a> </p> <p class="card-text"><strong>Abstract:</strong></p> This paper discusses the effects of surface roughness on a cantilever beam vibrational energy harvester. A silicon sample was fabricated using MEMS fabrication processes. When etching silicon using deep reactive ion etching (DRIE) at large etch depths, rougher surfaces are observed as a result of increased response in process pressure, amount of coil power and increased helium backside cooling readings. To account for the effects of surface roughness on the characteristics of the cantilever beam, finite element method (FEM) modeling was performed using actual roughness data from fabricated samples. It was found that when etching about 550um of silicon, root mean square roughness parameter, Sq, varies by 1 to 3 um (at 100um thick) across a 6-inch wafer. Given this Sq variation, FEM simulations predict an 8 to148 Hz shift in the resonant frequency while having no significant effect on the output power. The significant shift in the resonant frequency implies that careful consideration of surface roughness from fabrication processes must be done when designing energy harvesters. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=deep%20reactive%20ion%20etching" title="deep reactive ion etching">deep reactive ion etching</a>, <a href="https://publications.waset.org/abstracts/search?q=finite%20element%20method" title=" finite element method"> finite element method</a>, <a href="https://publications.waset.org/abstracts/search?q=microelectromechanical%20systems" title=" microelectromechanical systems"> microelectromechanical systems</a>, <a href="https://publications.waset.org/abstracts/search?q=multiphysics%20analysis" title=" multiphysics analysis"> multiphysics analysis</a>, <a href="https://publications.waset.org/abstracts/search?q=surface%20roughness" title=" surface roughness"> surface roughness</a>, <a href="https://publications.waset.org/abstracts/search?q=vibrational%20energy%20harvester" title=" vibrational energy harvester"> vibrational energy harvester</a> </p> <a href="https://publications.waset.org/abstracts/115941/effects-of-surface-roughness-on-a-unimorph-piezoelectric-micro-electro-mechanical-systems-vibrational-energy-harvester-using-finite-element-method-modeling" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/115941.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">121</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3393</span> Fabrication of Durable and Renegerable Superhydrophobic Coatings on Metallic Surfaces for Potential Industrial Applications</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=Priya%20Varshney">Priya Varshney</a>, <a href="https://publications.waset.org/abstracts/search?q=Soumya%20S.%20Mohapatra"> Soumya S. Mohapatra</a> </p> <p class="card-text"><strong>Abstract:</strong></p> Fabrication of anti-corrosion and self-cleaning superhydrophobic coatings for metallic surfaces which are regenerable and durable in the aggressive conditions has shown tremendous interest in materials science. In this work, the superhydrophobic coatings on metallic surfaces (aluminum, steel, copper) were prepared by two-step and one-step chemical etching process. In two-step process, roughness on surface was created by chemical etching and then passivation of roughened surface with low surface energy materials whereas, in one-step process, roughness on surface by chemical etching and passivation of surface with low surface energy materials were done in a single step. Beside this, the effect of etchant concentration and etching time on wettability and morphology was also studied. Thermal, mechanical, ultra-violet stability of these coatings were also tested. Along with this, regeneration of coatings and self-cleaning, corrosion resistance and water repelling characteristics were also studied. The surface morphology shows the presence of a rough microstuctures on the treated surfaces and the contact angle measurements confirms the superhydrophobic nature. It is experimentally observed that the surface roughness and contact angle increases with increase in etching time as well as with concentration of etchant. Superhydrophobic surfaces show the excellent self-cleaning behaviour. Coatings are found to be stable and maintain their superhydrophobicity in acidic and alkaline solutions. Water jet impact, floatation on water surface, and low temperature condensation tests prove the water-repellent nature of the coatings. These coatings are found to be thermal, mechanical and ultra-violet stable. These durable superhydrophobic metallic surfaces have potential industrial applications. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=superhydrophobic" title="superhydrophobic">superhydrophobic</a>, <a href="https://publications.waset.org/abstracts/search?q=water-repellent" title=" water-repellent"> water-repellent</a>, <a href="https://publications.waset.org/abstracts/search?q=anti-corrosion" title=" anti-corrosion"> anti-corrosion</a>, <a href="https://publications.waset.org/abstracts/search?q=self-cleaning" title=" self-cleaning"> self-cleaning</a> </p> <a href="https://publications.waset.org/abstracts/61291/fabrication-of-durable-and-renegerable-superhydrophobic-coatings-on-metallic-surfaces-for-potential-industrial-applications" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/61291.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">279</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3392</span> Development of Excellent Water-Repellent Coatings for Metallic and Ceramic Surfaces</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=Aditya%20Kumar">Aditya Kumar</a> </p> <p class="card-text"><strong>Abstract:</strong></p> One of the most fascinating properties of various insects and plant surfaces in nature is their water-repellent (superhydrophobicity) capability. The nature offers new insights to learn and replicate the same in designing artificial superhydrophobic structures for a wide range of applications such as micro-fluidics, micro-electronics, textiles, self-cleaning surfaces, anti-corrosion, anti-fingerprint, oil/water separation, etc. In general, artificial superhydrophobic surfaces are synthesized by creating roughness and then treating the surface with low surface energy materials. In this work, various super-hydrophobic coatings on metallic surfaces (aluminum, steel, copper, steel mesh) were synthesized by chemical etching process using different etchants and fatty acid. Also, SiO2 nano/micro-particles embedded polyethylene, polystyrene, and poly(methyl methacrylate) superhydrophobic coatings were synthesized on glass substrates. Also, the effect of process parameters such as etching time, etchant concentration, and particle concentration on wettability was studied. To know the applications of the coatings, surface morphology, contact angle, self-cleaning, corrosion-resistance, and water-repellent characteristics were investigated at various conditions. Furthermore, durabilities of coatings were also studied by performing thermal, ultra-violet, and mechanical stability tests. The surface morphology confirms the creation of rough microstructures by chemical etching or by embedding particles, and the contact angle measurements reveal the superhydrophobic nature. Experimentally it is found that the coatings have excellent self-cleaning, anti-corrosion and water-repellent nature. These coatings also withstand mechanical disturbances such surface bending, adhesive peeling, and abrasion. Coatings are also found to be thermal and ultra-violet stable. Additionally, coatings are also reproducible. Hence aforesaid durable superhydrophobic surfaces have many potential industrial applications. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=superhydrophobic" title="superhydrophobic">superhydrophobic</a>, <a href="https://publications.waset.org/abstracts/search?q=water-repellent" title=" water-repellent"> water-repellent</a>, <a href="https://publications.waset.org/abstracts/search?q=anti-corrosion" title=" anti-corrosion"> anti-corrosion</a>, <a href="https://publications.waset.org/abstracts/search?q=self-cleaning" title=" self-cleaning"> self-cleaning</a> </p> <a href="https://publications.waset.org/abstracts/61288/development-of-excellent-water-repellent-coatings-for-metallic-and-ceramic-surfaces" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/61288.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">295</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3391</span> Fatty Acid and Amino Acid Composition in Mene maculata in The Sea of Maluku</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=Semuel%20Unwakoly">Semuel Unwakoly</a>, <a href="https://publications.waset.org/abstracts/search?q=Reinner%20Puppela"> Reinner Puppela</a>, <a href="https://publications.waset.org/abstracts/search?q=Maresthy%20Rumalean"> Maresthy Rumalean</a>, <a href="https://publications.waset.org/abstracts/search?q=Healthy%20Kainama"> Healthy Kainama</a> </p> <p class="card-text"><strong>Abstract:</strong></p> Fish is a kind of food that contains many nutritions, one of those is the long chain of unsaturated fatty acids as omega-3 and omega-6 fatty acids and essential amino acid in enough amount for the necessity of our body. Like pelagic fish that found in the sea of Maluku. This research was done to identify fatty acids and amino acids composition in Moonfish (<em>M. maculata</em>) using transesterification reaction steps and Gas Chromatograph-Mass Spectrophotometer (GC-MS) and High-Performance Liquid Chromatography (HPLC). The result showed that fatty acids composition in Moonfish (<em>M. maculata</em>) contained tridecanoic acid (2.84%); palmitoleic acid (2.65%); palmitic acid (35.24%); oleic acid (6.2%); stearic acid (14.20%); and 5,8,11,14-eicosatetraenoic acid (1.29%) and 12 amino acids composition that consist of 7 essential amino acids, were leucine, isoleucine, valine, phenylalanine, methionine, lysine, and histidine, and also 5 non-essential amino acid, were tyrosine, glycine, alanine, glutamic acid, and arginine.Thus, these fishes can be used by the people to complete the necessity of essential fatty acid and amino acid. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=Moonfish%20%28M.%20maculata%29" title="Moonfish (M. maculata)">Moonfish (M. maculata)</a>, <a href="https://publications.waset.org/abstracts/search?q=fatty%20acid" title=" fatty acid"> fatty acid</a>, <a href="https://publications.waset.org/abstracts/search?q=amino%20acid" title=" amino acid"> amino acid</a>, <a href="https://publications.waset.org/abstracts/search?q=GC-MS" title=" GC-MS"> GC-MS</a>, <a href="https://publications.waset.org/abstracts/search?q=HPLC" title=" HPLC"> HPLC</a> </p> <a href="https://publications.waset.org/abstracts/75018/fatty-acid-and-amino-acid-composition-in-mene-maculata-in-the-sea-of-maluku" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/75018.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">249</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3390</span> Structural and Microstructural Investigation into Causes of Rail Squat Defects and Their Correlation with White Etching Layers</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=A.%20Al-Juboori">A. Al-Juboori</a>, <a href="https://publications.waset.org/abstracts/search?q=D.%20Wexler"> D. Wexler</a>, <a href="https://publications.waset.org/abstracts/search?q=H.%20Li"> H. Li</a>, <a href="https://publications.waset.org/abstracts/search?q=H.%20Zhu"> H. Zhu</a>, <a href="https://publications.waset.org/abstracts/search?q=C.%20Lu"> C. Lu</a>, <a href="https://publications.waset.org/abstracts/search?q=A.%20McCusker"> A. McCusker</a>, <a href="https://publications.waset.org/abstracts/search?q=J.%20McLeod"> J. McLeod</a>, <a href="https://publications.waset.org/abstracts/search?q=S.%20Pannila"> S. Pannila</a>, <a href="https://publications.waset.org/abstracts/search?q=Z.%20Wang"> Z. Wang</a> </p> <p class="card-text"><strong>Abstract:</strong></p> Squats are a type railhead defect related to rolling contact fatigue (RCF) damage and are considered serious problem affecting a wide range of railway networks across the world. Squats can lead to partial or complete rail failure. Formation mechanics of squats on the surface of rail steel is still a matter of debate. In this work, structural and microstructural observations from ex-service damaged rail both confirms the phases present in white etching layer (WEL) regions and relationship between cracking in WEL and squat defect formation. XRD synchrotron results obtained from the top surfaces of rail regions containing both WEL and squat defects reveal that these regions contain both martensite and retained austenite. Microstructural analysis of these regions revealed the occurrence cracks extending from WEL down into the rail through the squat region. These findings obtained from field rail specimen support the view that WEL contains regions of austenite and martensitic transformation product, and that cracks in this brittle surface layer propagate deeper into the rail as squats originate and grow. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=squat" title="squat">squat</a>, <a href="https://publications.waset.org/abstracts/search?q=white%20etching%20layer" title=" white etching layer"> white etching layer</a>, <a href="https://publications.waset.org/abstracts/search?q=rolling%20contact%20fatigue" title=" rolling contact fatigue"> rolling contact fatigue</a>, <a href="https://publications.waset.org/abstracts/search?q=synchrotron%20diffraction" title=" synchrotron diffraction"> synchrotron diffraction</a> </p> <a href="https://publications.waset.org/abstracts/83593/structural-and-microstructural-investigation-into-causes-of-rail-squat-defects-and-their-correlation-with-white-etching-layers" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/83593.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">331</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3389</span> A Metallography Study of Secondary A226 Aluminium Alloy Used in Automotive Industries </h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=Lenka%20Hurtalov%C3%A1">Lenka Hurtalová</a>, <a href="https://publications.waset.org/abstracts/search?q=Eva%20Tillov%C3%A1"> Eva Tillová</a>, <a href="https://publications.waset.org/abstracts/search?q=M%C3%A1ria%20Chalupov%C3%A1"> Mária Chalupová</a>, <a href="https://publications.waset.org/abstracts/search?q=Juraj%20Belan"> Juraj Belan</a>, <a href="https://publications.waset.org/abstracts/search?q=Milan%20Uhr%C3%AD%C4%8Dik"> Milan Uhríčik</a> </p> <p class="card-text"><strong>Abstract:</strong></p> The secondary alloy A226 is used for many automotive casting produced by mould casting and high pressure die-casting. This alloy has excellent castability, good mechanical properties and cost-effectiveness. Production of primary aluminium alloys belong to heavy source fouling of life environs. The European Union calls for the emission reduction and reduction in energy consumption, therefore, increase production of recycled (secondary) aluminium cast alloys. The contribution is deal with influence of recycling on the quality of the casting made from A226 in automotive industry. The properties of the casting made from secondary aluminium alloys were compared with the required properties of primary aluminium alloys. The effect of recycling on microstructure was observed using combination different analytical techniques (light microscopy upon black-white etching, scanning electron microscopy-SEM upon deep etching and energy dispersive X-ray analysis-EDX). These techniques were used for the identification of the various structure parameters, which was used to compare secondary alloy microstructure with primary alloy microstructure. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=A226%20secondary%20aluminium%20alloy" title="A226 secondary aluminium alloy">A226 secondary aluminium alloy</a>, <a href="https://publications.waset.org/abstracts/search?q=deep%20etching" title=" deep etching"> deep etching</a>, <a href="https://publications.waset.org/abstracts/search?q=mechanical%20properties" title=" mechanical properties"> mechanical properties</a>, <a href="https://publications.waset.org/abstracts/search?q=recycling%20foundry%20aluminium%20alloy" title=" recycling foundry aluminium alloy"> recycling foundry aluminium alloy</a> </p> <a href="https://publications.waset.org/abstracts/20090/a-metallography-study-of-secondary-a226-aluminium-alloy-used-in-automotive-industries" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/20090.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">541</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3388</span> Characterization of Sunflower Oil for Illustration of Its Components</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=Mehwish%20Shahzadi">Mehwish Shahzadi</a> </p> <p class="card-text"><strong>Abstract:</strong></p> Sunflower is cultivated all over the world not only as an ornament plant but also for the purpose of getting oil. It is the third most cultivated plant in the history because its oil considered best for health. The present study deals with the preparation of sunflower oil from commercial seed sample which was obtained from local market. The physicochemical properties of the oil were determined which included saponification value, acid value and ester value. Results showed that saponification value of the oil was 191.675, acid value was 0.64 and ester value to be 191.035 for the sample under observation. GC-MS analysis of sunflower oil was carried out to check its composition. Oleic acid was determined with linoleic acid and isopropyl palmitate. It represents the presence of three major components of sunflower oil. Other compounds detected were, p-toluylic acid, butylated hydroxytoluene, 1,2-benzenedicarboxylic acid, benzoic acid, 2,4,6-trimethyl-, 2,4,6-trimethylphenyl ester and 2,4-decadienal, (E,E). <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=GC-MS" title="GC-MS">GC-MS</a>, <a href="https://publications.waset.org/abstracts/search?q=oleic%20acid" title=" oleic acid"> oleic acid</a>, <a href="https://publications.waset.org/abstracts/search?q=saponification%20value" title=" saponification value"> saponification value</a>, <a href="https://publications.waset.org/abstracts/search?q=sunflower%20oil" title=" sunflower oil"> sunflower oil</a> </p> <a href="https://publications.waset.org/abstracts/42725/characterization-of-sunflower-oil-for-illustration-of-its-components" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/42725.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">318</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3387</span> Comparison of Punicic Acid Amounts in Abdominal Fat Farm Feeding Hy-Line Chickens</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=Ozcan%20Baris%20Citil">Ozcan Baris Citil</a>, <a href="https://publications.waset.org/abstracts/search?q=Mehmet%20Akoz"> Mehmet Akoz</a> </p> <p class="card-text"><strong>Abstract:</strong></p> Effects of fatty acid composition and punicic acid contents of abdominal fat of Hy-line hens were investigated by the gas chromatographic method. Total 30 different fatty acids were determined in fatty acid compositions of eggs. These fatty acids were varied between C 8 to C 22. The punicic acid content of abdominal fats analysed was found to be higher percentages in the 90th day than those of 30th and 60th day. At the end of the experiment, total punicic acid contents of abdominal fats were significantly increased. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=fatty%20acids" title="fatty acids">fatty acids</a>, <a href="https://publications.waset.org/abstracts/search?q=gas%20chromatography" title=" gas chromatography"> gas chromatography</a>, <a href="https://publications.waset.org/abstracts/search?q=punicic%20acid" title=" punicic acid"> punicic acid</a>, <a href="https://publications.waset.org/abstracts/search?q=abdominal%20fats" title=" abdominal fats "> abdominal fats </a> </p> <a href="https://publications.waset.org/abstracts/47496/comparison-of-punicic-acid-amounts-in-abdominal-fat-farm-feeding-hy-line-chickens" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/47496.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">347</span> </span> </div> </div> <div class="card paper-listing mb-3 mt-3"> <h5 class="card-header" style="font-size:.9rem"><span class="badge badge-info">3386</span> Proximate Analysis of Muscle of Helix aspersa Living in Konya, Turkey</h5> <div class="card-body"> <p class="card-text"><strong>Authors:</strong> <a href="https://publications.waset.org/abstracts/search?q=Ozcan%20Baris%20Citil">Ozcan Baris Citil</a> </p> <p class="card-text"><strong>Abstract:</strong></p> The aim of the present study is the determination of the effects of variations in the proximate analysis, cholesterol content and fatty acid compositions of Helix aspersa. Garden snails (Helix aspersa) were picked up by hand from the Central Anatolia Region of Turkey, in autumn (November) in 2015. Fatty acid methyl esters (FAMEs) and cholesterol analysis were analyzed by gas chromatography (GC). The protein contents of snail muscle were determined with Kjeldahl distillation units. Statistical comparisons were made by using SPSS Software (version 16.0). Thirty different fatty acids of different saturation levels were detected. As the predominant fatty acids, stearic acid (C18:0), oleic acid (C18:1ω9), linoleic acid (C18:2ω6), palmitic acid (C16:0), arachidonic acid (C20:4ω6), eicosadienoic acid (C20:2) and linolenic acid (C18:3ω3) were found in Helix aspersa. Palmitic acid (C16:0) was identified as the major SFA in autumn. Linoleic acid (C18:2ω6), eicosadienoic acid (C20:2) and arachidonic acid (C20:4ω6) have the highest levels among the PUFAs. In the present study, ω3 were found 5.48% in autumn. Linolenic acid and omega-3 fatty acid amounts in the autumn decreased significantly but cholesterol content was not affected in Helix aspersa in autumn (November) in 2015. <p class="card-text"><strong>Keywords:</strong> <a href="https://publications.waset.org/abstracts/search?q=Helix%20aspersa" title="Helix aspersa">Helix aspersa</a>, <a href="https://publications.waset.org/abstracts/search?q=fatty%20acid" title=" fatty acid"> fatty acid</a>, <a href="https://publications.waset.org/abstracts/search?q=SFA" title=" SFA"> SFA</a>, <a href="https://publications.waset.org/abstracts/search?q=PUFA" title=" PUFA"> PUFA</a>, <a href="https://publications.waset.org/abstracts/search?q=cholesterol" title=" cholesterol"> cholesterol</a> </p> <a href="https://publications.waset.org/abstracts/47347/proximate-analysis-of-muscle-of-helix-aspersa-living-in-konya-turkey" class="btn btn-primary btn-sm">Procedia</a> <a href="https://publications.waset.org/abstracts/47347.pdf" target="_blank" class="btn btn-primary btn-sm">PDF</a> <span class="bg-info text-light px-1 py-1 float-right rounded"> Downloads <span class="badge badge-light">338</span> </span> </div> </div> <ul class="pagination"> <li class="page-item disabled"><span class="page-link">&lsaquo;</span></li> <li class="page-item active"><span class="page-link">1</span></li> <li class="page-item"><a class="page-link" href="https://publications.waset.org/abstracts/search?q=acid%20etching&page=2">2</a></li> <li class="page-item"><a class="page-link" href="https://publications.waset.org/abstracts/search?q=acid%20etching&page=3">3</a></li> <li class="page-item"><a class="page-link" href="https://publications.waset.org/abstracts/search?q=acid%20etching&page=4">4</a></li> <li class="page-item"><a class="page-link" href="https://publications.waset.org/abstracts/search?q=acid%20etching&page=5">5</a></li> <li class="page-item"><a class="page-link" href="https://publications.waset.org/abstracts/search?q=acid%20etching&page=6">6</a></li> 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