Electronic Materials | An Open Access Journal from MDPI

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<option value="microwave" > Microwave </option> <option value="minerals" > Minerals </option> <option value="mining" > Mining </option> <option value="modelling" > Modelling </option> <option value="mmphys" > Modern Mathematical Physics </option> <option value="molbank" > Molbank </option> <option value="molecules" > Molecules </option> <option value="mti" > Multimodal Technologies and Interaction (MTI) </option> <option value="muscles" > Muscles </option> <option value="nanoenergyadv" > Nanoenergy Advances </option> <option value="nanomanufacturing" > Nanomanufacturing </option> <option value="nanomaterials" > Nanomaterials </option> <option value="ndt" > NDT </option> <option value="network" > Network </option> <option value="neuroglia" > Neuroglia </option> <option value="neurolint" > Neurology International </option> <option value="neurosci" > NeuroSci </option> <option value="nitrogen" > Nitrogen </option> <option value="ncrna" > Non-Coding RNA (ncRNA) </option> <option 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<a href="/about/journals">Journals</a> </div> <div class="breadcrumb__element"> <a href="#">Electronic Materials</a> </div> </div> </header> <div id="main-content" class=""> <div class="row full-width" data-equalizer="three-columns"> <div id="middle-column" class="content__column large-6 large-push-3 medium-6 medium-push-3 small-12 columns end middle-bordered"> <div id="js-small-main-top-container"> </div> <div class="content__container content__container__orbit "> <div id="title-story" class=""> <ul class="title-story-orbit" data-orbit> <li > <a href="/2673-3978/5/4/19"> <img src="https://pub.mdpi-res.com/title_story/title_story_1736216502021.jpg?1739771134" alt="Dielectric Polyimides" /> <div class="orbit-caption"> Dielectric Polyimides </div> </a> </li> <li class="hidden"> <a href="/2673-3978/5/4/20"> <img src="https://pub.mdpi-res.com/title_story/title_story_1734599265115.jpg?1739771134" alt="A Unified Ballistic Threshold Voltage Model for the Modern MG MOSFET" /> <div 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content__container--overflow-initial"> <div class="custom-accordion-for-small-screen-link active"> <h2 class="no-padding-left">Latest Articles</h2> </div> <div class="custom-accordion-for-small-screen-content"> <div class="expanding-div collapsed"> <div class="generic-item article-item no-border"> <div class="article-content"> <div class="label right label__btn"> <span style="font-size: 12px; color: #1a1a1a;"> 8 pages, 1488 KiB   </span> <a href="/2673-3978/6/1/2/pdf?version=1737624622" class="UD_Listings_ArticlePDF" title="Article PDF" data-name="Wrapping Amorphous Indium-Gallium-Zinc-Oxide Transistors with High Current Density" data-journal="electronicmat"> <i class="material-icons custom-download"></i> </a> </div> <div class="article-icons"><span class="label openaccess" data-dropdown="drop-article-label-openaccess" aria-expanded="false">Open Access</span><span class="label articletype">Article</span></div> <a class="title-link" href="/2673-3978/6/1/2">Wrapping Amorphous Indium-Gallium-Zinc-Oxide Transistors with High Current Density</a> <div class="authors"> by <span class="inlineblock "><strong>Jiaxin Liu</strong>, </span><span class="inlineblock "><strong>Shan Huang</strong>, </span><span class="inlineblock "><strong>Zhenyuan Xiao</strong>, </span><span class="inlineblock "><strong>Ning Li</strong>, </span><span class="inlineblock "><strong>Jaekyun Kim</strong>, </span><span class="inlineblock "><strong>Jidong Jin</strong> and </span><span class="inlineblock "><strong>Jiawei Zhang</strong></span> </div> <div class="color-grey-dark"> <em>Electron. Mater.</em> <b>2025</b>, <em>6</em>(1), 2; <a href="https://doi.org/10.3390/electronicmat6010002">https://doi.org/10.3390/electronicmat6010002</a> - 23 Jan 2025 </div> <div class="abstract-div"> <a href="#" onclick="$(this).next('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> <strong>Abstract </strong> </a> <div class="abstract-cropped inline"> Amorphous oxide semiconductor transistors with a high current density output are highly desirable for large-area electronics. In this study, wrapping amorphous indium-gallium-zinc-oxide (a-IGZO) transistors are proposed to enhance the current density output relative to a-IGZO source-gated transistors (SGTs). Device performances are analyzed using <a href="#" data-counterslink = "https://www.mdpi.com/2673-3978/6/1/2/more" onclick="$(this).parents('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> [...] Read more.</a> </div> <div class="abstract-full "> Amorphous oxide semiconductor transistors with a high current density output are highly desirable for large-area electronics. In this study, wrapping amorphous indium-gallium-zinc-oxide (a-IGZO) transistors are proposed to enhance the current density output relative to a-IGZO source-gated transistors (SGTs). Device performances are analyzed using technology computer-aided design (TCAD) simulations. The TCAD simulation results reveal that, with an optimized device structure, the current density of the wrapping a-IGZO transistor can reach 7.34 μA/μm, representing an approximate two-fold enhancement compared to that of the a-IGZO SGT. Furthermore, the optimized wrapping a-IGZO transistor exhibits clear flat saturation and pinch-off behavior. The proposed wrapping a-IGZO transistors show significant potential for applications in large-area electronics. <a href="/2673-3978/6/1/2">Full article</a> </div> </div> <div class="belongsTo" style="margin-bottom: 10px;"> (This article belongs to the Special Issue <a href=" /journal/electronicmat/special_issues/MOSEA ">Metal Oxide Semiconductors for Electronic Applications</a>)<br/> </div> <a href="#" class="abstract-figures-show" data-counterslink = "https://www.mdpi.com/2673-3978/6/1/2/show" ><span >►</span><span style=" display: none;">▼</span> Show Figures </a><div class="abstract-image-preview "><div class="arrow left-arrow" id="prev1574227"><i class="fa fa-caret-left"></i></div><div class="arrow right-arrow" id="next1574227"><i class="fa fa-caret-right"></i></div><div class="absgraph cycle-slideshow manual" data-cycle-fx="scrollHorz" data-cycle-timeout="0" data-cycle-next="#next1574227" data-cycle-prev="#prev1574227" data-cycle-progressive="#images1574227" data-cycle-slides=">div" data-cycle-log="false"><div class='openpopupgallery cycle-slide' data-imgindex='0' data-target='article-1574227-popup'><span class="helper"></span><img src="data:image/gif;base64,R0lGODlhAQABAAD/ACwAAAAAAQABAAACADs=" data-src="https://pub.mdpi-res.com/electronicmat/electronicmat-06-00002/article_deploy/html/images/electronicmat-06-00002-g001-550.jpg?1737624760" alt="" style="border: 0;"><p>Figure 1</p></div><script id="images1574227" type="text/cycle" data-cycle-split="---"><div class='openpopupgallery' data-imgindex='1' data-target='article-1574227-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-06-00002/article_deploy/html/images/electronicmat-06-00002-g002-550.jpg?1737624761'><p>Figure 2</p></div> --- <div class='openpopupgallery' data-imgindex='2' data-target='article-1574227-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-06-00002/article_deploy/html/images/electronicmat-06-00002-g003-550.jpg?1737624762'><p>Figure 3</p></div> --- <div class='openpopupgallery' data-imgindex='3' data-target='article-1574227-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-06-00002/article_deploy/html/images/electronicmat-06-00002-g004-550.jpg?1737624763'><p>Figure 4</p></div></script></div></div><div id="article-1574227-popup" class="popupgallery" style="display: inline; line-height: 200%"><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-06-00002/article_deploy/html/images/electronicmat-06-00002-g001-550.jpg?1737624760" title=" <strong>Figure 1</strong><br/> <p>Schematic of (<b>a</b>) a-IGZO TFT, (<b>b</b>) a-IGZO SGT, (<b>c</b>) type 1 wrapping a-IGZO transistor, (<b>d</b>) type 2 wrapping a-IGZO transistor, and (<b>e</b>) type 3 wrapping a-IGZO transistor.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/6/1/2'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-06-00002/article_deploy/html/images/electronicmat-06-00002-g002-550.jpg?1737624761" title=" <strong>Figure 2</strong><br/> <p>(<b>a</b>) Transfer characteristics of a-IGZO TFT and a-IGZO SGT. (<b>b</b>) Output characteristics of a-IGZO TFT and a-IGZO SGT. Electron concentration plots of (<b>c</b>) a-IGZO TFT and (<b>d</b>) a-IGZO SGT when V<sub>G</sub> = 6 V and V<sub>D</sub> = 6 V.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/6/1/2'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-06-00002/article_deploy/html/images/electronicmat-06-00002-g003-550.jpg?1737624762" title=" <strong>Figure 3</strong><br/> <p>(<b>a</b>) Transfer characteristics of wrapping IGZO transistors. (<b>b</b>) Output characteristics of type 1 wrapping a-IGZO transistor. (<b>c</b>) Output characteristics of type 2 and type 3 wrapping a-IGZO transistor. Electron concentration plots of (<b>d</b>) type 1, (<b>e</b>) type 2, and (<b>f</b>) type 3 wrapping a-IGZO transistors when V<sub>G</sub> = 6 V and V<sub>D</sub> = 6 V.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/6/1/2'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-06-00002/article_deploy/html/images/electronicmat-06-00002-g004-550.jpg?1737624763" title=" <strong>Figure 4</strong><br/> <p>Electron concentration plots of (<b>a</b>) type 2 and (<b>b</b>) type 3 wrapping a-IGZO transistors when V<sub>G</sub> = −1 V.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/6/1/2'>Full article</a></strong> "></a></div> </div> </div> </div> <div class="extending-content content-ready"> <div class="expanding-div collapsed"> <div class="generic-item article-item"> <div class="article-content"> <div class="label right label__btn"> <span style="font-size: 12px; color: #1a1a1a;"> 18 pages, 10238 KiB   </span> <a href="/2673-3978/6/1/1/pdf?version=1736318762" class="UD_Listings_ArticlePDF" title="Article PDF" data-name="Tribological, Thermal, Kinetic, and Surface Microtextural Characterization of Prime p-Type Silicon Wafer CMP for Direct Wafer Bonding Applications" data-journal="electronicmat"> <i class="material-icons custom-download"></i> </a> </div> <div class="article-icons"><span class="label openaccess" data-dropdown="drop-article-label-openaccess" aria-expanded="false">Open Access</span><span class="label articletype">Article</span></div> <a class="title-link" href="/2673-3978/6/1/1">Tribological, Thermal, Kinetic, and Surface Microtextural Characterization of Prime p-Type <100> Silicon Wafer CMP for Direct Wafer Bonding Applications</a> <div class="authors"> by <span class="inlineblock "><strong>Michelle Yap</strong>, </span><span class="inlineblock "><strong>Catherine Yap</strong>, </span><span class="inlineblock "><strong>Yasa Sampurno</strong>, </span><span class="inlineblock "><strong>Glenn Whitener</strong>, </span><span class="inlineblock "><strong>Jason Keleher</strong>, </span><span class="inlineblock "><strong>Len Borucki</strong> and </span><span class="inlineblock "><strong>Ara Philipossian</strong></span> </div> <div class="color-grey-dark"> <em>Electron. Mater.</em> <b>2025</b>, <em>6</em>(1), 1; <a href="https://doi.org/10.3390/electronicmat6010001">https://doi.org/10.3390/electronicmat6010001</a> - 8 Jan 2025 </div> <div class="abstract-div"> <a href="#" onclick="$(this).next('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> <strong>Abstract </strong> </a> <div class="abstract-cropped inline"> We investigated the tribological, thermal, kinetic, and surface microtextural characteristics of chemical mechanical polishing (CMP) of 300 mm p-type <100> prime silicon wafers (and their native oxide) at various pressures, sliding velocities, and starting platen temperatures. Results showed the dominant tribological mechanism for <a href="#" data-counterslink = "https://www.mdpi.com/2673-3978/6/1/1/more" onclick="$(this).parents('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> [...] Read more.</a> </div> <div class="abstract-full "> We investigated the tribological, thermal, kinetic, and surface microtextural characteristics of chemical mechanical polishing (CMP) of 300 mm p-type <100> prime silicon wafers (and their native oxide) at various pressures, sliding velocities, and starting platen temperatures. Results showed the dominant tribological mechanism for both native oxide and silicon polishing to be boundary lubrication. Using frictional data, we pinpointed the exact time that corresponded to the total removal of the native oxide and the onset of silicon polishing. This allowed us to separately characterize removal rates of each layer. For native oxide, while the rate depended on temperature, the presence of a temperature-independent shear force threshold and the low observed rates suggested that its removal by the slurry was dominantly mechanical. In contrast, for silicon polish, the absence of a distinctive shear force threshold and the fact that, for the same set of consumables, rates were more than 200 times larger for silicon than for native oxide suggested a dominantly chemical process with an average apparent activation energy of 0.34 eV. It was further confirmed that rate selectivity between native oxide and PE-TEOS based SiO<sub>2</sub> control wafers was around 1 to 7, which underscored the importance of being able to directly measure native oxide removal rates. In all cases, we achieved excellent post-polish surfaces with <i>S<sub>a</sub></i> and <i>S<sub>q</sub></i> values of below 1 nm. Due to thermal softening of the thermoplastic pad at elevated temperatures, which we confirmed via dynamic mechanical analysis, overall process vibrations were significantly higher when platen heating was employed. <a href="/2673-3978/6/1/1">Full article</a> </div> </div> <a href="#" class="abstract-figures-show" data-counterslink = "https://www.mdpi.com/2673-3978/6/1/1/show" ><span >►</span><span style=" display: none;">▼</span> Show Figures </a><div class="abstract-image-preview "><div class="arrow left-arrow" id="prev1562189"><i class="fa fa-caret-left"></i></div><div class="arrow right-arrow" id="next1562189"><i class="fa fa-caret-right"></i></div><div class="absgraph cycle-slideshow manual" data-cycle-fx="scrollHorz" data-cycle-timeout="0" data-cycle-next="#next1562189" data-cycle-prev="#prev1562189" data-cycle-progressive="#images1562189" data-cycle-slides=">div" data-cycle-log="false"><div class='openpopupgallery cycle-slide' data-imgindex='0' data-target='article-1562189-popup'><span class="helper"></span><img src="data:image/gif;base64,R0lGODlhAQABAAD/ACwAAAAAAQABAAACADs=" data-src="https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g001-550.jpg?1736318847" alt="" style="border: 0;"><p>Figure 1</p></div><script id="images1562189" type="text/cycle" data-cycle-split="---"><div class='openpopupgallery' data-imgindex='1' data-target='article-1562189-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g002-550.jpg?1736318849'><p>Figure 2</p></div> --- <div class='openpopupgallery' data-imgindex='2' data-target='article-1562189-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g003-550.jpg?1736318850'><p>Figure 3</p></div> --- <div class='openpopupgallery' data-imgindex='3' data-target='article-1562189-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g004-550.jpg?1736318851'><p>Figure 4</p></div> --- <div class='openpopupgallery' data-imgindex='4' data-target='article-1562189-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g005-550.jpg?1736318852'><p>Figure 5</p></div> --- <div class='openpopupgallery' data-imgindex='5' data-target='article-1562189-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g006-550.jpg?1736318854'><p>Figure 6</p></div> --- <div class='openpopupgallery' data-imgindex='6' data-target='article-1562189-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g007-550.jpg?1736318855'><p>Figure 7</p></div> --- <div class='openpopupgallery' data-imgindex='7' data-target='article-1562189-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g008-550.jpg?1736318856'><p>Figure 8</p></div> --- <div class='openpopupgallery' data-imgindex='8' data-target='article-1562189-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g009-550.jpg?1736318859'><p>Figure 9</p></div> --- <div class='openpopupgallery' data-imgindex='9' data-target='article-1562189-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g010-550.jpg?1736318860'><p>Figure 10</p></div> --- <div class='openpopupgallery' data-imgindex='10' data-target='article-1562189-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g011-550.jpg?1736318861'><p>Figure 11</p></div> --- <div class='openpopupgallery' data-imgindex='11' data-target='article-1562189-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g012-550.jpg?1736318863'><p>Figure 12</p></div> --- <div class='openpopupgallery' data-imgindex='12' data-target='article-1562189-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g013-550.jpg?1736318864'><p>Figure 13</p></div> --- <div class='openpopupgallery' data-imgindex='13' data-target='article-1562189-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g014-550.jpg?1736318865'><p>Figure 14</p></div> --- <div class='openpopupgallery' data-imgindex='14' data-target='article-1562189-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g015-550.jpg?1736318867'><p>Figure 15</p></div> --- <div class='openpopupgallery' data-imgindex='15' data-target='article-1562189-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g016-550.jpg?1736318869'><p>Figure 16</p></div> --- <div class='openpopupgallery' data-imgindex='16' data-target='article-1562189-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g017-550.jpg?1736318870'><p>Figure 17</p></div></script></div></div><div id="article-1562189-popup" class="popupgallery" style="display: inline; line-height: 200%"><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g001-550.jpg?1736318847" title=" <strong>Figure 1</strong><br/> <p>Time traces of <span class="html-italic">COF</span>: (<b>a</b>) Phase 1 at 3 PSI—1.58 m/s, (<b>b</b>) Phase 1 at 5 PSI—2.17 m/s, (<b>c</b>) Phase 2 at 3 PSI—1.58 m/s, (<b>d</b>) Phase 2 at 5 PSI—2.17 m/s.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/6/1/1'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g002-550.jpg?1736318849" title=" <strong>Figure 2</strong><br/> <p>Incubation times (<span class="html-italic">t<sub>inc</sub></span>) as a function of power density for native oxide polishing: Phase 1 (<b>left</b>), Phase 2 (<b>right</b>).</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/6/1/1'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g003-550.jpg?1736318850" title=" <strong>Figure 3</strong><br/> <p>Mean pad temperature as a function of power density for native oxide polishing.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/6/1/1'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g004-550.jpg?1736318851" title=" <strong>Figure 4</strong><br/> <p><span class="html-italic">COF</span> as a function of <span class="html-italic">P</span> for each <span class="html-italic">V</span> for native oxide polishing during <span class="html-italic">t<sub>inc</sub></span> in Phase 1 (top solid curves) and Phase 2 (bottom solid curves). A copy of the Phase 1 data has been translated (shifted) downward (dashed curves) to show the relationship of the Phase1 data to the Phase 2 data.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/6/1/1'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g005-550.jpg?1736318852" title=" <strong>Figure 5</strong><br/> <p>Dynamic storage modulus, loss modulus, and tan δ of the VP6000<sup>®</sup> pad.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/6/1/1'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g006-550.jpg?1736318854" title=" <strong>Figure 6</strong><br/> <p>Removal rate of native oxide vs. polishing power density: Phase 1 (<b>left</b>), Phase 2 (<b>right</b>).</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/6/1/1'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g007-550.jpg?1736318855" title=" <strong>Figure 7</strong><br/> <p>Lim–Ashby plots for native oxide removal rates: Phase 1 (<b>left</b>), Phase 2 (<b>right</b>).</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/6/1/1'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g008-550.jpg?1736318856" title=" <strong>Figure 8</strong><br/> <p>Removal rate of native oxide vs. actual shear force per unit area.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/6/1/1'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g009-550.jpg?1736318859" title=" <strong>Figure 9</strong><br/> <p>Mean pad temperatures as a function of power density for silicon polishing.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/6/1/1'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g010-550.jpg?1736318860" title=" <strong>Figure 10</strong><br/> <p>COF of silicon polishing—abscissa in linear scale: Phase 1 (solid curves), Phase 2 (dashed curves).</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/6/1/1'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g011-550.jpg?1736318861" title=" <strong>Figure 11</strong><br/> <p>Average removal rates during silicon polishing: Phase 1 (<b>left</b>), Phase 2 (<b>right</b>).</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/6/1/1'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g012-550.jpg?1736318863" title=" <strong>Figure 12</strong><br/> <p>Lim–Ashby plots for silicon removal rates: Phase 1 (<b>left</b>), Phase 2 (<b>right</b>).</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/6/1/1'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g013-550.jpg?1736318864" title=" <strong>Figure 13</strong><br/> <p>Removal rate of silicon vs. actual shear force per unit area.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/6/1/1'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g014-550.jpg?1736318865" title=" <strong>Figure 14</strong><br/> <p>Arrhenius plots for silicon polishing.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/6/1/1'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g015-550.jpg?1736318867" title=" <strong>Figure 15</strong><br/> <p>Surface microscopy of pre-polished and post-polished Si wafers.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/6/1/1'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g016-550.jpg?1736318869" title=" <strong>Figure 16</strong><br/> <p>Surface roughness of pre-polished and post-polished Si wafers.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/6/1/1'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-06-00001/article_deploy/html/images/electronicmat-06-00001-g017-550.jpg?1736318870" title=" <strong>Figure 17</strong><br/> <p>Average variances of shear force and normal force.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/6/1/1'>Full article</a></strong> "></a></div> </div> </div> </div> <div class="expanding-div collapsed"> <div class="generic-item article-item"> <div class="article-content"> <div class="label right label__btn"> <span style="font-size: 12px; color: #1a1a1a;"> 10 pages, 958 KiB   </span> <a href="/2673-3978/5/4/20/pdf?version=1734062331" class="UD_Listings_ArticlePDF" title="Article PDF" data-name="A Unified Semiconductor-Device-Physics-Based Ballistic Model for the Threshold Voltage of Modern Multiple-Gate Metal-Oxide-Semiconductor Field-Effect-Transistors" data-journal="electronicmat"> <i class="material-icons custom-download"></i> </a> </div> <div class="article-icons"><span class="label openaccess" data-dropdown="drop-article-label-openaccess" aria-expanded="false">Open Access</span><span class="label articletype">Article</span></div> <a class="title-link" href="/2673-3978/5/4/20">A Unified Semiconductor-Device-Physics-Based Ballistic Model for the Threshold Voltage of Modern Multiple-Gate Metal-Oxide-Semiconductor Field-Effect-Transistors</a> <div class="authors"> by <span class="inlineblock "><strong>Te-Kuang Chiang</strong></span> </div> <div class="color-grey-dark"> <em>Electron. Mater.</em> <b>2024</b>, <em>5</em>(4), 321-330; <a href="https://doi.org/10.3390/electronicmat5040020">https://doi.org/10.3390/electronicmat5040020</a> - 13 Dec 2024 </div> <div class="abstract-div"> <a href="#" onclick="$(this).next('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> <strong>Abstract </strong> </a> <div class="abstract-cropped inline"> Based on the minimum conduction band edge caused by the minimum channel potential resulting from the quasi-3D scaling theory and the 3D density of state (DOS) accompanied by the Fermi–Dirac distribution function on the source and drain sides, a unified semiconductor-device-physics-based ballistic model <a href="#" data-counterslink = "https://www.mdpi.com/2673-3978/5/4/20/more" onclick="$(this).parents('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> [...] Read more.</a> </div> <div class="abstract-full "> Based on the minimum conduction band edge caused by the minimum channel potential resulting from the quasi-3D scaling theory and the 3D density of state (DOS) accompanied by the Fermi–Dirac distribution function on the source and drain sides, a unified semiconductor-device-physics-based ballistic model is developed for the threshold voltage of modern multiple-gate (MG) transistors, including FinFET, Ω-gate MOSFET, and nanosheet (NS) MOSFET. It is shown that the thin silicon, thin gate oxide, and high work function will alleviate ballistic effects and resist threshold voltage degradation. In addition, as the device dimension is further reduced to give rise to the 2D/1D DOS, the lowest conduction band edge is increased to resist threshold voltage degradation. The nanosheet MOSFET exhibits the largest threshold voltage among the three transistors due to the smallest minimum conduction band edge caused by the quasi-3D minimum channel potential. When the n-type MOSFET (N-FET) is compared to the P-type MOSFET (P-FET), the P-FET shows more threshold voltage because the hole has a more effective mass than the electron. <a href="/2673-3978/5/4/20">Full article</a> </div> </div> <div class="belongsTo" style="margin-bottom: 10px;"> (This article belongs to the Special Issue <a href=" /journal/electronicmat/special_issues/MOSEA ">Metal Oxide Semiconductors for Electronic Applications</a>)<br/> </div> <a href="#" class="abstract-figures-show" data-counterslink = "https://www.mdpi.com/2673-3978/5/4/20/show" ><span >►</span><span style=" display: none;">▼</span> Show Figures </a><div class="abstract-image-preview "><div class="arrow left-arrow" id="prev1542728"><i class="fa fa-caret-left"></i></div><div class="arrow right-arrow" id="next1542728"><i class="fa fa-caret-right"></i></div><div class="absgraph cycle-slideshow manual" data-cycle-fx="scrollHorz" data-cycle-timeout="0" data-cycle-next="#next1542728" data-cycle-prev="#prev1542728" data-cycle-progressive="#images1542728" data-cycle-slides=">div" data-cycle-log="false"><div class='openpopupgallery cycle-slide' data-imgindex='0' data-target='article-1542728-popup'><span class="helper"></span><img src="data:image/gif;base64,R0lGODlhAQABAAD/ACwAAAAAAQABAAACADs=" data-src="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00020/article_deploy/html/images/electronicmat-05-00020-g001-550.jpg?1734062410" alt="" style="border: 0;"><p>Figure 1</p></div><script id="images1542728" type="text/cycle" data-cycle-split="---"><div class='openpopupgallery' data-imgindex='1' data-target='article-1542728-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00020/article_deploy/html/images/electronicmat-05-00020-g002-550.jpg?1734062411'><p>Figure 2</p></div> --- <div class='openpopupgallery' data-imgindex='2' data-target='article-1542728-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00020/article_deploy/html/images/electronicmat-05-00020-g003-550.jpg?1734062411'><p>Figure 3</p></div> --- <div class='openpopupgallery' data-imgindex='3' data-target='article-1542728-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00020/article_deploy/html/images/electronicmat-05-00020-g004-550.jpg?1734062412'><p>Figure 4</p></div> --- <div class='openpopupgallery' data-imgindex='4' data-target='article-1542728-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00020/article_deploy/html/images/electronicmat-05-00020-g005-550.jpg?1734062412'><p>Figure 5</p></div> --- <div class='openpopupgallery' data-imgindex='5' data-target='article-1542728-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00020/article_deploy/html/images/electronicmat-05-00020-g006-550.jpg?1734062413'><p>Figure 6</p></div> --- <div class='openpopupgallery' data-imgindex='6' data-target='article-1542728-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00020/article_deploy/html/images/electronicmat-05-00020-g007-550.jpg?1734062413'><p>Figure 7</p></div></script></div></div><div id="article-1542728-popup" class="popupgallery" style="display: inline; line-height: 200%"><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00020/article_deploy/html/images/electronicmat-05-00020-g001-550.jpg?1734062410" title=" <strong>Figure 1</strong><br/> <p>Typical schematic of the 3D modern multiple-gate MOSFETs composed of (<b>A</b>) nanosheet (NS) MOSFET, (<b>B</b>) Ω-gate MOSFET, and (<b>C</b>) FinFET. The channel direction is along the z-axis. The channel length, height, and width are denoted by <span class="html-italic">L<sub>g</sub></span>, <span class="html-italic">H</span>, and <span class="html-italic">W</span>, respectively. The gate oxide thickness is denoted by <span class="html-italic">t<sub>ox</sub></span>. <span class="html-italic">W<sub>o</sub></span> is the opening of the bottom oxide in the Ω-gate MOSFET.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/20'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00020/article_deploy/html/images/electronicmat-05-00020-g002-550.jpg?1734062411" title=" <strong>Figure 2</strong><br/> <p>Threshold voltage versus channel length for different silicon thicknesses of FinFET.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/20'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00020/article_deploy/html/images/electronicmat-05-00020-g003-550.jpg?1734062411" title=" <strong>Figure 3</strong><br/> <p>Threshold voltage versus channel length for different gate oxide thicknesses of Ω-gate MOSFET.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/20'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00020/article_deploy/html/images/electronicmat-05-00020-g004-550.jpg?1734062412" title=" <strong>Figure 4</strong><br/> <p>Threshold voltage versus channel length for different work functions of nanosheet MOSFET.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/20'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00020/article_deploy/html/images/electronicmat-05-00020-g005-550.jpg?1734062412" title=" <strong>Figure 5</strong><br/> <p>Threshold voltage versus channel length for different dimensionalities of FinFET.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/20'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00020/article_deploy/html/images/electronicmat-05-00020-g006-550.jpg?1734062413" title=" <strong>Figure 6</strong><br/> <p>Threshold voltage versus channel length for different MG FETs, including FinFET, Ω-gate MOSFET, and nanosheet MOSFET.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/20'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00020/article_deploy/html/images/electronicmat-05-00020-g007-550.jpg?1734062413" title=" <strong>Figure 7</strong><br/> <p>Threshold voltage versus scaling factor for silicon/oxide thickness combinations of FinFET.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/20'>Full article</a></strong> "></a></div> </div> </div> </div> <div class="expanding-div collapsed"> <div class="generic-item article-item"> <div class="article-content"> <div class="label right label__btn"> <span style="font-size: 12px; color: #1a1a1a;"> 18 pages, 6783 KiB   </span> <a href="/2673-3978/5/4/19/pdf?version=1734002710" class="UD_Listings_ArticlePDF" title="Article PDF" data-name="Polyimide-Based Dielectric Materials for High-Temperature Capacitive Energy Storage" data-journal="electronicmat"> <i class="material-icons custom-download"></i> </a> </div> <div class="article-icons"><span class="label openaccess" data-dropdown="drop-article-label-openaccess" aria-expanded="false">Open Access</span><span class="label articletype">Review</span></div> <a class="title-link" href="/2673-3978/5/4/19">Polyimide-Based Dielectric Materials for High-Temperature Capacitive Energy Storage</a> <div class="authors"> by <span class="inlineblock "><strong>Lingling Liu</strong>, </span><span class="inlineblock "><strong>Li Li</strong>, </span><span class="inlineblock "><strong>Shixian Zhang</strong>, </span><span class="inlineblock "><strong>Wenhan Xu</strong> and </span><span class="inlineblock "><strong>Qing Wang</strong></span> </div> <div class="color-grey-dark"> <em>Electron. Mater.</em> <b>2024</b>, <em>5</em>(4), 303-320; <a href="https://doi.org/10.3390/electronicmat5040019">https://doi.org/10.3390/electronicmat5040019</a> - 8 Dec 2024 </div> <div class="abstract-div"> <a href="#" onclick="$(this).next('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> <strong>Abstract </strong> </a> <div class="abstract-cropped inline"> Polyimide (PI) has received great attention for high-temperature capacitive energy storage materials due to its remarkable thermal stability, relatively high breakdown strength, strong mechanical properties, and ease of synthesis and modification. In this review, several key parameters for evaluating capacitive energy storage performance <a href="#" data-counterslink = "https://www.mdpi.com/2673-3978/5/4/19/more" onclick="$(this).parents('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> [...] Read more.</a> </div> <div class="abstract-full "> Polyimide (PI) has received great attention for high-temperature capacitive energy storage materials due to its remarkable thermal stability, relatively high breakdown strength, strong mechanical properties, and ease of synthesis and modification. In this review, several key parameters for evaluating capacitive energy storage performance are introduced. Subsequently, the properties of the commercially available PIs are presented. Then, the recent development of designing and tailoring all-organic PI-based polymers is discussed in detail, focusing on molecular composition and spatial configuration to enhance dielectric constant, breakdown strength, discharged energy density, and charge-discharge efficiency. Finally, we outline the current challenges and future development directions of PI-based high-temperature energy storage dielectric materials. <a href="/2673-3978/5/4/19">Full article</a> </div> </div> <a href="#" class="abstract-figures-show" data-counterslink = "https://www.mdpi.com/2673-3978/5/4/19/show" ><span >►</span><span style=" display: none;">▼</span> Show Figures </a><div class="abstract-image-preview "><div class="arrow left-arrow" id="prev1539291"><i class="fa fa-caret-left"></i></div><div class="arrow right-arrow" id="next1539291"><i class="fa fa-caret-right"></i></div><div class="absgraph cycle-slideshow manual" data-cycle-fx="scrollHorz" data-cycle-timeout="0" data-cycle-next="#next1539291" data-cycle-prev="#prev1539291" data-cycle-progressive="#images1539291" data-cycle-slides=">div" data-cycle-log="false"><div class='openpopupgallery cycle-slide' data-imgindex='0' data-target='article-1539291-popup'><span class="helper"></span><img src="data:image/gif;base64,R0lGODlhAQABAAD/ACwAAAAAAQABAAACADs=" data-src="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00019/article_deploy/html/images/electronicmat-05-00019-g001-550.jpg?1734002813" alt="" style="border: 0;"><p>Figure 1</p></div><script id="images1539291" type="text/cycle" data-cycle-split="---"><div class='openpopupgallery' data-imgindex='1' data-target='article-1539291-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00019/article_deploy/html/images/electronicmat-05-00019-g002-550.jpg?1734002813'><p>Figure 2</p></div> --- <div class='openpopupgallery' data-imgindex='2' data-target='article-1539291-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00019/article_deploy/html/images/electronicmat-05-00019-g003-550.jpg?1734002815'><p>Figure 3</p></div> --- <div class='openpopupgallery' data-imgindex='3' data-target='article-1539291-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00019/article_deploy/html/images/electronicmat-05-00019-g004-550.jpg?1734002816'><p>Figure 4</p></div> --- <div class='openpopupgallery' data-imgindex='4' data-target='article-1539291-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00019/article_deploy/html/images/electronicmat-05-00019-g005-550.jpg?1734002818'><p>Figure 5</p></div> --- <div class='openpopupgallery' data-imgindex='5' data-target='article-1539291-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00019/article_deploy/html/images/electronicmat-05-00019-g006-550.jpg?1734002820'><p>Figure 6</p></div> --- <div class='openpopupgallery' data-imgindex='6' data-target='article-1539291-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00019/article_deploy/html/images/electronicmat-05-00019-g007-550.jpg?1734002822'><p>Figure 7</p></div> --- <div class='openpopupgallery' data-imgindex='7' data-target='article-1539291-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00019/article_deploy/html/images/electronicmat-05-00019-sch001-550.jpg?1734002823'><p>Scheme 1</p></div></script></div></div><div id="article-1539291-popup" class="popupgallery" style="display: inline; line-height: 200%"><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00019/article_deploy/html/images/electronicmat-05-00019-g001-550.jpg?1734002813" title=" <strong>Figure 1</strong><br/> <p>Schematic of <span class="html-italic">D</span>–<span class="html-italic">E</span> loop for calculating energy density and charge-discharge efficiency.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/19'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00019/article_deploy/html/images/electronicmat-05-00019-g002-550.jpg?1734002813" title=" <strong>Figure 2</strong><br/> <p>Schematic of self-clearing mechanism.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/19'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00019/article_deploy/html/images/electronicmat-05-00019-g003-550.jpg?1734002815" title=" <strong>Figure 3</strong><br/> <p>(<b>a</b>) Schematic of different carbonyl-containing polyimides. (<b>b</b>) Dielectric constant and dissipation factor as a function of frequency at 25 °C. (<b>c</b>) Weibull breakdown strength of CPI-1–5. Reprinted with permission from Ref. [<a href="#B66-electronicmat-05-00019" class="html-bibr">66</a>]. Copyright 2019 John Wiley and Sons.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/19'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00019/article_deploy/html/images/electronicmat-05-00019-g004-550.jpg?1734002816" title=" <strong>Figure 4</strong><br/> <p>(<b>a</b>) Molecular structure of 12 predicted derived PIs with nine structural blocks. (<b>b</b>) Comparison of energy bandgaps and glass transition temperatures of several commercial dielectric polymers and PI-derived polymers in this work. (<b>c</b>) Quantitative effects of structural unit addition and substitution on <math display="inline"><semantics> <mrow> <msub> <mrow> <mi>E</mi> </mrow> <mrow> <mi>g</mi> </mrow> </msub> </mrow> </semantics></math> and <math display="inline"><semantics> <mrow> <msub> <mrow> <mi>T</mi> </mrow> <mrow> <mi>g</mi> </mrow> </msub> </mrow> </semantics></math>. (<b>d</b>) Discharged energy density and efficiency of PI-derived polymers which have <math display="inline"><semantics> <mrow> <msub> <mrow> <mi>E</mi> </mrow> <mrow> <mi>g</mi> </mrow> </msub> </mrow> </semantics></math> over 3.3 eV at 200 °C and 100 Hz. Reprinted with permission from Ref. [<a href="#B17-electronicmat-05-00019" class="html-bibr">17</a>] from Springer Nature.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/19'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00019/article_deploy/html/images/electronicmat-05-00019-g005-550.jpg?1734002818" title=" <strong>Figure 5</strong><br/> <p>(<b>a</b>) Synthesis of two alicyclic polyimides (CBDA/DCHM and CBDA/TFMB). (<b>b</b>) Weibull breakdown strength of CBDA/DCHM, CBDA/TFMB, and PMDA/ODA at 200 °C. (<b>c</b>) Dielectric capacitive performance of three polyimides at 200 °C. (<b>d</b>) Discharged energy density comparisons of polyimides reported in this work and a previous work at 200 °C. Reprinted with permission from Ref. [<a href="#B71-electronicmat-05-00019" class="html-bibr">71</a>]. Copyright 2023 Royal Society of Chemistry.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/19'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00019/article_deploy/html/images/electronicmat-05-00019-g006-550.jpg?1734002820" title=" <strong>Figure 6</strong><br/> <p>(<b>a</b>) Synthesis of semi-alicyclic SO-PI copolymer. (<b>b</b>) Picture of semi-alicyclic SO-PI copolymer. (<b>c</b>) Atomic force microscopy (AFM) image of semi-alicyclic SO-PI copolymer. (<b>d</b>) Electrostatic potential distribution of SO-PI and semi-alicyclic SO-PI. (<b>e</b>) Temperature-dependent dielectric constant at 1 kHz. (<b>f</b>) Discharged energy density and efficiency of SO-PI and SO-PI-14.3 copolymer at 200 °C. Reprinted with permission from Ref. [<a href="#B27-electronicmat-05-00019" class="html-bibr">27</a>]. Copyright 2024 John Wiley and Sons.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/19'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00019/article_deploy/html/images/electronicmat-05-00019-g007-550.jpg?1734002822" title=" <strong>Figure 7</strong><br/> <p>(<b>a</b>) Energy-favored configuration of four PIs, i.e., regular PI, PI-B, spiral-structured PI-1, and spiral-structured PI-2. (<b>b</b>) Schematic of 3D electrostatic potential distribution of four PIs. (<b>c</b>) Weibull breakdown strength of PI, PI-B, PI-spiro-1, and PI-spiro-2 at 200 °C. (<b>d</b>) Discharge energy density of PIs with <span class="html-italic">η</span> above 90% at 150 and 200 °C. Reprinted with permission from Ref. [<a href="#B14-electronicmat-05-00019" class="html-bibr">14</a>]. Copyright 2023 John Wiley and Sons.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/19'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00019/article_deploy/html/images/electronicmat-05-00019-sch001-550.jpg?1734002823" title=" <strong>Scheme 1</strong><br/> <p>Polyimide synthesized by two or one-step method.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/19'>Full article</a></strong> "></a></div> </div> </div> </div> <div class="expanding-div collapsed"> <div class="generic-item article-item"> <div class="article-content"> <div class="label right label__btn"> <a data-dropdown="drop-supplementary-1520576" aria-controls="drop-supplementary-1520576" aria-expanded="false" title="Supplementary Material"> <i class="material-icons">attachment</i> </a> <div id="drop-supplementary-1520576" class="f-dropdown label__btn__dropdown label__btn__dropdown--wide" data-dropdown-content aria-hidden="true" tabindex="-1"> Supplementary material: <br/> <a href="/2673-3978/5/4/18/s1?version=1731570864"> Supplementary File 1 (ZIP, 1684 KiB) </a><br/> </div> </div> <div class="label right label__btn"> <span style="font-size: 12px; color: #1a1a1a;"> 10 pages, 2242 KiB   </span> <a href="/2673-3978/5/4/18/pdf?version=1731570864" class="UD_Listings_ArticlePDF" title="Article PDF" data-name="Direct Writing of Metal Nanostructures with Focused Helium Ion Beams" data-journal="electronicmat"> <i class="material-icons custom-download"></i> </a> </div> <div class="article-icons"><span class="label openaccess" data-dropdown="drop-article-label-openaccess" aria-expanded="false">Open Access</span><span class="label articletype">Article</span></div> <a class="title-link" href="/2673-3978/5/4/18">Direct Writing of Metal Nanostructures with Focused Helium Ion Beams</a> <div class="authors"> by <span class="inlineblock "><strong>Vladimir Bruevich</strong>, </span><span class="inlineblock "><strong>Leila Kasaei</strong>, </span><span class="inlineblock "><strong>Leonard C. Feldman</strong> and </span><span class="inlineblock "><strong>Vitaly Podzorov</strong></span> </div> <div class="color-grey-dark"> <em>Electron. Mater.</em> <b>2024</b>, <em>5</em>(4), 293-302; <a href="https://doi.org/10.3390/electronicmat5040018">https://doi.org/10.3390/electronicmat5040018</a> - 14 Nov 2024 </div> <div class="abstract-div"> <a href="#" onclick="$(this).next('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> <strong>Abstract </strong> </a> <div class="abstract-cropped inline"> A helium ion microscope (HIM) with a focused He<sup>+</sup>-ion beam of variable flux and energy can be used as a tool for local nanoscale surface modification. In this work, we demonstrate a simple but versatile use of the HIM focused He <a href="#" data-counterslink = "https://www.mdpi.com/2673-3978/5/4/18/more" onclick="$(this).parents('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> [...] Read more.</a> </div> <div class="abstract-full "> A helium ion microscope (HIM) with a focused He<sup>+</sup>-ion beam of variable flux and energy can be used as a tool for local nanoscale surface modification. In this work, we demonstrate a simple but versatile use of the HIM focused He ion beam to fabricate conducting metallic nano- and microstructures on arbitrary substrates of varied types and shapes by directly patterning pre-deposited initially discontinuous and highly insulating (>10 TΩ/sq.) ultrathin metal films. Gold or silver films, measuring 3 nm in thickness, thermally evaporated on solid substrates have a discontinuous nanocluster morphology. Such highly resistive films can be made locally conductive using moderate doses (2 × 10<sup>16</sup>–10<sup>17</sup> cm<sup>−2</sup>) of low-energy (30 KeV) ion bombardment. We show that an HIM can be used to directly “draw” Au and Ag conductive lines and other patterns with a variable sheet resistance as low as 10 kΩ/sq. without the use of additional precursors. This relatively straightforward, high-definition technique of direct writing with an ion beam, free from complex in vacuo catalytic or precursor chemistries, opens up new opportunities for directly fabricating elements of conformal metallic nanocircuits (interconnects, resistors, and contacts) on arbitrary organic or inorganic substrates, including those with highly curved surfaces. <a href="/2673-3978/5/4/18">Full article</a> </div> </div> <div class="belongsTo" style="margin-bottom: 10px;"> (This article belongs to the Special Issue <a href=" /journal/electronicmat/special_issues/570D5DE0W3 ">Feature Papers of Electronic Materials—Third Edition</a>)<br/> </div> <a href="#" class="abstract-figures-show" data-counterslink = "https://www.mdpi.com/2673-3978/5/4/18/show" ><span >►</span><span style=" display: none;">▼</span> Show Figures </a><div class="abstract-image-preview "><div class="arrow left-arrow" id="prev1520576"><i class="fa fa-caret-left"></i></div><div class="arrow right-arrow" id="next1520576"><i class="fa fa-caret-right"></i></div><div class="absgraph cycle-slideshow manual" data-cycle-fx="scrollHorz" data-cycle-timeout="0" data-cycle-next="#next1520576" data-cycle-prev="#prev1520576" data-cycle-progressive="#images1520576" data-cycle-slides=">div" data-cycle-log="false"><div class='openpopupgallery cycle-slide' data-imgindex='0' data-target='article-1520576-popup'><span class="helper"></span><img src="data:image/gif;base64,R0lGODlhAQABAAD/ACwAAAAAAQABAAACADs=" data-src="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00018/article_deploy/html/images/electronicmat-05-00018-g001-550.jpg?1731571016" alt="" style="border: 0;"><p>Figure 1</p></div><script id="images1520576" type="text/cycle" data-cycle-split="---"><div class='openpopupgallery' data-imgindex='1' data-target='article-1520576-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00018/article_deploy/html/images/electronicmat-05-00018-g002-550.jpg?1731571018'><p>Figure 2</p></div> --- <div class='openpopupgallery' data-imgindex='2' data-target='article-1520576-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00018/article_deploy/html/images/electronicmat-05-00018-g003-550.jpg?1731571021'><p>Figure 3</p></div> --- <div class='openpopupgallery' data-imgindex='3' data-target='article-1520576-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00018/article_deploy/html/images/electronicmat-05-00018-g004-550.jpg?1731571023'><p>Figure 4</p></div></script></div></div><div id="article-1520576-popup" class="popupgallery" style="display: inline; line-height: 200%"><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00018/article_deploy/html/images/electronicmat-05-00018-g001-550.jpg?1731571016" title=" <strong>Figure 1</strong><br/> <p>The proposed mechanism and examples of the patterning of conductive nanostructures with a helium ion microscope (HIM). (<b>a</b>) Schematics illustrating the mechanism of HIM patterning proposed in this work: local sputtering of metal atoms of isolated metallic clusters, lateral redistribution of the metal, and modifications of the substrate’s surface energy under He<sup>+</sup>-ion bombardment, leading to a well-interconnected conducting film. (<b>b</b>) An HIM image of an ultrathin, non-conductive silver film of a nominal thickness of 7 nm deposited on glass. The nanocluster morphology of the film is apparent. (<b>c</b>) An example of HIM patterning: abbreviations “LSM” and “HIM” are drawn with a He<sup>+</sup>-ion beam of a dose 10<sup>16</sup> cm<sup>−2</sup> on a sub-continuous gold film of a nominal thickness of 3 nm. The patterned regions are usually brighter, likely because of their reduced charging. (<b>d</b>) A 40 nm wide conducting line drawn with a high-dose focused He<sup>+</sup>-ion beam on an otherwise non-conducting, ultrathin sub-continuous silver film.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/18'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00018/article_deploy/html/images/electronicmat-05-00018-g002-550.jpg?1731571018" title=" <strong>Figure 2</strong><br/> <p>Thin-film device structures and representative HIM-patterned channels used to evaluate the conductivity of the patterned regions. (<b>a</b>) A sub-continuous, non-conducting silver film (of a nominal thickness of 7 nm) deposited between two thick silver electrodes separated by a 25 µm gap on a glass substrate. (<b>b</b>) The corresponding HIM image of a patterned conducting line drawn using a He<sup>+</sup>-ion beam on this film. (<b>c</b>) Another type of device using a sub-continuous gold film (of a nominal thickness of 3 nm) on parylene-N. (<b>d</b>) An HIM image of a series of lines patterned in this film. The HIM-drawn conducting stripes are about 1 µm wide, bridging the 25 µm long gap between the thick silver electrodes used to measure the conductivity of these samples.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/18'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00018/article_deploy/html/images/electronicmat-05-00018-g003-550.jpg?1731571021" title=" <strong>Figure 3</strong><br/> <p>Experimental evaluation of the sheet resistance of HIM-patterned ultrathin metal films. Measured sheet resistances (<math display="inline"><semantics> <mrow> <msub> <mrow> <mi>R</mi> </mrow> <mrow> <mi mathvariant="normal">S</mi> </mrow> </msub> </mrow> </semantics></math>) of conducting stripes patterned with the HIM in an ultrathin initially insulating seed layer of gold of a nominal thickness of 3.0 ± 0.3 nm evaporated on parylene-N surface, shown here as a function of the He<sup>+</sup>-ion beam dose. As a reference, the blue and red dashed lines show the <math display="inline"><semantics> <mrow> <msub> <mrow> <mi>R</mi> </mrow> <mrow> <mi mathvariant="normal">S</mi> </mrow> </msub> </mrow> </semantics></math> of the unpatterned seed film and the calculated <math display="inline"><semantics> <mrow> <msub> <mrow> <mi>R</mi> </mrow> <mrow> <mi mathvariant="normal">S</mi> </mrow> </msub> </mrow> </semantics></math> of a hypothetic (continuous) gold film of the same nominal thickness (3 nm), assuming it preserves the resistivity of a pure bulk solid gold (<math display="inline"><semantics> <mrow> <msub> <mrow> <mi>ρ</mi> </mrow> <mrow> <mn>3</mn> <mi mathvariant="normal">D</mi> </mrow> </msub> <mo>=</mo> <mn>2.44</mn> <mo>×</mo> <msup> <mrow> <mtext> </mtext> <mn>10</mn> </mrow> <mrow> <mo>−</mo> <mn>6</mn> </mrow> </msup> <mtext> </mtext> <mi mathvariant="sans-serif">Ω</mi> <mo>·</mo> <mi mathvariant="normal">c</mi> <mi mathvariant="normal">m</mi> </mrow> </semantics></math>), unaffected by the interface, surface roughness, or grain-boundary carrier scattering processes.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/18'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00018/article_deploy/html/images/electronicmat-05-00018-g004-550.jpg?1731571023" title=" <strong>Figure 4</strong><br/> <p>Drawing conducting microstructures with a helium ion microscope on non-flat surfaces. Here, a sharp edge of a molecular single crystal, rubrene, was used for demonstration. (<b>a</b>) An HIM image of the edge between the (001) and (100) facets of rubrene. (<b>b</b>,<b>c</b>) Optical microphotographs of a parylene-N-coated rubrene single crystal, fixed on a substrate with this edge facing up, before and after the thick continuous silver electrodes were evaporated through a shadow mask (a 25 µm thick wire) on either facets above and below the edge, forming a 25 µm long channel. HIM patterning was performed at the location where the channel runs over the edge (marked with a small black rectangle). (<b>d</b>) An HIM image of the patterned “T”-shaped contacts. The lower side of the HIM image is brighter because the secondary electron detector is positioned on the corresponding side of the HIM vacuum chamber.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/18'>Full article</a></strong> "></a></div> </div> </div> </div> <div class="expanding-div collapsed"> <div class="generic-item article-item"> <div class="article-content"> <div class="label right label__btn"> <span style="font-size: 12px; color: #1a1a1a;"> 44 pages, 16725 KiB   </span> <a href="/2673-3978/5/4/17/pdf?version=1730886525" class="UD_Listings_ArticlePDF" title="Article PDF" data-name="Microchannel Heat Sinks—A Comprehensive Review" data-journal="electronicmat"> <i class="material-icons custom-download"></i> </a> </div> <div class="article-icons"><span class="label openaccess" data-dropdown="drop-article-label-openaccess" aria-expanded="false">Open Access</span><span class="label articletype">Review</span></div> <a class="title-link" href="/2673-3978/5/4/17">Microchannel Heat Sinks—A Comprehensive Review</a> <div class="authors"> by <span class="inlineblock "><strong>Usman Ghani</strong>, </span><span class="inlineblock "><strong>Muhammad Anas Wazir</strong>, </span><span class="inlineblock "><strong>Kareem Akhtar</strong>, </span><span class="inlineblock "><strong>Mohsin Wajib</strong> and </span><span class="inlineblock "><strong>Shahmir Shaukat</strong></span> </div> <div class="color-grey-dark"> <em>Electron. Mater.</em> <b>2024</b>, <em>5</em>(4), 249-292; <a href="https://doi.org/10.3390/electronicmat5040017">https://doi.org/10.3390/electronicmat5040017</a> - 6 Nov 2024 </div> <div class="abstract-div"> <a href="#" onclick="$(this).next('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> <strong>Abstract </strong> </a> <div class="abstract-cropped inline"> An efficient cooling system is necessary for the reliability and safety of modern microchips for a longer life. As microchips become smaller and more powerful, the heat flux generated by these chips per unit area also rises sharply. Traditional cooling techniques are inadequate <a href="#" data-counterslink = "https://www.mdpi.com/2673-3978/5/4/17/more" onclick="$(this).parents('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> [...] Read more.</a> </div> <div class="abstract-full "> An efficient cooling system is necessary for the reliability and safety of modern microchips for a longer life. As microchips become smaller and more powerful, the heat flux generated by these chips per unit area also rises sharply. Traditional cooling techniques are inadequate to meet the recent cooling requirements of microchips. To meet the current cooling demand of microelectromechanical systems (MEMS) devices and microchips, microchannel heat sink (MCHS) technology is the latest invention, one that can dissipate a significant amount of heat because of its high surface area to volume ratio. This study provides a concise summary of the design, material selection, and performance parameters of the MCHSs that have been developed over the last few decades. The limitations and challenges associated with the different techniques employed by researchers over time to enhance the thermal efficiency of microchannel heat sinks are discussed. The effects on the thermal enhancement factor, Nusselt number, and pressure drop at different Reynold numbers in passive techniques (flow obstruction) i.e., ribs, grooves, dimples, and cavities change in the curvature of MCHSs, are discussed. This study also discusses the increase in heat transfer using nanofluids and how a change in coolant type also significantly affects the thermal performance of MCHSs by obstructing flow. This study provides trends and useful guidelines for researchers to design more effective MCHSs to keep up with the cooling demands of power electronics. <a href="/2673-3978/5/4/17">Full article</a> </div> </div> <a href="#" class="abstract-figures-show" data-counterslink = "https://www.mdpi.com/2673-3978/5/4/17/show" ><span >►</span><span style=" display: none;">▼</span> Show Figures </a><div class="abstract-image-preview "><div class="arrow left-arrow" id="prev1515087"><i class="fa fa-caret-left"></i></div><div class="arrow right-arrow" id="next1515087"><i class="fa fa-caret-right"></i></div><div class="absgraph cycle-slideshow manual" data-cycle-fx="scrollHorz" data-cycle-timeout="0" data-cycle-next="#next1515087" data-cycle-prev="#prev1515087" data-cycle-progressive="#images1515087" data-cycle-slides=">div" data-cycle-log="false"><div class='openpopupgallery cycle-slide' data-imgindex='0' data-target='article-1515087-popup'><span class="helper"></span><img src="data:image/gif;base64,R0lGODlhAQABAAD/ACwAAAAAAQABAAACADs=" data-src="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g001-550.jpg?1730886635" alt="" style="border: 0;"><p>Figure 1</p></div><script id="images1515087" type="text/cycle" data-cycle-split="---"><div class='openpopupgallery' data-imgindex='1' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g002-550.jpg?1730886636'><p>Figure 2</p></div> --- <div class='openpopupgallery' data-imgindex='2' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g003-550.jpg?1730886636'><p>Figure 3</p></div> --- <div class='openpopupgallery' data-imgindex='3' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g004-550.jpg?1730886637'><p>Figure 4</p></div> --- <div class='openpopupgallery' data-imgindex='4' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g005-550.jpg?1730886638'><p>Figure 5</p></div> --- <div class='openpopupgallery' data-imgindex='5' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g006-550.jpg?1730886639'><p>Figure 6</p></div> --- <div class='openpopupgallery' data-imgindex='6' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g007-550.jpg?1730886639'><p>Figure 7</p></div> --- <div class='openpopupgallery' data-imgindex='7' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g008-550.jpg?1730886640'><p>Figure 8</p></div> --- <div class='openpopupgallery' data-imgindex='8' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g009-550.jpg?1730886641'><p>Figure 9</p></div> --- <div class='openpopupgallery' data-imgindex='9' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g010-550.jpg?1730886641'><p>Figure 10</p></div> --- <div class='openpopupgallery' data-imgindex='10' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g011-550.jpg?1730886642'><p>Figure 11</p></div> --- <div class='openpopupgallery' data-imgindex='11' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g012-550.jpg?1730886643'><p>Figure 12</p></div> --- <div class='openpopupgallery' data-imgindex='12' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g013-550.jpg?1730886643'><p>Figure 13</p></div> --- <div class='openpopupgallery' data-imgindex='13' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g014-550.jpg?1730886644'><p>Figure 14</p></div> --- <div class='openpopupgallery' data-imgindex='14' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g015-550.jpg?1730886645'><p>Figure 15</p></div> --- <div class='openpopupgallery' data-imgindex='15' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g016-550.jpg?1730886646'><p>Figure 16</p></div> --- <div class='openpopupgallery' data-imgindex='16' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g017-550.jpg?1730886647'><p>Figure 17</p></div> --- <div class='openpopupgallery' data-imgindex='17' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g018-550.jpg?1730886648'><p>Figure 18</p></div> --- <div class='openpopupgallery' data-imgindex='18' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g019-550.jpg?1730886648'><p>Figure 19</p></div> --- <div class='openpopupgallery' data-imgindex='19' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g020-550.jpg?1730886649'><p>Figure 20</p></div> --- <div class='openpopupgallery' data-imgindex='20' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g021-550.jpg?1730886649'><p>Figure 21</p></div> --- <div class='openpopupgallery' data-imgindex='21' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g022-550.jpg?1730886650'><p>Figure 22</p></div> --- <div class='openpopupgallery' data-imgindex='22' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g023-550.jpg?1730886651'><p>Figure 23</p></div> --- <div class='openpopupgallery' data-imgindex='23' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g024-550.jpg?1730886652'><p>Figure 24</p></div> --- <div class='openpopupgallery' data-imgindex='24' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g025-550.jpg?1730886653'><p>Figure 25</p></div> --- <div class='openpopupgallery' data-imgindex='25' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g026-550.jpg?1730886653'><p>Figure 26</p></div> --- <div class='openpopupgallery' data-imgindex='26' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g027-550.jpg?1730886654'><p>Figure 27</p></div> --- <div class='openpopupgallery' data-imgindex='27' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g028-550.jpg?1730886654'><p>Figure 28</p></div> --- <div class='openpopupgallery' data-imgindex='28' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g029-550.jpg?1730886655'><p>Figure 29</p></div> --- <div class='openpopupgallery' data-imgindex='29' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g030-550.jpg?1730886656'><p>Figure 30</p></div> --- <div class='openpopupgallery' data-imgindex='30' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g031-550.jpg?1730886656'><p>Figure 31</p></div> --- <div class='openpopupgallery' data-imgindex='31' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g032-550.jpg?1730886657'><p>Figure 32</p></div> --- <div class='openpopupgallery' data-imgindex='32' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g033-550.jpg?1730886657'><p>Figure 33</p></div> --- <div class='openpopupgallery' data-imgindex='33' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g034-550.jpg?1730886659'><p>Figure 34</p></div> --- <div class='openpopupgallery' data-imgindex='34' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g035-550.jpg?1730886660'><p>Figure 35</p></div> --- <div class='openpopupgallery' data-imgindex='35' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g036-550.jpg?1730886661'><p>Figure 36</p></div> --- <div class='openpopupgallery' data-imgindex='36' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g037-550.jpg?1730886661'><p>Figure 37</p></div> --- <div class='openpopupgallery' data-imgindex='37' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g038-550.jpg?1730886662'><p>Figure 38</p></div> --- <div class='openpopupgallery' data-imgindex='38' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g039-550.jpg?1730886662'><p>Figure 39</p></div> --- <div class='openpopupgallery' data-imgindex='39' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g040-550.jpg?1730886662'><p>Figure 40</p></div> --- <div class='openpopupgallery' data-imgindex='40' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g041-550.jpg?1730886663'><p>Figure 41</p></div> --- <div class='openpopupgallery' data-imgindex='41' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g042-550.jpg?1730886663'><p>Figure 42</p></div> --- <div class='openpopupgallery' data-imgindex='42' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g043-550.jpg?1730886663'><p>Figure 43</p></div> --- <div class='openpopupgallery' data-imgindex='43' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g044-550.jpg?1730886664'><p>Figure 44</p></div> --- <div class='openpopupgallery' data-imgindex='44' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g045-550.jpg?1730886664'><p>Figure 45</p></div> --- <div class='openpopupgallery' data-imgindex='45' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g046-550.jpg?1730886665'><p>Figure 46</p></div> --- <div class='openpopupgallery' data-imgindex='46' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g047-550.jpg?1730886665'><p>Figure 47</p></div> --- <div class='openpopupgallery' data-imgindex='47' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g048-550.jpg?1730886666'><p>Figure 48</p></div> --- <div class='openpopupgallery' data-imgindex='48' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g049-550.jpg?1730886666'><p>Figure 49</p></div> --- <div class='openpopupgallery' data-imgindex='49' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g050-550.jpg?1730886667'><p>Figure 50</p></div> --- <div class='openpopupgallery' data-imgindex='50' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g051-550.jpg?1730886667'><p>Figure 51</p></div> --- <div class='openpopupgallery' data-imgindex='51' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g052-550.jpg?1730886667'><p>Figure 52</p></div> --- <div class='openpopupgallery' data-imgindex='52' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g053-550.jpg?1730886668'><p>Figure 53</p></div> --- <div class='openpopupgallery' data-imgindex='53' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g054-550.jpg?1730886669'><p>Figure 54</p></div> --- <div class='openpopupgallery' data-imgindex='54' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g055-550.jpg?1730886669'><p>Figure 55</p></div> --- <div class='openpopupgallery' data-imgindex='55' data-target='article-1515087-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g056-550.jpg?1730886670'><p>Figure 56</p></div></script></div></div><div id="article-1515087-popup" class="popupgallery" style="display: inline; line-height: 200%"><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g001-550.jpg?1730886635" title=" <strong>Figure 1</strong><br/> <p>Major causes of electronic failure [<a href="#B3-electronicmat-05-00017" class="html-bibr">3</a>].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g002-550.jpg?1730886636" title=" <strong>Figure 2</strong><br/> <p>Heat sink topology [<a href="#B9-electronicmat-05-00017" class="html-bibr">9</a>]. Reproduced with permission from Khattak et al. [<a href="#B9-electronicmat-05-00017" class="html-bibr">9</a>]; published by De Gruyter, 2020.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g003-550.jpg?1730886636" title=" <strong>Figure 3</strong><br/> <p>Number of studies vs flow type [<a href="#B10-electronicmat-05-00017" class="html-bibr">10</a>]. Reproduced with permission from Adham et al. [<a href="#B10-electronicmat-05-00017" class="html-bibr">10</a>]; published by Elsevier, 2013.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g004-550.jpg?1730886637" title=" <strong>Figure 4</strong><br/> <p>A typical plate fin heat sink [<a href="#B13-electronicmat-05-00017" class="html-bibr">13</a>].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g005-550.jpg?1730886638" title=" <strong>Figure 5</strong><br/> <p>Heat transfer enhancement techniques for MCHSs.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g006-550.jpg?1730886639" title=" <strong>Figure 6</strong><br/> <p>Rectangular microchannel with micro-scale ribs and grooves by Guilian Wang et al. [<a href="#B30-electronicmat-05-00017" class="html-bibr">30</a>]. Reproduced with permission from Guilian Wang et al. [<a href="#B30-electronicmat-05-00017" class="html-bibr">30</a>]; published by Elsevier, 2015.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g007-550.jpg?1730886639" title=" <strong>Figure 7</strong><br/> <p>Rectangular microchannel with arc-shaped ribs and grooves by G. D. Xia et al. [<a href="#B31-electronicmat-05-00017" class="html-bibr">31</a>]. Reproduced with permission from G. D. Xia et al. [<a href="#B31-electronicmat-05-00017" class="html-bibr">31</a>]; published by Taylor and Francis, 2016.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g008-550.jpg?1730886640" title=" <strong>Figure 8</strong><br/> <p>Rectangular microchannel with cylindrical ribs and cavities by Faraz Ahmad et al. [<a href="#B32-electronicmat-05-00017" class="html-bibr">32</a>]. Reproduced with permission from Faraz Ahmad et al. [<a href="#B32-electronicmat-05-00017" class="html-bibr">32</a>]; published by Proceedings of SIMEC, 2019.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g009-550.jpg?1730886641" title=" <strong>Figure 9</strong><br/> <p>Rectangular microchannel with trefoil-shaped ribs by Ahmad, F et al. [<a href="#B12-electronicmat-05-00017" class="html-bibr">12</a>]. Reproduced with permission from Ahmad, F et al. [<a href="#B12-electronicmat-05-00017" class="html-bibr">12</a>]; published by Nature, 2022.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g010-550.jpg?1730886641" title=" <strong>Figure 10</strong><br/> <p>Rectangular microchannel with hydrofoil ribs by Shahzad Ali et al. [<a href="#B33-electronicmat-05-00017" class="html-bibr">33</a>]. Reproduced with permission from Shahzad Ali et al. [<a href="#B33-electronicmat-05-00017" class="html-bibr">33</a>]; published by IEEE, 2021.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g011-550.jpg?1730886642" title=" <strong>Figure 11</strong><br/> <p>Rectangular microchannel with ribs and cones by Ahmad, F et al. [<a href="#B37-electronicmat-05-00017" class="html-bibr">37</a>]. Reproduced with permission from Ahmad, F et al. [<a href="#B37-electronicmat-05-00017" class="html-bibr">37</a>]; published by IEEE Access, 2022.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g012-550.jpg?1730886643" title=" <strong>Figure 12</strong><br/> <p>Rectangular microchannel with bidirectional Ribs by Guilian Wang et al. [<a href="#B38-electronicmat-05-00017" class="html-bibr">38</a>]. Reproduced with permission from Guilian Wang et al. [<a href="#B38-electronicmat-05-00017" class="html-bibr">38</a>]; published by Elsevier, 2019.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g013-550.jpg?1730886643" title=" <strong>Figure 13</strong><br/> <p>Rectangular microchannel with rectangular ribs and sinusoidal cavities by Ihsan Ali Ghani et al. [<a href="#B40-electronicmat-05-00017" class="html-bibr">40</a>]. Reproduced with permission from Ihsan Ali Ghani et al. [<a href="#B40-electronicmat-05-00017" class="html-bibr">40</a>]; published by Elsevier, 2017.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g014-550.jpg?1730886644" title=" <strong>Figure 14</strong><br/> <p>Interrupted microchannel with rectangular ribs by Lei Chai et al. [<a href="#B41-electronicmat-05-00017" class="html-bibr">41</a>] Reproduced with permission from Lei Chai et al. [<a href="#B41-electronicmat-05-00017" class="html-bibr">41</a>]; published by Elsevier, 2013.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g015-550.jpg?1730886645" title=" <strong>Figure 15</strong><br/> <p>Rectangular microchannel with rectangular ribs and triangular cavities (<b>a</b>) Straight Microchanned (<b>b</b>) by Y.F. Li et al. [<a href="#B42-electronicmat-05-00017" class="html-bibr">42</a>]. Reproduced with permission from Y.F. Li et al. [<a href="#B42-electronicmat-05-00017" class="html-bibr">42</a>]; published by Elsevier, 2016.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g016-550.jpg?1730886646" title=" <strong>Figure 16</strong><br/> <p>Rectangular microchannel with rectangular, trapezoidal, and circular ribs by Y.L. Zhai et al. [<a href="#B21-electronicmat-05-00017" class="html-bibr">21</a>]. Reproduced with permission from Y.L. Zhai et al. [<a href="#B21-electronicmat-05-00017" class="html-bibr">21</a>]; published by Elsevier, 2014.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g017-550.jpg?1730886647" title=" <strong>Figure 17</strong><br/> <p>Interrupted microchannel on an Al<sub>2</sub>O<sub>3</sub>/water-based nanofluid by Ayodeji S. Binuyo [<a href="#B43-electronicmat-05-00017" class="html-bibr">43</a>].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g018-550.jpg?1730886648" title=" <strong>Figure 18</strong><br/> <p>Rectangular with rectangular grooves and different-shaped ribs in different configurations by Q. Zhu et al. [<a href="#B47-electronicmat-05-00017" class="html-bibr">47</a>].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g019-550.jpg?1730886648" title=" <strong>Figure 19</strong><br/> <p>Grooved MCHS by Hamdi E. Ahmed et al. [<a href="#B49-electronicmat-05-00017" class="html-bibr">49</a>]. Reproduced with permission from Hamdi E. Ahmed et al. [<a href="#B49-electronicmat-05-00017" class="html-bibr">49</a>]; published by Elsevier, 2015.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g020-550.jpg?1730886649" title=" <strong>Figure 20</strong><br/> <p>Grooved MCHS with curved vanes by Cila Herman et al. [<a href="#B52-electronicmat-05-00017" class="html-bibr">52</a>]. Reproduced with permission from Cila Herman et al. [<a href="#B52-electronicmat-05-00017" class="html-bibr">52</a>]; published by Elsevier, 2002.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g021-550.jpg?1730886649" title=" <strong>Figure 21</strong><br/> <p>MCHS with hemispherical-shaped protrusions/dimples by Mohib-ur-Rehman [<a href="#B57-electronicmat-05-00017" class="html-bibr">57</a>]. Reproduced with permission from Mohib-ur-Rehman [<a href="#B57-electronicmat-05-00017" class="html-bibr">57</a>]; published by Springer Nature, 2019.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g022-550.jpg?1730886650" title=" <strong>Figure 22</strong><br/> <p>MCHS with turbulent flow over the dimpled surface by Yu Chen [<a href="#B54-electronicmat-05-00017" class="html-bibr">54</a>]. Reproduced with permission from Yu Chen [<a href="#B54-electronicmat-05-00017" class="html-bibr">54</a>]; published by Elsevier, 2012.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g023-550.jpg?1730886651" title=" <strong>Figure 23</strong><br/> <p>MCHS with dimples by Minghai Xu [<a href="#B53-electronicmat-05-00017" class="html-bibr">53</a>]. Reproduced with permission from Minghai Xu [<a href="#B53-electronicmat-05-00017" class="html-bibr">53</a>]; published by Elsevier, 2016.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g024-550.jpg?1730886652" title=" <strong>Figure 24</strong><br/> <p>Rectangular MCHS with concavities by Moon [<a href="#B55-electronicmat-05-00017" class="html-bibr">55</a>].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g025-550.jpg?1730886653" title=" <strong>Figure 25</strong><br/> <p>Computational domain of Suabsakul Gururatana [<a href="#B56-electronicmat-05-00017" class="html-bibr">56</a>].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g026-550.jpg?1730886653" title=" <strong>Figure 26</strong><br/> <p>Rectangular MCHS with offset strip fin by F. Hong [<a href="#B60-electronicmat-05-00017" class="html-bibr">60</a>]. Reproduced with permission from F. Hong [<a href="#B60-electronicmat-05-00017" class="html-bibr">60</a>]; published by Elsevier, 2009.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g027-550.jpg?1730886654" title=" <strong>Figure 27</strong><br/> <p>Rectangular MCHS with longitudinal fins by Dogan [<a href="#B16-electronicmat-05-00017" class="html-bibr">16</a>]. Reproduced with permission from Dogan [<a href="#B16-electronicmat-05-00017" class="html-bibr">16</a>]; published by Elsevier, 2010.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g028-550.jpg?1730886654" title=" <strong>Figure 28</strong><br/> <p>Rectangular MCHS with dimples and pin fin by Ping Li [<a href="#B58-electronicmat-05-00017" class="html-bibr">58</a>]. Reproduced with permission from Ping Li [<a href="#B58-electronicmat-05-00017" class="html-bibr">58</a>]; published by Elsevier, 2018.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g029-550.jpg?1730886655" title=" <strong>Figure 29</strong><br/> <p>MCHS with semi-closed omega-shaped configuration by Daxiang Deng et al. [<a href="#B62-electronicmat-05-00017" class="html-bibr">62</a>]. Reproduced with permission from Daxiang Deng et al. [<a href="#B62-electronicmat-05-00017" class="html-bibr">62</a>]; published by Elsevier, 2015.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g030-550.jpg?1730886656" title=" <strong>Figure 30</strong><br/> <p>Trapezoidal MCHS by Wu H. et al. [<a href="#B63-electronicmat-05-00017" class="html-bibr">63</a>]. Reproduced with permission from Wu H. et al. [<a href="#B63-electronicmat-05-00017" class="html-bibr">63</a>]; published by Elsevier, 2003.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g031-550.jpg?1730886656" title=" <strong>Figure 31</strong><br/> <p>C rectangular microchannel by K.C. Toh et al. [<a href="#B73-electronicmat-05-00017" class="html-bibr">73</a>]. Reproduced with permission from K.C. Toh et al. [<a href="#B73-electronicmat-05-00017" class="html-bibr">73</a>]; published by Elsevier, 2002.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g032-550.jpg?1730886657" title=" <strong>Figure 32</strong><br/> <p>Rectangular microchannel by J.L. Xu et al. [<a href="#B75-electronicmat-05-00017" class="html-bibr">75</a>]. Reproduced with permission from J.L. Xu. et al. [<a href="#B75-electronicmat-05-00017" class="html-bibr">75</a>]; published by Elsevier, 2005.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g033-550.jpg?1730886657" title=" <strong>Figure 33</strong><br/> <p>Rectangular microchannel by Amy Rachel Betz et al. [<a href="#B77-electronicmat-05-00017" class="html-bibr">77</a>] Reproduced with permission from Amy Rachel Betz et al. [<a href="#B77-electronicmat-05-00017" class="html-bibr">77</a>]; published by Elsevier, 2010.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g034-550.jpg?1730886659" title=" <strong>Figure 34</strong><br/> <p>Array mini channel by Deng, B. et al. [<a href="#B64-electronicmat-05-00017" class="html-bibr">64</a>]. Reproduced with permission from Deng, B. et al. [<a href="#B64-electronicmat-05-00017" class="html-bibr">64</a>]; published by Elsevier, 2011.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g035-550.jpg?1730886660" title=" <strong>Figure 35</strong><br/> <p>MCHS with two-phase flow by Tom Saenen et al. [<a href="#B79-electronicmat-05-00017" class="html-bibr">79</a>].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g036-550.jpg?1730886661" title=" <strong>Figure 36</strong><br/> <p>Microchannel heat sink with manifold and oblique channels by Min Yang et al. [<a href="#B82-electronicmat-05-00017" class="html-bibr">82</a>]. Reproduced with permission from Min Yang et al. [<a href="#B82-electronicmat-05-00017" class="html-bibr">82</a>]; published by Elsevier, 2022.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g037-550.jpg?1730886661" title=" <strong>Figure 37</strong><br/> <p>Rectangular MCHS with porous medium by Tsung-Hsun Tsai et al. [<a href="#B94-electronicmat-05-00017" class="html-bibr">94</a>]. Reproduced with permission from Tsung-Hsun Tsai et al. [<a href="#B94-electronicmat-05-00017" class="html-bibr">94</a>]; published by Elsevier, 2007.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g038-550.jpg?1730886662" title=" <strong>Figure 38</strong><br/> <p>Rectangular microchannels of copper, silicon, and stainless steel by Zhigang et al. [<a href="#B92-electronicmat-05-00017" class="html-bibr">92</a>]. Reproduced with permission from Zhigang et al. [<a href="#B92-electronicmat-05-00017" class="html-bibr">92</a>]; published by Elsevier, 2007.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g039-550.jpg?1730886662" title=" <strong>Figure 39</strong><br/> <p>C rectangular MCHS using water–air coolant by Zade A.Q. et al. [<a href="#B78-electronicmat-05-00017" class="html-bibr">78</a>]. Reproduced with permission from Zade A.Q. et al. [<a href="#B78-electronicmat-05-00017" class="html-bibr">78</a>]; published by Elsevier, 2011.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g040-550.jpg?1730886662" title=" <strong>Figure 40</strong><br/> <p>Rectangular microchannel by Chien-Hsin Chen et al. [<a href="#B19-electronicmat-05-00017" class="html-bibr">19</a>]. Reproduced with permission from Chien-Hsin Chen et al. [<a href="#B19-electronicmat-05-00017" class="html-bibr">19</a>]; published by Elsevier, 2007.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g041-550.jpg?1730886663" title=" <strong>Figure 41</strong><br/> <p>Rectangular MCHS by Guodong Xia et al. [<a href="#B95-electronicmat-05-00017" class="html-bibr">95</a>]. Reproduced with permission from Guodong Xia et al. [<a href="#B95-electronicmat-05-00017" class="html-bibr">95</a>]; published by Elsevier, 2011.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g042-550.jpg?1730886663" title=" <strong>Figure 42</strong><br/> <p>Rectangular MCHS with ribs and cavities by Ghani et al. [<a href="#B96-electronicmat-05-00017" class="html-bibr">96</a>]. Reproduced with permission from Ghani et al. [<a href="#B96-electronicmat-05-00017" class="html-bibr">96</a>]; published by Elsevier, 2017.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g043-550.jpg?1730886663" title=" <strong>Figure 43</strong><br/> <p>Rectangular MCHS with triangular cavities by Lei Chai et al. [<a href="#B41-electronicmat-05-00017" class="html-bibr">41</a>].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g044-550.jpg?1730886664" title=" <strong>Figure 44</strong><br/> <p>Trapezoidal and parallel orientations rectangular MCHS by Memon et al. [<a href="#B87-electronicmat-05-00017" class="html-bibr">87</a>]. Reproduced with permission from Memon et al. [<a href="#B87-electronicmat-05-00017" class="html-bibr">87</a>]; published by MDPI, 2020.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g045-550.jpg?1730886664" title=" <strong>Figure 45</strong><br/> <p>Manifold MCHS with secondary oblique fin by Yang et al. [<a href="#B88-electronicmat-05-00017" class="html-bibr">88</a>]. Reproduced with permission from Yang et al. [<a href="#B88-electronicmat-05-00017" class="html-bibr">88</a>]; published by Elsevier, 2020.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g046-550.jpg?1730886665" title=" <strong>Figure 46</strong><br/> <p>Rectangular secondary flow MCHS by Kuppusamay et al. [<a href="#B90-electronicmat-05-00017" class="html-bibr">90</a>]. Reproduced with permission from Kuppusamay et al. [<a href="#B90-electronicmat-05-00017" class="html-bibr">90</a>]; published by Elsevier, 2014.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g047-550.jpg?1730886665" title=" <strong>Figure 47</strong><br/> <p>MCHS with ribs and secondary channels by Bahirae et al. [<a href="#B91-electronicmat-05-00017" class="html-bibr">91</a>]. Reproduced with permission from Bahirae et al. [<a href="#B91-electronicmat-05-00017" class="html-bibr">91</a>]; published by Elsevier, 2019.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g048-550.jpg?1730886666" title=" <strong>Figure 48</strong><br/> <p>Sinusoidal secondary flow MCHS by D.D. Ma et al. [<a href="#B95-electronicmat-05-00017" class="html-bibr">95</a>]. Reproduced with permission from D.D. Ma et al. [<a href="#B95-electronicmat-05-00017" class="html-bibr">95</a>]; published by Elsevier, 2021.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g049-550.jpg?1730886666" title=" <strong>Figure 49</strong><br/> <p>C MCHS with ribs and secondary channels by SA Razali et al. [<a href="#B101-electronicmat-05-00017" class="html-bibr">101</a>].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g050-550.jpg?1730886667" title=" <strong>Figure 50</strong><br/> <p>Square-shaped MCHS with one and two initial loops by Farzaneh et al. [<a href="#B97-electronicmat-05-00017" class="html-bibr">97</a>]. Reproduced with permission from Farzaneh et al. [<a href="#B97-electronicmat-05-00017" class="html-bibr">97</a>]; published by Elsevier, 2016.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g051-550.jpg?1730886667" title=" <strong>Figure 51</strong><br/> <p>Rectangular Parallel-Slot MCHS by Huang et al. [<a href="#B98-electronicmat-05-00017" class="html-bibr">98</a>]. Reproduced with permission from Huang et al. [<a href="#B98-electronicmat-05-00017" class="html-bibr">98</a>]; published by Elsevier, 2016.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g052-550.jpg?1730886667" title=" <strong>Figure 52</strong><br/> <p>Truncated double-layer MCHS by AAA Arani et al. [<a href="#B108-electronicmat-05-00017" class="html-bibr">108</a>]. Reproduced with permission from AAA Arani et al. [<a href="#B108-electronicmat-05-00017" class="html-bibr">108</a>]; published by Elsevier, 2017.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g053-550.jpg?1730886668" title=" <strong>Figure 53</strong><br/> <p>Double-layer MCHS by Arabpour, A. et al. [<a href="#B109-electronicmat-05-00017" class="html-bibr">109</a>]. Reproduced with permission from Arabpour, A. et al. [<a href="#B109-electronicmat-05-00017" class="html-bibr">109</a>]; published by Springer Link, 2017.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g054-550.jpg?1730886669" title=" <strong>Figure 54</strong><br/> <p>Multi-nozzle trapezoidal MCHS by Ngoctan et al. [<a href="#B113-electronicmat-05-00017" class="html-bibr">113</a>]. Reproduced with permission from Ngoctan et al. [<a href="#B113-electronicmat-05-00017" class="html-bibr">113</a>]; published by Elsevier, 2018.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g055-550.jpg?1730886669" title=" <strong>Figure 55</strong><br/> <p>Single-layer fractal MCHS by Zangonji et al. [<a href="#B102-electronicmat-05-00017" class="html-bibr">102</a>].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00017/article_deploy/html/images/electronicmat-05-00017-g056-550.jpg?1730886670" title=" <strong>Figure 56</strong><br/> <p>Experimental rectangular MCHS by Chabi et al. [<a href="#B116-electronicmat-05-00017" class="html-bibr">116</a>]. Reproduced with permission from Chabi et al. [<a href="#B116-electronicmat-05-00017" class="html-bibr">116</a>]; published by Elsevier, 2016.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/17'>Full article</a></strong> "></a></div> </div> </div> </div> <div class="expanding-div collapsed"> <div class="generic-item article-item"> <div class="article-content"> <div class="label right label__btn"> <a data-dropdown="drop-supplementary-1502499" aria-controls="drop-supplementary-1502499" aria-expanded="false" title="Supplementary Material"> <i class="material-icons">attachment</i> </a> <div id="drop-supplementary-1502499" class="f-dropdown label__btn__dropdown label__btn__dropdown--wide" data-dropdown-content aria-hidden="true" tabindex="-1"> Supplementary material: <br/> <a href="/2673-3978/5/4/16/s1?version=1729337638"> Supplementary File 1 (ZIP, 642 KiB) </a><br/> </div> </div> <div class="label right label__btn"> <span style="font-size: 12px; color: #1a1a1a;"> 10 pages, 2268 KiB   </span> <a href="/2673-3978/5/4/16/pdf?version=1729746976" class="UD_Listings_ArticlePDF" title="Article PDF" data-name="The Extraction of the Density of States of Atomic-Layer-Deposited ZnO Transistors by Analyzing Gate-Dependent Field-Effect Mobility" data-journal="electronicmat"> <i class="material-icons custom-download"></i> </a> </div> <div class="article-icons"><span class="label openaccess" data-dropdown="drop-article-label-openaccess" aria-expanded="false">Open Access</span><span class="label articletype">Article</span></div> <a class="title-link" href="/2673-3978/5/4/16">The Extraction of the Density of States of Atomic-Layer-Deposited ZnO Transistors by Analyzing Gate-Dependent Field-Effect Mobility</a> <div class="authors"> by <span class="inlineblock "><strong>Minho Yoon</strong></span> </div> <div class="color-grey-dark"> <em>Electron. Mater.</em> <b>2024</b>, <em>5</em>(4), 239-248; <a href="https://doi.org/10.3390/electronicmat5040016">https://doi.org/10.3390/electronicmat5040016</a> - 19 Oct 2024 </div> <a href="/2673-3978/5/4/16#metrics">Cited by 1</a> <div class="abstract-div"> <a href="#" onclick="$(this).next('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> <strong>Abstract </strong> </a> <div class="abstract-cropped inline"> In this study, we investigated the density of states extraction method for atomic-deposited ZnO thin-film transistors (TFTs) by analyzing gate-dependent field-effect mobility. The atomic layer deposition (ALD) method offers ultra-thin and smooth ZnO films, but these films suffer from interface and semiconductor defects, <a href="#" data-counterslink = "https://www.mdpi.com/2673-3978/5/4/16/more" onclick="$(this).parents('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> [...] Read more.</a> </div> <div class="abstract-full "> In this study, we investigated the density of states extraction method for atomic-deposited ZnO thin-film transistors (TFTs) by analyzing gate-dependent field-effect mobility. The atomic layer deposition (ALD) method offers ultra-thin and smooth ZnO films, but these films suffer from interface and semiconductor defects, which lead to disordered localized electronic structures. Hence, to investigate the unstable localized structure of ZnO TFTs, we tried to derive the electronic state relationship by assuming field-effect mobility can be expressed as a gate-dependent Arrhenius relation, and the activation energy in the relation is the required energy for hopping. Following this derived relationship, the DOS of the atomic-deposited ZnO transistor was extracted and found to be consistent with those using temperature-dependent measurements. Moreover, to ensure the proposed method is reliable, we applied methods for the extraction of DOSs of doped ZnO transistors, which show enhanced mobilities with shifted threshold voltages, and the results show that the extraction method is reliable. Thus, we can state that the mobility-based DOS extraction method offers practical benefits for estimating the density of states of disordered transistors using a single transfer characteristic of these devices. <a href="/2673-3978/5/4/16">Full article</a> </div> </div> <a href="#" class="abstract-figures-show" data-counterslink = "https://www.mdpi.com/2673-3978/5/4/16/show" ><span >►</span><span style=" display: none;">▼</span> Show Figures </a><div class="abstract-image-preview "><div class="arrow left-arrow" id="prev1502499"><i class="fa fa-caret-left"></i></div><div class="arrow right-arrow" id="next1502499"><i class="fa fa-caret-right"></i></div><div class="absgraph cycle-slideshow manual" data-cycle-fx="scrollHorz" data-cycle-timeout="0" data-cycle-next="#next1502499" data-cycle-prev="#prev1502499" data-cycle-progressive="#images1502499" data-cycle-slides=">div" data-cycle-log="false"><div class='openpopupgallery cycle-slide' data-imgindex='0' data-target='article-1502499-popup'><span class="helper"></span><img src="data:image/gif;base64,R0lGODlhAQABAAD/ACwAAAAAAQABAAACADs=" data-src="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00016/article_deploy/html/images/electronicmat-05-00016-g001-550.jpg?1729747112" alt="" style="border: 0;"><p>Figure 1</p></div><script id="images1502499" type="text/cycle" data-cycle-split="---"><div class='openpopupgallery' data-imgindex='1' data-target='article-1502499-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00016/article_deploy/html/images/electronicmat-05-00016-g002-550.jpg?1729747113'><p>Figure 2</p></div> --- <div class='openpopupgallery' data-imgindex='2' data-target='article-1502499-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00016/article_deploy/html/images/electronicmat-05-00016-g003-550.jpg?1729747114'><p>Figure 3</p></div> --- <div class='openpopupgallery' data-imgindex='3' data-target='article-1502499-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00016/article_deploy/html/images/electronicmat-05-00016-g004-550.jpg?1729747115'><p>Figure 4</p></div> --- <div class='openpopupgallery' data-imgindex='4' data-target='article-1502499-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00016/article_deploy/html/images/electronicmat-05-00016-g005-550.jpg?1729747117'><p>Figure 5</p></div></script></div></div><div id="article-1502499-popup" class="popupgallery" style="display: inline; line-height: 200%"><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00016/article_deploy/html/images/electronicmat-05-00016-g001-550.jpg?1729747112" title=" <strong>Figure 1</strong><br/> <p>(<b>a</b>) Optical microscopy image of ZnO TFTs; (<b>b</b>) thickness profiles of ZnO film by AFM (inset: topographic image of ZnO layer); (<b>c</b>) surface morphology of ZnO film; (<b>d</b>) transfer characteristics (<span class="html-italic">I<sub>ds</sub></span> vs. <span class="html-italic">V<sub>gs</sub></span>) of ZnO TFTs; (<b>e</b>) threshold voltage extraction of ZnO TFTs with gate bias ranges up to 40 (red), 60 (blue), and 80 V (black); and (<b>f</b>) subthreshold swing of ZnO TFTs.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/16'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00016/article_deploy/html/images/electronicmat-05-00016-g002-550.jpg?1729747113" title=" <strong>Figure 2</strong><br/> <p>(<b>a</b>) XPS spectra of ZnO film; (<b>b</b>) XRD pattern of ZnO films; (<b>c</b>) temperature dependence of transfer curves of ZnO TFTs; and (<b>d</b>) extracted trap density of states (DOS) of ZnO TFTs.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/16'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00016/article_deploy/html/images/electronicmat-05-00016-g003-550.jpg?1729747114" title=" <strong>Figure 3</strong><br/> <p>(<b>a</b>) Mobility-based DOS estimation plots of ZnO TFTs; (<b>b</b>) resulting activation energy from integral of derivative activation energies; and (<b>c</b>) extracted trap density of states (DOS) of ZnO TFTs.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/16'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00016/article_deploy/html/images/electronicmat-05-00016-g004-550.jpg?1729747115" title=" <strong>Figure 4</strong><br/> <p>(<b>a</b>,<b>d</b>) Transfer characteristics (<span class="html-italic">I<sub>ds</sub></span> vs. <span class="html-italic">V<sub>gs</sub></span> at <span class="html-italic">V<sub>ds</sub></span> = 1 V) of 1 and 3 nm-thin Al<sub>2</sub>O<sub>3</sub>-coated ZnO TFTs, respectively; (<b>b</b>,<b>e</b>) mobility-based DOS estimation plots of 1 and 3 nm-thin Al<sub>2</sub>O<sub>3</sub>-coated ZnO TFTs, respectively; and (<b>c</b>,<b>f</b>) extracted trap density of states (DOS) of ZnO TFTs.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/16'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00016/article_deploy/html/images/electronicmat-05-00016-g005-550.jpg?1729747117" title=" <strong>Figure 5</strong><br/> <p>(<b>a</b>) Field-effect mobilities of pure and doped ZnO TFTs; (<b>b</b>) extracted trap density of states (DOSs) of TFTs; (<b>c</b>) mobility prefactors of pure and doped ZnO TFTs; (<b>d</b>) Hall measurements of pure and doped ZnO films (inset: optical microscope image of van der Pauw samples); and (<b>e</b>) schematic illustration of doping effects in ZnO films.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/16'>Full article</a></strong> "></a></div> </div> </div> </div> <div class="expanding-div collapsed"> <div class="generic-item article-item"> <div class="article-content"> <div class="label right label__btn"> <a data-dropdown="drop-supplementary-1493217" aria-controls="drop-supplementary-1493217" aria-expanded="false" title="Supplementary Material"> <i class="material-icons">attachment</i> </a> <div id="drop-supplementary-1493217" class="f-dropdown label__btn__dropdown label__btn__dropdown--wide" data-dropdown-content aria-hidden="true" tabindex="-1"> Supplementary material: <br/> <a href="/2673-3978/5/4/15/s1?version=1728211865"> Supplementary File 1 (ZIP, 1082 KiB) </a><br/> </div> </div> <div class="label right label__btn"> <span style="font-size: 12px; color: #1a1a1a;"> 18 pages, 4511 KiB   </span> <a href="/2673-3978/5/4/15/pdf?version=1728211865" class="UD_Listings_ArticlePDF" title="Article PDF" data-name="Intrinsic Metal Component-Assisted Microwave Pyrolysis and Kinetic Study of Waste Printed Circuit Boards" data-journal="electronicmat"> <i class="material-icons custom-download"></i> </a> </div> <div class="article-icons"><span class="label openaccess" data-dropdown="drop-article-label-openaccess" aria-expanded="false">Open Access</span><span class="label articletype">Article</span></div> <a class="title-link" href="/2673-3978/5/4/15">Intrinsic Metal Component-Assisted Microwave Pyrolysis and Kinetic Study of Waste Printed Circuit Boards</a> <div class="authors"> by <span class="inlineblock "><strong>Diyi Jin</strong>, </span><span class="inlineblock "><strong>Min Zhao</strong>, </span><span class="inlineblock "><strong>Haochen Zhu</strong>, </span><span class="inlineblock "><strong>Guangming Li</strong> and </span><span class="inlineblock "><strong>Wenzhi He</strong></span> </div> <div class="color-grey-dark"> <em>Electron. Mater.</em> <b>2024</b>, <em>5</em>(4), 221-238; <a href="https://doi.org/10.3390/electronicmat5040015">https://doi.org/10.3390/electronicmat5040015</a> - 6 Oct 2024 </div> <div class="abstract-div"> <a href="#" onclick="$(this).next('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> <strong>Abstract </strong> </a> <div class="abstract-cropped inline"> Waste printed circuit boards (WPCBs) hold great recycling value, but improper recycling can lead to environmental issues. This study combines pyrolysis and microwave technologies, leveraging the unique phenomenon where metal materials tend to “spark” in a microwave field, to develop a microwave pyrolysis <a href="#" data-counterslink = "https://www.mdpi.com/2673-3978/5/4/15/more" onclick="$(this).parents('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> [...] Read more.</a> </div> <div class="abstract-full "> Waste printed circuit boards (WPCBs) hold great recycling value, but improper recycling can lead to environmental issues. This study combines pyrolysis and microwave technologies, leveraging the unique phenomenon where metal materials tend to “spark” in a microwave field, to develop a microwave pyrolysis process for WPCBs that incorporates metal fillers. The research analyzes the effects of microwave power, metal filler addition, and pyrolysis time on the efficiency of microwave pyrolysis. It explores the mechanisms of microwave pyrolysis and the pathways of pyrolysis product formation, and the kinetics of the pyrolysis reaction of WPCBs. The results indicate that microwave-assisted pyrolysis greatly improves efficiency. Within the experimental range, the optimal conditions are found to be a microwave power of 1600–1800 W, a metal filler addition of 10%, and a pyrolysis time of 10 min. Under these conditions, the yield of pyrolysis liquid was 12.8%, with approximately 5–12 different components, while the yield of pyrolysis gas was 12.7–13.4%, with about 9–11 different components. Compared to conventional pyrolysis products, the liquid products from microwave pyrolysis are simpler and more advantageous for resource utilization. Theoretical calculations show that the average activation energy for the microwave pyrolysis process is 81.05 kJ/mol, with an average reaction order of 0.93, which is greatly better than the 147.75 kJ/mol of the conventional pyrolysis process. <a href="/2673-3978/5/4/15">Full article</a> </div> </div> <a href="#" class="abstract-figures-show" data-counterslink = "https://www.mdpi.com/2673-3978/5/4/15/show" ><span >►</span><span style=" display: none;">▼</span> Show Figures </a><div class="abstract-image-preview "><div class="arrow left-arrow" id="prev1493217"><i class="fa fa-caret-left"></i></div><div class="arrow right-arrow" id="next1493217"><i class="fa fa-caret-right"></i></div><div class="absgraph cycle-slideshow manual" data-cycle-fx="scrollHorz" data-cycle-timeout="0" data-cycle-next="#next1493217" data-cycle-prev="#prev1493217" data-cycle-progressive="#images1493217" data-cycle-slides=">div" data-cycle-log="false"><div class='openpopupgallery cycle-slide' data-imgindex='0' data-target='article-1493217-popup'><span class="helper"></span><img src="data:image/gif;base64,R0lGODlhAQABAAD/ACwAAAAAAQABAAACADs=" data-src="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g001-550.jpg?1728211949" alt="" style="border: 0;"><p>Figure 1</p></div><script id="images1493217" type="text/cycle" data-cycle-split="---"><div class='openpopupgallery' data-imgindex='1' data-target='article-1493217-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g002-550.jpg?1728211949'><p>Figure 2</p></div> --- <div class='openpopupgallery' data-imgindex='2' data-target='article-1493217-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g003-550.jpg?1728211950'><p>Figure 3</p></div> --- <div class='openpopupgallery' data-imgindex='3' data-target='article-1493217-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g004-550.jpg?1728211951'><p>Figure 4</p></div> --- <div class='openpopupgallery' data-imgindex='4' data-target='article-1493217-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g005-550.jpg?1728211952'><p>Figure 5</p></div> --- <div class='openpopupgallery' data-imgindex='5' data-target='article-1493217-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g006-550.jpg?1728211953'><p>Figure 6</p></div> --- <div class='openpopupgallery' data-imgindex='6' data-target='article-1493217-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g007-550.jpg?1728211954'><p>Figure 7</p></div> --- <div class='openpopupgallery' data-imgindex='7' data-target='article-1493217-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g008-550.jpg?1728211955'><p>Figure 8</p></div> --- <div class='openpopupgallery' data-imgindex='8' data-target='article-1493217-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g009-550.jpg?1728211955'><p>Figure 9</p></div> --- <div class='openpopupgallery' data-imgindex='9' data-target='article-1493217-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g010-550.jpg?1728211956'><p>Figure 10</p></div> --- <div class='openpopupgallery' data-imgindex='10' data-target='article-1493217-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g011-550.jpg?1728211958'><p>Figure 11</p></div> --- <div class='openpopupgallery' data-imgindex='11' data-target='article-1493217-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g012-550.jpg?1728211960'><p>Figure 12</p></div> --- <div class='openpopupgallery' data-imgindex='12' data-target='article-1493217-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g013-550.jpg?1728211962'><p>Figure 13</p></div></script></div></div><div id="article-1493217-popup" class="popupgallery" style="display: inline; line-height: 200%"><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g001-550.jpg?1728211949" title=" <strong>Figure 1</strong><br/> <p>A rectangular multimode microwave cavity rotary reactor [<a href="#B24-electronicmat-05-00015" class="html-bibr">24</a>].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/15'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g002-550.jpg?1728211949" title=" <strong>Figure 2</strong><br/> <p>Microwave pyrolysis process sketch. 1. Nitrogen, 2. valve, 3. flowmeter, 4. corundum container, 5. WPCBs, 6. shielded thermocouples, 7. quartz tubes, 8. rotating tubular microwave pyrolysis reactor, 9. debromination packing, 10. condenser, 11. triangular bottles, and 12. gas tanks.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/15'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g003-550.jpg?1728211950" title=" <strong>Figure 3</strong><br/> <p>TG and DTG curves of thermal decomposition at different heating rates.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/15'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g004-550.jpg?1728211951" title=" <strong>Figure 4</strong><br/> <p>(<b>a</b>)<b>.</b> Plot of different microwave heating powers versus volatilization product temperatures and (<b>b</b>). plot of different microwave heating times versus volatilization product temperatures.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/15'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g005-550.jpg?1728211952" title=" <strong>Figure 5</strong><br/> <p>Photograph of microwave pyrolysis sparking with added metal fillers.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/15'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g006-550.jpg?1728211953" title=" <strong>Figure 6</strong><br/> <p>Pyrolysis rate versus metal filler additions.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/15'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g007-550.jpg?1728211954" title=" <strong>Figure 7</strong><br/> <p>(<b>a</b>). Microwave pyrolysis power versus pyrolysis rate, (<b>b</b>). microwave pyrolysis power versus PL yield, and (<b>c</b>). microwave pyrolysis power versus PG yield.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/15'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g008-550.jpg?1728211955" title=" <strong>Figure 8</strong><br/> <p>The main components of PG with different powers.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/15'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g009-550.jpg?1728211955" title=" <strong>Figure 9</strong><br/> <p>(<b>a</b>). Microwave pyrolysis time versus pyrolysis rate, (<b>b</b>). microwave pyrolysis time versus PL yield, and (<b>c</b>). microwave pyrolysis time versus PG yield.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/15'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g010-550.jpg?1728211956" title=" <strong>Figure 10</strong><br/> <p>Variation in higher gas content with different heating time yields.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/15'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g011-550.jpg?1728211958" title=" <strong>Figure 11</strong><br/> <p>(<b>a</b>). TG curves of microwave pyrolysis under different heating rate conditions, (<b>b</b>). DTG curves of microwave pyrolysis under different heating rate conditions, (<b>c</b>). Friedman plots of the microwave pyrolysis of discarded printed wiring boards, and (<b>d</b>). changes in the activation energy of microwave pyrolysis and the transformation of R<sup>2</sup>.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/15'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g012-550.jpg?1728211960" title=" <strong>Figure 12</strong><br/> <p>Determination of n of the microwave pyrolysis reaction and ln<span class="html-italic">A</span>: (<b>a</b>). 10 K/min, (<b>b</b>). 30 K/min, and (<b>c</b>). 50 K/min.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/15'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00015/article_deploy/html/images/electronicmat-05-00015-g013-550.jpg?1728211962" title=" <strong>Figure 13</strong><br/> <p>(<b>a</b>). TG curves of ordinary pyrolysis under different heating rate conditions, (<b>b</b>). DTG curves of ordinary pyrolysis under different heating rate conditions, (<b>c</b>). Friedman plot of the ordinary pyrolysis of discarded printed wiring boards, and (<b>d</b>). Friedman plot of the activation energy change in ordinary pyrolysis and the transformation of R<sup>2</sup>.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/15'>Full article</a></strong> "></a></div> </div> </div> </div> <div class="expanding-div collapsed"> <div class="generic-item article-item"> <div class="article-content"> <div class="label right label__btn"> <span style="font-size: 12px; color: #1a1a1a;"> 17 pages, 6901 KiB   </span> <a href="/2673-3978/5/4/14/pdf?version=1727771640" class="UD_Listings_ArticlePDF" title="Article PDF" data-name="Analysis of Power Modules Including Phase Change Materials in the Top Interconnection of Semiconductor Devices" data-journal="electronicmat"> <i class="material-icons custom-download"></i> </a> </div> <div class="article-icons"><span class="label openaccess" data-dropdown="drop-article-label-openaccess" aria-expanded="false">Open Access</span><span class="label articletype">Article</span></div> <a class="title-link" href="/2673-3978/5/4/14">Analysis of Power Modules Including Phase Change Materials in the Top Interconnection of Semiconductor Devices</a> <div class="authors"> by <span class="inlineblock "><strong>Rabih Khazaka</strong>, </span><span class="inlineblock "><strong>Rachelle Hanna</strong>, </span><span class="inlineblock "><strong>Yvan Avenas</strong> and </span><span class="inlineblock "><strong>Stephane Azzopardi</strong></span> </div> <div class="color-grey-dark"> <em>Electron. Mater.</em> <b>2024</b>, <em>5</em>(4), 204-220; <a href="https://doi.org/10.3390/electronicmat5040014">https://doi.org/10.3390/electronicmat5040014</a> - 1 Oct 2024 </div> <div class="abstract-div"> <a href="#" onclick="$(this).next('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> <strong>Abstract </strong> </a> <div class="abstract-cropped inline"> Power modules can occasionally be exposed to brief power peaks, causing overheating and premature failure of the power semiconductor devices. In order to overcome this issue without oversizing the module or its cooling system, this study aims to design a new class of <a href="#" data-counterslink = "https://www.mdpi.com/2673-3978/5/4/14/more" onclick="$(this).parents('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> [...] Read more.</a> </div> <div class="abstract-full "> Power modules can occasionally be exposed to brief power peaks, causing overheating and premature failure of the power semiconductor devices. In order to overcome this issue without oversizing the module or its cooling system, this study aims to design a new class of power modules with integrated Phase Change Material (PCM) in a container serving as a top device interconnection. Simulations and experiments are performed with two organic PCMs, and the interest in adding copper foam is discussed. Under various test conditions, the results show that the simulations agree well with the experiments. Hence, virtual prototyping can be very useful for sizing containers based on a specific mission profile. For a constant selected PCM volume (around 1 cm<sup>3</sup>/device) and with a convection heat transfer coefficient value of 800 W.m<sup>−2</sup>.K<sup>−1</sup>, the solution allows achieving a junction temperature reduction of about 35 °C (erythritol and 90% porosity copper foam) compared to a wire-bonded conventional technique. Repetitive power cycles can be achieved with both materials, but the selection of the PCM should be conducted cautiously based on the mission profile. The two selected organic PCMs show degradation of their latent heat of fusion and mass loss during high-temperature isothermal aging in air above 130 °C. By assuming as endpoint criterion the reduction of energy storage by 50% compared to the initial state, the lifetime of erythritol and RT100 is evaluated to be about 100 and 340 h, respectively, during aging at 150 °C. <a href="/2673-3978/5/4/14">Full article</a> </div> </div> <a href="#" class="abstract-figures-show" data-counterslink = "https://www.mdpi.com/2673-3978/5/4/14/show" ><span >►</span><span style=" display: none;">▼</span> Show Figures </a><div class="abstract-image-preview "><div class="arrow left-arrow" id="prev1490402"><i class="fa fa-caret-left"></i></div><div class="arrow right-arrow" id="next1490402"><i class="fa fa-caret-right"></i></div><div class="absgraph cycle-slideshow manual" data-cycle-fx="scrollHorz" data-cycle-timeout="0" data-cycle-next="#next1490402" data-cycle-prev="#prev1490402" data-cycle-progressive="#images1490402" data-cycle-slides=">div" data-cycle-log="false"><div class='openpopupgallery cycle-slide' data-imgindex='0' data-target='article-1490402-popup'><span class="helper"></span><img src="data:image/gif;base64,R0lGODlhAQABAAD/ACwAAAAAAQABAAACADs=" data-src="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g001-550.jpg?1727771772" alt="" style="border: 0;"><p>Figure 1</p></div><script id="images1490402" type="text/cycle" data-cycle-split="---"><div class='openpopupgallery' data-imgindex='1' data-target='article-1490402-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g002-550.jpg?1727771773'><p>Figure 2</p></div> --- <div class='openpopupgallery' data-imgindex='2' data-target='article-1490402-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g003-550.jpg?1727771774'><p>Figure 3</p></div> --- <div class='openpopupgallery' data-imgindex='3' data-target='article-1490402-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g004-550.jpg?1727771775'><p>Figure 4</p></div> --- <div class='openpopupgallery' data-imgindex='4' data-target='article-1490402-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g005-550.jpg?1727771776'><p>Figure 5</p></div> --- <div class='openpopupgallery' data-imgindex='5' data-target='article-1490402-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g006-550.jpg?1727771777'><p>Figure 6</p></div> --- <div class='openpopupgallery' data-imgindex='6' data-target='article-1490402-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g007-550.jpg?1727771778'><p>Figure 7</p></div> --- <div class='openpopupgallery' data-imgindex='7' data-target='article-1490402-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g008-550.jpg?1727771779'><p>Figure 8</p></div> --- <div class='openpopupgallery' data-imgindex='8' data-target='article-1490402-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g009-550.jpg?1727771780'><p>Figure 9</p></div> --- <div class='openpopupgallery' data-imgindex='9' data-target='article-1490402-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g010-550.jpg?1727771781'><p>Figure 10</p></div> --- <div class='openpopupgallery' data-imgindex='10' data-target='article-1490402-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g011-550.jpg?1727771782'><p>Figure 11</p></div> --- <div class='openpopupgallery' data-imgindex='11' data-target='article-1490402-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g012-550.jpg?1727771783'><p>Figure 12</p></div> --- <div class='openpopupgallery' data-imgindex='12' data-target='article-1490402-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g013-550.jpg?1727771783'><p>Figure 13</p></div> --- <div class='openpopupgallery' data-imgindex='13' data-target='article-1490402-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g014-550.jpg?1727771784'><p>Figure 14</p></div> --- <div class='openpopupgallery' data-imgindex='14' data-target='article-1490402-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g015-550.jpg?1727771785'><p>Figure 15</p></div></script></div></div><div id="article-1490402-popup" class="popupgallery" style="display: inline; line-height: 200%"><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g001-550.jpg?1727771772" title=" <strong>Figure 1</strong><br/> <p>(<b>a</b>) 3D schematic view of a phase-leg power module using the proposed solution. Two SiC MOSFETs are used for each switch. (<b>b</b>) Cross-section view showing 1 SiC MOSFET.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/14'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g002-550.jpg?1727771773" title=" <strong>Figure 2</strong><br/> <p>(<b>a</b>) Top view of the assembly and (<b>b</b>) the device under thermal testing.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/14'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g003-550.jpg?1727771774" title=" <strong>Figure 3</strong><br/> <p>3D view and cross-section view of the simulated geometry, including two MOSFETs in parallel.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/14'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g004-550.jpg?1727771775" title=" <strong>Figure 4</strong><br/> <p>DSC measurements during heating and cooling of RT100 (<b>a</b>) and erythritol (<b>b</b>) at a rate of 10 °C/min. The measured density and thermal conductivity used in the simulation are shown in the graphs.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/14'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g005-550.jpg?1727771776" title=" <strong>Figure 5</strong><br/> <p>(<b>a</b>) Simulated (lines) and measured (markers) <span class="html-italic">Tj</span> as a function of time for an empty container, a container filled with RT100, and a container filled with RT100 and Cu foam. (<b>b</b>) Calculated PCM melt volume ratio as a function of time for a container filled with RT100 and a container filled with RT100 and Cu foam.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/14'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g006-550.jpg?1727771777" title=" <strong>Figure 6</strong><br/> <p>(<b>a</b>) Images of the top of the container and simulated temperature of the PCM alone after 1 s, 30 s, 60 s and 120 s of power peak application. (<b>b</b>) Images of the top of the container and simulated temperature of the PCM with copper foam after 1 s, 5 s, 10 s and 30 s of power peak application.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/14'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g007-550.jpg?1727771778" title=" <strong>Figure 7</strong><br/> <p>Simulated (lines) and measured (markers) <span class="html-italic">Tj</span> as a function of time under two peak power values for containers with copper foam before and after filling with erythritol. The black line represents the simulated data for the wire-bonded conventional structure added for comparison.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/14'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g008-550.jpg?1727771779" title=" <strong>Figure 8</strong><br/> <p>(<b>a</b>) Power profiles applied during preliminary tests and (<b>b</b>) power profiles used for repetitive power cycling.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/14'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g009-550.jpg?1727771780" title=" <strong>Figure 9</strong><br/> <p>(<b>a</b>) Measured <span class="html-italic">Tj</span> as a function of time for different power cycles for RT100 with copper foam, and (<b>b</b>) measured <span class="html-italic">Tj</span> as a function of time during the heating phase for erythritol with copper foam.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/14'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g010-550.jpg?1727771781" title=" <strong>Figure 10</strong><br/> <p>DSC measurements before and after 100 h of isothermal aging at 130 °C, 140 °C, and 150 °C for RT100 (<b>a</b>) and erythritol (<b>b</b>).</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/14'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g011-550.jpg?1727771782" title=" <strong>Figure 11</strong><br/> <p>(<b>a</b>) Color change of tested PCMs after 100h of aging and (<b>b</b>) mass loss ratio at various aging temperatures.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/14'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g012-550.jpg?1727771783" title=" <strong>Figure 12</strong><br/> <p>ln(<span class="html-italic">L<sub>t</sub></span>/<span class="html-italic">L</span><sub>0</sub>) vs. aging time at various aging temperatures for RT100 (<b>a</b>) and erythritol (<b>b</b>).</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/14'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g013-550.jpg?1727771783" title=" <strong>Figure 13</strong><br/> <p>Arrhenius plot of the reaction rate constant for erythritol and RT100.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/14'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g014-550.jpg?1727771784" title=" <strong>Figure 14</strong><br/> <p>Calculated latent heat of fusion as a function of aging time at different temperatures between 130 °C and 160 °C for RT100 (<b>a</b>) and erythritol (<b>b</b>).·</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/14'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00014/article_deploy/html/images/electronicmat-05-00014-g015-550.jpg?1727771785" title=" <strong>Figure 15</strong><br/> <p>Calculated storage energy ratio as a function of aging time at 150 °C in air.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/14'>Full article</a></strong> "></a></div> </div> </div> </div> <div class="expanding-div collapsed"> <div class="generic-item article-item"> <div class="article-content"> <div class="label right label__btn"> <span style="font-size: 12px; color: #1a1a1a;"> 15 pages, 1347 KiB   </span> <a href="/2673-3978/5/4/13/pdf?version=1727351520" class="UD_Listings_ArticlePDF" title="Article PDF" data-name="Polymer Composites Containing Ionic Liquids: A Study of Electrical Conductivity" data-journal="electronicmat"> <i class="material-icons custom-download"></i> </a> </div> <div class="article-icons"><span class="label openaccess" data-dropdown="drop-article-label-openaccess" aria-expanded="false">Open Access</span><span class="label articletype">Review</span></div> <a class="title-link" href="/2673-3978/5/4/13">Polymer Composites Containing Ionic Liquids: A Study of Electrical Conductivity</a> <div class="authors"> by <span class="inlineblock "><strong>Ahmad Adlie Shamsuri</strong>, </span><span class="inlineblock "><strong>Siti Nurul Ain Md. Jamil</strong>, </span><span class="inlineblock "><strong>Mohd Zuhri Mohamed Yusoff</strong> and </span><span class="inlineblock "><strong>Khalina Abdan</strong></span> </div> <div class="color-grey-dark"> <em>Electron. Mater.</em> <b>2024</b>, <em>5</em>(4), 189-203; <a href="https://doi.org/10.3390/electronicmat5040013">https://doi.org/10.3390/electronicmat5040013</a> - 26 Sep 2024 </div> <div class="abstract-div"> <a href="#" onclick="$(this).next('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> <strong>Abstract </strong> </a> <div class="abstract-cropped inline"> Polymer composites are engineered materials that combine polymers with diverse fillers to enhance their physicochemical properties. The electrical conductivity of polymer composites is a vital characteristic that significantly broadens their use, particularly in electronic applications. The addition of ionic liquids into polymer composites <a href="#" data-counterslink = "https://www.mdpi.com/2673-3978/5/4/13/more" onclick="$(this).parents('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> [...] Read more.</a> </div> <div class="abstract-full "> Polymer composites are engineered materials that combine polymers with diverse fillers to enhance their physicochemical properties. The electrical conductivity of polymer composites is a vital characteristic that significantly broadens their use, particularly in electronic applications. The addition of ionic liquids into polymer composites represents a new method to enhance their functional properties, particularly in terms of electrical conductivity. In this brief review, several polymer matrices, conductive fillers, and ionic liquids utilized in polymer composites are categorized. Additionally, the effect of ionic liquids on the electrical conductivity of polymer composites is concisely explained. This review gives brief information that increases the understanding of electrical conductivity in polymer composites containing ionic liquids. In summary, most studies show that adding ionic liquids enhances the electrical conductivity of polymer composites regardless of the polymer matrix or conductive filler type. This enhancement is due to ionic liquids improving filler dispersion and promoting the creation of effective three-dimensional conductive networks within the matrix, thus boosting electron transport and mobility throughout the structure. This review provides new insights into the behavior of ionic liquids in composite systems, highlighting their role in improving properties for advanced applications. It encourages innovation in next-generation conductive materials and assists future research and development of more efficient materials for electronics. <a href="/2673-3978/5/4/13">Full article</a> </div> </div> <a href="#" class="abstract-figures-show" data-counterslink = "https://www.mdpi.com/2673-3978/5/4/13/show" ><span >►</span><span style=" display: none;">▼</span> Show Figures </a><div class="abstract-image-preview "><div class="arrow left-arrow" id="prev1486454"><i class="fa fa-caret-left"></i></div><div class="arrow right-arrow" id="next1486454"><i class="fa fa-caret-right"></i></div><div class="absgraph cycle-slideshow manual" data-cycle-fx="scrollHorz" data-cycle-timeout="0" data-cycle-next="#next1486454" data-cycle-prev="#prev1486454" data-cycle-progressive="#images1486454" data-cycle-slides=">div" data-cycle-log="false"><div class='openpopupgallery cycle-slide' data-imgindex='0' data-target='article-1486454-popup'><span class="helper"></span><img src="data:image/gif;base64,R0lGODlhAQABAAD/ACwAAAAAAQABAAACADs=" data-src="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00013/article_deploy/html/images/electronicmat-05-00013-g001-550.jpg?1727351640" alt="" style="border: 0;"><p>Figure 1</p></div><script id="images1486454" type="text/cycle" data-cycle-split="---"><div class='openpopupgallery' data-imgindex='1' data-target='article-1486454-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00013/article_deploy/html/images/electronicmat-05-00013-g002a-550.jpg?1727351642'><p>Figure 2</p></div> --- <div class='openpopupgallery' data-imgindex='2' data-target='article-1486454-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00013/article_deploy/html/images/electronicmat-05-00013-g002b-550.jpg?1727351644'><p>Figure 2 Cont.</p></div> --- <div class='openpopupgallery' data-imgindex='3' data-target='article-1486454-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00013/article_deploy/html/images/electronicmat-05-00013-g003a-550.jpg?1727351644'><p>Figure 3</p></div> --- <div class='openpopupgallery' data-imgindex='4' data-target='article-1486454-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00013/article_deploy/html/images/electronicmat-05-00013-g003b-550.jpg?1727351646'><p>Figure 3 Cont.</p></div> --- <div class='openpopupgallery' data-imgindex='5' data-target='article-1486454-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00013/article_deploy/html/images/electronicmat-05-00013-g004-550.jpg?1727351647'><p>Figure 4</p></div> --- <div class='openpopupgallery' data-imgindex='6' data-target='article-1486454-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00013/article_deploy/html/images/electronicmat-05-00013-g005-550.jpg?1727351648'><p>Figure 5</p></div></script></div></div><div id="article-1486454-popup" class="popupgallery" style="display: inline; line-height: 200%"><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00013/article_deploy/html/images/electronicmat-05-00013-g001-550.jpg?1727351640" title=" <strong>Figure 1</strong><br/> <p>Chemical structures of (<b>a</b>) PVDF, (<b>b</b>) PMMA, (<b>c</b>) PANI, (<b>d</b>) CR, and (<b>e</b>) SBR.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/13'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00013/article_deploy/html/images/electronicmat-05-00013-g002a-550.jpg?1727351642" title=" <strong>Figure 2</strong><br/> <p>Chemical structures of (<b>a</b>) MWCNTs, (<b>b</b>) Gra, and (<b>c</b>) GO.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/13'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00013/article_deploy/html/images/electronicmat-05-00013-g002b-550.jpg?1727351644" title=" <strong>Figure 2 Cont.</strong><br/> <p>Chemical structures of (<b>a</b>) MWCNTs, (<b>b</b>) Gra, and (<b>c</b>) GO.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/13'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00013/article_deploy/html/images/electronicmat-05-00013-g003a-550.jpg?1727351644" title=" <strong>Figure 3</strong><br/> <p>Chemical structures of (<b>a</b>) [C<sub>4</sub>mim][NTf<sub>2</sub>], (<b>b</b>) [C<sub>4</sub>mim][BF<sub>4</sub>], (<b>c</b>) [C<sub>4</sub>mim][PF<sub>6</sub>], (<b>d</b>) [P<sub>6,6,6,14</sub>][NTf<sub>2</sub>], and (<b>e</b>) [C<sub>4</sub>mpy][Br].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/13'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00013/article_deploy/html/images/electronicmat-05-00013-g003b-550.jpg?1727351646" title=" <strong>Figure 3 Cont.</strong><br/> <p>Chemical structures of (<b>a</b>) [C<sub>4</sub>mim][NTf<sub>2</sub>], (<b>b</b>) [C<sub>4</sub>mim][BF<sub>4</sub>], (<b>c</b>) [C<sub>4</sub>mim][PF<sub>6</sub>], (<b>d</b>) [P<sub>6,6,6,14</sub>][NTf<sub>2</sub>], and (<b>e</b>) [C<sub>4</sub>mpy][Br].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/13'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00013/article_deploy/html/images/electronicmat-05-00013-g004-550.jpg?1727351647" title=" <strong>Figure 4</strong><br/> <p>Schematic presentation showing the interaction between [Aemim][Br]-modified GO and the PVDF matrix. Reprinted from [<a href="#B24-electronicmat-05-00013" class="html-bibr">24</a>], with permission from Elsevier.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/13'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00013/article_deploy/html/images/electronicmat-05-00013-g005-550.jpg?1727351648" title=" <strong>Figure 5</strong><br/> <p>Schematic diagram showing the interactions between [Bzmim][Cl], SBR, and MWCNTs. Reprinted from [<a href="#B50-electronicmat-05-00013" class="html-bibr">50</a>], with permission from Elsevier.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/4/13'>Full article</a></strong> "></a></div> </div> </div> </div> <div class="expanding-div collapsed"> <div class="generic-item article-item"> <div class="article-content"> <div class="label right label__btn"> <span style="font-size: 12px; color: #1a1a1a;"> 23 pages, 5813 KiB   </span> <a href="/2673-3978/5/3/12/pdf?version=1726189250" class="UD_Listings_ArticlePDF" title="Article PDF" data-name="Raman Spectroscopy and Electrical Transport in 30Li2O• (67−x) B2O3•(x) SiO2•3Al2O3 Glasses" data-journal="electronicmat"> <i class="material-icons custom-download"></i> </a> </div> <div class="article-icons"><span class="label openaccess" data-dropdown="drop-article-label-openaccess" aria-expanded="false">Open Access</span><span class="label articletype">Article</span></div> <a class="title-link" href="/2673-3978/5/3/12">Raman Spectroscopy and Electrical Transport in 30Li<sub>2</sub>O• (67−<i>x</i>) B<sub>2</sub>O<sub>3</sub>•(<i>x</i>) SiO<sub>2</sub>•3Al<sub>2</sub>O<sub>3</sub> Glasses</a> <div class="authors"> by <span class="inlineblock "><strong>Amrit P. Kafle</strong>, </span><span class="inlineblock "><strong>David McKeown</strong>, </span><span class="inlineblock "><strong>Winnie Wong-Ng</strong>, </span><span class="inlineblock "><strong>Meznh Alsubaie</strong>, </span><span class="inlineblock "><strong>Manar Alenezi</strong>, </span><span class="inlineblock "><strong>Ian L. Pegg</strong> and </span><span class="inlineblock "><strong>Biprodas Dutta</strong></span> </div> <div class="color-grey-dark"> <em>Electron. Mater.</em> <b>2024</b>, <em>5</em>(3), 166-188; <a href="https://doi.org/10.3390/electronicmat5030012">https://doi.org/10.3390/electronicmat5030012</a> - 12 Sep 2024 </div> <div class="abstract-div"> <a href="#" onclick="$(this).next('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> <strong>Abstract </strong> </a> <div class="abstract-cropped inline"> We have investigated the influence of the relative proportions of glass formers in a series of lithium alumino-borosilicate glasses with respect to electrical conductivity (σ) and glass transition temperature (<i>T</i><sub>g</sub>) as functions of glass structure, as determined using Raman spectroscopy. <a href="#" data-counterslink = "https://www.mdpi.com/2673-3978/5/3/12/more" onclick="$(this).parents('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> [...] Read more.</a> </div> <div class="abstract-full "> We have investigated the influence of the relative proportions of glass formers in a series of lithium alumino-borosilicate glasses with respect to electrical conductivity (σ) and glass transition temperature (<i>T</i><sub>g</sub>) as functions of glass structure, as determined using Raman spectroscopy. The ternary lithium alumino-borate glass exhibits the highest <i>σ</i> and lowest <i>T</i><sub>g</sub> among all the compositions of the glass series, 30Li<sub>2</sub>O•3Al<sub>2</sub>O<sub>3</sub>• (67−<i>x</i>) B<sub>2</sub>O<sub>3</sub>•<i>x</i>SiO<sub>2</sub>. However, as B<sub>2</sub>O<sub>3</sub> is replaced by SiO<sub>2</sub>, a shallow minimum in <i>σ</i>, as well as a shallow maximum in <i>T</i><sub>g</sub>, are observed near <i>x</i> = 27, where the Raman spectra indicate that isolated diborate/tetraborate/orthoborate groups are being progressively replaced by danburite/reedmergnerite-like borosilicate network units. Overall, as the glasses become silica-rich, <i>σ</i> is minimized, while <i>T</i><sub>g</sub> is maximized. In general, these findings show correlations among <i>T</i><sub>g</sub> (sensitive to network polymerization), <i>σ</i> (proportional to ionic mobility), and the different borate and silicate glass structural units as determined using Raman spectroscopy. <a href="/2673-3978/5/3/12">Full article</a> </div> </div> <a href="#" class="abstract-figures-show" data-counterslink = "https://www.mdpi.com/2673-3978/5/3/12/show" ><span >►</span><span style=" display: none;">▼</span> Show Figures </a><div class="abstract-image-preview "><div class="arrow left-arrow" id="prev1476753"><i class="fa fa-caret-left"></i></div><div class="arrow right-arrow" id="next1476753"><i class="fa fa-caret-right"></i></div><div class="absgraph cycle-slideshow manual" data-cycle-fx="scrollHorz" data-cycle-timeout="0" data-cycle-next="#next1476753" data-cycle-prev="#prev1476753" data-cycle-progressive="#images1476753" data-cycle-slides=">div" data-cycle-log="false"><div class='openpopupgallery cycle-slide' data-imgindex='0' data-target='article-1476753-popup'><span class="helper"></span><img src="data:image/gif;base64,R0lGODlhAQABAAD/ACwAAAAAAQABAAACADs=" data-src="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g001-550.jpg?1726189344" alt="" style="border: 0;"><p>Figure 1</p></div><script id="images1476753" type="text/cycle" data-cycle-split="---"><div class='openpopupgallery' data-imgindex='1' data-target='article-1476753-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g002-550.jpg?1726189347'><p>Figure 2</p></div> --- <div class='openpopupgallery' data-imgindex='2' data-target='article-1476753-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g003-550.jpg?1726189348'><p>Figure 3</p></div> --- <div class='openpopupgallery' data-imgindex='3' data-target='article-1476753-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g004-550.jpg?1726189349'><p>Figure 4</p></div> --- <div class='openpopupgallery' data-imgindex='4' data-target='article-1476753-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g005-550.jpg?1726189350'><p>Figure 5</p></div> --- <div class='openpopupgallery' data-imgindex='5' data-target='article-1476753-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g006-550.jpg?1726189351'><p>Figure 6</p></div> --- <div class='openpopupgallery' data-imgindex='6' data-target='article-1476753-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g007-550.jpg?1726189354'><p>Figure 7</p></div> --- <div class='openpopupgallery' data-imgindex='7' data-target='article-1476753-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g008-550.jpg?1726189357'><p>Figure 8</p></div> --- <div class='openpopupgallery' data-imgindex='8' data-target='article-1476753-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g009-550.jpg?1726189359'><p>Figure 9</p></div> --- <div class='openpopupgallery' data-imgindex='9' data-target='article-1476753-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g010-550.jpg?1726189361'><p>Figure 10</p></div> --- <div class='openpopupgallery' data-imgindex='10' data-target='article-1476753-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g011-550.jpg?1726189362'><p>Figure 11</p></div> --- <div class='openpopupgallery' data-imgindex='11' data-target='article-1476753-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g012-550.jpg?1726189363'><p>Figure 12</p></div></script></div></div><div id="article-1476753-popup" class="popupgallery" style="display: inline; line-height: 200%"><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g001-550.jpg?1726189344" title=" <strong>Figure 1</strong><br/> <p>Li<sub>2</sub>O-B<sub>2</sub>O<sub>3</sub>-SiO<sub>2</sub> ternary diagram with the LABS series glass compositions (green squares on red line), with some R (pink) and K (blue) ratio values displayed.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/12'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g002-550.jpg?1726189347" title=" <strong>Figure 2</strong><br/> <p>DTA plots, arrow showing <span class="html-italic">T</span><sub>g</sub>, for some glasses of the series. Endothermic changes are shown as a drop in heat flow.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/12'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g003-550.jpg?1726189348" title=" <strong>Figure 3</strong><br/> <p>Electrical conductivity (as log σ) with respect to LABS glass compositions, with guiding lines to aid visualization.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/12'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g004-550.jpg?1726189349" title=" <strong>Figure 4</strong><br/> <p>Arrhenius plots with error bars showing variation in log σ in S/cm, expressed as units of electrical conductivity, along with the inverse of temperature in K<sup>−1</sup> (legends are based on in the order of decrease in conductivity from top to bottom, not on composition across the glass series).</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/12'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g005-550.jpg?1726189350" title=" <strong>Figure 5</strong><br/> <p>Glass transition temperature (<span class="html-italic">T</span><sub>g</sub>) and activation energy from 50 °C to 170 °C with respect to glass composition.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/12'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g006-550.jpg?1726189351" title=" <strong>Figure 6</strong><br/> <p>Parallel polarized reduced Raman spectra for the glass series. Plots are offset for clarity.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/12'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g007-550.jpg?1726189354" title=" <strong>Figure 7</strong><br/> <p>(<b>a</b>) Simple polyborate species, (<b>b</b>) complex polyborate species, (<b>c</b>) silicate species, and (<b>d</b>) borosilicate species.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/12'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g008-550.jpg?1726189357" title=" <strong>Figure 8</strong><br/> <p>(<b>a</b>) Parallel polarized (blue) and cross-polarized (red) reduced Raman spectra for 67B glass. Some vibrational assignments with corresponding structural units are indicated. (<b>b</b>) Parallel polarized Raman spectrum of 67B glass and associated Gaussian component fit by the program IGOR [<a href="#B65-electronicmat-05-00012" class="html-bibr">65</a>]. The data are black points, the fitted individual Gaussian components are plotted in blue, and the sum of all Gaussian-fitted components are plotted in red. Residual intensities are the differences between observed data and the sum of the Gaussian components. Structural unit assignments are indicated for some of the major fitted Gaussian components.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/12'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g009-550.jpg?1726189359" title=" <strong>Figure 9</strong><br/> <p>(<b>a</b>) Parallel polarized (blue) and cross-polarized (red) reduced Raman spectra of 30B37Si glass. Some vibrational assignments with corresponding structural units are indicated. (<b>b</b>) Parallel polarized Raman spectrum of 30B37Si glass and associated Gaussian component fit by the program IGOR [<a href="#B65-electronicmat-05-00012" class="html-bibr">65</a>]. Conventions from <a href="#electronicmat-05-00012-f008" class="html-fig">Figure 8</a>b are followed.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/12'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g010-550.jpg?1726189361" title=" <strong>Figure 10</strong><br/> <p>(<b>a</b>) Parallel polarized (blue) and cross-polarized (red) reduced Raman spectra of 67Si glass. Some vibrational assignments with corresponding structural units are indicated. (<b>b</b>) Parallel polarized Raman spectrum of 67Si glass and associated Gaussian component fit by the program IGOR [<a href="#B65-electronicmat-05-00012" class="html-bibr">65</a>]. Conventions from <a href="#electronicmat-05-00012-f008" class="html-fig">Figure 8</a>b are followed.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/12'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g011-550.jpg?1726189362" title=" <strong>Figure 11</strong><br/> <p>Major Gaussian component areas versus glass composition for important Raman spectral features. Danburite ring assignments are indicated for 30B37Si and 20B47Si glasses only. Each plotted Gaussian component is labeled with its corresponding glass structural unit assignment.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/12'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00012/article_deploy/html/images/electronicmat-05-00012-g012-550.jpg?1726189363" title=" <strong>Figure 12</strong><br/> <p>Parallel polarized reduced Raman spectra of 67B, 30B37Si, and 67Si glass with major structural unit assignments.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/12'>Full article</a></strong> "></a></div> </div> </div> </div> <div class="expanding-div collapsed"> <div class="generic-item article-item"> <div class="article-content"> <div class="label right label__btn"> <span style="font-size: 12px; color: #1a1a1a;"> 6 pages, 1103 KiB   </span> <a href="/2673-3978/5/3/11/pdf?version=1724417501" class="UD_Listings_ArticlePDF" title="Article PDF" data-name="Inkjet Printing of a Gate Insulator: Towards Fully Printable Organic Field Effect Transistor" data-journal="electronicmat"> <i class="material-icons custom-download"></i> </a> </div> <div class="article-icons"><span class="label openaccess" data-dropdown="drop-article-label-openaccess" aria-expanded="false">Open Access</span><span class="label articletype">Article</span></div> <a class="title-link" href="/2673-3978/5/3/11">Inkjet Printing of a Gate Insulator: Towards Fully Printable Organic Field Effect Transistor</a> <div class="authors"> by <span class="inlineblock "><strong>Huiwen Bai</strong>, </span><span class="inlineblock "><strong>Richard M. Voyles</strong> and </span><span class="inlineblock "><strong>Robert A. Nawrocki</strong></span> </div> <div class="color-grey-dark"> <em>Electron. Mater.</em> <b>2024</b>, <em>5</em>(3), 160-165; <a href="https://doi.org/10.3390/electronicmat5030011">https://doi.org/10.3390/electronicmat5030011</a> - 23 Aug 2024 </div> <a href="/2673-3978/5/3/11#metrics">Cited by 2</a> <div class="abstract-div"> <a href="#" onclick="$(this).next('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> <strong>Abstract </strong> </a> <div class="abstract-cropped inline"> In this work, a gate insulator poly (4-vinylphenol) (PVP) of an organic field effect transistor (OFET) was deposited using an inkjet printing technique, realized via a high printing resolution. Various parameters, including the molecular weight of PVP, printing direction, printing voltage, and drop <a href="#" data-counterslink = "https://www.mdpi.com/2673-3978/5/3/11/more" onclick="$(this).parents('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> [...] Read more.</a> </div> <div class="abstract-full "> In this work, a gate insulator poly (4-vinylphenol) (PVP) of an organic field effect transistor (OFET) was deposited using an inkjet printing technique, realized via a high printing resolution. Various parameters, including the molecular weight of PVP, printing direction, printing voltage, and drop frequency, were investigated to optimize OFET performance. Consequently, PVP with a smaller molecular weight of 11 k and a printing direction parallel to the channel, a printing voltage of 18 V, and a drop frequency of 10 kHz showed the best OFET performance. With a direct ink writing-printed organic semiconductor, this work paves the way for fully inkjet-printed OFETs. <a href="/2673-3978/5/3/11">Full article</a> </div> </div> <a href="#" class="abstract-figures-show" data-counterslink = "https://www.mdpi.com/2673-3978/5/3/11/show" ><span >►</span><span style=" display: none;">▼</span> Show Figures </a><div class="abstract-image-preview "><div class="arrow left-arrow" id="prev1462738"><i class="fa fa-caret-left"></i></div><div class="arrow right-arrow" id="next1462738"><i class="fa fa-caret-right"></i></div><div class="absgraph cycle-slideshow manual" data-cycle-fx="scrollHorz" data-cycle-timeout="0" data-cycle-next="#next1462738" data-cycle-prev="#prev1462738" data-cycle-progressive="#images1462738" data-cycle-slides=">div" data-cycle-log="false"><div class='openpopupgallery cycle-slide' data-imgindex='0' data-target='article-1462738-popup'><span class="helper"></span><img src="data:image/gif;base64,R0lGODlhAQABAAD/ACwAAAAAAQABAAACADs=" data-src="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00011/article_deploy/html/images/electronicmat-05-00011-g001-550.jpg?1724417607" alt="" style="border: 0;"><p>Figure 1</p></div><script id="images1462738" type="text/cycle" data-cycle-split="---"><div class='openpopupgallery' data-imgindex='1' data-target='article-1462738-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00011/article_deploy/html/images/electronicmat-05-00011-g002-550.jpg?1724417608'><p>Figure 2</p></div> --- <div class='openpopupgallery' data-imgindex='2' data-target='article-1462738-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00011/article_deploy/html/images/electronicmat-05-00011-g003-550.jpg?1724417609'><p>Figure 3</p></div> --- <div class='openpopupgallery' data-imgindex='3' data-target='article-1462738-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00011/article_deploy/html/images/electronicmat-05-00011-g004-550.jpg?1724417611'><p>Figure 4</p></div></script></div></div><div id="article-1462738-popup" class="popupgallery" style="display: inline; line-height: 200%"><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00011/article_deploy/html/images/electronicmat-05-00011-g001-550.jpg?1724417607" title=" <strong>Figure 1</strong><br/> <p>The schematic of an OFET. Dielectric PVP was inkjet printed, while semiconducting TIPS-pentacene was DIW printed and all of the electrodes were thermally evaporated.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/11'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00011/article_deploy/html/images/electronicmat-05-00011-g002-550.jpg?1724417608" title=" <strong>Figure 2</strong><br/> <p>(<b>a</b>) The leakage current and (<b>b</b>) transfer curves of the OFETs with PVP with different molecular weights.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/11'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00011/article_deploy/html/images/electronicmat-05-00011-g003-550.jpg?1724417609" title=" <strong>Figure 3</strong><br/> <p>The transfer function of OFETs with PVP inkjet printed with (<b>a</b>) different printing directions and (<b>b</b>) printing voltages.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/11'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00011/article_deploy/html/images/electronicmat-05-00011-g004-550.jpg?1724417611" title=" <strong>Figure 4</strong><br/> <p>The transfer function of OFETs with PVP inkjet printed with different drop frequencies.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/11'>Full article</a></strong> "></a></div> </div> </div> </div> <div class="expanding-div collapsed"> <div class="generic-item article-item"> <div class="article-content"> <div class="label right label__btn"> <span style="font-size: 12px; color: #1a1a1a;"> 15 pages, 5252 KiB   </span> <a href="/2673-3978/5/3/10/pdf?version=1723710526" class="UD_Listings_ArticlePDF" title="Article PDF" data-name="C60/CZTS Junction Combination to Improve the Efficiency of CZTS-Based Heterostructure Solar Cells: A Numerical Approach" data-journal="electronicmat"> <i class="material-icons custom-download"></i> </a> </div> <div class="article-icons"><span class="label openaccess" data-dropdown="drop-article-label-openaccess" aria-expanded="false">Open Access</span><span class="label articletype">Article</span></div> <a class="title-link" href="/2673-3978/5/3/10">C<sub>60</sub>/CZTS Junction Combination to Improve the Efficiency of CZTS-Based Heterostructure Solar Cells: A Numerical Approach</a> <div class="authors"> by <span class="inlineblock "><strong>Jobair Al Rafi</strong>, </span><span class="inlineblock "><strong>Md. Ariful Islam</strong>, </span><span class="inlineblock "><strong>Sayed Mahmud</strong>, </span><span class="inlineblock "><strong>Mitsuhiro Honda</strong>, </span><span class="inlineblock "><strong>Yo Ichikawa</strong> and </span><span class="inlineblock "><strong>Muhammad Athar Uddin</strong></span> </div> <div class="color-grey-dark"> <em>Electron. Mater.</em> <b>2024</b>, <em>5</em>(3), 145-159; <a href="https://doi.org/10.3390/electronicmat5030010">https://doi.org/10.3390/electronicmat5030010</a> - 15 Aug 2024 </div> <div class="abstract-div"> <a href="#" onclick="$(this).next('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> <strong>Abstract </strong> </a> <div class="abstract-cropped inline"> This work presents a copper zinc tin sulfide (CZTS)-based solar cell structure (AI/ITO/C<sub>60</sub>/CZTS/SnS/Pt) with C<sub>60</sub> as a buffer layer, developed using the SCAPS-1D simulator by optimizing each parameter to calculate the output. Optimizing the parameters, the acceptor concentration and thickness <a href="#" data-counterslink = "https://www.mdpi.com/2673-3978/5/3/10/more" onclick="$(this).parents('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> [...] Read more.</a> </div> <div class="abstract-full "> This work presents a copper zinc tin sulfide (CZTS)-based solar cell structure (AI/ITO/C<sub>60</sub>/CZTS/SnS/Pt) with C<sub>60</sub> as a buffer layer, developed using the SCAPS-1D simulator by optimizing each parameter to calculate the output. Optimizing the parameters, the acceptor concentration and thickness were altered from 6.0 × 10<sup>15</sup> cm<sup>−3</sup> to 6.0 × 10<sup>18</sup> cm<sup>−3</sup> and 1500 nm to 3000 nm, respectively. Although, in this simulator, we can tune the value for the acceptor concentration to 6.0 × 10<sup>22</sup>, higher doping might present an issue regarding adjustment in the physical experiment. Thus, tunable parameters need to be chosen according to the reliability of the experimental work. The defect density varied from 1.0 × 10<sup>14</sup> cm<sup>−3</sup> to 1.0 × 10<sup>17</sup> cm<sup>−3</sup> and the auger hole/electron capture coefficient was determined to be 1.0 × 10<sup>−26</sup> cm<sup>6</sup> s<sup>−1</sup> for the maintenance of the minorities in theoretical to quasi-proper experimental measurements. Although the temperature was intended to be kept near room temperature, this parameter was varied from 290 K to 475 K to investigate the effects of the temperature on this cell. The optimization of the proposed structure resulted in a final acceptor concentration of 6.0 × 10<sup>18</sup> cm<sup>−3</sup> and a thickness of 3000 nm at a defect density of 1.0 × 10<sup>15</sup> cm<sup>−3</sup>, which will help to satisfy the desired experimental performance. Satisfactory outcomes (V<sub>OC</sub> = 1.24 V, J<sub>SC</sub> = 27.03 mA/cm<sup>2</sup>, FF = 89.96%, η = 30.18%) were found compared to the previous analysis. <a href="/2673-3978/5/3/10">Full article</a> </div> </div> <a href="#" class="abstract-figures-show" data-counterslink = "https://www.mdpi.com/2673-3978/5/3/10/show" ><span >►</span><span style=" display: none;">▼</span> Show Figures </a><div class="abstract-image-preview "><div class="arrow left-arrow" id="prev1456777"><i class="fa fa-caret-left"></i></div><div class="arrow right-arrow" id="next1456777"><i class="fa fa-caret-right"></i></div><div class="absgraph cycle-slideshow manual" data-cycle-fx="scrollHorz" data-cycle-timeout="0" data-cycle-next="#next1456777" data-cycle-prev="#prev1456777" data-cycle-progressive="#images1456777" data-cycle-slides=">div" data-cycle-log="false"><div class='openpopupgallery cycle-slide' data-imgindex='0' data-target='article-1456777-popup'><span class="helper"></span><img src="data:image/gif;base64,R0lGODlhAQABAAD/ACwAAAAAAQABAAACADs=" data-src="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00010/article_deploy/html/images/electronicmat-05-00010-g001-550.jpg?1723710591" alt="" style="border: 0;"><p>Figure 1</p></div><script id="images1456777" type="text/cycle" data-cycle-split="---"><div class='openpopupgallery' data-imgindex='1' data-target='article-1456777-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00010/article_deploy/html/images/electronicmat-05-00010-g002-550.jpg?1723710591'><p>Figure 2</p></div> --- <div class='openpopupgallery' data-imgindex='2' data-target='article-1456777-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00010/article_deploy/html/images/electronicmat-05-00010-g003-550.jpg?1723710594'><p>Figure 3</p></div> --- <div class='openpopupgallery' data-imgindex='3' data-target='article-1456777-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00010/article_deploy/html/images/electronicmat-05-00010-g004-550.jpg?1723710595'><p>Figure 4</p></div> --- <div class='openpopupgallery' data-imgindex='4' data-target='article-1456777-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00010/article_deploy/html/images/electronicmat-05-00010-g005-550.jpg?1723710598'><p>Figure 5</p></div> --- <div class='openpopupgallery' data-imgindex='5' data-target='article-1456777-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00010/article_deploy/html/images/electronicmat-05-00010-g006-550.jpg?1723710601'><p>Figure 6</p></div> --- <div class='openpopupgallery' data-imgindex='6' data-target='article-1456777-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00010/article_deploy/html/images/electronicmat-05-00010-g007-550.jpg?1723710603'><p>Figure 7</p></div> --- <div class='openpopupgallery' data-imgindex='7' data-target='article-1456777-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00010/article_deploy/html/images/electronicmat-05-00010-g008-550.jpg?1723710604'><p>Figure 8</p></div> --- <div class='openpopupgallery' data-imgindex='8' data-target='article-1456777-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00010/article_deploy/html/images/electronicmat-05-00010-g009-550.jpg?1723710605'><p>Figure 9</p></div> --- <div class='openpopupgallery' data-imgindex='9' data-target='article-1456777-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00010/article_deploy/html/images/electronicmat-05-00010-g010-550.jpg?1723710606'><p>Figure 10</p></div></script></div></div><div id="article-1456777-popup" class="popupgallery" style="display: inline; line-height: 200%"><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00010/article_deploy/html/images/electronicmat-05-00010-g001-550.jpg?1723710591" title=" <strong>Figure 1</strong><br/> <p>Structural model of the proposed solar cell device (Al/ITO/C<sub>60</sub>/CZTS/SnS/Pt).</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/10'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00010/article_deploy/html/images/electronicmat-05-00010-g002-550.jpg?1723710591" title=" <strong>Figure 2</strong><br/> <p>Energy band diagram of the proposed heterostructure cell—ITO/C<sub>60</sub>/CZTS/SnS.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/10'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00010/article_deploy/html/images/electronicmat-05-00010-g003-550.jpg?1723710594" title=" <strong>Figure 3</strong><br/> <p>Simultaneous implications of acceptor concentration and thickness of absorber layer on performance ((<b>a</b>) V<sub>OC</sub>, (<b>b</b>) J<sub>SC</sub>, (<b>c</b>) FF, and (<b>d</b>) %η) of CZTS-based solar cell.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/10'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00010/article_deploy/html/images/electronicmat-05-00010-g004-550.jpg?1723710595" title=" <strong>Figure 4</strong><br/> <p>Normalized values of solar cell output parameters as a function of (<b>a</b>) acceptor concentration and (<b>b</b>) thickness.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/10'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00010/article_deploy/html/images/electronicmat-05-00010-g005-550.jpg?1723710598" title=" <strong>Figure 5</strong><br/> <p>Impact of defect density and absorber layer thickness on PV performance parameters ((<b>a</b>) V<sub>OC</sub>, (<b>b</b>) J<sub>SC</sub>, (<b>c</b>) FF, and (<b>d</b>) %η) of CZTS-based solar cell.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/10'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00010/article_deploy/html/images/electronicmat-05-00010-g006-550.jpg?1723710601" title=" <strong>Figure 6</strong><br/> <p>Impact of (<b>a</b>) series and (<b>b</b>) shunt resistance on PV performance (V<sub>OC</sub>, J<sub>SC</sub>, FF, and PCE).</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/10'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00010/article_deploy/html/images/electronicmat-05-00010-g007-550.jpg?1723710603" title=" <strong>Figure 7</strong><br/> <p>Effect of temperature on solar cell performance parameters: (<b>a</b>) open-circuit voltage (V<sub>OC</sub>), (<b>b</b>) short-circuit current (J<sub>SC</sub>), (<b>c</b>) fill factor (FF), and (<b>d</b>) efficiency (η%).</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/10'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00010/article_deploy/html/images/electronicmat-05-00010-g008-550.jpg?1723710604" title=" <strong>Figure 8</strong><br/> <p>(<b>a</b>) Capacitance (C) and (<b>b</b>) Mott–Schottky (1/C<sup>2</sup>) plot for the proposed structure.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/10'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00010/article_deploy/html/images/electronicmat-05-00010-g009-550.jpg?1723710605" title=" <strong>Figure 9</strong><br/> <p>(<b>a</b>) Generation rate and (<b>b</b>) recombination rate for the proposed structure.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/10'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00010/article_deploy/html/images/electronicmat-05-00010-g010-550.jpg?1723710606" title=" <strong>Figure 10</strong><br/> <p>(<b>a</b>) J–V characteristics and (<b>b</b>) quantum efficiency (QE) plot of the proposed structure.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/10'>Full article</a></strong> "></a></div> </div> </div> </div> <div class="expanding-div collapsed"> <div class="generic-item article-item"> <div class="article-content"> <div class="label right label__btn"> <span style="font-size: 12px; color: #1a1a1a;"> 13 pages, 6772 KiB   </span> <a href="/2673-3978/5/3/9/pdf?version=1721743906" class="UD_Listings_ArticlePDF" title="Article PDF" data-name="Alternative Measurement Approach for the Evaluation of Hot-Electron Degradation in p-GaN Gate AlGaN/GaN Power HEMTs" data-journal="electronicmat"> <i class="material-icons custom-download"></i> </a> </div> <div class="article-icons"><span class="label openaccess" data-dropdown="drop-article-label-openaccess" aria-expanded="false">Open Access</span><span class="label articletype">Article</span></div> <a class="title-link" href="/2673-3978/5/3/9">Alternative Measurement Approach for the Evaluation of Hot-Electron Degradation in p-GaN Gate AlGaN/GaN Power HEMTs</a> <div class="authors"> by <span class="inlineblock "><strong>Marcello Cioni</strong>, </span><span class="inlineblock "><strong>Giovanni Giorgino</strong>, </span><span class="inlineblock "><strong>Alessandro Chini</strong>, </span><span class="inlineblock "><strong>Antonino Parisi</strong>, </span><span class="inlineblock "><strong>Giacomo Cappellini</strong>, </span><span class="inlineblock "><strong>Cristina Miccoli</strong>, </span><span class="inlineblock "><strong>Maria Eloisa Castagna</strong>, </span><span class="inlineblock "><strong>Cristina Tringali</strong> and </span><span class="inlineblock "><strong>Ferdinando Iucolano</strong></span> </div> <div class="color-grey-dark"> <em>Electron. Mater.</em> <b>2024</b>, <em>5</em>(3), 132-144; <a href="https://doi.org/10.3390/electronicmat5030009">https://doi.org/10.3390/electronicmat5030009</a> - 23 Jul 2024 </div> <a href="/2673-3978/5/3/9#metrics">Cited by 1</a> <div class="abstract-div"> <a href="#" onclick="$(this).next('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> <strong>Abstract </strong> </a> <div class="abstract-cropped inline"> In this paper, a new method for evaluating hot-electron degradation in p-GaN gate AlGaN/GaN power HEMTs is proposed. The method exploits a commercial parameter analyzer to study V<sub>TH</sub> and R<sub>ON</sub> drifts induced by on-state stress at V<sub>DS</sub> = 50 V. <a href="#" data-counterslink = "https://www.mdpi.com/2673-3978/5/3/9/more" onclick="$(this).parents('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> [...] Read more.</a> </div> <div class="abstract-full "> In this paper, a new method for evaluating hot-electron degradation in p-GaN gate AlGaN/GaN power HEMTs is proposed. The method exploits a commercial parameter analyzer to study V<sub>TH</sub> and R<sub>ON</sub> drifts induced by on-state stress at V<sub>DS</sub> = 50 V. The results show that V<sub>TH</sub> drift and part of the R<sub>ON</sub> degradation induced by the on-state stress are recoverable and likely due to the ionization of C-related acceptors in the buffer. This was confirmed by a preliminary characterization of C-related buffer traps. Conversely, the remaining part of R<sub>ON</sub> degradation (not recovered in 1000 s) was strongly affected by the surface treatment. The current level set during on-state stress affected the amount of non-recoverable degradation, confirming the involvement of hot electrons. Thanks to the monitoring of the parameters’ recovery, the proposed method provides important insights into the physical mechanisms governing the parameters’ degradation. This extends the capabilities of state-of-the art systems, without the need for custom setup development. <a href="/2673-3978/5/3/9">Full article</a> </div> </div> <a href="#" class="abstract-figures-show" data-counterslink = "https://www.mdpi.com/2673-3978/5/3/9/show" ><span >►</span><span style=" display: none;">▼</span> Show Figures </a><div class="abstract-image-preview "><div class="arrow left-arrow" id="prev1441191"><i class="fa fa-caret-left"></i></div><div class="arrow right-arrow" id="next1441191"><i class="fa fa-caret-right"></i></div><div class="absgraph cycle-slideshow manual" data-cycle-fx="scrollHorz" data-cycle-timeout="0" data-cycle-next="#next1441191" data-cycle-prev="#prev1441191" data-cycle-progressive="#images1441191" data-cycle-slides=">div" data-cycle-log="false"><div class='openpopupgallery cycle-slide' data-imgindex='0' data-target='article-1441191-popup'><span class="helper"></span><img src="data:image/gif;base64,R0lGODlhAQABAAD/ACwAAAAAAQABAAACADs=" data-src="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g001-550.jpg?1721743976" alt="" style="border: 0;"><p>Figure 1</p></div><script id="images1441191" type="text/cycle" data-cycle-split="---"><div class='openpopupgallery' data-imgindex='1' data-target='article-1441191-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g002-550.jpg?1721743976'><p>Figure 2</p></div> --- <div class='openpopupgallery' data-imgindex='2' data-target='article-1441191-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g003-550.jpg?1721743977'><p>Figure 3</p></div> --- <div class='openpopupgallery' data-imgindex='3' data-target='article-1441191-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g004-550.jpg?1721743977'><p>Figure 4</p></div> --- <div class='openpopupgallery' data-imgindex='4' data-target='article-1441191-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g005-550.jpg?1721743978'><p>Figure 5</p></div> --- <div class='openpopupgallery' data-imgindex='5' data-target='article-1441191-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g006-550.jpg?1721743979'><p>Figure 6</p></div> --- <div class='openpopupgallery' data-imgindex='6' data-target='article-1441191-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g007-550.jpg?1721743979'><p>Figure 7</p></div> --- <div class='openpopupgallery' data-imgindex='7' data-target='article-1441191-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g008-550.jpg?1721743980'><p>Figure 8</p></div> --- <div class='openpopupgallery' data-imgindex='8' data-target='article-1441191-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g009-550.jpg?1721743980'><p>Figure 9</p></div> --- <div class='openpopupgallery' data-imgindex='9' data-target='article-1441191-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g010-550.jpg?1721743982'><p>Figure 10</p></div> --- <div class='openpopupgallery' data-imgindex='10' data-target='article-1441191-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g011-550.jpg?1721743983'><p>Figure 11</p></div> --- <div class='openpopupgallery' data-imgindex='11' data-target='article-1441191-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g012-550.jpg?1721743984'><p>Figure 12</p></div> --- <div class='openpopupgallery' data-imgindex='12' data-target='article-1441191-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g013-550.jpg?1721743984'><p>Figure 13</p></div> --- <div class='openpopupgallery' data-imgindex='13' data-target='article-1441191-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g014-550.jpg?1721743985'><p>Figure 14</p></div> --- <div class='openpopupgallery' data-imgindex='14' data-target='article-1441191-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g015-550.jpg?1721743986'><p>Figure 15</p></div> --- <div class='openpopupgallery' data-imgindex='15' data-target='article-1441191-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g016-550.jpg?1721743987'><p>Figure 16</p></div> --- <div class='openpopupgallery' data-imgindex='16' data-target='article-1441191-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g017-550.jpg?1721743987'><p>Figure 17</p></div></script></div></div><div id="article-1441191-popup" class="popupgallery" style="display: inline; line-height: 200%"><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g001-550.jpg?1721743976" title=" <strong>Figure 1</strong><br/> <p>Schematic cross section of the tested devices.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/9'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g002-550.jpg?1721743976" title=" <strong>Figure 2</strong><br/> <p>Test sequence employed to study the mechanism responsible for current collapse under off-state stress: a 1000 s stress is performed with V<sub>DS,off</sub> = 25 V and V<sub>GS,off</sub> = 0 V to induce current collapse; the consequent I<sub>D</sub>/I<sub>D0</sub> is monitored for 1000 s with V<sub>DS,recovery</sub> = 0.5 V and V<sub>GS,recovery</sub> = 6 V.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/9'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g003-550.jpg?1721743977" title=" <strong>Figure 3</strong><br/> <p>Typical I<sub>D</sub>/I<sub>D0</sub> recovery transients acquired on Type A device after 1000 s stress at different temperatures (30 °C, 50 °C, 70 °C, 90 °C, 110 °C). The drain current completely recovered in 1000 s with an exponential-like trend that sped up while increasing the base-plate temperature.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/9'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g004-550.jpg?1721743977" title=" <strong>Figure 4</strong><br/> <p>d(I<sub>D</sub>/I<sub>D0</sub>)/dlog<sub>10</sub>t signals extracted from the I<sub>D</sub>/I<sub>D0</sub> recovery transients in order to extract the process time constant for each temperature in correspondence to the derivative peak.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/9'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g005-550.jpg?1721743978" title=" <strong>Figure 5</strong><br/> <p>Arrhenius plot obtained by extracting the I<sub>D</sub>/I<sub>D0</sub> transient time constant at each temperature. The Arrhenius plot extracted is consistent with previous literature (Chen et al., 2020 [<a href="#B23-electronicmat-05-00009" class="html-bibr">23</a>]), associating current collapse with C-related buffer traps.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/9'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g006-550.jpg?1721743979" title=" <strong>Figure 6</strong><br/> <p>Stress/measurement sequence developed on AM200 PIV system.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/9'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g007-550.jpg?1721743979" title=" <strong>Figure 7</strong><br/> <p>Waveforms corresponding to (<b>a</b>) soft-switching mode (i.e., in which the DUT is turned ON/OFF ant 0 V drain voltage) and (<b>b</b>) hard-switching mode (i.e., in which the DUT is turned ON/OFF at V<sub>DS</sub> = V<sub>DS,off</sub>).</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/9'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g008-550.jpg?1721743980" title=" <strong>Figure 8</strong><br/> <p>Comparison between I<sub>D</sub>-V<sub>GS</sub> characteristics obtained on fresh devices and after 1000 s stress at V<sub>GS,off</sub> = 0 V and V<sub>DS,off</sub> = 50 V under soft-switching (SS) mode for both (<b>a</b>) Type A and (<b>b</b>) Type B devices.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/9'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g009-550.jpg?1721743980" title=" <strong>Figure 9</strong><br/> <p>Comparison between I<sub>D</sub>-V<sub>GS</sub> characteristics obtained on fresh devices and after 1000 s stress at V<sub>GS,off</sub> = 0 V and V<sub>DS,off</sub> = 50 V under hard-switching (HS) mode for both (<b>a</b>) Type A and (<b>b</b>) Type B devices.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/9'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g010-550.jpg?1721743982" title=" <strong>Figure 10</strong><br/> <p>Measurement sequence applied for the evaluation of power devices’ degradation under on-state stress conditions.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/9'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g011-550.jpg?1721743983" title=" <strong>Figure 11</strong><br/> <p>Example of curves acquired during the different steps of the measurement procedure. (<b>a</b>) I<sub>D</sub>-V<sub>GS</sub> curves captured during Steps 1–2–3 and Step 5; (<b>b</b>) current recovery transient measured during Step 4.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/9'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g012-550.jpg?1721743984" title=" <strong>Figure 12</strong><br/> <p>Comparison between the experimental results obtained on devices presenting (<b>a</b>) surface treatment Type A and (<b>b</b>) Type B.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/9'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g013-550.jpg?1721743984" title=" <strong>Figure 13</strong><br/> <p>Comparison between the I<sub>D</sub> recovery transients captured after on-state stress on Type A and Type B devices.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/9'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g014-550.jpg?1721743985" title=" <strong>Figure 14</strong><br/> <p>Band diagrams representing the configuration of the DUTs during (<b>a</b>) Step 1 (fresh I<sub>D</sub>-V<sub>GS</sub>), (<b>b</b>) Step 3 (I<sub>D</sub>-V<sub>GS</sub> after on-state stress) and (<b>c</b>) Step 4 (I<sub>D</sub>-V<sub>GS</sub> after 1000 s recovery).</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/9'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g015-550.jpg?1721743986" title=" <strong>Figure 15</strong><br/> <p>(<b>a</b>) I<sub>D</sub>-V<sub>GS</sub> curve acquired during Step 2 by imposing different current compliance levels. (<b>b</b>) Impact of the current compliance level on the I<sub>D</sub>-V<sub>GS</sub> curve acquired during Step 3.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/9'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g016-550.jpg?1721743987" title=" <strong>Figure 16</strong><br/> <p>Comparison between the current transients measured after on-state stress test preformed at different compliances.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/9'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00009/article_deploy/html/images/electronicmat-05-00009-g017-550.jpg?1721743987" title=" <strong>Figure 17</strong><br/> <p>Impact of the current compliance level on the I<sub>D</sub>-V<sub>GS</sub> degradation retained 1000 s after the removal of the on-state stress.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/9'>Full article</a></strong> "></a></div> </div> </div> </div> <div class="expanding-div collapsed"> <div class="generic-item article-item"> <div class="article-content"> <div class="label right label__btn"> <span style="font-size: 12px; color: #1a1a1a;"> 31 pages, 7363 KiB   </span> <a href="/2673-3978/5/3/8/pdf?version=1721022661" class="UD_Listings_ArticlePDF" title="Article PDF" data-name="Recent Advances of Conductive Hydrogels for Flexible Electronics" data-journal="electronicmat"> <i class="material-icons custom-download"></i> </a> </div> <div class="article-icons"><span class="label openaccess" data-dropdown="drop-article-label-openaccess" aria-expanded="false">Open Access</span><span class="label articletype">Review</span></div> <a class="title-link" href="/2673-3978/5/3/8">Recent Advances of Conductive Hydrogels for Flexible Electronics</a> <div class="authors"> by <span class="inlineblock "><strong>Jingyu Wang</strong>, </span><span class="inlineblock "><strong>Bao Yang</strong>, </span><span class="inlineblock "><strong>Zhenyu Jiang</strong>, </span><span class="inlineblock "><strong>Yiping Liu</strong>, </span><span class="inlineblock "><strong>Licheng Zhou</strong>, </span><span class="inlineblock "><strong>Zejia Liu</strong> and </span><span class="inlineblock "><strong>Liqun Tang</strong></span> </div> <div class="color-grey-dark"> <em>Electron. Mater.</em> <b>2024</b>, <em>5</em>(3), 101-131; <a href="https://doi.org/10.3390/electronicmat5030008">https://doi.org/10.3390/electronicmat5030008</a> - 22 Jun 2024 </div> <a href="/2673-3978/5/3/8#metrics">Cited by 1</a> <div class="abstract-div"> <a href="#" onclick="$(this).next('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> <strong>Abstract </strong> </a> <div class="abstract-cropped inline"> Conductive hydrogels combine the properties of both hydrogels and conductors, making them soft, flexible, and biocompatible. These properties enable them to conform to irregular surfaces, stretch and bend without losing their electrical conductivity, and interface with biological systems. Conductive hydrogels can be utilized <a href="#" data-counterslink = "https://www.mdpi.com/2673-3978/5/3/8/more" onclick="$(this).parents('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> [...] Read more.</a> </div> <div class="abstract-full "> Conductive hydrogels combine the properties of both hydrogels and conductors, making them soft, flexible, and biocompatible. These properties enable them to conform to irregular surfaces, stretch and bend without losing their electrical conductivity, and interface with biological systems. Conductive hydrogels can be utilized as conductive traces, electrodes, or as a matrix for flexible electronics. Exciting applications in sensors, tissue engineering, and human-machine interaction have been demonstrated worldwide. This review comprehensively covers the progress in this field, focusing on several main aspects: functional materials, performance improvement strategies, and wearable applications in human-related areas. Furthermore, the major approaches and challenges for improving their mechanical properties, conductivity, and long-term stability are systematically summarized. <a href="/2673-3978/5/3/8">Full article</a> </div> </div> <a href="#" class="abstract-figures-show" data-counterslink = "https://www.mdpi.com/2673-3978/5/3/8/show" ><span >►</span><span style=" display: none;">▼</span> Show Figures </a><div class="abstract-image-preview "><div class="arrow left-arrow" id="prev1420141"><i class="fa fa-caret-left"></i></div><div class="arrow right-arrow" id="next1420141"><i class="fa fa-caret-right"></i></div><div class="absgraph cycle-slideshow manual" data-cycle-fx="scrollHorz" data-cycle-timeout="0" data-cycle-next="#next1420141" data-cycle-prev="#prev1420141" data-cycle-progressive="#images1420141" data-cycle-slides=">div" data-cycle-log="false"><div class='openpopupgallery cycle-slide' data-imgindex='0' data-target='article-1420141-popup'><span class="helper"></span><img src="data:image/gif;base64,R0lGODlhAQABAAD/ACwAAAAAAQABAAACADs=" data-src="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00008/article_deploy/html/images/electronicmat-05-00008-g001-550.jpg?1721022783" alt="" style="border: 0;"><p>Figure 1</p></div><script id="images1420141" type="text/cycle" data-cycle-split="---"><div class='openpopupgallery' data-imgindex='1' data-target='article-1420141-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00008/article_deploy/html/images/electronicmat-05-00008-g002-550.jpg?1721022789'><p>Figure 2</p></div> --- <div class='openpopupgallery' data-imgindex='2' data-target='article-1420141-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00008/article_deploy/html/images/electronicmat-05-00008-g003-550.jpg?1721022793'><p>Figure 3</p></div> --- <div class='openpopupgallery' data-imgindex='3' data-target='article-1420141-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00008/article_deploy/html/images/electronicmat-05-00008-g004-550.jpg?1721022797'><p>Figure 4</p></div> --- <div class='openpopupgallery' data-imgindex='4' data-target='article-1420141-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00008/article_deploy/html/images/electronicmat-05-00008-g005-550.jpg?1721022800'><p>Figure 5</p></div> --- <div class='openpopupgallery' data-imgindex='5' data-target='article-1420141-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00008/article_deploy/html/images/electronicmat-05-00008-g006-550.jpg?1721022803'><p>Figure 6</p></div></script></div></div><div id="article-1420141-popup" class="popupgallery" style="display: inline; line-height: 200%"><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00008/article_deploy/html/images/electronicmat-05-00008-g001-550.jpg?1721022783" title=" <strong>Figure 1</strong><br/> <p>Classification, properties and applications of conductive hydrogels. The various applications of the conductive hydrogels include: sensory skin, reprinted/adapted with permission from Ref. [<a href="#B15-electronicmat-05-00008" class="html-bibr">15</a>]; strain sensor, reprinted/adapted with permission from Ref. [<a href="#B16-electronicmat-05-00008" class="html-bibr">16</a>]; human–computer interaction, reprinted/adapted with permission from Ref. [<a href="#B17-electronicmat-05-00008" class="html-bibr">17</a>]; soft robotic, reprinted/adapted with permission from Ref. [<a href="#B18-electronicmat-05-00008" class="html-bibr">18</a>]; motion monitoring, reprinted/adapted with permission from Ref. [<a href="#B19-electronicmat-05-00008" class="html-bibr">19</a>]; for flexible wearable electronics, and cardiac tissue, reprinted/adapted with permission from Ref. [<a href="#B20-electronicmat-05-00008" class="html-bibr">20</a>]; skin tissue, reprinted/adapted with permission from Ref. [<a href="#B21-electronicmat-05-00008" class="html-bibr">21</a>]; muscle tissue (from the Internet), neural tissue (from the Internet), and bone tissue (from the Internet) for tissue engineering.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/8'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00008/article_deploy/html/images/electronicmat-05-00008-g002-550.jpg?1721022789" title=" <strong>Figure 2</strong><br/> <p>The three main categories of conductive hydrogels: electronic conductive hydrogels: such as (<b>a</b>) PPy, reprinted/adapted with permission from Ref. [<a href="#B25-electronicmat-05-00008" class="html-bibr">25</a>]; (<b>b</b>) poly(3,4-ethylenedioxythiophene) (PEDOT), reprinted/adapted with permission from Ref. [<a href="#B26-electronicmat-05-00008" class="html-bibr">26</a>]; and (<b>c</b>) polyaniline (PANI) reprinted/adapted with permission from Ref. [<a href="#B31-electronicmat-05-00008" class="html-bibr">31</a>]. Nanoparticle conductive hydrogels: including but not limited to (<b>d</b>) graphene, reprinted/adapted with permission from Ref. [<a href="#B39-electronicmat-05-00008" class="html-bibr">39</a>]; (<b>e</b>) metal particles (e.g., silver flakes), reprinted/adapted with permission from Ref. [<a href="#B50-electronicmat-05-00008" class="html-bibr">50</a>]; and (<b>f</b>) carbon nanotubes, re-printed/adapted with permission from Ref. [<a href="#B38-electronicmat-05-00008" class="html-bibr">38</a>]. Ionic conductive hydrogels: (<b>g</b>,<b>h</b>) consisting of various metal ions, reprinted/adapted with permission from Refs. [<a href="#B19-electronicmat-05-00008" class="html-bibr">19</a>,<a href="#B24-electronicmat-05-00008" class="html-bibr">24</a>].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/8'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00008/article_deploy/html/images/electronicmat-05-00008-g003-550.jpg?1721022793" title=" <strong>Figure 3</strong><br/> <p>Conductivity and mechanical properties of conductive hydrogels: (<b>a</b>) fabrication of (PAM–CMC)/Ca hydrogel for iontronic sensors, reprinted/adapted with permission from Ref. [<a href="#B19-electronicmat-05-00008" class="html-bibr">19</a>]; (<b>b</b>) the EIS Nyquist plots, reprinted/adapted with permission from Ref. [<a href="#B19-electronicmat-05-00008" class="html-bibr">19</a>]; and (<b>c</b>) the conductivity of (PAM–CMC)/Ca hydrogel with different Ca<sup>2+</sup> content, reprinted/adapted with permission from Ref. [<a href="#B19-electronicmat-05-00008" class="html-bibr">19</a>]; (<b>d</b>) conductive hydrogels with different concentrations of PEDOT/PSS, reprinted/adapted with permission from Ref. [<a href="#B62-electronicmat-05-00008" class="html-bibr">62</a>]; (<b>e</b>) mechanical properties and (<b>f</b>) electrochemical properties CV of conductivity hydrogel with different PEDOT/PSS content with scan range from −0.8 to 0.65 V, reprinted/adapted with permission from Ref. [<a href="#B62-electronicmat-05-00008" class="html-bibr">62</a>]; (<b>g</b>) the network structure of the carrageenan/Polyacrylamide (PAAm) hydrogel, reprinted/adapted with permission from Ref. [<a href="#B67-electronicmat-05-00008" class="html-bibr">67</a>]; (<b>h</b>) stable signal output under different strains, reprinted/adapted with permission from Ref. [<a href="#B67-electronicmat-05-00008" class="html-bibr">67</a>]; (<b>i</b>) chemical cross-linking reaction in PB-Ag/TA@CNC hydrogels, reprinted/adapted with permission from Ref. [<a href="#B33-electronicmat-05-00008" class="html-bibr">33</a>]; (<b>j</b>,<b>k</b>) excellent stretchable and mechanical properties of PB-Ag/TA@CNC4 hydrogels, reprinted/adapted with permission from Ref. [<a href="#B33-electronicmat-05-00008" class="html-bibr">33</a>]; (<b>l</b>) illustration of PAAm-Gelatin DN hydrogel, reprinted/adapted with permission from Ref. [<a href="#B93-electronicmat-05-00008" class="html-bibr">93</a>]; (<b>m</b>,<b>n</b>) excellent stretchable and mechanical properties of AAm-Gelatin DN hydrogel, reprinted/adapted with permission from Ref. [<a href="#B93-electronicmat-05-00008" class="html-bibr">93</a>].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/8'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00008/article_deploy/html/images/electronicmat-05-00008-g004-550.jpg?1721022797" title=" <strong>Figure 4</strong><br/> <p>Stability and biocompatibility of conductive hydrogels: (<b>a</b>) preparation process of SPP hydrogel, reprinted/adapted with permission from Ref. [<a href="#B102-electronicmat-05-00008" class="html-bibr">102</a>]; (<b>b</b>) hydrogen bonding dominates good self-healing properties, reprinted/adapted with permission from Ref. [<a href="#B102-electronicmat-05-00008" class="html-bibr">102</a>]; (<b>c</b>) illustration of the self-healing mechanism of the PAA/CMCx–Fe<sup>3+</sup>–S hydrogels, ionic dynamic bonds dominate good self-healing properties, reprinted/adapted with permission from Ref. [<a href="#B107-electronicmat-05-00008" class="html-bibr">107</a>]; (<b>d</b>) H-A-P hydrogels, mainly hydrogen bond dominated self-healing, reprinted/adapted with permission from Ref. [<a href="#B109-electronicmat-05-00008" class="html-bibr">109</a>]; (<b>e</b>,<b>f</b>) GW hydrogel shows antifreeze and high temperature resistance (−20–60 °C), reprinted/adapted with permission from Ref. [<a href="#B82-electronicmat-05-00008" class="html-bibr">82</a>]; (<b>g</b>) the freezing resistances of glycerol–PVA and TCGP hydrogels, reprinted/adapted with permission from Ref. [<a href="#B107-electronicmat-05-00008" class="html-bibr">107</a>]; (<b>h</b>) fluorescence image of cells cultured on conductive hydrogel film. Live cells appear green, while dead cells appear red, reprinted/adapted with permission from Ref. [<a href="#B128-electronicmat-05-00008" class="html-bibr">128</a>]; (<b>i</b>) cell survival rate on conductive hydrogel film on days 1, 3, and 7, reprinted/adapted with permission from Ref. [<a href="#B128-electronicmat-05-00008" class="html-bibr">128</a>]; (<b>j</b>) differentiation of skeletal muscle cells on conductive hydrogel, reprinted/adapted with permission from Ref. [<a href="#B127-electronicmat-05-00008" class="html-bibr">127</a>].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/8'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00008/article_deploy/html/images/electronicmat-05-00008-g005-550.jpg?1721022800" title=" <strong>Figure 5</strong><br/> <p>Several applications of conductive hydrogel in tissue engineering: (<b>a</b>) conductive polymer hydrogel used to replace damaged nerve, reprinted/adapted with permission from Ref. [<a href="#B146-electronicmat-05-00008" class="html-bibr">146</a>]; (<b>b</b>) carbon nanotube conductive hydrogel is used to treat infarcted heart, reprinted/adapted with permission from Ref. [<a href="#B20-electronicmat-05-00008" class="html-bibr">20</a>]; (<b>c</b>) treatment process of Cu-Fe (III)-HEO nanocomposite hydrogel for burn wound dressing, reprinted/adapted with permission from Ref. [<a href="#B155-electronicmat-05-00008" class="html-bibr">155</a>].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/8'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00008/article_deploy/html/images/electronicmat-05-00008-g006-550.jpg?1721022803" title=" <strong>Figure 6</strong><br/> <p>Several applications of conductive hydrogel in flexible wearable electronic: (<b>a</b>) illustration for the functioning of the soft robotic skin system, reprinted/adapted with permission from Ref. [<a href="#B161-electronicmat-05-00008" class="html-bibr">161</a>]; (<b>b</b>) electronic skin for real-time monitoring of breathing and coughing, reprinted/adapted with permission from Ref. [<a href="#B161-electronicmat-05-00008" class="html-bibr">161</a>]; (<b>c</b>) the signal of the hydrogel sensor on the throat when saying “Hello, hydrogel, Nice to meet you”, reprinted/adapted with permission from Ref. [<a href="#B90-electronicmat-05-00008" class="html-bibr">90</a>]; (<b>d</b>) conductive hydrogel used for human ECG, EOG and EEG test signals, reprinted/adapted with permission from Ref. [<a href="#B166-electronicmat-05-00008" class="html-bibr">166</a>]; (<b>e</b>) schematic diagram of LP-TENG absorbing electrical energy, reprinted/adapted with permission from Ref. [<a href="#B47-electronicmat-05-00008" class="html-bibr">47</a>]; (<b>f</b>,<b>g</b>) output voltage generated by LP-TENG self-powered sensors for body movement monitoring and output voltage at different stretching lengths, reprinted/adapted with permission from Ref. [<a href="#B47-electronicmat-05-00008" class="html-bibr">47</a>]; (<b>h</b>) the physical diagram and equivalent circuit diagram of the electronic meter powered by the energy collected from STENG, reprinted/adapted with permission from Ref. [<a href="#B172-electronicmat-05-00008" class="html-bibr">172</a>]; (<b>i</b>) STENG serves as the voltage distribution under five different pressures, reprinted/adapted with permission from Ref. [<a href="#B172-electronicmat-05-00008" class="html-bibr">172</a>]; (<b>j</b>) the voltage distribution diagram of the capacitor that supplies power to the electronic watch by STENG, reprinted/adapted with permission from Ref. [<a href="#B172-electronicmat-05-00008" class="html-bibr">172</a>].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/3/8'>Full article</a></strong> "></a></div> </div> </div> </div> <div class="expanding-div collapsed"> <div class="generic-item article-item"> <div class="article-content"> <div class="label right label__btn"> <span style="font-size: 12px; color: #1a1a1a;"> 21 pages, 9870 KiB   </span> <a href="/2673-3978/5/2/7/pdf?version=1719376318" class="UD_Listings_ArticlePDF" title="Article PDF" data-name="Review on Power Cycling Reliability of SiC Power Device" data-journal="electronicmat"> <i class="material-icons custom-download"></i> </a> </div> <div class="article-icons"><span class="label openaccess" data-dropdown="drop-article-label-openaccess" aria-expanded="false">Open Access</span><span class="label articletype">Review</span></div> <a class="title-link" href="/2673-3978/5/2/7">Review on Power Cycling Reliability of SiC Power Device</a> <div class="authors"> by <span class="inlineblock "><strong>Xu Gao</strong>, </span><span class="inlineblock "><strong>Qiang Jia</strong>, </span><span class="inlineblock "><strong>Yishu Wang</strong>, </span><span class="inlineblock "><strong>Hongqiang Zhang</strong>, </span><span class="inlineblock "><strong>Limin Ma</strong>, </span><span class="inlineblock "><strong>Guisheng Zou</strong> and </span><span class="inlineblock "><strong>Fu Guo</strong></span> </div> <div class="color-grey-dark"> <em>Electron. Mater.</em> <b>2024</b>, <em>5</em>(2), 80-100; <a href="https://doi.org/10.3390/electronicmat5020007">https://doi.org/10.3390/electronicmat5020007</a> - 10 Jun 2024 </div> <div class="abstract-div"> <a href="#" onclick="$(this).next('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> <strong>Abstract </strong> </a> <div class="abstract-cropped inline"> The rising demand for increased integration and higher power outputs poses a hidden risk to the long-term reliable operation of third-generation semiconductors. Thus, the power cycling test (PCT) is widely regarded as the utmost critical test for assessing the packaging reliability of power <a href="#" data-counterslink = "https://www.mdpi.com/2673-3978/5/2/7/more" onclick="$(this).parents('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> [...] Read more.</a> </div> <div class="abstract-full "> The rising demand for increased integration and higher power outputs poses a hidden risk to the long-term reliable operation of third-generation semiconductors. Thus, the power cycling test (PCT) is widely regarded as the utmost critical test for assessing the packaging reliability of power devices. In this work, low-thermal-resistance packaging design structures of SiC devices are introduced, encompassing planar packaging with dual heat dissipation, press-pack packaging, three-dimensional (3D) packaging, and hybrid packaging. PCT methods and their control strategies are summarized and discussed. Direct-current PCT is the focus of this review. The failure mechanisms of SiC devices under PCT are pointed out. The electrical and temperature-sensitive parameters adopted to monitor the aging of SiC devices are organized. The existing international standards for PCT are evaluated. Due to the lack of authoritative statements for SiC devices, it is difficult to achieve comparison research results without consistent preconditions. Furthermore, the lifetimes of the various packaging designs of the tested SiC devices under PCTs are statistically analyzed. Additionally, problems related to parameter monitoring and test equipment are also summarized. This review explores the broader landscape by delving into the current challenges and main trends in PCTs for SiC devices. <a href="/2673-3978/5/2/7">Full article</a> </div> </div> <a href="#" class="abstract-figures-show" data-counterslink = "https://www.mdpi.com/2673-3978/5/2/7/show" ><span >►</span><span style=" display: none;">▼</span> Show Figures </a><div class="abstract-image-preview "><div class="arrow left-arrow" id="prev1411987"><i class="fa fa-caret-left"></i></div><div class="arrow right-arrow" id="next1411987"><i class="fa fa-caret-right"></i></div><div class="absgraph cycle-slideshow manual" data-cycle-fx="scrollHorz" data-cycle-timeout="0" data-cycle-next="#next1411987" data-cycle-prev="#prev1411987" data-cycle-progressive="#images1411987" data-cycle-slides=">div" data-cycle-log="false"><div class='openpopupgallery cycle-slide' data-imgindex='0' data-target='article-1411987-popup'><span class="helper"></span><img src="data:image/gif;base64,R0lGODlhAQABAAD/ACwAAAAAAQABAAACADs=" data-src="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g001-550.jpg?1719376422" alt="" style="border: 0;"><p>Figure 1</p></div><script id="images1411987" type="text/cycle" data-cycle-split="---"><div class='openpopupgallery' data-imgindex='1' data-target='article-1411987-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g002-550.jpg?1719376423'><p>Figure 2</p></div> --- <div class='openpopupgallery' data-imgindex='2' data-target='article-1411987-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g003-550.jpg?1719376423'><p>Figure 3</p></div> --- <div class='openpopupgallery' data-imgindex='3' data-target='article-1411987-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g004-550.jpg?1719376424'><p>Figure 4</p></div> --- <div class='openpopupgallery' data-imgindex='4' data-target='article-1411987-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g005-550.jpg?1719376425'><p>Figure 5</p></div> --- <div class='openpopupgallery' data-imgindex='5' data-target='article-1411987-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g006-550.jpg?1719376425'><p>Figure 6</p></div> --- <div class='openpopupgallery' data-imgindex='6' data-target='article-1411987-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g007-550.jpg?1719376426'><p>Figure 7</p></div> --- <div class='openpopupgallery' data-imgindex='7' data-target='article-1411987-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g008-550.jpg?1719376428'><p>Figure 8</p></div> --- <div class='openpopupgallery' data-imgindex='8' data-target='article-1411987-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g009-550.jpg?1719376429'><p>Figure 9</p></div> --- <div class='openpopupgallery' data-imgindex='9' data-target='article-1411987-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g010-550.jpg?1719376430'><p>Figure 10</p></div> --- <div class='openpopupgallery' data-imgindex='10' data-target='article-1411987-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g011-550.jpg?1719376431'><p>Figure 11</p></div> --- <div class='openpopupgallery' data-imgindex='11' data-target='article-1411987-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g012-550.jpg?1719376432'><p>Figure 12</p></div> --- <div class='openpopupgallery' data-imgindex='12' data-target='article-1411987-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g013-550.jpg?1719376433'><p>Figure 13</p></div> --- <div class='openpopupgallery' data-imgindex='13' data-target='article-1411987-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g014-550.jpg?1719376434'><p>Figure 14</p></div> --- <div class='openpopupgallery' data-imgindex='14' data-target='article-1411987-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g015-550.jpg?1719376435'><p>Figure 15</p></div></script></div></div><div id="article-1411987-popup" class="popupgallery" style="display: inline; line-height: 200%"><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g001-550.jpg?1719376422" title=" <strong>Figure 1</strong><br/> <p>Comparison of SiC and Si intrinsic properties.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/7'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g002-550.jpg?1719376423" title=" <strong>Figure 2</strong><br/> <p>Typical power device packaging design and commercial SiC power device packages. (<b>a</b>) Cross-sectional view of DUT packages. (<b>b</b>) Semikron-1200V SiC MOSFET module—SKM500MB120SC. (<b>c</b>) Infineon EasyPACK<sup>TM</sup> 1200V SiC MOSFET module—FF2MR12W3M1H_B11. (<b>d</b>) ROHM 1200V SiC MOSFET module—BSM600D12P4G103. (<b>e</b>) ROHM 650V SiC Schottky diode—SCS320AH. (<b>f</b>) Infineon 1200V SiC Schottky diode—IDW30S120. (<b>g</b>) Infineon 650V SiC MOSFET—IMT65R022M1H.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/7'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g003-550.jpg?1719376423" title=" <strong>Figure 3</strong><br/> <p>Planar packaging with dual heat dissipation. (<b>a</b>) Miniaturized double-side cooling planar packaging based on Cu Clip interconnection. (<b>b</b>) Wire-bondless planar packaging module with double-side cooling. (<b>c</b>) LTCC-based double-side cooling planar packaging.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/7'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g004-550.jpg?1719376424" title=" <strong>Figure 4</strong><br/> <p>Press-pack packaging with dual heat dissipation. (<b>a</b>) Sandwiched configuration press-pack packaging. (<b>b</b>) ALG-based press-pack packaging. (<b>c</b>) Fuzz Button-based flexible press-pack packaging.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/7'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g005-550.jpg?1719376425" title=" <strong>Figure 5</strong><br/> <p>3D packaging. (<b>a</b>) Cu pin interconnection-based 3D wiring packaging. (<b>b</b>) Wire bondless highly integrated 3D packaging with stacked substrates. (<b>c</b>) 3D printing technology-based air-cooled 3D packaging.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/7'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g006-550.jpg?1719376425" title=" <strong>Figure 6</strong><br/> <p>DBC and PCB/FPC-based hybrid packaging.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/7'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g007-550.jpg?1719376426" title=" <strong>Figure 7</strong><br/> <p>Schematic diagrams of DC-PC and PWM-PCT. (<b>a</b>) Schematic and waveform diagrams of DC-PCT. (<b>b</b>) Schematic and waveform diagrams of DC-PCT.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/7'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g008-550.jpg?1719376428" title=" <strong>Figure 8</strong><br/> <p>Power cycling test with four different control strategies [<a href="#B40-electronicmat-05-00007" class="html-bibr">40</a>].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/7'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g009-550.jpg?1719376429" title=" <strong>Figure 9</strong><br/> <p>SiC device’s typical failure mechanisms under the power cycling test.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/7'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g010-550.jpg?1719376430" title=" <strong>Figure 10</strong><br/> <p>Comparison of electrical temperature-sensitive parameters of SiC devices [<a href="#B56-electronicmat-05-00007" class="html-bibr">56</a>,<a href="#B57-electronicmat-05-00007" class="html-bibr">57</a>,<a href="#B58-electronicmat-05-00007" class="html-bibr">58</a>,<a href="#B59-electronicmat-05-00007" class="html-bibr">59</a>,<a href="#B60-electronicmat-05-00007" class="html-bibr">60</a>,<a href="#B61-electronicmat-05-00007" class="html-bibr">61</a>,<a href="#B62-electronicmat-05-00007" class="html-bibr">62</a>,<a href="#B63-electronicmat-05-00007" class="html-bibr">63</a>,<a href="#B64-electronicmat-05-00007" class="html-bibr">64</a>,<a href="#B65-electronicmat-05-00007" class="html-bibr">65</a>].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/7'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g011-550.jpg?1719376431" title=" <strong>Figure 11</strong><br/> <p>Power cycling test standard summary [<a href="#B16-electronicmat-05-00007" class="html-bibr">16</a>,<a href="#B17-electronicmat-05-00007" class="html-bibr">17</a>,<a href="#B18-electronicmat-05-00007" class="html-bibr">18</a>,<a href="#B19-electronicmat-05-00007" class="html-bibr">19</a>,<a href="#B20-electronicmat-05-00007" class="html-bibr">20</a>].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/7'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g012-550.jpg?1719376432" title=" <strong>Figure 12</strong><br/> <p>Temperature swing ΔT<sub>j</sub>’ s setting frequency in studies [<a href="#B8-electronicmat-05-00007" class="html-bibr">8</a>,<a href="#B77-electronicmat-05-00007" class="html-bibr">77</a>,<a href="#B78-electronicmat-05-00007" class="html-bibr">78</a>,<a href="#B79-electronicmat-05-00007" class="html-bibr">79</a>,<a href="#B80-electronicmat-05-00007" class="html-bibr">80</a>,<a href="#B81-electronicmat-05-00007" class="html-bibr">81</a>,<a href="#B82-electronicmat-05-00007" class="html-bibr">82</a>,<a href="#B83-electronicmat-05-00007" class="html-bibr">83</a>,<a href="#B84-electronicmat-05-00007" class="html-bibr">84</a>,<a href="#B85-electronicmat-05-00007" class="html-bibr">85</a>,<a href="#B86-electronicmat-05-00007" class="html-bibr">86</a>,<a href="#B87-electronicmat-05-00007" class="html-bibr">87</a>,<a href="#B88-electronicmat-05-00007" class="html-bibr">88</a>,<a href="#B89-electronicmat-05-00007" class="html-bibr">89</a>,<a href="#B90-electronicmat-05-00007" class="html-bibr">90</a>,<a href="#B91-electronicmat-05-00007" class="html-bibr">91</a>,<a href="#B92-electronicmat-05-00007" class="html-bibr">92</a>,<a href="#B93-electronicmat-05-00007" class="html-bibr">93</a>,<a href="#B94-electronicmat-05-00007" class="html-bibr">94</a>,<a href="#B95-electronicmat-05-00007" class="html-bibr">95</a>,<a href="#B96-electronicmat-05-00007" class="html-bibr">96</a>,<a href="#B97-electronicmat-05-00007" class="html-bibr">97</a>,<a href="#B98-electronicmat-05-00007" class="html-bibr">98</a>].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/7'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g013-550.jpg?1719376433" title=" <strong>Figure 13</strong><br/> <p>Number of cycles to failure under different temperature swings ΔT<sub>vj</sub> [<a href="#B8-electronicmat-05-00007" class="html-bibr">8</a>,<a href="#B77-electronicmat-05-00007" class="html-bibr">77</a>,<a href="#B78-electronicmat-05-00007" class="html-bibr">78</a>,<a href="#B79-electronicmat-05-00007" class="html-bibr">79</a>,<a href="#B80-electronicmat-05-00007" class="html-bibr">80</a>,<a href="#B81-electronicmat-05-00007" class="html-bibr">81</a>,<a href="#B82-electronicmat-05-00007" class="html-bibr">82</a>,<a href="#B83-electronicmat-05-00007" class="html-bibr">83</a>,<a href="#B84-electronicmat-05-00007" class="html-bibr">84</a>,<a href="#B85-electronicmat-05-00007" class="html-bibr">85</a>,<a href="#B86-electronicmat-05-00007" class="html-bibr">86</a>,<a href="#B87-electronicmat-05-00007" class="html-bibr">87</a>,<a href="#B88-electronicmat-05-00007" class="html-bibr">88</a>,<a href="#B89-electronicmat-05-00007" class="html-bibr">89</a>,<a href="#B90-electronicmat-05-00007" class="html-bibr">90</a>,<a href="#B91-electronicmat-05-00007" class="html-bibr">91</a>,<a href="#B92-electronicmat-05-00007" class="html-bibr">92</a>,<a href="#B93-electronicmat-05-00007" class="html-bibr">93</a>,<a href="#B94-electronicmat-05-00007" class="html-bibr">94</a>,<a href="#B95-electronicmat-05-00007" class="html-bibr">95</a>,<a href="#B96-electronicmat-05-00007" class="html-bibr">96</a>,<a href="#B97-electronicmat-05-00007" class="html-bibr">97</a>,<a href="#B98-electronicmat-05-00007" class="html-bibr">98</a>]. (<b>a</b>) Power cycling results’ fitted curve based on the data in the references. (<b>b</b>) The power cycling results’ fitted curve refers to the Coffin–Manson model.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/7'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g014-550.jpg?1719376434" title=" <strong>Figure 14</strong><br/> <p>Power cycling lifetime statistics with different joining layers [<a href="#B8-electronicmat-05-00007" class="html-bibr">8</a>,<a href="#B77-electronicmat-05-00007" class="html-bibr">77</a>,<a href="#B78-electronicmat-05-00007" class="html-bibr">78</a>,<a href="#B79-electronicmat-05-00007" class="html-bibr">79</a>,<a href="#B80-electronicmat-05-00007" class="html-bibr">80</a>,<a href="#B81-electronicmat-05-00007" class="html-bibr">81</a>,<a href="#B82-electronicmat-05-00007" class="html-bibr">82</a>,<a href="#B83-electronicmat-05-00007" class="html-bibr">83</a>,<a href="#B84-electronicmat-05-00007" class="html-bibr">84</a>,<a href="#B85-electronicmat-05-00007" class="html-bibr">85</a>,<a href="#B86-electronicmat-05-00007" class="html-bibr">86</a>,<a href="#B87-electronicmat-05-00007" class="html-bibr">87</a>,<a href="#B88-electronicmat-05-00007" class="html-bibr">88</a>,<a href="#B89-electronicmat-05-00007" class="html-bibr">89</a>,<a href="#B90-electronicmat-05-00007" class="html-bibr">90</a>,<a href="#B91-electronicmat-05-00007" class="html-bibr">91</a>,<a href="#B92-electronicmat-05-00007" class="html-bibr">92</a>,<a href="#B93-electronicmat-05-00007" class="html-bibr">93</a>,<a href="#B94-electronicmat-05-00007" class="html-bibr">94</a>,<a href="#B95-electronicmat-05-00007" class="html-bibr">95</a>,<a href="#B96-electronicmat-05-00007" class="html-bibr">96</a>,<a href="#B97-electronicmat-05-00007" class="html-bibr">97</a>,<a href="#B98-electronicmat-05-00007" class="html-bibr">98</a>].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/7'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00007/article_deploy/html/images/electronicmat-05-00007-g015-550.jpg?1719376435" title=" <strong>Figure 15</strong><br/> <p>Conversion speed of SiC MOSFET and Si IGBT [<a href="#B104-electronicmat-05-00007" class="html-bibr">104</a>].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/7'>Full article</a></strong> "></a></div> </div> </div> </div> <div class="expanding-div collapsed"> <div class="generic-item article-item"> <div class="article-content"> <div class="label right label__btn"> <span style="font-size: 12px; color: #1a1a1a;"> 9 pages, 4960 KiB   </span> <a href="/2673-3978/5/2/6/pdf?version=1717652979" class="UD_Listings_ArticlePDF" title="Article PDF" data-name="The Switching Characteristics in Bilayer ZnO/HfO2 Resistive Random-Access Memory, Depending on the Top Electrode" data-journal="electronicmat"> <i class="material-icons custom-download"></i> </a> </div> <div class="article-icons"><span class="label openaccess" data-dropdown="drop-article-label-openaccess" aria-expanded="false">Open Access</span><span class="label articletype">Article</span></div> <a class="title-link" href="/2673-3978/5/2/6">The Switching Characteristics in Bilayer ZnO/HfO<sub>2</sub> Resistive Random-Access Memory, Depending on the Top Electrode</a> <div class="authors"> by <span class="inlineblock "><strong>So-Yeon Kwon</strong>, </span><span class="inlineblock "><strong>Woon-San Ko</strong>, </span><span class="inlineblock "><strong>Jun-Ho Byun</strong>, </span><span class="inlineblock "><strong>Do-Yeon Lee</strong>, </span><span class="inlineblock "><strong>Hi-Deok Lee</strong> and </span><span class="inlineblock "><strong>Ga-Won Lee</strong></span> </div> <div class="color-grey-dark"> <em>Electron. Mater.</em> <b>2024</b>, <em>5</em>(2), 71-79; <a href="https://doi.org/10.3390/electronicmat5020006">https://doi.org/10.3390/electronicmat5020006</a> - 6 Jun 2024 </div> <div class="abstract-div"> <a href="#" onclick="$(this).next('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> <strong>Abstract </strong> </a> <div class="abstract-cropped inline"> In this study, the bipolar switching behaviors in ZnO/HfO<sub>2</sub> bilayer resistive random-access memory (RRAM), depending on different metal top electrodes (TE), are analyzed. For this purpose, devices with two types of TE–TiN/Ti and Pd, which have varying oxygen affinities, are fabricated. X-ray <a href="#" data-counterslink = "https://www.mdpi.com/2673-3978/5/2/6/more" onclick="$(this).parents('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> [...] Read more.</a> </div> <div class="abstract-full "> In this study, the bipolar switching behaviors in ZnO/HfO<sub>2</sub> bilayer resistive random-access memory (RRAM), depending on different metal top electrodes (TE), are analyzed. For this purpose, devices with two types of TE–TiN/Ti and Pd, which have varying oxygen affinities, are fabricated. X-ray diffraction (XRD) analysis shows that ZnO has a hexagonal wurtzite structure, and HfO<sub>2</sub> exhibits both monoclinic and orthorhombic phases. The average grain sizes are 10.9 nm for ZnO and 1.55 nm for HfO<sub>2</sub>. In regards to the electrical characteristics, the I–V curve, cycling test, and voltage stress are measured. The measurement results indicate that devices with TiN/Ti TE exhibit lower set and higher reset voltage and stable bipolar switching behavior. However, a device with Pd TE demonstrates higher set and lower reset voltage. This phenomenon can be explained by the Gibbs free energy of formation (∆G<sub>f</sub>°). Additionally, the Pd TE device shows unstable bipolar switching characteristics, where unipolar switching occurs simultaneously during the cycling test. This instability in devices with Pd TE could potentially lead to soft errors in operation. For guaranteeing stable bipolar switching, the oxygen affinity of material for TE should be considered in regards to ZnO/HfO<sub>2</sub> bilayer RRAM. <a href="/2673-3978/5/2/6">Full article</a> </div> </div> <a href="#" class="abstract-figures-show" data-counterslink = "https://www.mdpi.com/2673-3978/5/2/6/show" ><span >►</span><span style=" display: none;">▼</span> Show Figures </a><div class="abstract-image-preview "><div class="arrow left-arrow" id="prev1409639"><i class="fa fa-caret-left"></i></div><div class="arrow right-arrow" id="next1409639"><i class="fa fa-caret-right"></i></div><div class="absgraph cycle-slideshow manual" data-cycle-fx="scrollHorz" data-cycle-timeout="0" data-cycle-next="#next1409639" data-cycle-prev="#prev1409639" data-cycle-progressive="#images1409639" data-cycle-slides=">div" data-cycle-log="false"><div class='openpopupgallery cycle-slide' data-imgindex='0' data-target='article-1409639-popup'><span class="helper"></span><img src="data:image/gif;base64,R0lGODlhAQABAAD/ACwAAAAAAQABAAACADs=" data-src="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00006/article_deploy/html/images/electronicmat-05-00006-g001-550.jpg?1717653079" alt="" style="border: 0;"><p>Figure 1</p></div><script id="images1409639" type="text/cycle" data-cycle-split="---"><div class='openpopupgallery' data-imgindex='1' data-target='article-1409639-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00006/article_deploy/html/images/electronicmat-05-00006-g002-550.jpg?1717653081'><p>Figure 2</p></div> --- <div class='openpopupgallery' data-imgindex='2' data-target='article-1409639-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00006/article_deploy/html/images/electronicmat-05-00006-g003-550.jpg?1717653082'><p>Figure 3</p></div> --- <div class='openpopupgallery' data-imgindex='3' data-target='article-1409639-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00006/article_deploy/html/images/electronicmat-05-00006-g004-550.jpg?1717653084'><p>Figure 4</p></div> --- <div class='openpopupgallery' data-imgindex='4' data-target='article-1409639-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00006/article_deploy/html/images/electronicmat-05-00006-g005-550.jpg?1717653085'><p>Figure 5</p></div> --- <div class='openpopupgallery' data-imgindex='5' data-target='article-1409639-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00006/article_deploy/html/images/electronicmat-05-00006-g006-550.jpg?1717653086'><p>Figure 6</p></div> --- <div class='openpopupgallery' data-imgindex='6' data-target='article-1409639-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00006/article_deploy/html/images/electronicmat-05-00006-g007-550.jpg?1717653087'><p>Figure 7</p></div> --- <div class='openpopupgallery' data-imgindex='7' data-target='article-1409639-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00006/article_deploy/html/images/electronicmat-05-00006-g008-550.jpg?1717653089'><p>Figure 8</p></div></script></div></div><div id="article-1409639-popup" class="popupgallery" style="display: inline; line-height: 200%"><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00006/article_deploy/html/images/electronicmat-05-00006-g001-550.jpg?1717653079" title=" <strong>Figure 1</strong><br/> <p>The schematic of (<b>a</b>) the TiN/Ti TE device, (<b>b</b>) the Pd TE device, and (<b>c</b>) the optical microscopic image of the fabricated device.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/6'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00006/article_deploy/html/images/electronicmat-05-00006-g002-550.jpg?1717653081" title=" <strong>Figure 2</strong><br/> <p>X-ray diffraction (XRD) analysis of (<b>a</b>) the ZnO/HfO<sub>2</sub> layer and (<b>b</b>) the HfO<sub>2</sub> layer. The ICDD card data of (<b>c</b>) ZnO and (<b>d</b>) HfO<sub>2</sub>.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/6'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00006/article_deploy/html/images/electronicmat-05-00006-g003-550.jpg?1717653082" title=" <strong>Figure 3</strong><br/> <p>The bipolar switching characteristic of (<b>a</b>) the TiN/Ti TE device and (<b>b</b>) the Pd TE device.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/6'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00006/article_deploy/html/images/electronicmat-05-00006-g004-550.jpg?1717653084" title=" <strong>Figure 4</strong><br/> <p>The standard Gibbs free energy of formation (∆G<sub>f</sub>°) and oxygen ion movement of (<b>a</b>) the TiN/Ti TE device and (<b>b</b>) the Pd TE device (based on the ideal operational scenario, without the diffusion).</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/6'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00006/article_deploy/html/images/electronicmat-05-00006-g005-550.jpg?1717653085" title=" <strong>Figure 5</strong><br/> <p>The cycling tests for (<b>a</b>) the TiN/Ti TE device and (<b>b</b>) the Pd TE device, showing (<b>c</b>) the unexpected unipolar switching characteristic of the Pd TE device under negative bias.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/6'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00006/article_deploy/html/images/electronicmat-05-00006-g006-550.jpg?1717653086" title=" <strong>Figure 6</strong><br/> <p>Resistance measurement results with V<sub>read</sub> = 0.5 V under different temperatures in the (<b>a</b>) TiN/Ti TE and (<b>b</b>) Pd TE devices.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/6'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00006/article_deploy/html/images/electronicmat-05-00006-g007-550.jpg?1717653087" title=" <strong>Figure 7</strong><br/> <p>Resistance measurement results with V<sub>read</sub> = 0.5 V under different voltage stress in the (<b>a</b>) TiN/Ti TE and (<b>b</b>) Pd TE device.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/6'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00006/article_deploy/html/images/electronicmat-05-00006-g008-550.jpg?1717653089" title=" <strong>Figure 8</strong><br/> <p>The operation mechanism and switching characteristics depend on the TE: (<b>a</b>) the Pd TE device and (<b>b</b>) the TiN/Ti TE device.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/6'>Full article</a></strong> "></a></div> </div> </div> </div> <div class="expanding-div collapsed"> <div class="generic-item article-item"> <div class="article-content"> <div class="label right label__btn"> <a data-dropdown="drop-supplementary-1393712" aria-controls="drop-supplementary-1393712" aria-expanded="false" title="Supplementary Material"> <i class="material-icons">attachment</i> </a> <div id="drop-supplementary-1393712" class="f-dropdown label__btn__dropdown label__btn__dropdown--wide" data-dropdown-content aria-hidden="true" tabindex="-1"> Supplementary material: <br/> <a href="/2673-3978/5/2/5/s1?version=1715606813"> Supplementary File 1 (ZIP, 1404 KiB) </a><br/> </div> </div> <div class="label right label__btn"> <span style="font-size: 12px; color: #1a1a1a;"> 15 pages, 12235 KiB   </span> <a href="/2673-3978/5/2/5/pdf?version=1715606812" class="UD_Listings_ArticlePDF" title="Article PDF" data-name="Silver-Doped CsPbI2Br Perovskite Semiconductor Thin Films" data-journal="electronicmat"> <i class="material-icons custom-download"></i> </a> </div> <div class="article-icons"><span class="label openaccess" data-dropdown="drop-article-label-openaccess" aria-expanded="false">Open Access</span><span class="label articletype">Article</span></div> <a class="title-link" href="/2673-3978/5/2/5">Silver-Doped CsPbI<sub>2</sub>Br Perovskite Semiconductor Thin Films</a> <div class="authors"> by <span class="inlineblock "><strong>Tamiru Kebede</strong>, </span><span class="inlineblock "><strong>Mulualem Abebe</strong>, </span><span class="inlineblock "><strong>Dhakshnamoorthy Mani</strong>, </span><span class="inlineblock "><strong>Aparna Thankappan</strong>, </span><span class="inlineblock "><strong>Sabu Thomas</strong> and </span><span class="inlineblock "><strong>Jung Yong Kim</strong></span> </div> <div class="color-grey-dark"> <em>Electron. Mater.</em> <b>2024</b>, <em>5</em>(2), 56-70; <a href="https://doi.org/10.3390/electronicmat5020005">https://doi.org/10.3390/electronicmat5020005</a> - 13 May 2024 </div> <a href="/2673-3978/5/2/5#metrics">Cited by 1</a> <div class="abstract-div"> <a href="#" onclick="$(this).next('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> <strong>Abstract </strong> </a> <div class="abstract-cropped inline"> All-inorganic perovskite semiconductors have received significant interest for their potential stability over heat and humidity. However, the typical CsPbI<sub>3</sub> displays phase instability despite its desirable bandgap of ~1.73 eV. Herein, we studied the mixed halide perovskite CsPbI<sub>2</sub>Br by varying the <a href="#" data-counterslink = "https://www.mdpi.com/2673-3978/5/2/5/more" onclick="$(this).parents('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> [...] Read more.</a> </div> <div class="abstract-full "> All-inorganic perovskite semiconductors have received significant interest for their potential stability over heat and humidity. However, the typical CsPbI<sub>3</sub> displays phase instability despite its desirable bandgap of ~1.73 eV. Herein, we studied the mixed halide perovskite CsPbI<sub>2</sub>Br by varying the silver doping concentration. For this purpose, we examined its bandgap tunability as a function of the silver doping by using density functional theory. Then, we studied the effect of silver on the structural and optical properties of CsPbI<sub>2</sub>Br. Resultantly, we found that ‘silver doping’ allowed for partial bandgap tunability from 1.91 eV to 2.05 eV, increasing the photoluminescence (PL) lifetime from 0.990 ns to 1.187 ns, and, finally, contributing to the structural stability when examining the aging effect via X-ray diffraction. Then, through the analysis of the intermolecular interactions based on the solubility parameter, we explain the solvent engineering process in relation to the solvent trapping phenomena in CsPbI<sub>2</sub>Br thin films. However, silver doping may induce a defect morphology (e.g., a pinhole) during the formation of the thin films. <a href="/2673-3978/5/2/5">Full article</a> </div> </div> <a href="#" class="abstract-figures-show" data-counterslink = "https://www.mdpi.com/2673-3978/5/2/5/show" ><span >►</span><span style=" display: none;">▼</span> Show Figures </a><div class="abstract-image-preview "><div class="arrow left-arrow" id="prev1393712"><i class="fa fa-caret-left"></i></div><div class="arrow right-arrow" id="next1393712"><i class="fa fa-caret-right"></i></div><div class="absgraph cycle-slideshow manual" data-cycle-fx="scrollHorz" data-cycle-timeout="0" data-cycle-next="#next1393712" data-cycle-prev="#prev1393712" data-cycle-progressive="#images1393712" data-cycle-slides=">div" data-cycle-log="false"><div class='openpopupgallery cycle-slide' data-imgindex='0' data-target='article-1393712-popup'><span class="helper"></span><img src="data:image/gif;base64,R0lGODlhAQABAAD/ACwAAAAAAQABAAACADs=" data-src="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00005/article_deploy/html/images/electronicmat-05-00005-g001-550.jpg?1715606981" alt="" style="border: 0;"><p>Figure 1</p></div><script id="images1393712" type="text/cycle" data-cycle-split="---"><div class='openpopupgallery' data-imgindex='1' data-target='article-1393712-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00005/article_deploy/html/images/electronicmat-05-00005-g002-550.jpg?1715606986'><p>Figure 2</p></div> --- <div class='openpopupgallery' data-imgindex='2' data-target='article-1393712-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00005/article_deploy/html/images/electronicmat-05-00005-g003-550.jpg?1715606987'><p>Figure 3</p></div> --- <div class='openpopupgallery' data-imgindex='3' data-target='article-1393712-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00005/article_deploy/html/images/electronicmat-05-00005-g004-550.jpg?1715606990'><p>Figure 4</p></div> --- <div class='openpopupgallery' data-imgindex='4' data-target='article-1393712-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00005/article_deploy/html/images/electronicmat-05-00005-g005-550.jpg?1715606991'><p>Figure 5</p></div> --- <div class='openpopupgallery' data-imgindex='5' data-target='article-1393712-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00005/article_deploy/html/images/electronicmat-05-00005-g006-550.jpg?1715606994'><p>Figure 6</p></div> --- <div class='openpopupgallery' data-imgindex='6' data-target='article-1393712-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00005/article_deploy/html/images/electronicmat-05-00005-g007-550.jpg?1715606995'><p>Figure 7</p></div> --- <div class='openpopupgallery' data-imgindex='7' data-target='article-1393712-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00005/article_deploy/html/images/electronicmat-05-00005-g008-550.jpg?1715606996'><p>Figure 8</p></div> --- <div class='openpopupgallery' data-imgindex='8' data-target='article-1393712-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00005/article_deploy/html/images/electronicmat-05-00005-g009-550.jpg?1715607004'><p>Figure 9</p></div></script></div></div><div id="article-1393712-popup" class="popupgallery" style="display: inline; line-height: 200%"><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00005/article_deploy/html/images/electronicmat-05-00005-g001-550.jpg?1715606981" title=" <strong>Figure 1</strong><br/> <p>(<b>a</b>) Unit cell and supercell of CsPbI<sub>2</sub>Br with lattice parameters, <b>a</b> = <b>b</b> = 6.395 <b>Å</b> and <b>c</b> = 5.988 <b>Å</b>. (<b>b</b>) B-site substitutional doping by silver for the CsPbI<sub>2</sub>Br supercell with a size of 2 × 2 × 1.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/5'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00005/article_deploy/html/images/electronicmat-05-00005-g002-550.jpg?1715606986" title=" <strong>Figure 2</strong><br/> <p>Band structure of the pseudo-cubic α-phase Cs<sub>4</sub>Pb<sub>4−x</sub>Ag<sub>x</sub>I<sub>8</sub>Br<sub>4</sub> when (<b>a</b>) x = 0, (<b>b</b>) x = 1, (<b>c</b>) x = 2, (<b>d</b>) x = 3, and (<b>e</b>) x = 4. (<b>f</b>) Bandgap as a function of x in Cs<sub>4</sub>Pb<sub>4−x</sub>Ag<sub>x</sub>I<sub>8</sub>Br<sub>4</sub>.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/5'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00005/article_deploy/html/images/electronicmat-05-00005-g003-550.jpg?1715606987" title=" <strong>Figure 3</strong><br/> <p>(<b>a</b>) UV–Vis spectra of CsPbI<sub>2</sub>Br as a function of the AgBr concentration. (<b>b</b>) Bandgap as a function of the AgBr doping concentration (%). Optical bandgap determination for CsPbI<sub>2</sub>Br as a function of the AgBr concentration by the Tauc plot.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/5'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00005/article_deploy/html/images/electronicmat-05-00005-g004-550.jpg?1715606990" title=" <strong>Figure 4</strong><br/> <p>Optical bandgap determination for CsPbI<span class="html-italic">2</span>Br as a function of the AgBr concentration (<b>a</b>) 0%, (<b>b</b>) 1%, (<b>c</b>) 2% and (<b>d</b>) 3% by the Tauc plot. Here, each arrow indicates the tangent line for determining the optical bandgap.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/5'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00005/article_deploy/html/images/electronicmat-05-00005-g005-550.jpg?1715606991" title=" <strong>Figure 5</strong><br/> <p>PL lifetime of the CsPbI<sub>2</sub>Br thin film as a function of the AgBr concentration.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/5'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00005/article_deploy/html/images/electronicmat-05-00005-g006-550.jpg?1715606994" title=" <strong>Figure 6</strong><br/> <p>(<b>a</b>) FT-IR spectra of CsPbI<sub>2</sub>Br with or without AgBr when processed with dimethyl sulfoxide (DMSO) and chlorobenzene (CB). (<b>b</b>) Chemical structures of DMSO and CB. (<b>c</b>) Solvent engineering process: when CB is dripping on top of the wet perovskite (precursor) film, DMSO can be washed away. During this process, some solvent molecules could be trapped in the perovskite thin film.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/5'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00005/article_deploy/html/images/electronicmat-05-00005-g007-550.jpg?1715606995" title=" <strong>Figure 7</strong><br/> <p>CsPbI<sub>2</sub>Br as a function of AgBr doping: (<b>a</b>) XRD patterns and (<b>b</b>) crystallite size. The PDF reference card number is 80-4039 [<a href="#B65-electronicmat-05-00005" class="html-bibr">65</a>,<a href="#B66-electronicmat-05-00005" class="html-bibr">66</a>].</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/5'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00005/article_deploy/html/images/electronicmat-05-00005-g008-550.jpg?1715606996" title=" <strong>Figure 8</strong><br/> <p>Structural stability test by the XRD: (<b>a</b>) CsPbI<sub>2</sub>Br without AgBr and (<b>b</b>) CsPbI<sub>2</sub>Br with 1% AgBr.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/5'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00005/article_deploy/html/images/electronicmat-05-00005-g009-550.jpg?1715607004" title=" <strong>Figure 9</strong><br/> <p>SEM images: (<b>a</b>) CsPbI<sub>2</sub>Br without AgBr, (<b>b</b>) CsPbI<sub>2</sub>Br with the 1% AgBr (<b>c</b>) CsPbI<sub>2</sub>Br with the 2% AgBr, and (<b>d</b>) CsPbI<sub>2</sub>Br with the 3% AgBr.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/5'>Full article</a></strong> "></a></div> </div> </div> </div> <div class="expanding-div collapsed"> <div class="generic-item article-item"> <div class="article-content"> <div class="label right label__btn"> <span style="font-size: 12px; color: #1a1a1a;"> 11 pages, 3141 KiB   </span> <a href="/2673-3978/5/2/4/pdf?version=1713241053" class="UD_Listings_ArticlePDF" title="Article PDF" data-name="Solution-Processable and Eco-Friendly Functionalization of Conductive Silver Nanoparticles Inks for Printable Electronics" data-journal="electronicmat"> <i class="material-icons custom-download"></i> </a> </div> <div class="article-icons"><span class="label openaccess" data-dropdown="drop-article-label-openaccess" aria-expanded="false">Open Access</span><span class="label articletype">Article</span></div> <a class="title-link" href="/2673-3978/5/2/4">Solution-Processable and Eco-Friendly Functionalization of Conductive Silver Nanoparticles Inks for Printable Electronics</a> <div class="authors"> by <span class="inlineblock "><strong>Sonia Ceron</strong>, </span><span class="inlineblock "><strong>David Barba</strong> and </span><span class="inlineblock "><strong>Miguel A. Dominguez</strong></span> </div> <div class="color-grey-dark"> <em>Electron. Mater.</em> <b>2024</b>, <em>5</em>(2), 45-55; <a href="https://doi.org/10.3390/electronicmat5020004">https://doi.org/10.3390/electronicmat5020004</a> - 16 Apr 2024 </div> <a href="/2673-3978/5/2/4#metrics">Cited by 2</a> <div class="abstract-div"> <a href="#" onclick="$(this).next('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> <strong>Abstract </strong> </a> <div class="abstract-cropped inline"> The functionalization of conductive inks has been carried out through the decomposition of hydrogen peroxide (H<sub>2</sub>O<sub>2</sub>) onto the surface of silver nanoparticles (AgNPs). The ink prepared using this eco-friendly chemical reagent has been characterized structurally, chemically, and morphologically, showing <a href="#" data-counterslink = "https://www.mdpi.com/2673-3978/5/2/4/more" onclick="$(this).parents('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> [...] Read more.</a> </div> <div class="abstract-full "> The functionalization of conductive inks has been carried out through the decomposition of hydrogen peroxide (H<sub>2</sub>O<sub>2</sub>) onto the surface of silver nanoparticles (AgNPs). The ink prepared using this eco-friendly chemical reagent has been characterized structurally, chemically, and morphologically, showing the presence of stable AgNPs with suitable properties as well as the absence of residual contamination. The electrical conductivity of such a solution-processable ink is evidenced for patterns designed on flexible photographic paper substrates, using a refillable fountain pen that is implemented as a printing mechanism for the fabrication of simple printed circuit boards (PCBs). The functionality and durability of the tested systems are demonstrated under various mechanical constraints, aiming to basically reproduce the normal operation conditions of flexible electronic devices. The obtained results indicate that the implementation of these AgNP-based inks is relevant for direct applications in inkjet printing technology, thus paving the way for the use of greener chemicals in ink preparation. <a href="/2673-3978/5/2/4">Full article</a> </div> </div> <a href="#" class="abstract-figures-show" data-counterslink = "https://www.mdpi.com/2673-3978/5/2/4/show" ><span >►</span><span style=" display: none;">▼</span> Show Figures </a><div class="abstract-image-preview "><div class="arrow left-arrow" id="prev1376291"><i class="fa fa-caret-left"></i></div><div class="arrow right-arrow" id="next1376291"><i class="fa fa-caret-right"></i></div><div class="absgraph cycle-slideshow manual" data-cycle-fx="scrollHorz" data-cycle-timeout="0" data-cycle-next="#next1376291" data-cycle-prev="#prev1376291" data-cycle-progressive="#images1376291" data-cycle-slides=">div" data-cycle-log="false"><div class='openpopupgallery cycle-slide' data-imgindex='0' data-target='article-1376291-popup'><span class="helper"></span><img src="data:image/gif;base64,R0lGODlhAQABAAD/ACwAAAAAAQABAAACADs=" data-src="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00004/article_deploy/html/images/electronicmat-05-00004-g001-550.jpg?1713241126" alt="" style="border: 0;"><p>Figure 1</p></div><script id="images1376291" type="text/cycle" data-cycle-split="---"><div class='openpopupgallery' data-imgindex='1' data-target='article-1376291-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00004/article_deploy/html/images/electronicmat-05-00004-g002-550.jpg?1713241127'><p>Figure 2</p></div> --- <div class='openpopupgallery' data-imgindex='2' data-target='article-1376291-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00004/article_deploy/html/images/electronicmat-05-00004-g003-550.jpg?1713241130'><p>Figure 3</p></div> --- <div class='openpopupgallery' data-imgindex='3' data-target='article-1376291-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00004/article_deploy/html/images/electronicmat-05-00004-g004-550.jpg?1713241131'><p>Figure 4</p></div> --- <div class='openpopupgallery' data-imgindex='4' data-target='article-1376291-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00004/article_deploy/html/images/electronicmat-05-00004-g005-550.jpg?1713241133'><p>Figure 5</p></div> --- <div class='openpopupgallery' data-imgindex='5' data-target='article-1376291-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00004/article_deploy/html/images/electronicmat-05-00004-g006-550.jpg?1713241134'><p>Figure 6</p></div> --- <div class='openpopupgallery' data-imgindex='6' data-target='article-1376291-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00004/article_deploy/html/images/electronicmat-05-00004-g007-550.jpg?1713241135'><p>Figure 7</p></div> --- <div class='openpopupgallery' data-imgindex='7' data-target='article-1376291-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00004/article_deploy/html/images/electronicmat-05-00004-g008-550.jpg?1713241137'><p>Figure 8</p></div></script></div></div><div id="article-1376291-popup" class="popupgallery" style="display: inline; line-height: 200%"><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00004/article_deploy/html/images/electronicmat-05-00004-g001-550.jpg?1713241126" title=" <strong>Figure 1</strong><br/> <p>XRD patterns of AgNPs (before mixing) showing the signature of Ag (<sup>o</sup>) and the one of NaNO<sub>3</sub> (*).</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/4'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00004/article_deploy/html/images/electronicmat-05-00004-g002-550.jpg?1713241127" title=" <strong>Figure 2</strong><br/> <p>XRD patterns of AgNP-based ink prepared after mixing in peroxide.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/4'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00004/article_deploy/html/images/electronicmat-05-00004-g003-550.jpg?1713241130" title=" <strong>Figure 3</strong><br/> <p>SEM images of (<b>a</b>) the surface morphology of the photographic paper before and (<b>b</b>) after its coating by the AgNP-based ink. (<b>c</b>) Size distribution of AgNP-based ink determined from the SEM analysis.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/4'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00004/article_deploy/html/images/electronicmat-05-00004-g004-550.jpg?1713241131" title=" <strong>Figure 4</strong><br/> <p>(<b>a</b>) Coating on photographic paper by AgNPs without peroxide dispersion and (<b>b</b>) size distribution determined by log normal distribution.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/4'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00004/article_deploy/html/images/electronicmat-05-00004-g005-550.jpg?1713241133" title=" <strong>Figure 5</strong><br/> <p>EDS spectra and analyses of pure AgNPs (<b>a</b>) and AgNP-based ink (<b>b</b>) deposited on photographic paper.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/4'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00004/article_deploy/html/images/electronicmat-05-00004-g006-550.jpg?1713241134" title=" <strong>Figure 6</strong><br/> <p>AFM topography mapping recorded along the vertical and horizontal gray lines (<b>a</b>), with their corresponding measured profile heights (<b>b</b>) and (<b>c</b>), respectively.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/4'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00004/article_deploy/html/images/electronicmat-05-00004-g007-550.jpg?1713241135" title=" <strong>Figure 7</strong><br/> <p>I-V measurement of the ink on photographic paper (<b>a</b>) with flexion and (<b>b</b>) bending cycles of the flexible substrates.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/4'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00004/article_deploy/html/images/electronicmat-05-00004-g008-550.jpg?1713241137" title=" <strong>Figure 8</strong><br/> <p>Design of a simple hybrid PCB, experimental set-up, and AgNP-based ink circuit drawn onto photographic paper using a fountain pen.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/2/4'>Full article</a></strong> "></a></div> </div> </div> </div> <div class="expanding-div collapsed"> <div class="generic-item article-item"> <div class="article-content"> <div class="label right label__btn"> <span style="font-size: 12px; color: #1a1a1a;"> 15 pages, 4567 KiB   </span> <a href="/2673-3978/5/1/3/pdf?version=1710317449" class="UD_Listings_ArticlePDF" title="Article PDF" data-name="Enhancement of Photo-Electrical Properties of CdS Thin Films: Effect of N2 Purging and N2 Annealing" data-journal="electronicmat"> <i class="material-icons custom-download"></i> </a> </div> <div class="article-icons"><span class="label openaccess" data-dropdown="drop-article-label-openaccess" aria-expanded="false">Open Access</span><span class="label articletype">Article</span></div> <a class="title-link" href="/2673-3978/5/1/3">Enhancement of Photo-Electrical Properties of CdS Thin Films: Effect of N<sub>2</sub> Purging and N<sub>2</sub> Annealing</a> <div class="authors"> by <span class="inlineblock "><strong>Gayan K. L. Sankalpa</strong>, </span><span class="inlineblock "><strong>Gayan R. K. K. G. R. Kumarasinghe</strong>, </span><span class="inlineblock "><strong>Buddhika S. Dassanayake</strong> and </span><span class="inlineblock "><strong>Gayan W. C. Kumarage</strong></span> </div> <div class="color-grey-dark"> <em>Electron. Mater.</em> <b>2024</b>, <em>5</em>(1), 30-44; <a href="https://doi.org/10.3390/electronicmat5010003">https://doi.org/10.3390/electronicmat5010003</a> - 13 Mar 2024 </div> <a href="/2673-3978/5/1/3#metrics">Cited by 1</a> <div class="abstract-div"> <a href="#" onclick="$(this).next('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> <strong>Abstract </strong> </a> <div class="abstract-cropped inline"> The impact of N<sub>2</sub> purging in the CdS deposition bath and subsequent N<sub>2</sub> annealing is examined and contrasted with conventional CdS films, which were deposited without purging and annealed in ambient air. All films were fabricated using the chemical bath deposition <a href="#" data-counterslink = "https://www.mdpi.com/2673-3978/5/1/3/more" onclick="$(this).parents('.abstract-cropped').toggleClass('inline').next('.abstract-full').toggleClass('inline'); return false;"> [...] Read more.</a> </div> <div class="abstract-full "> The impact of N<sub>2</sub> purging in the CdS deposition bath and subsequent N<sub>2</sub> annealing is examined and contrasted with conventional CdS films, which were deposited without purging and annealed in ambient air. All films were fabricated using the chemical bath deposition method at a temperature of 80 °C on fluorine-doped tin oxide glass slides (FTO). N<sub>2</sub> purged films were deposited by introducing nitrogen gas into the deposition bath throughout the CdS deposition process. Subsequently, both N<sub>2</sub> purged and un-purged films underwent annealing at temperatures ranging from 100 to 500 °C for one hour, either in a nitrogen or ambient air environment. Photoelectrochemical (PEC) cell studies reveal that films subjected to both N<sub>2</sub> purging and N<sub>2</sub> annealing exhibit a notable enhancement of 37.5% and 27% in I<sub>SC</sub> (short-circuit current) and V<sub>OC</sub> (open-circuit voltage) values, accompanied by a 5% improvement in optical transmittance compared to conventional CdS thin films. The films annealed at 300 °C demonstrate the highest I<sub>SC</sub>, V<sub>OC</sub>, and V<sub>FB</sub> values, 55 μA, 0.475 V, and −675 mV, respectively. The improved optoelectrical properties in both N<sub>2</sub>-purged and N<sub>2</sub>-annealed films are attributed to their well-packed structure, enhanced interconnectivity, and a higher sulfur to cadmium ratio of 0.76 in the films. <a href="/2673-3978/5/1/3">Full article</a> </div> </div> <div class="belongsTo" style="margin-bottom: 10px;"> (This article belongs to the Topic <a href="/topics/J1A7BPI59O">Optoelectronic Materials, 2nd Volume</a>)<br/> </div> <a href="#" class="abstract-figures-show" data-counterslink = "https://www.mdpi.com/2673-3978/5/1/3/show" ><span >►</span><span style=" display: none;">▼</span> Show Figures </a><div class="abstract-image-preview "><div class="arrow left-arrow" id="prev1355996"><i class="fa fa-caret-left"></i></div><div class="arrow right-arrow" id="next1355996"><i class="fa fa-caret-right"></i></div><div class="absgraph cycle-slideshow manual" data-cycle-fx="scrollHorz" data-cycle-timeout="0" data-cycle-next="#next1355996" data-cycle-prev="#prev1355996" data-cycle-progressive="#images1355996" data-cycle-slides=">div" data-cycle-log="false"><div class='openpopupgallery cycle-slide' data-imgindex='0' data-target='article-1355996-popup'><span class="helper"></span><img src="data:image/gif;base64,R0lGODlhAQABAAD/ACwAAAAAAQABAAACADs=" data-src="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00003/article_deploy/html/images/electronicmat-05-00003-g001-550.jpg?1710317534" alt="" style="border: 0;"><p>Figure 1</p></div><script id="images1355996" type="text/cycle" data-cycle-split="---"><div class='openpopupgallery' data-imgindex='1' data-target='article-1355996-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00003/article_deploy/html/images/electronicmat-05-00003-g002-550.jpg?1710317535'><p>Figure 2</p></div> --- <div class='openpopupgallery' data-imgindex='2' data-target='article-1355996-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00003/article_deploy/html/images/electronicmat-05-00003-g003-550.jpg?1710317536'><p>Figure 3</p></div> --- <div class='openpopupgallery' data-imgindex='3' data-target='article-1355996-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00003/article_deploy/html/images/electronicmat-05-00003-g004-550.jpg?1710317537'><p>Figure 4</p></div> --- <div class='openpopupgallery' data-imgindex='4' data-target='article-1355996-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00003/article_deploy/html/images/electronicmat-05-00003-g005-550.jpg?1710317538'><p>Figure 5</p></div> --- <div class='openpopupgallery' data-imgindex='5' data-target='article-1355996-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00003/article_deploy/html/images/electronicmat-05-00003-g006-550.jpg?1710317540'><p>Figure 6</p></div> --- <div class='openpopupgallery' data-imgindex='6' data-target='article-1355996-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00003/article_deploy/html/images/electronicmat-05-00003-g007-550.jpg?1710317545'><p>Figure 7</p></div> --- <div class='openpopupgallery' data-imgindex='7' data-target='article-1355996-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00003/article_deploy/html/images/electronicmat-05-00003-g008-550.jpg?1710317549'><p>Figure 8</p></div> --- <div class='openpopupgallery' data-imgindex='8' data-target='article-1355996-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00003/article_deploy/html/images/electronicmat-05-00003-g009-550.jpg?1710317551'><p>Figure 9</p></div> --- <div class='openpopupgallery' data-imgindex='9' data-target='article-1355996-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00003/article_deploy/html/images/electronicmat-05-00003-g010-550.jpg?1710317553'><p>Figure 10</p></div> --- <div class='openpopupgallery' data-imgindex='10' data-target='article-1355996-popup'><span class="helper"></span><img src='https://pub.mdpi-res.com/electronicmat/electronicmat-05-00003/article_deploy/html/images/electronicmat-05-00003-g011-550.jpg?1710317553'><p>Figure 11</p></div></script></div></div><div id="article-1355996-popup" class="popupgallery" style="display: inline; line-height: 200%"><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00003/article_deploy/html/images/electronicmat-05-00003-g001-550.jpg?1710317534" title=" <strong>Figure 1</strong><br/> <p>Optical transmittance of the CBD-CdS annealed from 100 to 500 °C; (<b>a</b>) CdS/A; (<b>b</b>) CdS/N<sub>2</sub>; (<b>c</b>) N<sub>2</sub>-CdS/A; (<b>d</b>) N<sub>2</sub>-CdS/N<sub>2</sub>.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/1/3'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00003/article_deploy/html/images/electronicmat-05-00003-g002-550.jpg?1710317535" title=" <strong>Figure 2</strong><br/> <p>Variation of <span class="html-italic">E<sub>g</sub></span> of the four different types of samples with respect to annealing temperature.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/1/3'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00003/article_deploy/html/images/electronicmat-05-00003-g003-550.jpg?1710317536" title=" <strong>Figure 3</strong><br/> <p>The variation in V<sub>OC</sub> value of the four different types of CdS films at different annealing temperatures.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/1/3'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00003/article_deploy/html/images/electronicmat-05-00003-g004-550.jpg?1710317537" title=" <strong>Figure 4</strong><br/> <p>The variation in I<sub>SC</sub> value of the four different types of CdS films deposited at different annealing temperatures.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/1/3'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00003/article_deploy/html/images/electronicmat-05-00003-g005-550.jpg?1710317538" title=" <strong>Figure 5</strong><br/> <p>The variation in I<sub>SC</sub> × V<sub>OC</sub> value of the four different types of CdS films deposited at different annealing temperatures.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/1/3'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00003/article_deploy/html/images/electronicmat-05-00003-g006-550.jpg?1710317540" title=" <strong>Figure 6</strong><br/> <p>The variation in V<sub>FB</sub> value of the four different types of CdS films deposited at different annealing temperatures.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/1/3'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00003/article_deploy/html/images/electronicmat-05-00003-g007-550.jpg?1710317545" title=" <strong>Figure 7</strong><br/> <p>SEM images of the CdS films; (<b>a</b>) CdS/A; (<b>b</b>) CdS/N<sub>2</sub>; (<b>c</b>) N<sub>2</sub>-CdS/A; (<b>d</b>) N<sub>2</sub>-CdS/N<sub>2</sub> annealed at 300 °C for 1 h.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/1/3'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00003/article_deploy/html/images/electronicmat-05-00003-g008-550.jpg?1710317549" title=" <strong>Figure 8</strong><br/> <p>SEM and AFM images of the CdS films; (<b>a</b>,<b>c</b>) unannealed and unpurged CdS; (<b>b</b>,<b>d</b>) N<sub>2</sub> purged and un-annealed CdS.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/1/3'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00003/article_deploy/html/images/electronicmat-05-00003-g009-550.jpg?1710317551" title=" <strong>Figure 9</strong><br/> <p>X-ray diffractograms of the (<b>a</b>) CdS/A; (<b>b</b>) CdS/N<sub>2</sub>; (<b>c</b>) N<sub>2</sub>-CdS/A; (<b>d</b>) N<sub>2</sub>-CdS/N<sub>2</sub> thin films annealed at 300 °C for 1 h; (<b>e</b>) as-deposited CdS; (<b>f</b>) bare FTO.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/1/3'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00003/article_deploy/html/images/electronicmat-05-00003-g010-550.jpg?1710317553" title=" <strong>Figure 10</strong><br/> <p>Crystal size of the CdS/A, CdS/N<sub>2,</sub> N<sub>2</sub>-CdS/A, and N<sub>2</sub>-CdS/N<sub>2</sub>.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/1/3'>Full article</a></strong> "></a><a href="https://pub.mdpi-res.com/electronicmat/electronicmat-05-00003/article_deploy/html/images/electronicmat-05-00003-g011-550.jpg?1710317553" title=" <strong>Figure 11</strong><br/> <p>Texture coefficient of CBD-CdS/A, CdS/N<sub>2</sub>, N<sub>2</sub>-CdS/A, and N<sub>2</sub>-CdS/N<sub>2</sub> films.</p> <strong style='display: block; margin-top: 10px; font-size: 18px;'><a style='color: #fff' href='/2673-3978/5/1/3'>Full article</a></strong> "></a></div> </div> </div> </div> </div> <div class="generic-item last-item"> <a class="bold" href="/search?q=&journal=electronicmat&sort=pubdate&page_count=50">More Articles...</a> </div> </div> </div> </div> <div id="left-column" class="content__column large-3 large-pull-6 medium-3 medium-pull-6 small-12 columns"> <div id="js-large-main-top-container"> <div id="js-main-top-container" class="content__container"> <a href="/journal/electronicmat"> <img src="https://pub.mdpi-res.com/img/journals/electronicmat-logo.png?8600e93ff98dbf14" alt="electronicmat-logo" title="Electronic Materials" style="max-height: 60px; 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$(document).foundation('orbit', 'reflow'); } } if (undefined !== $(this).data("callback")) { var customCallback = $(this).data("callback"); func = window[customCallback]; func(); } }); $(document).on("click", ".js-open-small-search", function(e) { e.preventDefault(); $(this).toggleClass("active").closest(".tab-bar").toggleClass("active"); $(".search-container").toggleClass("hide-for-small-down"); }); $(document).on("click", ".js-open-menu", function(e) { $(".search-container").addClass("hide-for-small-down"); }); $(window).on('resize', function() { recalculate_main_browser_position(); recalculate_responsive_moving_containers(); }); updateSearchLabelVisibilities(); recalculate_main_browser_position(); recalculate_responsive_moving_containers(); if (window.document.documentMode == 11) { $("<link/>", { rel: "stylesheet", type: "text/css", href: "https://fonts.googleapis.com/icon?family=Material+Icons"}).appendTo("head"); } }); function recalculate_main_browser_position() { if 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$(".responsive-moving-container.large[data-id='"+$(this).data("id")+"']"); } if (previousParent.attr("class") !== currentParent.attr("class")) { currentParent.html(movingContent); previousParent.html(); currentParent.addClass("active"); previousParent.removeClass("active"); } }); } // cookies allowed is checked from a) local storage and b) from server separately so that the footer bar doesn't // get included in the custom page caches function checkCookiesAllowed() { var cookiesEnabled = localStorage.getItem("mdpi_cookies_enabled"); if (null === cookiesEnabled) { $.ajax({ url: "/ajax_cookie_value/mdpi_cookies_accepted", success: function(data) { if (data.value) { localStorage.setItem("mdpi_cookies_enabled", true); checkDisplaySurvey(); } else { $(".js-allow-cookies").show(); } } }); } else { checkDisplaySurvey(); } } function checkDisplaySurvey() { } window.addEventListener('CookiebotOnAccept', function (e) { var CookieDate = new Date; if (Cookiebot.consent.preferences) { 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$("#journal-browser-go").toggleClass("button--grey", "" === $("#journal-browser-volume").val()); $("#journal-browser-go").toggleClass("button--color", "" !== $("#journal-browser-volume").val()); $("#journal-browser-volume").change(function(e) { $('#journal-browser-issue').find('option').not('.volume-0').hide(); $('#journal-browser-issue').find('.volume-' + $(this).val()).show(); $('#journal-browser-issue').find('option:first').prop('selected', 'selected'); $("#journal-browser-issue").trigger("chosen:updated"); $('#journal-browser-go').toggleClass('button--grey', '' === $(this).val()); $('#journal-browser-go').toggleClass('button--color', '' !== $(this).val()); }); // add resize event for the window (to recalculate side column elements) // TODO: is it better to use resize end or resize here? $(window).on('resize', function() { mdpi_column_height_module.calculateColumnHeights(false, mainColumn1); }); $(".link-journal-menu").click(function(e) { e.preventDefault(); $(this).find('span').toggle(); $(this).next("ul").toggleClass("active"); $("#social-media-links").toggle(); $("#journal-alerts").toggle(); }); $(".link-journal-browser").click(function(e) { e.preventDefault(); $(this).find('span').toggle(); $(this).next("div").toggleClass('show-for-medium-up'); }); }); </script>   <script type="text/plain" data-cookieconsent="marketing"> !function(e,t,n,s,u,a){e.twq||(s=e.twq=function(){s.exe?s.exe.apply(s,arguments):s.queue.push(arguments); },s.version='1.1',s.queue=[],u=t.createElement(n),u.async=!0,u.src='//static.ads-twitter.com/uwt.js', a=t.getElementsByTagName(n)[0],a.parentNode.insertBefore(u,a))}(window,document,'script'); // Insert Twitter Pixel ID and Standard Event data below twq('init','o2pip'); twq('track','PageView'); </script>  <script>(function(){function c(){var b=a.contentDocument||a.contentWindow.document;if(b){var d=b.createElement('script');d.innerHTML="window.__CF$cv$params={r:'9133c47f9fdc3e01',t:'MTczOTc3NDIzNC4wMDAwMDA='};var 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