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Communities and Initiatives</span></a></li></ul></li><li id="menu-item-1241" class="menu-item menu-item-type-custom menu-item-object-custom menu-item-1241 grve-first-level grve-menu-type-button grve-primary-1 grve-hover-primary-2"><a target="_blank" rel="noopener noreferrer" href="#grve-sidearea" class="grve-toggle-hiddenarea"><span class="grve-item">Join SSCS</span></a></li></ul></div></nav></div></div></div></div><div id="grve-responsive-header"><div id="grve-main-responsive-header" class="grve-wrapper clearfix"><div class="grve-container"><div class="grve-logo grve-position-left"><div class="grve-wrapper"> <a href="https://sscs.ieee.org/"> <img class="grve-logo-responsive" src="//sscs.ieee.org/wp-content/uploads/ieee-sscs-mobile-logo2x.png" alt="IEEE Solid-State Circuits Society" width="402" height="108"> </a></div></div><div class="grve-header-elements-wrapper grve-position-right"><div class="grve-hidden-menu-btn grve-position-right"><div class="grve-header-element"> <a href="#grve-hidden-menu" class="grve-toggle-hiddenarea" aria-label="Menu"> <span class="grve-item"> <span class="grve-icon-menu" aria-hidden="true"></span> </span> </a></div></div><div class="grve-header-elements grve-position-left"><div class="grve-wrapper"><ul><li class="grve-header-element"> <a href="#grve-sidearea" class="grve-sidearea-btn grve-toggle-hiddenarea" aria-label="Side area"> <span class="grve-item"><i class="grve-icon-safebutton"></i></span> </a></li></ul></div></div></div></div></div></div></div></header><div id="grve-page-title" class="grve-page-title grve-with-title grve-custom-size grve-bg-primary-1" data-height="10" style="min-height:160px;"><div class="grve-wrapper clearfix" style="height:10vh; min-height:160px;"><div class="grve-content grve-align-left-center" data-animation="none"><div class="grve-container"><div class="grve-title-content-wrapper grve-bg-none grve-align-left grve-content-large"><h1 class="grve-title grve-with-line grve-text-light"><span>JSSC Submission – Information for Authors</span></h1></div></div></div></div></div><div id="grve-page-breadcrumbs" class="grve-breadcrumbs clearfix grve-align-left"><div class="grve-breadcrumbs-wrapper"><div class="grve-container"><nav><span><span><a href="https://sscs.ieee.org/">Home</a></span> › <span><a href="https://sscs.ieee.org/publications/">Publications</a></span> › <span><a href="https://sscs.ieee.org/publications/ieee-journal-of-solid-state-circuits-jssc/">IEEE Journal of Solid-State Circuits (JSSC)</a></span> › <span class="breadcrumb_last" aria-current="page">JSSC Submission – Information for Authors</span></span></nav></div></div></div><div id="grve-content" class="clearfix "><div class="grve-content-wrapper"><div id="grve-main-content"><div class="grve-main-content-wrapper clearfix"><div id="page-156" class="post-156 page type-page status-publish hentry"><div class="grve-section grve-row-section grve-fullwidth-background grve-padding-bottom-1x grve-bg-none"><div class="grve-container"><div class="grve-row grve-bookmark grve-columns-gap-30"><div class="grve-column wpb_column grve-column-2-3 txt-column left" ><div class="grve-column-wrapper" ><h2 class="grve-element grve-title grve-align-left grve-h5" style=""><span>ScholarOne Web-Based Submission and Review</span></h2><div class="grve-element grve-text"><p>The JSSC uses the web-based ScholarOne system for the submission and review of manuscripts. ScholarOne makes it easier and more efficient for authors, reviewers and editors.</p><p><a class="arrow-link" href="https://ieee.atyponrex.com/journal/jssc-ieee" target="_blank" rel="noopener">Visit the JSSC IEEE Author Portal</a></p><p>All IEEE journals require an Open Researcher and Contributor ID (ORCID) for all authors. The author will need a registered ORCID in order to submit a manuscript or review a proof in this journal.</p><p><a class="arrow-link" href="https://orcid.org/register" target="_blank" rel="noopener">Create an ORCID</a></p></div><h3 class="grve-element grve-title grve-align-left grve-h5" style=""><span>Style for Manuscript Submissions</span></h3><div class="grve-element grve-text"><p>All papers must be submitted using the IEEE TRANSACTIONS two-column format. For general manuscript preparation guidelines, visit the <a href="https://ieeeauthorcenter.ieee.org/" target="_blank" rel="noopener">IEEE Author Center</a>. Article templates, including guidance on stylistic elements such as figures, tables, equations, abbreviations, etc. are available at IEEE Author Center.</p><p><a class="arrow-link" href="https://ieeeauthorcenter.ieee.org/create-your-ieee-article/use-authoring-tools-and-ieee-article-templates/ieee-article-templates/templates-for-transactions/" target="_blank" rel="noopener">Visit the IEEE Author Center</a></p><p>Figures and tables must be placed inline at their relevant position in the text. Author names and affiliations are mandatory, but biographies are optional during the review process.</p></div><h3 class="grve-element grve-title grve-align-left grve-h5" style=""><span>Prepublication Policy</span></h3><div class="grve-element grve-text"><p>During submission, all related prior publications and related current submissions in other journals or conferences should be fully declared. Include a pdf copy of those papers, as well as a prepublication statement explaining the overlap and differences of the submitted manuscripts for the convenience of the reviewers. Furthermore, authors should inform the Editor-in-Chief of any related submissions made while their JSSC submission is in review.</p><p>Prior and related publications obviously refers to e.g. earlier conference papers on which the JSSC manuscript elaborates. But also other publications where (part of) the submitted work was disclosed, earlier work of you or your group in the same field on which the submitted manuscript builds further, etc. must be included.</p><p>Please consider this list carefully. An automated plagiarism check is performed on each submission, and violations of this prepublication policy detected during the review process may result in a publication ban.</p></div><h3 class="grve-element grve-title grve-align-left grve-h5" style=""><span>Manuscript Length</span></h3><div class="grve-element grve-text"><p>Submitted manuscripts, describing both the theoretical and implementation aspects of an advance solid-state circuit design, are allowed to have up to 8 pages in the two-column format described above. This page limit is valid for the whole manuscript, but excluding references and bios. All figures must be sized such that they are properly readable. No modifications to the IEEE templates are allowed.</p><p>Exceptions of up to 4 extra pages are possible for systems or topics that do not fit in this regular length. To request such an exception, a detailed motivation must be provided at the time of submission. Exceptions are subject to approval by the editorial board.</p><p>During revisions, deviations on this page limit are allowed if more material is requested by the editor or reviewers.</p></div><h3 class="grve-element grve-title grve-align-left grve-h5" style=""><span>Copyright</span></h3><div class="grve-element grve-text"><p>Submission of a manuscript manifests the fact that it has received proper clearance from the author’s company or institution, that it has not been copyrighted, published, submitted, or accepted for publication elsewhere, and that it will not be submitted elsewhere while under consideration. The manuscript text should not contain any commercial references, such as company names, university names, trademarks, commercial acronyms, or part numbers.</p><p>IEEE owns copyright to the technical contributions it publishes. To comply with the U.S. Copyright Law, authors are required to sign an IEEE copyright transfer form. Authors can sign and submit an electronic version of the copyright form while submitting their manuscript through ScholarOne.</p></div><h3 class="grve-element grve-title grve-align-left grve-h5" style=""><span>Review Process</span></h3><div class="grve-element grve-text"><p>The first round of the review process usually requires about three months. The author is then notified of the decision of the Editor or Associate Editor based on reviewer recommendations. The authors may be asked to revise the manuscript if it is not accepted, or rejected in its original form. The elapsed time between receipt of a manuscript and publication is usually about 8 months, but is heavily dependent on the quality and clarity of the original manuscript.</p><p>Authors are therefore strongly requested to report on their work as open and clearly as possible in their original manuscript submissions. The editors and reviewers understand that not always all aspects of the design presented are perfect, but hiding such items from the readers is often a reason for several revisions, and often even rejection. The solid-state circuits community will also learn from the less-good aspects of the design presented, so authors are encouraged to present those as well.</p><p>The articles in this journal are peer reviewed in accordance with the requirements set forth in the <a href="https://pspb.ieee.org/images/files/files/opsmanual.pd" target="_blank" rel="noopener">IEEE Publication Services and Products Board Operations Manual</a> (Sections 8.2.1C and 8.2.2A). Each published article was reviewed by a minimum of two independent reviewers using a single-anonymous peer review process, where the identities of the reviewers are not known to the authors, but the reviewers know the identities of the authors. Articles will be screened for plagiarism before acceptance.</p></div><h3 class="grve-element grve-title grve-align-left grve-h5" style=""><span>Open Access</span></h3><div class="grve-element grve-text"><p>This publication is a hybrid journal, allowing either Traditional or Open Access (author-pays OA) manuscript submission. Upon submission, if you choose to have your manuscript be an Open Access article, you commit to pay the discounted OA fee if your manuscript is accepted for publication in order to enable unrestricted public access. Any other application charges (such as charge for the use of color in the print format) will be billed separately once the manuscript formatting is complete but prior to publication. If you would like your manuscript to be a Traditional submission, your article will be available to qualified subscribers and purchasers via IEEE <em>Xplore</em>. No OA payment is required for Traditional submission. Corresponding authors from low-income countries are eligible for waived or reduced open access APCs.</p><h1 id="m_2083771002247794151m_8001754033837669833m_-5588053341579256458gmail-headline-113-47"><span style="font-family: tahoma, sans-serif; font-size: small;">Article Processing Charges (APCs)</span></h1><div id="m_2083771002247794151m_8001754033837669833m_-5588053341579256458gmail-_rich_text-114-47"><p><span style="font-family: tahoma, sans-serif;">US$2495 for articles submitted in 2024. APC US$2645 for articles submitted in 2025.</span></p><ul><li dir="ltr"><p dir="ltr" role="presentation"><span style="font-family: tahoma, sans-serif;">IEEE Members receive a 5% discount</span></p></li><li dir="ltr"><p dir="ltr" role="presentation"><span style="font-family: tahoma, sans-serif;">IEEE Society Members receive a 20% discount</span></p></li><li dir="ltr"><p dir="ltr" role="presentation"><span style="font-family: tahoma, sans-serif;">Discounts cannot be combined</span></p></li><li dir="ltr"><p dir="ltr" role="presentation"><span style="font-family: tahoma, sans-serif;">Discounts do not apply to undergraduate and graduate students</span></p></li><li><p role="presentation"><span style="font-family: tahoma, sans-serif;">Information about <a href="https://open.ieee.org/for-authors/ieee-low-and-lower-middle-income-country-open-access-discount-program/" target="_blank" rel="noopener" data-saferedirecturl="https://www.google.com/url?q=https://open.ieee.org/for-authors/ieee-low-and-lower-middle-income-country-open-access-discount-program/&source=gmail&ust=1730905495277000&usg=AOvVaw13yFqe6CxBBGIpE0ZBT4gz">IEEE’s Low and Lower-middle Income Country Program</a> is available </span></p></li></ul><p><span style="font-family: tahoma, sans-serif;">Some institutions offer assistance for open access funding. Check our <a href="https://open.ieee.org/for-institutions/institutional-partners/" target="_blank" rel="noopener" data-saferedirecturl="https://www.google.com/url?q=https://open.ieee.org/for-institutions/institutional-partners/&source=gmail&ust=1730905495277000&usg=AOvVaw3KWCcLaZ9daBrmSYH6hGw9">institutional partners</a> list to see if yours is one.</span></p></div></div><h3 class="grve-element grve-title grve-align-left grve-h5" style=""><span>Page Charges</span></h3><div class="grve-element grve-text"><p>Papers will be reviewed for their technical merit, and decisions to publish will be made independently of an author’s ability to pay page charges. A voluntary page charge of $110 per printed page will be requested with the galley proof to cover the cost of publication.</p><p>Starting for papers submitted after October 1st, 2018, the SSCS will apply mandatory overlength page charges. This is irrespective of the page limits applied during submission, hence also applies to manuscripts that have obtained an exception for overlength submission. Charges are assessed when galley proofs are prepared, which is the last step before final publication in the Journal. Note that this could be slightly different from the formatting used by the authors during submission. If a manuscript exceeds ten pages in length, a mandatory overlength charge of $185 per page is applied beginning at the 11th page. The page count will not include the last page of the paper if the last page consists only of reference and bios. Exceptions on this must be discussed with the Editor-in-Chief.</p></div><div class="grve-element grve-callout bg-lt-grey grve-margin-top-3x grve-btn-right" style=""><div class="grve-callout-wrapper"><h4 class="grve-callout-content grve-h4">Questions?</h4><p class="">For any further questions or information on the submission process, please contact us.</p></div><div class="grve-button-wrapper"><a href="javascript:;" data-enc-email="wffpnqzva[at]vrrr.bet" title="Contact Us" class="grve-btn grve-btn-medium grve-extra-round grve-bg-primary-1 grve-bg-hover-primary-2 mail-link" data-wpel-link="ignore"><span>Contact Us</span></a></div></div></div></div><div class="grve-column wpb_column grve-column-1-3 img-column right" ><div class="grve-column-wrapper bg-red-gradient card resources" ><h5 class="grve-element grve-title grve-align-left grve-h5" style=""><span>Resource Links</span></h5><div class="grve-element grve-text"><ul><li><a class="arrow-link" href="https://journals.ieeeauthorcenter.ieee.org/create-your-ieee-journal-article/authoring-tools-and-templates/tools-for-ieee-authors/" target="_blank" rel="noopener">IEEE Author Tools</a></li><li><a class="arrow-link" href="https://ieee-collabratec.ieee.org/app/community/18/activities" target="_blank" rel="noopener">IEEE Collabratec Author Lab</a></li><li><a class="arrow-link" href="http://ieeesscs.wpengine.com/wp-content/uploads/2015/12/ScholarOne_Author_Tutorial_July2019.pptx" target="_blank" rel="noopener">JSSC Author Tutorial</a></li><li><a class="arrow-link" href="https://journals.ieeeauthorcenter.ieee.org/create-your-ieee-journal-article/authoring-tools-and-templates/tools-for-ieee-authors/ieee-article-templates/" target="_blank" rel="noopener">Manuscript Templates</a></li><li><a class="arrow-link" href="https://ieee.atyponrex.com/journal/jssc-ieee" target="_blank" rel="noopener">IEEE Author Portal</a></li><li><a class="arrow-link" href="https://sscs.ieee.org/wp-content/uploads/Resubmissions-2.pdf">Resubmissions</a></li></ul></div></div></div></div></div><div class="grve-background-wrapper"></div></div></div></div></div></div></div><footer id="grve-footer" data-sticky-footer="no" class="grve-border grve-bookmark"><div id="grve-bottom-bar" class="grve-bookmark"><div class="grve-section grve-row-section grve-fullwidth-background grve-padding-top-3x grve-padding-bottom-3x grve-bg-none bg-red-gradient" id="join-sscs"><div class="grve-container"><div class="grve-row grve-bookmark grve-columns-gap-30"><div class="grve-column wpb_column grve-column-1 grve-align-center" ><div class="grve-column-wrapper mw-770" ><h2 class="grve-element grve-title grve-align-center grve-subtitle-text" style=""><span>Join IEEE Solid-State Circuits Society</span></h2><div class="grve-element grve-text"><p>As a member of the IEEE SSCS Society, you will receive communications about networking opportunities, conferences, meetings, special events, exclusive content, and so much more.</p></div><div class="grve-element grve-align-center ieee-btn"><a href="#grve-sidearea" title="Learn More" class="grve-btn grve-btn-medium grve-extra-round grve-bg-white grve-bg-hover-primary-2 grve-toggle-hiddenarea"><span>Learn More</span></a></div></div></div></div></div><div class="grve-background-wrapper"></div></div></div><div class="grve-footer-wrapper"><div class="grve-widget-area"><div class="grve-container grve-padding-top-2x grve-padding-bottom-1x "><div class="grve-row grve-columns-gap-30"><div class="wpb_column grve-column grve-column-1-2 grve-tablet-column-1-2"><div class="grve-column-wrapper"><div id="media_image-2" class="grve-widget widget widget_media_image"><a href="/"><img width="476" height="128" src="https://sscs.ieee.org/wp-content/uploads/ieee-sscs-sm-ko-logo2x.png" class="image wp-image-1260 attachment-full size-full" alt="IEEE Solid-State Circuits Society logo" style="max-width: 100%; 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