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class="share-wechat"><i class="icon icon-wechat"></i><span>微信</span></a> </div> <div class="content-box"> <h1 class="title" id="title">秋水半导体获数千万元天使+轮投资 全球首创无损Micro-LED芯片</h1> <div class="info"> <span style="padding-right:1em">日期：2024-11-12</span> <span id="hits">阅读：336</span> </div> <div class="introduce">核心提示：11月18-21日，第十届国际第三代半导体论坛（IFWS2024）&第二十一届中国国际半导体照明论坛（SSLCHINA2024）、先进半导体技术应用创新展（CASTAS）将在苏州国际博览中心举办。秋水半导体董事长蒋振宇将出席论坛，并将在”Mini/Micro-LED技术产业应用峰会”带来《基于混合键合的无损Micro-LED芯片技术》的大会报告。 敬请关注！</div><div id="content"><div class="content" id="article"><p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/12/140820561.jpg" alt="头图" width="668" height="284" /></p> <p>据“硬氪”消息，Micro-LED显示技术公司秋水半导体近日已连续完成了数千万元人民币的天使轮及天使+轮融资，由英诺天使基金领投，力合资本、汕韩光层和数字光芯跟投，兴棠资本担任其长期财务顾问。据了解，本轮资金主要用于Micro-LED技术的研发与工艺验证。</p> <p>资料显示，秋水半导体成立于2022年11月，是一家专注于Micro-LED显示技术的半导体公司。公司的主要产品为Micro-LED微显示芯片与模组，覆盖应用领域包括数字车灯、微投影和AR显示等。秋水半导体的创立，源于创始人蒋振宇博士在宾夕法尼亚州立大学读博期间的研究。作为专利第一发明人，蒋振宇博士开创了Gap-free Microdisplay技术，该技术在全球首次提出采用离子轰击而非刻蚀的方法来改善材料损伤的问题。</p> <p>公司团队进一步发明了一种全新的技术路线——无损（Damage-free）Micro-LED芯片技术。这项技术采用电性绝缘结构替代物理绝缘方式，在无材料损伤的情况下实现了像素点的电性隔离，有效解决了传统Micro-LED芯片生产中因刻蚀工艺带来的材料损伤问题，提升了芯片的效率和稳定性，为Micro-LED芯片的大规模量产提供了可能性。秋水半导体采用了Hybrid Bo<em></em>nding 3D半导体封装工艺，采用先进半导体工艺制程，全面提升了Micro-LED芯片的制程工艺水平，一定程度上提升芯片的良率，降低成本。据了解，秋水半导体是国内首个报道实现基于8英寸混合键合先进制程的Micro-LED初创公司。</p> <p>当前，秋水半导体的第一代产品车灯芯片已给客户送样，预计明年可实现量产。团队方面，秋水半导体拥有无损Micro-LED技术路线等一系列专利，其核心技术团队是中国混合键合技术的开拓者之一，拥有成熟的量产工艺经验。团队成员具备深厚的专业知识和丰富的行业经验，曾实现最小pitch 0.7微米的混合键合量产工艺开发。</p> <p>2024年11月18-21日，第十届国际第三代半导体论坛（IFWS2024）&第二十一届中国国际半导体照明论坛（SSLCHINA2024）、先进半导体技术应用创新展（CASTAS）将在苏州国际博览中心举办。苏州秋水半导体科技有限公司董事长蒋振宇将出席论坛，并将在”Mini/Micro-LED技术产业应用峰会”带来《基于混合键合的无损Micro-LED芯片技术》的大会报告。 敬请关注！</p> <p><b>报告嘉宾</b></p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/12/140935361.jpg" alt="蒋振宇" width="300" height="367" /></p> <p align="center">蒋振宇</p> <p align="center">苏州秋水半导体科技有限公司董事长 </p> <p><strong>演讲报告</strong>：基于混合键合的无损Micro-LED芯片术 </p> <p><strong>演讲场次</strong>：Mini/Micro-LED技术产业应用峰会</p> <p><strong>峰会详细日程</strong></p> <table border="1" cellspacing="0"> <tbody> <tr> <td width="699" valign="top" colspan="2"> <p align="center"><b>产业峰会：</b><b>Mini/Micro-LED技术产业应用峰会</b></p> <p align="center"><b>Industrial Summit: Application of Mini/Micro-LED Summit</b></p> </td> </tr> <tr> <td width="699" valign="top" colspan="2"> <p><b>时间：</b><b>2024年11月20日</b><b> </b><b>13</b><b>:</b><b>2</b><b>0</b><b>-</b><b>1</b><b>8</b><b>:</b><b>0</b><b>0</b></p> <p><b>地点：</b><b>苏州国际博览中心</b><b>G馆 • G105</b></p> <p><b>Time: </b><b>Nov 20, 13</b><b>:</b><b>2</b><b>0</b><b>-</b><b>1</b><b>8</b><b>:</b><b>0</b><b>0</b></p> <p><b>Location:</b><b> </b><b>Suzhou Internatio<em></em>nal Expo Centre • G105</b></p> </td> </tr> <tr> <td width="104" valign="top"> <p><b>协办单位 </b><b> </b></p> </td> <td width="595" valign="top"> <p><b>国家第三代半导体技术创新中心（苏州）</b></p> <p>Natio<em></em>nal Center of Technology Innovation for Wide Bandgap Semico<em></em>nductors (Suzhou)</p> <p><b>北京北方华创微电子装备有限公司</b></p> <p>Beijing Naura Microelectro<em></em>nics Equipment Co., Ltd.</p> <p><b>苏州思体尔软件科技有限公司</b></p> <p>Suzhou STR Software Technology Co. Ltd.</p> <p><b>元旭半导体科技股份有限公司</b></p> <p>INNOSHINE Technology Co., Ltd.</p> </td> </tr> <tr> <td width="104" valign="top"> <p><b>主持人</b></p> <p><b>Moderator</b></p> </td> <td width="595" valign="top"> <p><b>刘纪美/</b><b>Kei May LAU </b></p> <p><b>美国国家工程院院士、香港科技大学讲席教授</b></p> <p>Member of Natio<em></em>nal Academy of Engineering, Chair Professor at the Hong Kong University of Science & Technology (HKUST)</p> <p> </p> <p><b>孙小卫/</b><b>SUN Xiaowei</b></p> <p><b>南方科技大学纳米科学与应用研究院执行院长、讲席教授</b></p> <p>Chair Professor at SUSTech, Executive Dean of Institute of Nanoscience and Applications at SUSTech</p> <p> </p> <p><b>刘 斌/</b><b>LIU Bin</b></p> <p><b>南京大学电子科学与工程学院副院长、教授</b></p> <p>Associate Dean & Professor of School of Electro<em></em>nic Science and Engineering at Nanjing University</p> <p> </p> <p><b>汪 莱/</b><b>WANG Lai</b></p> <p><b>清华大学教授</b></p> <p>Professor of Tsinghua University</p> </td> </tr> <tr> <td width="104" valign="top"> <p><b>13:</b><b>20</b><b>-1</b><b>3</b><b>:</b><b>3</b><b>0</b></p> </td> <td width="595" valign="top"> <p><b>嘉宾致辞 </b><b>& </b><b>合影 /</b><b> Opening</b><b> Address</b><b> & </b><b>Group</b><b> </b><b>Photo</b><b>shooting</b></p> </td> </tr> <tr> <td width="104" valign="top"> <p><b>1</b><b>3</b><b>:</b><b>3</b><b>0-1</b><b>3</b><b>:</b><b>5</b><b>0</b></p> </td> <td width="595" valign="top"> <p><b>MicroLED的量產策略 </b></p> <p>MicroLED Mass Production Strategy</p> <p><b>李允立</b>——<b>台湾錼创科技董事长</b></p> <p>Yun-Li (Charles) Li——President of PlayNitride Inc.</p> </td> </tr> <tr> <td width="104" valign="top"> <p><b>1</b><b>3</b><b>:</b><b>5</b><b>0-14:</b><b>10</b></p> </td> <td width="595" valign="top"> <p><b>从芯到屏，垂直整合</b>——<b>开启Micro-LED智慧显示时代</b></p> <p>From Chip to Screen, Vertical Integration - Open the Era of Micro-LED Smart Display</p> <p><b>席光义</b>——<b>元旭半导体科技股份有限公司董事会主席兼CEO</b></p> <p>XI Guangyi——Chairman and CEO of Novoshine</p> </td> </tr> <tr> <td width="104" valign="top"> <p><b>14:</b><b>10</b><b>-14:</b><b>30</b></p> </td> <td width="595" valign="top"> <p><b>显示用Micro</b><b>-</b><b>LED芯片与集成技术新进展</b></p> <p>New Progress of Micro-LED Chip and Integration Technology for Display</p> <p><b>黄凯</b>——<b>厦门大学物理科学与技术学院副院长、教授</b></p> <p>HUANG Kai——Deputy Dean & Professor of College of Physical Science and Technology, Xiamen University</p> </td> </tr> <tr> <td width="104" valign="top"> <p><b>14:</b><b>30</b><b>-14:</b><b>50</b></p> </td> <td width="595" valign="top"> <p><b>基于量子点光刻技术的 0.18cc全彩Micro-LED光机</b></p> <p>0.18cc Full-color Micro-LED Light Engine Powered by QDPR Technology</p> <p><b>庄永漳</b>——<b>镭昱光电科技(苏州)有限公司创始人兼CEO</b></p> <p>Eddie CHONG——Founder & CEO of Raysolve Optoelectro<em></em>nics (Suzhou) Company Limited.</p> </td> </tr> <tr> <td width="104" valign="top"> <p><b>14:</b><b>50</b><b>-15:</b><b>10</b></p> </td> <td width="595" valign="top"> <p><b>探索多元</b><b>Mini-LED显示技术进阶之路</b></p> <p>Explore the Advanced Road Multiple Mini-LED Display Technology</p> <p><b>刘传标</b>——<b>广州市鸿利显示电子有限公司总经理</b></p> <p>LIU Chuanbiao——General Manager of Hongli-gx Light</p> </td> </tr> <tr> <td width="104" valign="top"> <p><b>15:</b><b>10</b><b>-15:</b><b>25</b></p> </td> <td width="595" valign="top"> <p><b>茶歇 </b><b>/ Coffee Break</b></p> </td> </tr> <tr> <td width="104" valign="top"> <p><b>15:</b><b>2</b><b>5-15:</b><b>4</b><b>5</b></p> </td> <td width="595" valign="top"> <p><b>玻璃基TFT Micro-LED拼接屏的机遇和挑战</b></p> <p>Opportunities and Challenges of TFT Micro-LED Display</p> <p><b>曹轩</b>——<b>成都辰显光电有限公司副总经理</b></p> <p>Carl CAO——Vice General Manager & CTO of Chengdu Vistar Optoelectro<em></em>nics Co., Ltd.</p> </td> </tr> <tr> <td width="104" valign="top"> <p><b>15:</b><b>4</b><b>5-16:</b><b>0</b><b>5</b></p> </td> <td width="595" valign="top"> <p><b>基于混合键合的无损Micro-LED芯片技术</b></p> <p>Damage-free Micro-LED ba<em></em>sed on Hybrid Bo<em></em>nding Technology</p> <p><b>蒋振宇</b>——<b>苏州秋水半导体科技有限公司董事长</b></p> <p>JIANG Zhenyu——President of Suzhou QiuShui Semico<em></em>nductor Technology Inc.</p> </td> </tr> <tr> <td width="104" valign="top"> <p><b>16:</b><b>0</b><b>5-16:</b><b>2</b><b>5</b></p> </td> <td width="595" valign="top"> <p><b>CSP芯片级封装在Mini-LED背光中的应用进展</b></p> <p>The Progress of Chip Scale Package in Mini-LED TV Backlighting”</p> <p><b>刘国旭</b>——<b>北京易美新创科技有限公司CTO、执行副总裁</b></p> <p>LIU Guoxu——CTO & Executive VP of ShineOn Innovation Technology Co., Ltd</p> </td> </tr> <tr> <td width="104" valign="top"> <p><b>16:</b><b>2</b><b>5-16:</b><b>4</b><b>5</b></p> </td> <td width="595" valign="top"> <p><b>基于纳米压印全生态产业平台的微纳光学器件制造</b></p> <p>Manufacturing of Micro and Nano Optical Devices ba<em></em>sed on Nanoimprint Eco-industrial Platform</p> <p><b>罗刚</b>——<b>材料科学姑苏实验室研究员、苏州新维度微纳科技有限公司创始人</b></p> <p>LUO Gang——Professor of Gusu Lab, Founder of NDnano</p> </td> </tr> <tr> <td width="104" valign="top"> <p><b>16:45-17:05</b></p> </td> <td width="595" valign="top"> <p><b>面向Micro-LED封装的先进半导体键合集成技术</b></p> <p>Advanced Semico<em></em>nductor 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