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The object" /> <meta property="article:author" content="https://independent.academia.edu/IanAcworth" /> <meta name="description" content="Current Determination of Additives Damascene, or acid copper plating baths, have been in use since the mid 19th century on decorative items and machinery.1,2 The process generally uses copper sulfate and sulfuric acid in an aqueous medium. The object" /> <title>(PDF) Measurement and Control of Copper Additives in Electroplating Baths by High-Performance Liquid Chromatography</title> <link rel="canonical" href="https://www.academia.edu/111644955/Measurement_and_Control_of_Copper_Additives_in_Electroplating_Baths_by_High_Performance_Liquid_Chromatography" /> <script async src="https://www.googletagmanager.com/gtag/js?id=G-5VKX33P2DS"></script> <script> window.dataLayer = window.dataLayer || []; function gtag(){dataLayer.push(arguments);} gtag('js', new Date()); gtag('config', 'G-5VKX33P2DS', { cookie_domain: 'academia.edu', send_page_view: false, }); gtag('event', 'page_view', { 'controller': "single_work", 'action': "show", 'controller_action': 'single_work#show', 'logged_in': 'false', 'edge': 'unknown', // Send nil if there is no A/B test bucket, in case some records get logged // with missing data - that way we can distinguish between the two cases. // ab_test_bucket should be of the form <ab_test_name>:<bucket> 'ab_test_bucket': null, }) </script> <script> var $controller_name = 'single_work'; var $action_name = "show"; var $rails_env = 'production'; var $app_rev = 'b092bf3a3df71cf13feee7c143e83a57eb6b94fb'; var $domain = 'academia.edu'; var $app_host = "academia.edu"; var $asset_host = "academia-assets.com"; var $start_time = new Date().getTime(); var $recaptcha_key = "6LdxlRMTAAAAADnu_zyLhLg0YF9uACwz78shpjJB"; var $recaptcha_invisible_key = "6Lf3KHUUAAAAACggoMpmGJdQDtiyrjVlvGJ6BbAj"; var $disableClientRecordHit = false; </script> <script> window.require = { config: function() { return function() {} } } </script> <script> window.Aedu = window.Aedu || {}; window.Aedu.hit_data = null; window.Aedu.serverRenderTime = new Date(1739810471000); window.Aedu.timeDifference = new Date().getTime() - 1739810471000; </script> <script type="application/ld+json">{"@context":"https://schema.org","@type":"ScholarlyArticle","abstract":"Current Determination of Additives Damascene, or acid copper plating baths, have been in use since the mid 19th century on decorative items and machinery.1,2 The process generally uses copper sulfate and sulfuric acid in an aqueous medium. The object to be plated is placed into the bath, which is attached to a cathode in a direct current circuit. When power is applied, the copper (II) ions in solution are reduced at the cathode, forming a metallic copper film on the substrate. Recently, copper has been incorporated into the fine wires (down to nanometer widths) in integrated chips, requiring careful control of the plating process.","author":[{"@context":"https://schema.org","@type":"Person","name":"Ian Acworth","url":"https://independent.academia.edu/IanAcworth"}],"contributor":[],"dateCreated":"2023-12-17","datePublished":"2016-01-01","headline":"Measurement and Control of Copper Additives in Electroplating Baths by High-Performance Liquid 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The object to be plated is placed into the bath, which is attached to a cathode in a direct current circuit. When power is applied, the copper (II) ions in solution are reduced at the cathode, forming a metallic copper film on the substrate. Recently, copper has been incorporated into the fine wires (down to nanometer widths) in integrated chips, requiring careful control of the plating process.","publication_date":"2016,,"},"document_type":"paper","pre_hit_view_count_baseline":null,"quality":"high","language":"en","title":"Measurement and Control of Copper Additives in Electroplating Baths by High-Performance Liquid Chromatography","broadcastable":true,"draft":null,"has_indexable_attachment":true,"indexable":true}}["work"]; window.loswp.workCoauthors = [118808047]; window.loswp.locale = "en"; window.loswp.countryCode = "SG"; window.loswp.cwvAbTestBucket = ""; window.loswp.designVariant = "ds_vanilla"; window.loswp.fullPageMobileSutdModalVariant = "full_page_mobile_sutd_modal"; window.loswp.useOptimizedScribd4genScript = false; window.loginModal = {}; window.loginModal.appleClientId = 'edu.academia.applesignon'; window.userInChina = "false";</script><script defer="" src="https://accounts.google.com/gsi/client"></script><div class="ds-loswp-container"><div class="ds-work-card--grid-container"><div class="ds-work-card--container js-loswp-work-card"><div class="ds-work-card--cover"><div class="ds-work-cover--wrapper"><div class="ds-work-cover--container"><button class="ds-work-cover--clickable js-swp-download-button" data-signup-modal="{"location":"swp-splash-paper-cover","attachmentId":109122136,"attachmentType":"pdf"}"><img alt="First page of “Measurement and Control of Copper Additives in Electroplating Baths by High-Performance Liquid Chromatography”" class="ds-work-cover--cover-thumbnail" src="https://0.academia-photos.com/attachment_thumbnails/109122136/mini_magick20231217-1-zlsepw.png?1702830489" /><img alt="PDF Icon" class="ds-work-cover--file-icon" src="//a.academia-assets.com/images/single_work_splash/adobe_icon.svg" /><div class="ds-work-cover--hover-container"><span class="material-symbols-outlined" style="font-size: 20px" translate="no">download</span><p>Download Free PDF</p></div><div class="ds-work-cover--ribbon-container">Download Free PDF</div><div class="ds-work-cover--ribbon-triangle"></div></button></div></div></div><div class="ds-work-card--work-information"><h1 class="ds-work-card--work-title">Measurement and Control of Copper Additives in Electroplating Baths by High-Performance Liquid Chromatography</h1><div class="ds-work-card--work-authors ds-work-card--detail"><a class="ds-work-card--author js-wsj-grid-card-author ds2-5-body-md ds2-5-body-link" data-author-id="118808047" href="https://independent.academia.edu/IanAcworth"><img alt="Profile image of Ian Acworth" class="ds-work-card--author-avatar" src="//a.academia-assets.com/images/s65_no_pic.png" />Ian Acworth</a></div><div class="ds-work-card--detail"><p class="ds-work-card--detail ds2-5-body-sm">2016</p><div class="ds-work-card--work-metadata"><div class="ds-work-card--work-metadata__stat"><span class="material-symbols-outlined" style="font-size: 20px" translate="no">visibility</span><p class="ds2-5-body-sm" id="work-metadata-view-count">…</p></div><div class="ds-work-card--work-metadata__stat"><span class="material-symbols-outlined" style="font-size: 20px" translate="no">description</span><p class="ds2-5-body-sm">13 pages</p></div><div class="ds-work-card--work-metadata__stat"><span class="material-symbols-outlined" style="font-size: 20px" translate="no">link</span><p class="ds2-5-body-sm">1 file</p></div></div><script>(async () => { const workId = 111644955; const worksViewsPath = "/v0/works/views?subdomain_param=api&work_ids%5B%5D=111644955"; const getWorkViews = async (workId) => { const response = await fetch(worksViewsPath); if (!response.ok) { throw new Error('Failed to load work views'); } const data = await response.json(); return data.views[workId]; }; // Get the view count for the work - we send this immediately rather than waiting for // the DOM to load, so it can be available as soon as possible (but without holding up // the backend or other resource requests, because it's a bit expensive and not critical). const viewCount = await getWorkViews(workId); const updateViewCount = (viewCount) => { try { const viewCountNumber = parseInt(viewCount, 10); if (viewCountNumber === 0) { // Remove the whole views element if there are zero views. document.getElementById('work-metadata-view-count')?.parentNode?.remove(); return; } const commaizedViewCount = viewCountNumber.toLocaleString(); const viewCountBody = document.getElementById('work-metadata-view-count'); if (!viewCountBody) { throw new Error('Failed to find work views element'); } viewCountBody.textContent = `${commaizedViewCount} views`; } catch (error) { // Remove the whole views element if there was some issue parsing. document.getElementById('work-metadata-view-count')?.parentNode?.remove(); throw new Error(`Failed to parse view count: ${viewCount}`, error); } }; // If the DOM is still loading, wait for it to be ready before updating the view count. if (document.readyState === "loading") { document.addEventListener('DOMContentLoaded', () => { updateViewCount(viewCount); }); // Otherwise, just update it immediately. } else { updateViewCount(viewCount); } })();</script></div><p class="ds-work-card--work-abstract ds-work-card--detail ds2-5-body-md">Current Determination of Additives Damascene, or acid copper plating baths, have been in use since the mid 19th century on decorative items and machinery.1,2 The process generally uses copper sulfate and sulfuric acid in an aqueous medium. The object to be plated is placed into the bath, which is attached to a cathode in a direct current circuit. When power is applied, the copper (II) ions in solution are reduced at the cathode, forming a metallic copper film on the substrate. Recently, copper has been incorporated into the fine wires (down to nanometer widths) in integrated chips, requiring careful control of the plating process.</p><div class="ds-work-card--button-container"><button class="ds2-5-button js-swp-download-button" data-signup-modal="{"location":"continue-reading-button--work-card","attachmentId":109122136,"attachmentType":"pdf","workUrl":"https://www.academia.edu/111644955/Measurement_and_Control_of_Copper_Additives_in_Electroplating_Baths_by_High_Performance_Liquid_Chromatography"}">See full PDF</button><button class="ds2-5-button ds2-5-button--secondary js-swp-download-button" data-signup-modal="{"location":"download-pdf-button--work-card","attachmentId":109122136,"attachmentType":"pdf","workUrl":"https://www.academia.edu/111644955/Measurement_and_Control_of_Copper_Additives_in_Electroplating_Baths_by_High_Performance_Liquid_Chromatography"}"><span class="material-symbols-outlined" style="font-size: 20px" translate="no">download</span>Download PDF</button></div><div class="ds-signup-banner-trigger-container"><div class="ds-signup-banner-trigger ds-signup-banner-trigger-control"></div></div><div class="ds-signup-banner ds-signup-banner-control"><div id="ds-signup-banner-close-button"><button class="ds2-5-button ds2-5-button--secondary ds2-5-button--inverse"><span class="material-symbols-outlined" style="font-size: 20px" translate="no">close</span></button></div><div class="ds-signup-banner-ctas"><img src="//a.academia-assets.com/images/academia-logo-capital-white.svg" /><h4 class="ds2-5-heading-serif-sm">Sign up for access to the world's latest research</h4><button class="ds2-5-button ds2-5-button--inverse ds2-5-button--full-width js-swp-download-button" data-signup-modal="{"location":"signup-banner"}">Sign up for free<span class="material-symbols-outlined" style="font-size: 20px" translate="no">arrow_forward</span></button></div><div class="ds-signup-banner-divider"></div><div class="ds-signup-banner-reasons"><div class="ds-signup-banner-reasons-item"><span class="material-symbols-outlined" style="font-size: 24px" translate="no">check</span><span>Get notified about relevant papers</span></div><div class="ds-signup-banner-reasons-item"><span class="material-symbols-outlined" style="font-size: 24px" translate="no">check</span><span>Save papers to use in your research</span></div><div class="ds-signup-banner-reasons-item"><span class="material-symbols-outlined" style="font-size: 24px" translate="no">check</span><span>Join the discussion with peers</span></div><div class="ds-signup-banner-reasons-item"><span class="material-symbols-outlined" style="font-size: 24px" translate="no">check</span><span>Track your impact</span></div></div></div><script>(() => { // Set up signup banner show/hide behavior: // 1. 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The challenges for effective management of a copper damascene plating process have evolved due to early limitations and problems which were discovered, and then as more demands resulted from Chemical Mechanical Planarization issues, yield and reliability concerns, reduction in critical feature size and the shift to 300 mm wafers as well as the adoption of dielectric films with low dielectric constants. The demands have been addressed by adherence to quality control methodology, improvements in plater design and operation, advancements in plating electrolytes, and by new metrology tools and methodology. The key measurement areas outlined here are bath concentration measurement and control, film properties metrology, contamination issues, and defects. Particular attention is given to the use of electrochemical and optical methods with enhanced capabilities. This includes the use of chemometrics for electroanalytical bath concentration control and optical methods for film thickness, surface roughness, and film stress/wafer curvature measurements.</p><div class="ds-related-work--ctas"><button class="ds2-5-text-link ds2-5-text-link--inline js-swp-download-button" data-signup-modal="{"location":"wsj-grid-card-download-pdf-modal","work_title":"Review—Management of Copper Damascene Plating","attachmentId":112253089,"attachmentType":"pdf","work_url":"https://www.academia.edu/116002498/Review_Management_of_Copper_Damascene_Plating","alternativeTracking":true}"><span class="material-symbols-outlined" style="font-size: 18px" translate="no">download</span><span class="ds2-5-text-link__content">Download free PDF</span></button><a class="ds2-5-text-link ds2-5-text-link--inline js-wsj-grid-card-view-pdf" href="https://www.academia.edu/116002498/Review_Management_of_Copper_Damascene_Plating"><span class="ds2-5-text-link__content">View PDF</span><span class="material-symbols-outlined" style="font-size: 18px" translate="no">chevron_right</span></a></div></div><div class="ds-related-work--container js-wsj-grid-card" data-collection-position="1" data-entity-id="91878855" data-sort-order="default"><a class="ds-related-work--title js-wsj-grid-card-title ds2-5-body-md ds2-5-body-link" href="https://www.academia.edu/91878855/CVS_Control_of_Via_Fill_Acid_Copper_Electroplating_Baths">CVS Control of Via Fill Acid Copper Electroplating Baths</a><div class="ds-related-work--metadata"><a class="js-wsj-grid-card-author ds2-5-body-sm ds2-5-body-link" data-author-id="247811678" href="https://independent.academia.edu/RogerBernards">Roger Bernards</a></div><p class="ds-related-work--metadata ds2-5-body-xs">2015</p><p class="ds-related-work--abstract ds2-5-body-sm">Due to the increasing demands placed on acid copper plating solutions to perform via fill plating of blind micro vias it is critical that the plating additives be monitored precisely. This paper presents electrochemical techniques for analyzing additives commonly used in via fill plating baths. The additives, commonly referred to as suppressor, brightener and leveler, all need to be precisely monitored during the production process in order to achieve optimum via fill. Utilizing cyclic voltametric stripping (CVS), these additive types can be monitored with a single analytical instrument when the proper techniques are employed and the measurement procedures are optimized for each additive. Background: Via fill plating solutions are designed to fill a blind micro via or through hole completely with plated copper metal with a minimum of plating thickness on the surface of the printed circuit board (PCB). Blind micro vias of 75 um width and 75 um depth can be via fill plated with about ...</p><div class="ds-related-work--ctas"><button class="ds2-5-text-link ds2-5-text-link--inline js-swp-download-button" data-signup-modal="{"location":"wsj-grid-card-download-pdf-modal","work_title":"CVS Control of Via Fill Acid Copper Electroplating Baths","attachmentId":95040800,"attachmentType":"pdf","work_url":"https://www.academia.edu/91878855/CVS_Control_of_Via_Fill_Acid_Copper_Electroplating_Baths","alternativeTracking":true}"><span class="material-symbols-outlined" style="font-size: 18px" translate="no">download</span><span class="ds2-5-text-link__content">Download free PDF</span></button><a class="ds2-5-text-link ds2-5-text-link--inline js-wsj-grid-card-view-pdf" href="https://www.academia.edu/91878855/CVS_Control_of_Via_Fill_Acid_Copper_Electroplating_Baths"><span class="ds2-5-text-link__content">View PDF</span><span class="material-symbols-outlined" style="font-size: 18px" translate="no">chevron_right</span></a></div></div><div class="ds-related-work--container js-wsj-grid-card" data-collection-position="2" data-entity-id="92307687" data-sort-order="default"><a class="ds-related-work--title js-wsj-grid-card-title ds2-5-body-md ds2-5-body-link" href="https://www.academia.edu/92307687/Bath_Additive_and_Current_Density_Effects_on_Copper_Electroplating_Fill_of_Cu_Damascene_Structures">Bath Additive and Current Density Effects on Copper Electroplating Fill of Cu Damascene Structures</a><div class="ds-related-work--metadata"><a class="js-wsj-grid-card-author ds2-5-body-sm ds2-5-body-link" data-author-id="23570681" href="https://independent.academia.edu/CarpioRonald">Ronald Carpio</a></div><p class="ds-related-work--metadata ds2-5-body-xs">MRS Proceedings, 1999</p><p class="ds-related-work--abstract ds2-5-body-sm">ABSTRACTCopper electroplating has become the leading technology for gap fill of damascene structures on advanced interconnects. A key to developing a robust electroplating process that produces deposits free of voids and seams is understanding the role of the additive components, i.e., levelers, brighteners and wetting agents, and their relative diffusion/adsorption characteristics. Additionally, obtaining insight about the cathodic current/potential relationship is critical for maximizing the effectiveness of the additive components.Our results indicate that bath additive composition and the plating parameters (plating pulse frequency, and current density) play critical roles in the outcome of the Cu fill. SEM cross sectional analysis of timed partial electroplating fill studies show two types of fill, 1) conformal and 2) bottom-up. Conformal fill of features smaller than 0.25 μm with an aspect ratio (AR) of 4.0 tends to form seam voids in the center of the structure. These seam vo...</p><div class="ds-related-work--ctas"><button class="ds2-5-text-link ds2-5-text-link--inline js-swp-download-button" data-signup-modal="{"location":"wsj-grid-card-download-pdf-modal","work_title":"Bath Additive and Current Density Effects on Copper Electroplating Fill of Cu Damascene Structures","attachmentId":95350715,"attachmentType":"pdf","work_url":"https://www.academia.edu/92307687/Bath_Additive_and_Current_Density_Effects_on_Copper_Electroplating_Fill_of_Cu_Damascene_Structures","alternativeTracking":true}"><span class="material-symbols-outlined" style="font-size: 18px" translate="no">download</span><span class="ds2-5-text-link__content">Download free PDF</span></button><a class="ds2-5-text-link ds2-5-text-link--inline js-wsj-grid-card-view-pdf" href="https://www.academia.edu/92307687/Bath_Additive_and_Current_Density_Effects_on_Copper_Electroplating_Fill_of_Cu_Damascene_Structures"><span class="ds2-5-text-link__content">View PDF</span><span class="material-symbols-outlined" style="font-size: 18px" translate="no">chevron_right</span></a></div></div><div class="ds-related-work--container js-wsj-grid-card" data-collection-position="3" data-entity-id="98121840" data-sort-order="default"><a class="ds-related-work--title js-wsj-grid-card-title ds2-5-body-md ds2-5-body-link" href="https://www.academia.edu/98121840/Effects_of_additives_and_chelating_agents_on_electroless_copper_plating">Effects of additives and chelating agents on electroless copper plating</a><div class="ds-related-work--metadata"><a class="js-wsj-grid-card-author ds2-5-body-sm ds2-5-body-link" data-author-id="72366614" href="https://independent.academia.edu/ShiChernYen">ShiChern Yen</a></div><p class="ds-related-work--metadata ds2-5-body-xs">Applied Surface Science, 2001</p><p class="ds-related-work--abstract ds2-5-body-sm">In this study, ethylenediaminetetraacetic acid (EDTA), triethanolamine (TEA), and ethylenediamine (En) were adopted herein as additives or chelating agents in electroless copper plating, with formaldehyde as the reduction agent. Linear sweep voltammetry was successfully applied to analyze the potential shift of copper complexes and the adsorption capability of chelating agents on a surface. Moreover, the grain size and surface roughness of copper were investigated using atomic force microscopy (AFM). The experimental results for a dual-chelating-agent system indicated that EDTA plays an important role in chelating, while the main effect of TEA is adsorption on copper surfaces to inhibit formaldehyde oxidation. Meanwhile, ethylenediamene is a prominent re®ning agent owing to its markedly higher adsorption strength on copper surfaces than formaldehyde and TEA. The analyses including linear sweep voltammetry, AFM, and XRD are effective to explore the effect of chelating agents and additives on electroless copper plating and deposits.</p><div class="ds-related-work--ctas"><button class="ds2-5-text-link ds2-5-text-link--inline js-swp-download-button" data-signup-modal="{"location":"wsj-grid-card-download-pdf-modal","work_title":"Effects of additives and chelating agents on electroless copper plating","attachmentId":99559803,"attachmentType":"pdf","work_url":"https://www.academia.edu/98121840/Effects_of_additives_and_chelating_agents_on_electroless_copper_plating","alternativeTracking":true}"><span class="material-symbols-outlined" style="font-size: 18px" translate="no">download</span><span class="ds2-5-text-link__content">Download free PDF</span></button><a class="ds2-5-text-link ds2-5-text-link--inline js-wsj-grid-card-view-pdf" href="https://www.academia.edu/98121840/Effects_of_additives_and_chelating_agents_on_electroless_copper_plating"><span class="ds2-5-text-link__content">View PDF</span><span class="material-symbols-outlined" style="font-size: 18px" translate="no">chevron_right</span></a></div></div><div class="ds-related-work--container js-wsj-grid-card" data-collection-position="4" data-entity-id="98781299" data-sort-order="default"><a class="ds-related-work--title js-wsj-grid-card-title ds2-5-body-md ds2-5-body-link" href="https://www.academia.edu/98781299/Roles_of_Additives_in_Damascene_Copper_Electropolishing">Roles of Additives in Damascene Copper Electropolishing</a><div class="ds-related-work--metadata"><a class="js-wsj-grid-card-author ds2-5-body-sm ds2-5-body-link" data-author-id="140130486" href="https://independent.academia.edu/ShihSongCheng">Shih-Song Cheng</a></div><p class="ds-related-work--metadata ds2-5-body-xs">Journal of The Electrochemical Society, 2006</p><p class="ds-related-work--abstract ds2-5-body-sm">This study explores how the dissolution of damascene Cu depends on accelerators of organic acids in alcohol-containing H 3 PO 4 electropolishing electrolytes. Four two-additive electrolytes that contain different accelerators, acetic, citric, citrazinic, and benzoic acids, are evaluated. At the bottom of damascene features, an esterification reaction between alcohols and organic acids efficiently forms a highly resistive layer and reduces the acidity of the solution. Accordingly, outside the damascene features, the rate of removal of Cu is dominated by the acidity of electrolytes but, inside the features, it is also determined by the resistance of the viscous layer. For a weak acidic additive, acetic acid, an extremely high additive concentration is introduced to sustain the moderate acidity of the solution to initiate intense esterification. Therefore, acetic-acid-based two-additive electrolytes exhibit excellent Cu planarization capability.</p><div class="ds-related-work--ctas"><button class="ds2-5-text-link ds2-5-text-link--inline js-swp-download-button" data-signup-modal="{"location":"wsj-grid-card-download-pdf-modal","work_title":"Roles of Additives in Damascene Copper Electropolishing","attachmentId":100039446,"attachmentType":"pdf","work_url":"https://www.academia.edu/98781299/Roles_of_Additives_in_Damascene_Copper_Electropolishing","alternativeTracking":true}"><span class="material-symbols-outlined" style="font-size: 18px" translate="no">download</span><span class="ds2-5-text-link__content">Download free PDF</span></button><a class="ds2-5-text-link ds2-5-text-link--inline js-wsj-grid-card-view-pdf" href="https://www.academia.edu/98781299/Roles_of_Additives_in_Damascene_Copper_Electropolishing"><span class="ds2-5-text-link__content">View PDF</span><span class="material-symbols-outlined" style="font-size: 18px" translate="no">chevron_right</span></a></div></div><div class="ds-related-work--container js-wsj-grid-card" data-collection-position="5" data-entity-id="54029511" data-sort-order="default"><a class="ds-related-work--title js-wsj-grid-card-title ds2-5-body-md ds2-5-body-link" href="https://www.academia.edu/54029511/Local_electrochemical_investigation_of_copper_patina">Local electrochemical investigation of copper patina</a><div class="ds-related-work--metadata"><a class="js-wsj-grid-card-author ds2-5-body-sm ds2-5-body-link" data-author-id="38127025" href="https://independent.academia.edu/HMelo1">H. Melo</a></div><p class="ds-related-work--metadata ds2-5-body-xs">2012</p><p class="ds-related-work--abstract ds2-5-body-sm">Local electrochemical investigation of copper patina</p><div class="ds-related-work--ctas"><button class="ds2-5-text-link ds2-5-text-link--inline js-swp-download-button" data-signup-modal="{"location":"wsj-grid-card-download-pdf-modal","work_title":"Local electrochemical investigation of copper patina","attachmentId":70590700,"attachmentType":"pdf","work_url":"https://www.academia.edu/54029511/Local_electrochemical_investigation_of_copper_patina","alternativeTracking":true}"><span class="material-symbols-outlined" style="font-size: 18px" translate="no">download</span><span class="ds2-5-text-link__content">Download free PDF</span></button><a class="ds2-5-text-link ds2-5-text-link--inline js-wsj-grid-card-view-pdf" href="https://www.academia.edu/54029511/Local_electrochemical_investigation_of_copper_patina"><span class="ds2-5-text-link__content">View PDF</span><span class="material-symbols-outlined" style="font-size: 18px" translate="no">chevron_right</span></a></div></div><div class="ds-related-work--container js-wsj-grid-card" data-collection-position="6" data-entity-id="61833015" data-sort-order="default"><a class="ds-related-work--title js-wsj-grid-card-title ds2-5-body-md ds2-5-body-link" href="https://www.academia.edu/61833015/AFM_Studies_of_the_Effect_of_Chloride_Ion_on_the_Morphology_of_the_Copper_Electroplating_Surface">AFM Studies of the Effect of Chloride Ion on the Morphology of the Copper Electroplating Surface</a><div class="ds-related-work--metadata"><a class="js-wsj-grid-card-author ds2-5-body-sm ds2-5-body-link" data-author-id="101987687" href="https://independent.academia.edu/SharifiSoheil">Soheil Sharifi</a></div><p class="ds-related-work--metadata ds2-5-body-xs">Optics, 2014</p><p class="ds-related-work--abstract ds2-5-body-sm">The influence of plating mode, chloride ion on morphology of copper deposits has been studied on pure copper substrate. The electroplating was conducted at 50 , 25°C in cupric sulfate-sulfuric acid bath with various chloride additions 0.001-0.01 ml. The morphology and grain sizes of the electrodeposited copper were examined by atomic force microscopy. The maximum surface roughness and grain sizes of copper deposit were obtained when it was deposited with 0.01 ml of chloride ions. Small particles were observed on the surface of the copper film electroplated with the addition of chloride ions up to the amount of 0.001 ml.</p><div class="ds-related-work--ctas"><button class="ds2-5-text-link ds2-5-text-link--inline js-swp-download-button" data-signup-modal="{"location":"wsj-grid-card-download-pdf-modal","work_title":"AFM Studies of the Effect of Chloride Ion on the Morphology of the Copper Electroplating Surface","attachmentId":74768253,"attachmentType":"pdf","work_url":"https://www.academia.edu/61833015/AFM_Studies_of_the_Effect_of_Chloride_Ion_on_the_Morphology_of_the_Copper_Electroplating_Surface","alternativeTracking":true}"><span class="material-symbols-outlined" style="font-size: 18px" translate="no">download</span><span class="ds2-5-text-link__content">Download free PDF</span></button><a class="ds2-5-text-link ds2-5-text-link--inline js-wsj-grid-card-view-pdf" href="https://www.academia.edu/61833015/AFM_Studies_of_the_Effect_of_Chloride_Ion_on_the_Morphology_of_the_Copper_Electroplating_Surface"><span class="ds2-5-text-link__content">View PDF</span><span class="material-symbols-outlined" style="font-size: 18px" translate="no">chevron_right</span></a></div></div><div class="ds-related-work--container js-wsj-grid-card" data-collection-position="7" data-entity-id="89895827" data-sort-order="default"><a class="ds-related-work--title js-wsj-grid-card-title ds2-5-body-md ds2-5-body-link" href="https://www.academia.edu/89895827/Determination_of_chloride_in_acid_copper_plating_bath">Determination of chloride in acid copper plating bath</a><div class="ds-related-work--metadata"><a class="js-wsj-grid-card-author ds2-5-body-sm ds2-5-body-link" data-author-id="243539589" href="https://independent.academia.edu/EdwardKaiser2">Edward Kaiser</a></div><p class="ds-related-work--metadata ds2-5-body-xs">Lc Gc North America, 2002</p><p class="ds-related-work--abstract ds2-5-body-sm">The chloride concentration of an acid copper plating bath is critical to the quality of copper deposition. Ion chromatography (IC) with eluent generation and high-capacity anion-exchange columns provides a convenient method to accurately monitor the chloride concentration of this very acidic and highly ionic sample.</p><div class="ds-related-work--ctas"><button class="ds2-5-text-link ds2-5-text-link--inline js-swp-download-button" data-signup-modal="{"location":"wsj-grid-card-download-pdf-modal","work_title":"Determination of chloride in acid copper plating bath","attachmentId":93609640,"attachmentType":"pdf","work_url":"https://www.academia.edu/89895827/Determination_of_chloride_in_acid_copper_plating_bath","alternativeTracking":true}"><span class="material-symbols-outlined" style="font-size: 18px" translate="no">download</span><span class="ds2-5-text-link__content">Download free PDF</span></button><a class="ds2-5-text-link ds2-5-text-link--inline js-wsj-grid-card-view-pdf" href="https://www.academia.edu/89895827/Determination_of_chloride_in_acid_copper_plating_bath"><span class="ds2-5-text-link__content">View PDF</span><span class="material-symbols-outlined" style="font-size: 18px" translate="no">chevron_right</span></a></div></div><div class="ds-related-work--container js-wsj-grid-card" data-collection-position="8" data-entity-id="23117164" data-sort-order="default"><a class="ds-related-work--title js-wsj-grid-card-title ds2-5-body-md ds2-5-body-link" href="https://www.academia.edu/23117164/Effect_of_additives_on_Cu_electrodeposits_electrochemical_study_coupled_with_EQCM_measurements">Effect of additives on Cu electrodeposits: electrochemical study coupled with EQCM measurements</a><div class="ds-related-work--metadata"><a class="js-wsj-grid-card-author ds2-5-body-sm ds2-5-body-link" data-author-id="44891899" href="https://otmed.academia.edu/MarielleEyraud">Marielle Eyraud</a></div><p class="ds-related-work--metadata ds2-5-body-xs">Journal of Electroceramics, 2006</p><p class="ds-related-work--abstract ds2-5-body-sm">The effect of polyethylene glycol (PEG) and chloride ions on Cu electrodeposition mechanism is investigated. Using blank electrolyte, electrochemical measurements show that PEG adsorbs more or less on the electrode surface depending on the nature of this surface (copper, gold). Alternative current techniques and electrochemical quartz crystal microbalance (EQCM) experiments are performed at open circuit and under polarisation. They show that the PEG adsorption on the Cu electrode is weak at open circuit, but increases under polarisation. In complementary EQCM tests made on Au and on electrodeposited Cu, we conclude that the H 2 gas production reduces the apparent mass of the gold surface. In contrary on Cu, H 2 entrapped in the Cu deposit increases the mass. In all cases, there is an important mass hysteresis. Whatever the substrate, the addition of PEG + Cl − to solution has a beneficial effect by reducing this hysteresis due to the H 2 production. For Cu electrolytes, the PEG addition to solution has little effect, while the simultaneous PEG + Cl − addition inhibits both the Cu 2+ reduction current and the mass increase. Atomic force microscopy (AFM) images made on the deposits confirm the beneficial effect of the two additives in solution.</p><div class="ds-related-work--ctas"><button class="ds2-5-text-link ds2-5-text-link--inline js-swp-download-button" data-signup-modal="{"location":"wsj-grid-card-download-pdf-modal","work_title":"Effect of additives on Cu electrodeposits: electrochemical study coupled with EQCM measurements","attachmentId":43612941,"attachmentType":"pdf","work_url":"https://www.academia.edu/23117164/Effect_of_additives_on_Cu_electrodeposits_electrochemical_study_coupled_with_EQCM_measurements","alternativeTracking":true}"><span class="material-symbols-outlined" style="font-size: 18px" translate="no">download</span><span class="ds2-5-text-link__content">Download free PDF</span></button><a class="ds2-5-text-link ds2-5-text-link--inline js-wsj-grid-card-view-pdf" href="https://www.academia.edu/23117164/Effect_of_additives_on_Cu_electrodeposits_electrochemical_study_coupled_with_EQCM_measurements"><span class="ds2-5-text-link__content">View PDF</span><span class="material-symbols-outlined" style="font-size: 18px" translate="no">chevron_right</span></a></div></div><div class="ds-related-work--container js-wsj-grid-card" data-collection-position="9" data-entity-id="25773868" data-sort-order="default"><a class="ds-related-work--title js-wsj-grid-card-title ds2-5-body-md ds2-5-body-link" href="https://www.academia.edu/25773868/Initial_stages_of_copper_electrodeposition_in_the_presence_of_organic_additives">Initial stages of copper electrodeposition in the presence of organic additives</a><div class="ds-related-work--metadata"><a class="js-wsj-grid-card-author ds2-5-body-sm ds2-5-body-link" data-author-id="49518556" href="https://bas.academia.edu/AlexanderMilchev">Alexander A Milchev</a></div><p class="ds-related-work--metadata ds2-5-body-xs">Electrochimica Acta, 1993</p><p class="ds-related-work--abstract ds2-5-body-sm">The nucleation and growth kinetics of copper crystals electrochemically deposited on platinum and tungsten have been studied in the presence of a composite organic additive for bright copper plating. Data were obtained for the exchange current density io, for the transition coefficient ct of the copper ions, for the stationary nucleation rate 1st and for the size n k of the critical copper nucleus.</p><div class="ds-related-work--ctas"><button class="ds2-5-text-link ds2-5-text-link--inline js-swp-download-button" data-signup-modal="{"location":"wsj-grid-card-download-pdf-modal","work_title":"Initial stages of copper electrodeposition in the presence of organic additives","attachmentId":46130773,"attachmentType":"pdf","work_url":"https://www.academia.edu/25773868/Initial_stages_of_copper_electrodeposition_in_the_presence_of_organic_additives","alternativeTracking":true}"><span class="material-symbols-outlined" style="font-size: 18px" translate="no">download</span><span class="ds2-5-text-link__content">Download free PDF</span></button><a class="ds2-5-text-link ds2-5-text-link--inline js-wsj-grid-card-view-pdf" href="https://www.academia.edu/25773868/Initial_stages_of_copper_electrodeposition_in_the_presence_of_organic_additives"><span class="ds2-5-text-link__content">View PDF</span><span class="material-symbols-outlined" style="font-size: 18px" translate="no">chevron_right</span></a></div></div></div></div><div class="ds-sticky-ctas--wrapper js-loswp-sticky-ctas hidden"><div class="ds-sticky-ctas--grid-container"><div class="ds-sticky-ctas--container"><button class="ds2-5-button js-swp-download-button" data-signup-modal="{"location":"continue-reading-button--sticky-ctas","attachmentId":109122136,"attachmentType":"pdf","workUrl":null}">See full PDF</button><button class="ds2-5-button ds2-5-button--secondary js-swp-download-button" data-signup-modal="{"location":"download-pdf-button--sticky-ctas","attachmentId":109122136,"attachmentType":"pdf","workUrl":null}"><span class="material-symbols-outlined" style="font-size: 20px" translate="no">download</span>Download PDF</button></div></div></div><div class="ds-below-fold--grid-container"><div class="ds-work--container js-loswp-embedded-document"><div class="attachment_preview" data-attachment="Attachment_109122136" style="display: none"><div class="js-scribd-document-container"><div class="scribd--document-loading js-scribd-document-loader" style="display: block;"><img alt="Loading..." src="//a.academia-assets.com/images/loaders/paper-load.gif" /><p>Loading Preview</p></div></div><div style="text-align: center;"><div class="scribd--no-preview-alert js-preview-unavailable"><p>Sorry, preview is currently unavailable. 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href="https://www.academia.edu/80829210/New_non_cyanide_acidic_copper_electroplating_bath_based_on_glutamate_complexing_agent">New non-cyanide acidic copper electroplating bath based on glutamate complexing agent</a><div class="ds-related-work--metadata"><a class="js-related-work-grid-card-author ds2-5-body-sm ds2-5-body-link" data-author-id="106702346" href="https://independent.academia.edu/RashedBakdash">Rashed Bakdash</a></div><p class="ds-related-work--metadata ds2-5-body-xs">Surface and Coatings Technology, 2015</p><div class="ds-related-work--ctas"><button class="ds2-5-text-link ds2-5-text-link--inline js-swp-download-button" data-signup-modal="{"location":"wsj-grid-card-download-pdf-modal","work_title":"New non-cyanide acidic copper electroplating bath based on glutamate complexing 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ds2-5-body-link" href="https://www.academia.edu/89199590/An_electrochemical_approach_to_total_organic_carbon_control_in_printed_circuit_board_copper_sulfate_plating_baths_Part_II_Overall_system">An electrochemical approach to total organic carbon control in printed circuit board copper sulfate plating baths Part II: Overall system</a><div class="ds-related-work--metadata"><a class="js-related-work-grid-card-author ds2-5-body-sm ds2-5-body-link" data-author-id="242094955" href="https://independent.academia.edu/YvesMichelHenuset">Yves Michel Henuset</a></div><p class="ds-related-work--metadata ds2-5-body-xs">2002</p><div class="ds-related-work--ctas"><button class="ds2-5-text-link ds2-5-text-link--inline js-swp-download-button" data-signup-modal="{"location":"wsj-grid-card-download-pdf-modal","work_title":"An electrochemical approach to total organic carbon control in printed circuit board copper sulfate plating baths Part II: Overall system","attachmentId":93040750,"attachmentType":"pdf","work_url":"https://www.academia.edu/89199590/An_electrochemical_approach_to_total_organic_carbon_control_in_printed_circuit_board_copper_sulfate_plating_baths_Part_II_Overall_system","alternativeTracking":true}"><span class="material-symbols-outlined" style="font-size: 18px" translate="no">download</span><span class="ds2-5-text-link__content">Download free PDF</span></button><a class="ds2-5-text-link ds2-5-text-link--inline js-related-work-grid-card-view-pdf" href="https://www.academia.edu/89199590/An_electrochemical_approach_to_total_organic_carbon_control_in_printed_circuit_board_copper_sulfate_plating_baths_Part_II_Overall_system"><span class="ds2-5-text-link__content">View PDF</span><span class="material-symbols-outlined" style="font-size: 18px" translate="no">chevron_right</span></a></div></div><div class="ds-related-work--container js-related-work-sidebar-card" data-collection-position="5" data-entity-id="27589665" data-sort-order="default"><a class="ds-related-work--title js-related-work-grid-card-title ds2-5-body-md ds2-5-body-link" href="https://www.academia.edu/27589665/Surface_and_Morphological_Properties_of_Electrochemical_Composite_Copper_Layers">Surface and Morphological Properties of Electrochemical Composite Copper Layers</a><div class="ds-related-work--metadata"><a class="js-related-work-grid-card-author ds2-5-body-sm ds2-5-body-link" data-author-id="51567296" href="https://independent.academia.edu/MiroslavGojo">Miroslav Gojo</a></div><div class="ds-related-work--ctas"><button class="ds2-5-text-link ds2-5-text-link--inline js-swp-download-button" data-signup-modal="{"location":"wsj-grid-card-download-pdf-modal","work_title":"Surface and Morphological Properties of Electrochemical Composite Copper Layers","attachmentId":47851708,"attachmentType":"pdf","work_url":"https://www.academia.edu/27589665/Surface_and_Morphological_Properties_of_Electrochemical_Composite_Copper_Layers","alternativeTracking":true}"><span class="material-symbols-outlined" style="font-size: 18px" translate="no">download</span><span class="ds2-5-text-link__content">Download free PDF</span></button><a class="ds2-5-text-link ds2-5-text-link--inline js-related-work-grid-card-view-pdf" href="https://www.academia.edu/27589665/Surface_and_Morphological_Properties_of_Electrochemical_Composite_Copper_Layers"><span class="ds2-5-text-link__content">View PDF</span><span class="material-symbols-outlined" style="font-size: 18px" translate="no">chevron_right</span></a></div></div><div class="ds-related-work--container js-related-work-sidebar-card" data-collection-position="6" data-entity-id="110073211" data-sort-order="default"><a class="ds-related-work--title js-related-work-grid-card-title ds2-5-body-md ds2-5-body-link" href="https://www.academia.edu/110073211/A_comparison_of_three_methods_used_for_determining_chloride_in_acid_copper_sulfate_plating_bath_Gan_Yen_Shing">A comparison of three methods used for determining chloride in acid copper sulfate plating bath / Gan Yen Shing</a><div class="ds-related-work--metadata"><a class="js-related-work-grid-card-author ds2-5-body-sm ds2-5-body-link" data-author-id="279742784" href="https://independent.academia.edu/YenShingGan">Yen Shing Gan</a></div><p class="ds-related-work--metadata ds2-5-body-xs">2014</p><div class="ds-related-work--ctas"><button class="ds2-5-text-link ds2-5-text-link--inline js-swp-download-button" data-signup-modal="{"location":"wsj-grid-card-download-pdf-modal","work_title":"A comparison of three methods used for determining chloride in acid copper sulfate plating bath / Gan Yen 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