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<div class="col-xs-12"> <div class="header-social"> <div class="row"> <div class="col-xs-12 col-sm-8 col-md-5"> </div> <div class="hidden-xs col-xs-0 col-sm-4 col-md-4"></div> <div class="hidden-xs col-xs-0 col-sm-4 col-md-2"> </div> <div class="hidden-xs col-xs-0 col-sm-4 col-md-1"> <div class="social_btns" style="width:200px; float:right; display: none;"> <a class="social_btn" target="_blank" href="https://semiengineering.com/feed" title="rss" rel="alternate" type="application/rss+xml" title="rss feed"><i class="fa fa-rss fa-md"></i></a> <a class="social_btn" target="_blank" href="https://www.facebook.com/SemiEngineering" title="facebook" ><i class="fa fa-facebook fa-md"></i></a> <a class="social_btn" target="_blank" href="https://www.twitter.com/SemiEngineering" title="twitter" ><i class="fa fa-twitter fa-md"></i></a> <a class="social_btn" target="_blank" href="https://www.linkedin.com/company/semiconductor-engineering" title="linkedin" ><i class="fa fa-linkedin fa-md"></i></a> <a class="social_btn" target="_blank" href="https://www.youtube.com/user/SperlingMediaGroup" title="youtube" ><i class="fa fa-video-camera fa-md"></i></a> </div> </div> </div> </div> </div> </div> </div> </div> <div class="container"> <div class="row"> <div class="col-md-12"> <div class="bc_sb"> <div class="row"> <div class="col-xs-0 col-sm-0 col-md-7 hidden-sm hidden-xs" style="margin-top:4px; display: none;"> <a href="/">Home</a> > <a href="/">Home</a> > Critical Design Considerations For High-Bandwidth Chiplet Interconnects (TSMC) </div> <div class="col-xs-12 col-sm-12 col-md-12"> <div class="header_social_sharing"> <div class="header_social_sharing_panel">  <div class="sharethis-inline-share-buttons"></div> </div> </div> </div> </div> </div> </div> </div> </div> <div class="page_header"> <div class="container"> <div class="row"> <div class="col-xs-12"> <h1 class="page_title">tag: <span>advanced packaging</span></h1> </div> </div> </div> </div> <div class="container"> <div class="row"> <div class="col-sm-8 col-md-6 col-lg-6"> <div class="row"> <div class="col-md-12"> <div class="post_snippet_xl post_snippet_u"> <a href="https://semiengineering.com/critical-design-considerations-for-high-bandwidth-chiplet-interconnects-tsmc/" title="Critical Design Considerations For High-Bandwidth Chiplet Interconnects (TSMC)"><h1>Critical Design Considerations For High-Bandwidth Chiplet Interconnects (TSMC)</h1></a> <div class="loop_post_meta"> By <a href="https://semiengineering.com/author/technical-paper-link/">Technical Paper Link</a> - 26 Nov, 2024 - Comments: 0 </div> <br /> <div class="post_excerpt"> A new technical paper titled "High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions" was published by researchers at TSMC. Abstract: "The demand for chiplet integration using 2.5D and 3D advanced packaging technologies has surged, driven by the exponential growth in computing performance required by Artificial Intelligence a... <a href="https://semiengineering.com/critical-design-considerations-for-high-bandwidth-chiplet-interconnects-tsmc/">» read more</a> </div> <br /> </div> </div> </div> <div class="row"> <div class="col-md-12"> <div class="post_snippet_xl post_snippet_u"> <a href="https://semiengineering.com/analysis-of-multi-chiplet-package-designs-and-requirements-for-production-test-simplification/" title="Analysis Of Multi-Chiplet Package Designs And Requirements For Production Test Simplification"><h1>Analysis Of Multi-Chiplet Package Designs And Requirements For Production Test Simplification</h1></a> <div class="loop_post_meta"> By <a href="https://semiengineering.com/author/vineet-pancholi/">Vineet Pancholi</a> - 21 Nov, 2024 - Comments: 1 </div> <br /> <div class="post_excerpt"> In recent years there has been a sharp rise of multi-die system designs. Numerous publications targeting a large variety of applications exist in the public domain. One presentation [2] on the IEEE’s website does a good job of detailing the anecdotal path of multi-die systems by way of chiplet building blocks integrated within a single package [2]. The presentation includes references to a ha... <a href="https://semiengineering.com/analysis-of-multi-chiplet-package-designs-and-requirements-for-production-test-simplification/">» read more</a> </div> <br /> </div> </div> </div> <div class="row"> <div class="col-md-12"> <div class="post_snippet_xl post_snippet_u"> <a href="https://semiengineering.com/foplp-gains-traction-in-advanced-semiconductor-packaging/" title="FOPLP Gains Traction in Advanced Semiconductor Packaging"><h1>FOPLP Gains Traction in Advanced Semiconductor Packaging</h1></a> <div class="loop_post_meta"> By <a href="https://semiengineering.com/author/gregory-haley/">Gregory Haley</a> - 21 Nov, 2024 - Comments: 1 </div> <br /> <div class="post_excerpt"> Fan-Out Panel-Level Packaging (FOPLP) for advanced nodes, once hindered by manufacturability and yield challenges, is emerging as a promising solution to meet the industry’s demands for higher integration densities and cost efficiency. Traditionally, FOPLP has been a go-to solution for cost-sensitive applications in consumer electronics, IoT devices, and mid-tier automotive systems. Its ab... <a href="https://semiengineering.com/foplp-gains-traction-in-advanced-semiconductor-packaging/">» read more</a> </div> <br /> </div> </div> </div> <div class="row"> <div class="col-md-12"> <div class="post_snippet_xl post_snippet_u"> <a href="https://semiengineering.com/one-chip-vs-many-chiplets/" title="One Chip Vs. Many Chiplets"><h1>One Chip Vs. Many Chiplets</h1></a> <div class="loop_post_meta"> By <a href="https://semiengineering.com/author/esperling/">Ed Sperling</a> - 20 Nov, 2024 - Comments: 0 </div> <br /> <div class="post_excerpt"> Experts at the Table: Semiconductor Engineering sat down to discuss the growing list of challenges at advanced nodes and in advanced packages, with Jamie Schaeffer, vice president of product management at GlobalFoundries; Dechao Guo, director of advanced logic technology R&D at IBM; Dave Thompson, vice president at Intel; Mustafa Badaroglu, principal engineer at Qualcomm; and Thomas Ponnusw... <a href="https://semiengineering.com/one-chip-vs-many-chiplets/">» read more</a> </div> <br /> </div> </div> </div> <div class="row"> <div class="col-md-12"> <div class="post_snippet_xl post_snippet_u"> <a href="https://semiengineering.com/globally-asynchronous-locally-synchronous-clocks/" title="Globally Asynchronous, Locally Synchronous Clocks"><h1>Globally Asynchronous, Locally Synchronous Clocks</h1></a> <div class="loop_post_meta"> By <a href="https://semiengineering.com/author/esperling/">Ed Sperling</a> - 04 Nov, 2024 - Comments: 0 </div> <br /> <div class="post_excerpt"> Typical IC clocking schemes are under stress in complex chip/chiplet designs, where multiple compute elements may not be operating at the same frequency consistently. Some cores may be powered down to save energy, or they may age at different rates, which in turn reduces performance. 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Vertical integration techniques, such as multi-tier die stacking and hybrid bonding, enable increased integration density, therefore improving yield of high-quality devices. 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