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IFWS&SSLCHINA2024</h1> <div class="info"> <span style="padding-right:1em">日期：2024-12-02</span> <span style="padding-right:1em">来源：半导体产业网</span><span id="hits">阅读：376</span> </div> <div class="introduce">核心提示：“氮化镓射频电子器件与应用分会”上，深圳市汇芯通信技术有限公司、国家5G中高频器件创新中心副总经理、CTO 许明伟做了“FLAB：特色射频半导体的技术创新模式探索”的主题报告，分享了国家5G中高频器件创新中心FLAB三代特色半导体工艺技术创新的新模式，包括硬件建设、软件建设、开发体系、技术路线等。</div><div id="content"><div class="content" id="article"><p>当前，特色半导体领域中企业创新，面临着单一产品线企业不足以承担前期沉默成本，包括半导体工厂建设的资本支出和时间成本等诸多挑战。近日，第十届国际第三代半导体论坛&第二十一届中国国际半导体照明论坛（IFWS&SSLCHINA2024）在苏州召开。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202412/02/142835841.jpg" width="668" height="445" alt="" /></p> <p>期间，“氮化镓射频电子器件与应用分会”上，国家5G中高频器件创新中心/深圳市汇芯通信技术有限公司副总经理、CTO 做了“FLAB：特色射频半导体的技术创新模式探索”的主题报告，分享了国家5G中高频器件创新中心FLAB三代特色半导体工艺技术创新的新模式，包括硬件建设、软件建设、开发体系、技术路线等。</p> <p style="text-align: center;"> <img src="http://www.casmita.com/file/upload/202412/02/142848301.jpg" alt="许明伟" width="668" height="445" /><span><br /> </span><span style="text-align: start;">国家5G中高频器件创新中心/深圳市汇芯通信技术有限公司副总经理、</span><span style="text-align: start; text-indent: 2em;">CTO </span></p> <p>报告指出，特色半导体领域中企业创新，面临着单一产品线企业不足以承担前期沉默成本，包括半导体工厂建设的资本支出和时间成本；新企业往往无法同时具备的芯片从“市场应用-产品设计-工艺开发-工厂制造”的长链条的团队和相应的管理能力；行业领军企业同样需要在多样化的特色工艺路线上的具备量产条件的技术开发资源等挑战。 </p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202412/02/144708291.jpg" width="668" height="361" alt="" /></p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202412/02/144716931.jpg" width="668" height="348" alt="" /></p> <p style="text-align: center;">国家5G中高频器件创新中心的核心任务加速新材料/工艺/器件从中试到量产商用，创新地提出Lab-in-Fab的技术创新模式（简称FLAB模式）：在成熟的量产工艺线上建设三代半导体特色工艺线，并结合创新中心的内部技术中台支持合作伙伴的客制化特色半导体量产工艺创新，在业界首创地提出“0.49”开发业务边界内，赋能合作伙伴-特色半导体技术创新型企业和机构，助力伙伴在无沉默成本投入的条件下同时拥有专有工艺/产品创新能力与成熟工艺平台的量产能力。<img src="http://www.casmita.com/file/upload/202412/02/144727941.jpg" width="668" height="360" alt="" /></p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202412/02/144735901.jpg" width="668" height="372" alt="" /></p> <p>国家5G中高频器件创新中心在此模式下推进技术资源平台化/技术开发流程化/技术能力工具化，建成业界领先的硅基GaN有源器件和硅基AlN无源器件的模块化基线工艺平台，全流程的工具链支持和量产加速工具包，为合作伙伴的定制化工艺和器件开发提供了前所未有的技术创新体验。例如，在创新中心的硅基AlN无源器件的模块化基线工艺平台上，莫合作伙伴聚焦器件结构创新和先进工艺模块定制开发，包括DUV先进光刻工艺和小角度的金属薄膜刻蚀工艺，在两个月内实现一种11层光刻的高频滤波器器件的原型开发，并启动SPC统计工艺控制的数据收集。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202412/03/092932312.png" width="668" height="377" alt="" /></p> <p>此外，创新中心与资本紧密配合，打造技术资源+资本赋能的特色半导体技术创新生态，坚信三代半特色半导体的长期价值创造在于细分市场的应用需求和半导体技术和产品创新的高效匹配。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202412/03/092923832.png" width="668" height="376" alt="" /></p> <p><strong>关于汇芯通信</strong></p> <p>深圳市汇芯通信技术有限公司由深圳市政府、清华大学、南方科技大学发起，联合多家5G产业链上下游龙头企业和上市公司共同成立，是目前我国在5G移动通信领域唯一的国家级制造业创新中心“国家5G中高频器件创新中心”的依托公司，专注于5G通信中高频器件领域前沿技术和共性关键技术的研发供给、转移扩散和首次商业化应用。目前在量产工艺线上建设了硅基氮化物射频和毫米波量产工艺技术中试平台、特色工艺设计工具开发平台、射频和毫米波前端器件封测与验证平台三大公共技术服务平台，向产业链企业提供最专业的技术服务。</p> <p>（根据现场资料整理，仅供参考）  </p></div> </div> <div class="award"><div onclick="Go('http://www.casmita.com/member/award.php?mid=21&itemid=17295');">打赏</div></div><div id="comment" style="display:;"> <div class="block-head"><a href="http://www.casmita.com/comment/index.php?mid=21&itemid=17295"><b id="comment_count" class="px16 f_red">0</b> 条评论</a></div> <div id="comment_main"><div></div></div> </div> <script type="text/javascript" src="http://www.casmita.com/file/script/comment.js"></script> <div class="related"> <a href="http://www.casmita.com/news/search.php?kw="></a><a href="http://www.casmita.com/news/index.php?catid=6"></a> <div class="bui-box single-mode"> <div class="single-mode-rbox"> <div class="single-mode-rbox-inner"> <div 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