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data-rn-track-value="{"link-to-kiji-id-enc":"DGXZQOUC068M00W5A200C2000000","link-to-URL":"/tech-foresight/article/DGXZQOUC068M00W5A200C2000000/"}" href="/prime/tech-foresight/article/DGXZQOUC068M00W5A200C2000000"><div class="card_date__3gUsN"><time dateTime="2025-02-06T20:00:00.000Z">2月7日</time><div class="card_wappenContainer__pFxx1"><span class="card_wappen__2c48V">無料公開記事</span></div></div><div class="card_cardContent__6Mel9"><div><p class="card_title__JZXqr">事業に生かす　ビジネス視点の量子コンピューティング</p><p class="card_excerpt__tMda3">量子コンピューターの技術開発が加速しています。少し前まで実用的な「FTQC（誤り耐性型汎用量子コンピューター）」の実現は2050年ごろと見られていましたが、誤り訂正技術の急速な進化により、早期実現の期待が高まっています。それに伴い、産業利用に向けた企業の取り組みも増えてきました。ただし、量子コンピューターは既存のコンピューターと仕組みが大きく異なります。使いこなすには様々なノウハウが求められま</p></div><div class="card_imageContainer__QdZbL"><img alt="" loading="lazy" width="160" height="100" decoding="async" data-nimg="1" style="color:transparent;object-fit:contain" 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data-rn-track-value="{"link-to-kiji-id-enc":"DGXZQOUC052GZ0V00C25A2000000","link-to-URL":"/tech-foresight/article/DGXZQOUC052GZ0V00C25A2000000/"}" href="/prime/tech-foresight/article/DGXZQOUC052GZ0V00C25A2000000"><div class="card_date__3gUsN"><time dateTime="2025-02-05T20:00:00.000Z">2月6日</time></div><div class="card_cardContent__6Mel9"><div><p class="card_title__JZXqr">量子の強みは「最適化」と「解の多様性」　専門家解説</p><p class="card_excerpt__tMda3">量子コンピューティングのビジネスへの適用は現時点で限定的だ。将来の可能性を見据えて量子技術を正しく理解し、どのような価値を提供できるかを見極める必要がある。量子コンピューティングは未知の課題を解決できる技術であり、社会にとって不可欠なツールに進化する可能性を秘めている。「ビジネス視点で読み解く量子コンピューティング」では、量子技術をビジネスに生かすための情報を提供します。量子スタートアップQua</p></div><div class="card_imageContainer__QdZbL"><img alt="ビジネスで量子コンピューティングの強みを発揮するには様々なコツが必要になる（写真：IBM）" loading="lazy" width="160" height="100" decoding="async" data-nimg="1" style="color:transparent;object-fit:contain" srcSet="/prime/.resources/_next/image?url=https%3A%2F%2Farticle-image-ix.nikkei.com%2Fhttps%253A%252F%252Fimgix-proxy.n8s.jp%252FDSXZQO5961786005022025000000-1.jpg%3Fixlib%3Djs-2.3.2%26w%3D600%26h%3D375%26auto%3Dformat%252Ccompress%26fit%3Dcrop%26bg%3DFFFFFF%26fp-x%3D0.5%26fp-y%3D0.5%26fp-z%3D1%26crop%3Dfocalpoint%26s%3D892782bd25fcdaf6f9e5d66b987eaf5c&w=256&q=75 1x, /prime/.resources/_next/image?url=https%3A%2F%2Farticle-image-ix.nikkei.com%2Fhttps%253A%252F%252Fimgix-proxy.n8s.jp%252FDSXZQO5961786005022025000000-1.jpg%3Fixlib%3Djs-2.3.2%26w%3D600%26h%3D375%26auto%3Dformat%252Ccompress%26fit%3Dcrop%26bg%3DFFFFFF%26fp-x%3D0.5%26fp-y%3D0.5%26fp-z%3D1%26crop%3Dfocalpoint%26s%3D892782bd25fcdaf6f9e5d66b987eaf5c&w=384&q=75 2x" src="/prime/.resources/_next/image?url=https%3A%2F%2Farticle-image-ix.nikkei.com%2Fhttps%253A%252F%252Fimgix-proxy.n8s.jp%252FDSXZQO5961786005022025000000-1.jpg%3Fixlib%3Djs-2.3.2%26w%3D600%26h%3D375%26auto%3Dformat%252Ccompress%26fit%3Dcrop%26bg%3DFFFFFF%26fp-x%3D0.5%26fp-y%3D0.5%26fp-z%3D1%26crop%3Dfocalpoint%26s%3D892782bd25fcdaf6f9e5d66b987eaf5c&w=384&q=75"/><span class="card_credit__k14q5"></span></div></div></a><div class="stream-article-list_tagBarContainer__QF5_l"><div class="tag-bar-with-audio-save-button_container__dS_9P"><ul class="tags_tagList__kPgLB"><li class="tags_tag__wSkU2"><div class="ellipsis-button_ellipsisButton__cIsYK">…</div></li></ul><div class="tag-bar-with-audio-save-button_buttonList__RxWNu"></div></div></div></div></div><div class="stream-article-blocks_article__5vAqO"><div><a class="card_content__U9soM" data-rn-track="section-article" data-rn-track-value="{"link-to-kiji-id-enc":"DGXZQOUC051LT0V00C25A2000000","link-to-URL":"/tech-foresight/article/DGXZQOUC051LT0V00C25A2000000/"}" href="/prime/tech-foresight/article/DGXZQOUC051LT0V00C25A2000000"><div class="card_date__3gUsN"><time dateTime="2025-02-05T20:00:00.000Z">2月6日</time></div><div class="card_cardContent__6Mel9"><div><p class="card_title__JZXqr">ソシオネクスト、北米でSoC攻勢　ブロードコムに挑む</p><p class="card_excerpt__tMda3">ファブレス半導体メーカーのソシオネクストが海外市場で攻勢をかけている。2025年1月31日に開催した決算説明会では、北米でデータセンター向けと自動車向けSoC（システム・オン・チップ）、インドでデータセンター向けSoCの大型案件を受注したことを明かした。これら案件の売り上げは、2027年3月期から計上される見込みだ。特に北米市場は、生成AI（人工知能）需要を背景にデータセンターへの投資が急増し</p></div><div class="card_imageContainer__QdZbL"><img alt="ソシオネクストは米カリフォルニア州サンタクララ郡ミルピタスに米国本社を構える（出所：ソシオネクスト）" loading="lazy" width="160" height="100" decoding="async" data-nimg="1" style="color:transparent;object-fit:contain" srcSet="/prime/.resources/_next/image?url=https%3A%2F%2Farticle-image-ix.nikkei.com%2Fhttps%253A%252F%252Fimgix-proxy.n8s.jp%252FDSXZQO5961459005022025000000-1.png%3Fixlib%3Djs-2.3.2%26w%3D600%26h%3D375%26auto%3Dformat%252Ccompress%26fit%3Dcrop%26bg%3DFFFFFF%26fp-x%3D0.5%26fp-y%3D0.5%26fp-z%3D1%26crop%3Dfocalpoint%26q%3D75%26s%3D9c6d6b51e79e251b20cec907b5e48303&w=256&q=75 1x, /prime/.resources/_next/image?url=https%3A%2F%2Farticle-image-ix.nikkei.com%2Fhttps%253A%252F%252Fimgix-proxy.n8s.jp%252FDSXZQO5961459005022025000000-1.png%3Fixlib%3Djs-2.3.2%26w%3D600%26h%3D375%26auto%3Dformat%252Ccompress%26fit%3Dcrop%26bg%3DFFFFFF%26fp-x%3D0.5%26fp-y%3D0.5%26fp-z%3D1%26crop%3Dfocalpoint%26q%3D75%26s%3D9c6d6b51e79e251b20cec907b5e48303&w=384&q=75 2x" src="/prime/.resources/_next/image?url=https%3A%2F%2Farticle-image-ix.nikkei.com%2Fhttps%253A%252F%252Fimgix-proxy.n8s.jp%252FDSXZQO5961459005022025000000-1.png%3Fixlib%3Djs-2.3.2%26w%3D600%26h%3D375%26auto%3Dformat%252Ccompress%26fit%3Dcrop%26bg%3DFFFFFF%26fp-x%3D0.5%26fp-y%3D0.5%26fp-z%3D1%26crop%3Dfocalpoint%26q%3D75%26s%3D9c6d6b51e79e251b20cec907b5e48303&w=384&q=75"/><span class="card_credit__k14q5"></span></div></div></a><div class="stream-article-list_tagBarContainer__QF5_l"><div class="tag-bar-with-audio-save-button_container__dS_9P"><ul class="tags_tagList__kPgLB"><li class="tags_tag__wSkU2"><div class="ellipsis-button_ellipsisButton__cIsYK">…</div></li></ul><div class="tag-bar-with-audio-save-button_buttonList__RxWNu"></div></div></div></div></div><div class="stream-article-blocks_article__5vAqO"><div><a class="card_content__U9soM" data-rn-track="section-article" data-rn-track-value="{"link-to-kiji-id-enc":"DGXZQOUC292Q50Z20C25A1000000","link-to-URL":"/tech-foresight/article/DGXZQOUC292Q50Z20C25A1000000/"}" href="/prime/tech-foresight/article/DGXZQOUC292Q50Z20C25A1000000"><div class="card_date__3gUsN"><time dateTime="2025-01-29T20:00:00.000Z">1月30日</time></div><div class="card_cardContent__6Mel9"><div><p class="card_title__JZXqr">GaNパワー半導体、SiC超え視界に　日本先行も中国浮上</p><p class="card_excerpt__tMda3">炭化ケイ素（SiC）よりも低損失な窒化ガリウム（GaN）パワー素子の実現が見えてきた。「縦型」と呼ばれる構造を採用し、SiCパワー素子を上回る特性を示し始めた。半導体技術の国際学会「IEDM 2024」（2024年12月7〜11日、米サンフランシスコ）では、「ポストSiC」として期待されている縦型GaNパワー素子に関する研究開発成果が多数、発表された。縦型のパワー素子では、電流がチップ表面に対</p></div><div class="card_imageContainer__QdZbL"><img alt="半導体分野の国際学会「IEDM 2024」では、縦型GaNパワー素子に関する研究成果が相次いで発表された（写真：須田淳）" loading="lazy" width="160" height="100" decoding="async" data-nimg="1" style="color:transparent;object-fit:contain" srcSet="/prime/.resources/_next/image?url=https%3A%2F%2Farticle-image-ix.nikkei.com%2Fhttps%253A%252F%252Fimgix-proxy.n8s.jp%252FDSXZQO5930073029012025000000-1.jpg%3Fixlib%3Djs-2.3.2%26w%3D600%26h%3D375%26auto%3Dformat%252Ccompress%26fit%3Dcrop%26bg%3DFFFFFF%26fp-x%3D0.79%26fp-y%3D0.85%26fp-z%3D1%26crop%3Dfocalpoint%26s%3D6c851833f5239bd86fc8a19df6f96633&w=256&q=75 1x, /prime/.resources/_next/image?url=https%3A%2F%2Farticle-image-ix.nikkei.com%2Fhttps%253A%252F%252Fimgix-proxy.n8s.jp%252FDSXZQO5930073029012025000000-1.jpg%3Fixlib%3Djs-2.3.2%26w%3D600%26h%3D375%26auto%3Dformat%252Ccompress%26fit%3Dcrop%26bg%3DFFFFFF%26fp-x%3D0.79%26fp-y%3D0.85%26fp-z%3D1%26crop%3Dfocalpoint%26s%3D6c851833f5239bd86fc8a19df6f96633&w=384&q=75 2x" src="/prime/.resources/_next/image?url=https%3A%2F%2Farticle-image-ix.nikkei.com%2Fhttps%253A%252F%252Fimgix-proxy.n8s.jp%252FDSXZQO5930073029012025000000-1.jpg%3Fixlib%3Djs-2.3.2%26w%3D600%26h%3D375%26auto%3Dformat%252Ccompress%26fit%3Dcrop%26bg%3DFFFFFF%26fp-x%3D0.79%26fp-y%3D0.85%26fp-z%3D1%26crop%3Dfocalpoint%26s%3D6c851833f5239bd86fc8a19df6f96633&w=384&q=75"/><span class="card_credit__k14q5"></span></div></div></a><div class="stream-article-list_tagBarContainer__QF5_l"><div class="tag-bar-with-audio-save-button_container__dS_9P"><ul class="tags_tagList__kPgLB"><li class="tags_tag__wSkU2"><div class="ellipsis-button_ellipsisButton__cIsYK">…</div></li></ul><div class="tag-bar-with-audio-save-button_buttonList__RxWNu"></div></div></div></div></div><div class="stream-article-blocks_article__5vAqO"><div><a class="card_content__U9soM" data-rn-track="section-article" data-rn-track-value="{"link-to-kiji-id-enc":"DGXZQOUC283DT0Y5A120C2000000","link-to-URL":"/tech-foresight/article/DGXZQOUC283DT0Y5A120C2000000/"}" href="/prime/tech-foresight/article/DGXZQOUC283DT0Y5A120C2000000"><div class="card_date__3gUsN"><time dateTime="2025-01-28T20:00:00.000Z">1月29日</time></div><div class="card_cardContent__6Mel9"><div><p class="card_title__JZXqr">パワー半導体を安く　SiCやGaN、ウエハー加工に新潮流</p><p class="card_excerpt__tMda3">炭化ケイ素（SiC）や窒化ガリウム（GaN）は、シリコン（Si）に比べて低損失なパワー半導体として注目されているが、ウエハー（基板）コストが高価という課題を抱えている。そこで、「基板を薄くスライスする」「複数回再利用する」などコスト削減に向けた研究が盛んだ。こうした成果が広まれば、SiCやGaNのパワー素子を安価に調達できるようになる。半導体技術の国際学会「IEDM 2024」（2024年12</p></div><div class="card_imageContainer__QdZbL"><img alt="" loading="lazy" width="160" height="100" decoding="async" data-nimg="1" style="color:transparent;object-fit:contain" srcSet="/prime/.resources/_next/image?url=https%3A%2F%2Farticle-image-ix.nikkei.com%2Fhttps%253A%252F%252Fimgix-proxy.n8s.jp%252FDSXZQO5925137028012025000000-1.jpg%3Fixlib%3Djs-2.3.2%26w%3D600%26h%3D375%26auto%3Dformat%252Ccompress%26fit%3Dcrop%26bg%3DFFFFFF%26fp-x%3D0.5%26fp-y%3D0.5%26fp-z%3D1%26crop%3Dfocalpoint%26s%3D28bc120cb9c70afce6e500277c2bb0c0&w=256&q=75 1x, /prime/.resources/_next/image?url=https%3A%2F%2Farticle-image-ix.nikkei.com%2Fhttps%253A%252F%252Fimgix-proxy.n8s.jp%252FDSXZQO5925137028012025000000-1.jpg%3Fixlib%3Djs-2.3.2%26w%3D600%26h%3D375%26auto%3Dformat%252Ccompress%26fit%3Dcrop%26bg%3DFFFFFF%26fp-x%3D0.5%26fp-y%3D0.5%26fp-z%3D1%26crop%3Dfocalpoint%26s%3D28bc120cb9c70afce6e500277c2bb0c0&w=384&q=75 2x" src="/prime/.resources/_next/image?url=https%3A%2F%2Farticle-image-ix.nikkei.com%2Fhttps%253A%252F%252Fimgix-proxy.n8s.jp%252FDSXZQO5925137028012025000000-1.jpg%3Fixlib%3Djs-2.3.2%26w%3D600%26h%3D375%26auto%3Dformat%252Ccompress%26fit%3Dcrop%26bg%3DFFFFFF%26fp-x%3D0.5%26fp-y%3D0.5%26fp-z%3D1%26crop%3Dfocalpoint%26s%3D28bc120cb9c70afce6e500277c2bb0c0&w=384&q=75"/><span class="card_credit__k14q5"></span></div></div></a><div class="stream-article-list_tagBarContainer__QF5_l"><div class="tag-bar-with-audio-save-button_container__dS_9P"><ul class="tags_tagList__kPgLB"><li class="tags_tag__wSkU2"><div class="ellipsis-button_ellipsisButton__cIsYK">…</div></li></ul><div class="tag-bar-with-audio-save-button_buttonList__RxWNu"></div></div></div></div></div><div class="stream-article-blocks_article__5vAqO"><div><a class="card_content__U9soM" data-rn-track="section-article" data-rn-track-value="{"link-to-kiji-id-enc":"DGXZQOUC271KZ0X20C25A1000000","link-to-URL":"/tech-foresight/article/DGXZQOUC271KZ0X20C25A1000000/"}" href="/prime/tech-foresight/article/DGXZQOUC271KZ0X20C25A1000000"><div class="card_date__3gUsN"><time dateTime="2025-01-27T20:00:00.000Z">1月28日</time></div><div class="card_cardContent__6Mel9"><div><p class="card_title__JZXqr">次世代メモリー、AI向けに進化　鍵は強誘電体や化合物</p><p class="card_excerpt__tMda3">半導体技術の国際学会「IEDM 2024」（2024年12月7〜11日、米サンフランシスコ）では例年同様、半導体メモリーに関して多数の研究が発表され盛況だった。韓国Samsung Electronics（サムスン電子）や中国科学院、キオクシアなどがメモリーデバイスの研究開発の今後の方向性を示す論文を披露した。強誘電体を使うメモリーや次世代DRAMに関する発表が多かったのが今回の特徴といえる。 </p></div><div class="card_imageContainer__QdZbL"><img alt="サムスン電子は「IEDM 2024」で強誘電体を用いた次世代メモリー技術を発表した。写真は同社のNAND型フラッシュメモリー工場（出所：サムスン電子）" loading="lazy" width="160" height="100" decoding="async" data-nimg="1" style="color:transparent;object-fit:contain" srcSet="/prime/.resources/_next/image?url=https%3A%2F%2Farticle-image-ix.nikkei.com%2Fhttps%253A%252F%252Fimgix-proxy.n8s.jp%252FDSXZQO5918842027012025000000-1.jpg%3Fixlib%3Djs-2.3.2%26w%3D600%26h%3D375%26auto%3Dformat%252Ccompress%26fit%3Dcrop%26bg%3DFFFFFF%26fp-x%3D0.5%26fp-y%3D0.5%26fp-z%3D1%26crop%3Dfocalpoint%26s%3Df3c6cf2c8b55edd5d3ea11b0977de1cd&w=256&q=75 1x, /prime/.resources/_next/image?url=https%3A%2F%2Farticle-image-ix.nikkei.com%2Fhttps%253A%252F%252Fimgix-proxy.n8s.jp%252FDSXZQO5918842027012025000000-1.jpg%3Fixlib%3Djs-2.3.2%26w%3D600%26h%3D375%26auto%3Dformat%252Ccompress%26fit%3Dcrop%26bg%3DFFFFFF%26fp-x%3D0.5%26fp-y%3D0.5%26fp-z%3D1%26crop%3Dfocalpoint%26s%3Df3c6cf2c8b55edd5d3ea11b0977de1cd&w=384&q=75 2x" src="/prime/.resources/_next/image?url=https%3A%2F%2Farticle-image-ix.nikkei.com%2Fhttps%253A%252F%252Fimgix-proxy.n8s.jp%252FDSXZQO5918842027012025000000-1.jpg%3Fixlib%3Djs-2.3.2%26w%3D600%26h%3D375%26auto%3Dformat%252Ccompress%26fit%3Dcrop%26bg%3DFFFFFF%26fp-x%3D0.5%26fp-y%3D0.5%26fp-z%3D1%26crop%3Dfocalpoint%26s%3Df3c6cf2c8b55edd5d3ea11b0977de1cd&w=384&q=75"/><span class="card_credit__k14q5"></span></div></div></a><div class="stream-article-list_tagBarContainer__QF5_l"><div class="tag-bar-with-audio-save-button_container__dS_9P"><ul class="tags_tagList__kPgLB"><li class="tags_tag__wSkU2"><div class="ellipsis-button_ellipsisButton__cIsYK">…</div></li></ul><div class="tag-bar-with-audio-save-button_buttonList__RxWNu"></div></div></div></div></div><div class="stream-article-blocks_article__5vAqO"><div><a class="card_content__U9soM" data-rn-track="section-article" data-rn-track-value="{"link-to-kiji-id-enc":"DGXZQOUC244ZE0U5A120C2000000","link-to-URL":"/tech-foresight/article/DGXZQOUC244ZE0U5A120C2000000/"}" href="/prime/tech-foresight/article/DGXZQOUC244ZE0U5A120C2000000"><div class="card_date__3gUsN"><time dateTime="2025-01-26T20:00:00.000Z">1月27日</time></div><div class="card_cardContent__6Mel9"><div><p class="card_title__JZXqr">TSMC、2nm半導体の歩留まり9割　25年下期に量産開始</p><p class="card_excerpt__tMda3">台湾積体電路製造（TSMC）は半導体技術の国際学会「IEDM 2024」（2024年12月7〜11日、米サンフランシスコ）で、2nm（ナノメートル）世代技術の詳細を明らかにした。2nm世代技術の論文発表は業界初で、2025年下期（7〜12月）に量産を始める。トランジスタの構造を3nm世代までのFinFET（フィン型電界効果トランジスタ）からGAA（ゲート・オール・アラウンド）ナノシートに変え、動</p></div><div class="card_imageContainer__QdZbL"><img alt="TSMCは2024年10月に日本で開催したプライベートイベントで、2nm世代技術など微細化の進捗を説明した（出所：TSMC）" loading="lazy" width="160" height="100" decoding="async" data-nimg="1" style="color:transparent;object-fit:contain" srcSet="/prime/.resources/_next/image?url=https%3A%2F%2Farticle-image-ix.nikkei.com%2Fhttps%253A%252F%252Fimgix-proxy.n8s.jp%252FDSXZQO5912383024012025000000-1.jpg%3Fixlib%3Djs-2.3.2%26w%3D600%26h%3D375%26auto%3Dformat%252Ccompress%26fit%3Dcrop%26bg%3DFFFFFF%26fp-x%3D0.74%26fp-y%3D0.2%26fp-z%3D1%26crop%3Dfocalpoint%26s%3D1ec1f6ac74d4160869d8c2e3517e1e01&w=256&q=75 1x, /prime/.resources/_next/image?url=https%3A%2F%2Farticle-image-ix.nikkei.com%2Fhttps%253A%252F%252Fimgix-proxy.n8s.jp%252FDSXZQO5912383024012025000000-1.jpg%3Fixlib%3Djs-2.3.2%26w%3D600%26h%3D375%26auto%3Dformat%252Ccompress%26fit%3Dcrop%26bg%3DFFFFFF%26fp-x%3D0.74%26fp-y%3D0.2%26fp-z%3D1%26crop%3Dfocalpoint%26s%3D1ec1f6ac74d4160869d8c2e3517e1e01&w=384&q=75 2x" src="/prime/.resources/_next/image?url=https%3A%2F%2Farticle-image-ix.nikkei.com%2Fhttps%253A%252F%252Fimgix-proxy.n8s.jp%252FDSXZQO5912383024012025000000-1.jpg%3Fixlib%3Djs-2.3.2%26w%3D600%26h%3D375%26auto%3Dformat%252Ccompress%26fit%3Dcrop%26bg%3DFFFFFF%26fp-x%3D0.74%26fp-y%3D0.2%26fp-z%3D1%26crop%3Dfocalpoint%26s%3D1ec1f6ac74d4160869d8c2e3517e1e01&w=384&q=75"/><span class="card_credit__k14q5"></span></div></div></a><div class="stream-article-list_tagBarContainer__QF5_l"><div class="tag-bar-with-audio-save-button_container__dS_9P"><ul class="tags_tagList__kPgLB"><li class="tags_tag__wSkU2"><div class="ellipsis-button_ellipsisButton__cIsYK">…</div></li></ul><div class="tag-bar-with-audio-save-button_buttonList__RxWNu"></div></div></div></div></div><div class="stream-article-blocks_article__5vAqO"><div><a class="card_content__U9soM" data-rn-track="section-article" data-rn-track-value="{"link-to-kiji-id-enc":"DGXZQOUC235RD0T20C25A1000000","link-to-URL":"/tech-foresight/article/DGXZQOUC235RD0T20C25A1000000/"}" href="/prime/tech-foresight/article/DGXZQOUC235RD0T20C25A1000000"><div class="card_date__3gUsN"><time dateTime="2025-01-23T20:00:00.000Z">1月24日</time></div><div class="card_cardContent__6Mel9"><div><p class="card_title__JZXqr">米中対立激化で揺れるTSMC　台湾半導体に2つの不確実性</p><p class="card_excerpt__tMda3">「米国を再び偉大に」をスローガンに掲げたドナルド・トランプ氏が2025年1月20日、第47代米国大統領に就任した。トランプ氏は大統領選期間中、他国と米国の不公平な貿易関係を関税で是正すると繰り返し強調した。この発言は各国政府や企業の警戒を招いている。特に台湾にとって、「トランプ・ショック」が再来する影響は大きい。トランプ氏が米中貿易問題に強硬な姿勢で臨むことで、エレクトロニクス産業のサプライチ</p></div><div class="card_imageContainer__QdZbL"><img alt="TSMCなど台湾半導体企業はトランプ政権誕生で悪影響を受ける可能性がある" loading="lazy" width="160" height="100" decoding="async" data-nimg="1" style="color:transparent;object-fit:contain" 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2024」では、縦型GaNパワー素子に関する研究成果が相次いで発表された（写真：須田淳）","credit":"","aspectRatio":1.6,"isSharable":true},"topics":[{"id":"C2001006","label":"ハードウエア","topicType":"prime-subsection","isHonseki":true,"type":"subsection"},{"id":"C2004001","label":"グローバルトレンド","topicType":"prime-topic","isHonseki":false,"type":"topic"},{"id":"C2001001","label":"電機","topicType":"prime-subsection","isHonseki":false,"type":"subsection"},{"id":"C2001009","label":"特集","topicType":"prime-subsection","isHonseki":false,"type":"subsection"},{"id":"C200100C","label":"半導体","topicType":"prime-subsection","isHonseki":false,"type":"subsection"}],"snippet":"炭化ケイ素（SiC）よりも低損失な窒化ガリウム（GaN）パワー素子の実現が見えてきた。「縦型」と呼ばれる構造を採用し、SiCパワー素子を上回る特性を示し始めた。半導体技術の国際学会「IEDM 2024」（2024年12月7〜11日、米サンフランシスコ）では、「ポストSiC」として期待されている縦型GaNパワー素子に関する研究開発成果が多数、発表された。\n\n縦型のパワー素子では、電流がチップ表面に対","hasVideo":false,"shouldOpenExternalLink":{"externalLink":false},"origServiceCategory":null,"isFree":false,"operationTags":[]},{"id":"DGXZQOUC283DT0Y5A120C2000000","title":"パワー半導体を安く　SiCやGaN、ウエハー加工に新潮流","createdAt":"2025-01-29T05:00:00+09:00","updatedAt":null,"featuredImage":{"id":"DSXZQO5925137028012025000000","images":{"100":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5925137028012025000000-1.jpg?ixlib=js-2.3.2\u0026w=100\u0026h=62\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=472e6f6939b26f2803ba1a03cc3e4b13","200":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5925137028012025000000-1.jpg?ixlib=js-2.3.2\u0026w=200\u0026h=125\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=bb2793a9e2da9239f877aaecce349fa2","300":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5925137028012025000000-1.jpg?ixlib=js-2.3.2\u0026w=300\u0026h=187\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=f3fb45746540e1ed8566a39f1bd61125","400":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5925137028012025000000-1.jpg?ixlib=js-2.3.2\u0026w=400\u0026h=250\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=4a8800fc9f2cf980d26fc4136c2faaa9","500":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5925137028012025000000-1.jpg?ixlib=js-2.3.2\u0026w=500\u0026h=312\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=82029ed1ed3fb81220c6d6f380791f97","600":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5925137028012025000000-1.jpg?ixlib=js-2.3.2\u0026w=600\u0026h=375\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=28bc120cb9c70afce6e500277c2bb0c0","700":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5925137028012025000000-1.jpg?ixlib=js-2.3.2\u0026w=700\u0026h=437\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=928514d4dbb903057263ab4082e2920c","800":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5925137028012025000000-1.jpg?ixlib=js-2.3.2\u0026w=800\u0026h=500\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=ed1ff767363e3df768e1cf326766e5fc","original":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5925137028012025000000-1.jpg?ixlib=js-2.3.2\u0026w=1188\u0026h=742\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=ef8e65366e8bd90e9044400dd3cc1c7b"},"images2x":{"use2x":false},"alt":null,"credit":"","aspectRatio":1.6,"isSharable":true},"topics":[{"id":"C2001006","label":"ハードウエア","topicType":"prime-subsection","isHonseki":true,"type":"subsection"},{"id":"C2004001","label":"グローバルトレンド","topicType":"prime-topic","isHonseki":false,"type":"topic"},{"id":"C2001001","label":"電機","topicType":"prime-subsection","isHonseki":false,"type":"subsection"},{"id":"C2001009","label":"特集","topicType":"prime-subsection","isHonseki":false,"type":"subsection"},{"id":"C200100C","label":"半導体","topicType":"prime-subsection","isHonseki":false,"type":"subsection"}],"snippet":"炭化ケイ素（SiC）や窒化ガリウム（GaN）は、シリコン（Si）に比べて低損失なパワー半導体として注目されているが、ウエハー（基板）コストが高価という課題を抱えている。そこで、「基板を薄くスライスする」「複数回再利用する」などコスト削減に向けた研究が盛んだ。こうした成果が広まれば、SiCやGaNのパワー素子を安価に調達できるようになる。\n\n半導体技術の国際学会「IEDM 2024」（2024年12","hasVideo":false,"shouldOpenExternalLink":{"externalLink":false},"origServiceCategory":null,"isFree":false,"operationTags":[]},{"id":"DGXZQOUC271KZ0X20C25A1000000","title":"次世代メモリー、AI向けに進化　鍵は強誘電体や化合物","createdAt":"2025-01-28T05:00:00+09:00","updatedAt":null,"featuredImage":{"id":"DSXZQO5918842027012025000000","images":{"100":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5918842027012025000000-1.jpg?ixlib=js-2.3.2\u0026w=100\u0026h=62\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=f7f68232f2657f0c1ed333cadcc784bb","200":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5918842027012025000000-1.jpg?ixlib=js-2.3.2\u0026w=200\u0026h=125\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=e649525ac38de79331501041001722ad","300":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5918842027012025000000-1.jpg?ixlib=js-2.3.2\u0026w=300\u0026h=187\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=03147ea3165ce2bfc644706f8a4da9be","400":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5918842027012025000000-1.jpg?ixlib=js-2.3.2\u0026w=400\u0026h=250\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=8ac91ca2b0acef293cc54f6af8193e57","500":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5918842027012025000000-1.jpg?ixlib=js-2.3.2\u0026w=500\u0026h=312\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=caecbf199a909512afba9860558e0d2d","600":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5918842027012025000000-1.jpg?ixlib=js-2.3.2\u0026w=600\u0026h=375\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=f3c6cf2c8b55edd5d3ea11b0977de1cd","700":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5918842027012025000000-1.jpg?ixlib=js-2.3.2\u0026w=700\u0026h=437\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=56e95f1e8b0850d536bb8b216659e570","800":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5918842027012025000000-1.jpg?ixlib=js-2.3.2\u0026w=800\u0026h=500\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=47cf32b344ed2b6205fe43ae2686b499","original":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5918842027012025000000-1.jpg?ixlib=js-2.3.2\u0026w=1200\u0026h=750\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=6723d17593343c17eb8d04ecb6c15783"},"images2x":{"use2x":false},"alt":"サムスン電子は「IEDM 2024」で強誘電体を用いた次世代メモリー技術を発表した。写真は同社のNAND型フラッシュメモリー工場（出所：サムスン電子）","credit":"","aspectRatio":1.6,"isSharable":true},"topics":[{"id":"C2001006","label":"ハードウエア","topicType":"prime-subsection","isHonseki":true,"type":"subsection"},{"id":"C2004001","label":"グローバルトレンド","topicType":"prime-topic","isHonseki":false,"type":"topic"},{"id":"C2001001","label":"電機","topicType":"prime-subsection","isHonseki":false,"type":"subsection"},{"id":"C2001009","label":"特集","topicType":"prime-subsection","isHonseki":false,"type":"subsection"},{"id":"C200100C","label":"半導体","topicType":"prime-subsection","isHonseki":false,"type":"subsection"}],"snippet":"半導体技術の国際学会「IEDM 2024」（2024年12月7〜11日、米サンフランシスコ）では例年同様、半導体メモリーに関して多数の研究が発表され盛況だった。韓国Samsung Electronics（サムスン電子）や中国科学院、キオクシアなどがメモリーデバイスの研究開発の今後の方向性を示す論文を披露した。強誘電体を使うメモリーや次世代DRAMに関する発表が多かったのが今回の特徴といえる。\n\n","hasVideo":false,"shouldOpenExternalLink":{"externalLink":false},"origServiceCategory":null,"isFree":false,"operationTags":[]},{"id":"DGXZQOUC244ZE0U5A120C2000000","title":"TSMC、2nm半導体の歩留まり9割　25年下期に量産開始","createdAt":"2025-01-27T05:00:00+09:00","updatedAt":null,"featuredImage":{"id":"DSXZQO5912383024012025000000","images":{"100":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5912383024012025000000-1.jpg?ixlib=js-2.3.2\u0026w=100\u0026h=62\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.74\u0026fp-y=0.2\u0026fp-z=1\u0026crop=focalpoint\u0026s=1e41e90828a1a9b08c0f441634d2f03c","200":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5912383024012025000000-1.jpg?ixlib=js-2.3.2\u0026w=200\u0026h=125\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.74\u0026fp-y=0.2\u0026fp-z=1\u0026crop=focalpoint\u0026s=b1cbd026035599f62ea99d2e9bc72028","300":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5912383024012025000000-1.jpg?ixlib=js-2.3.2\u0026w=300\u0026h=187\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.74\u0026fp-y=0.2\u0026fp-z=1\u0026crop=focalpoint\u0026s=dbbe43c50721f75394dac226e01729f3","400":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5912383024012025000000-1.jpg?ixlib=js-2.3.2\u0026w=400\u0026h=250\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.74\u0026fp-y=0.2\u0026fp-z=1\u0026crop=focalpoint\u0026s=0116a60d85253d7077eb6be1314fe084","500":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5912383024012025000000-1.jpg?ixlib=js-2.3.2\u0026w=500\u0026h=312\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.74\u0026fp-y=0.2\u0026fp-z=1\u0026crop=focalpoint\u0026s=d30309c61fbee7ec33de74fbc78a0a5a","600":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5912383024012025000000-1.jpg?ixlib=js-2.3.2\u0026w=600\u0026h=375\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.74\u0026fp-y=0.2\u0026fp-z=1\u0026crop=focalpoint\u0026s=1ec1f6ac74d4160869d8c2e3517e1e01","700":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5912383024012025000000-1.jpg?ixlib=js-2.3.2\u0026w=700\u0026h=437\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.74\u0026fp-y=0.2\u0026fp-z=1\u0026crop=focalpoint\u0026s=38b6d9339daf34ec79eca68f9201cab2","800":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5912383024012025000000-1.jpg?ixlib=js-2.3.2\u0026w=800\u0026h=500\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.74\u0026fp-y=0.2\u0026fp-z=1\u0026crop=focalpoint\u0026s=693e25e7493483c8a1b9db5f7938789b","original":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5912383024012025000000-1.jpg?ixlib=js-2.3.2\u0026w=1200\u0026h=750\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.74\u0026fp-y=0.2\u0026fp-z=1\u0026crop=focalpoint\u0026s=527b8fb3d1c69dba4b3079f235b422bd"},"images2x":{"use2x":false},"alt":"TSMCは2024年10月に日本で開催したプライベートイベントで、2nm世代技術など微細化の進捗を説明した（出所：TSMC）","credit":"","aspectRatio":1.6,"isSharable":true},"topics":[{"id":"C2001006","label":"ハードウエア","topicType":"prime-subsection","isHonseki":true,"type":"subsection"},{"id":"C2001001","label":"電機","topicType":"prime-subsection","isHonseki":false,"type":"subsection"},{"id":"C2001009","label":"特集","topicType":"prime-subsection","isHonseki":false,"type":"subsection"},{"id":"C200100C","label":"半導体","topicType":"prime-subsection","isHonseki":false,"type":"subsection"}],"snippet":"台湾積体電路製造（TSMC）は半導体技術の国際学会「IEDM 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Foresight","topicType":"prime-topic","isHonseki":false,"type":"topic"},{"id":"C2001001","label":"電機","topicType":"prime-subsection","isHonseki":false,"type":"subsection"},{"id":"C200100C","label":"半導体","topicType":"prime-subsection","isHonseki":false,"type":"subsection"}],"snippet":"ファブレス半導体メーカーのソシオネクストが海外市場で攻勢をかけている。2025年1月31日に開催した決算説明会では、北米でデータセンター向けと自動車向けSoC（システム・オン・チップ）、インドでデータセンター向けSoCの大型案件を受注したことを明かした。これら案件の売り上げは、2027年3月期から計上される見込みだ。\n特に北米市場は、生成AI（人工知能）需要を背景にデータセンターへの投資が急増し","hasVideo":false,"shouldOpenExternalLink":{"externalLink":false},"origServiceCategory":null,"isFree":false,"operationTags":[]}]},{"displayDate":"2025年1月30日(木)","articles":[{"id":"DGXZQOUC292Q50Z20C25A1000000","title":"GaNパワー半導体、SiC超え視界に　日本先行も中国浮上","createdAt":"2025-01-30T05:00:00+09:00","updatedAt":null,"featuredImage":{"id":"DSXZQO5930073029012025000000","images":{"100":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5930073029012025000000-1.jpg?ixlib=js-2.3.2\u0026w=100\u0026h=62\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.79\u0026fp-y=0.85\u0026fp-z=1\u0026crop=focalpoint\u0026s=a488a74b6dd2f2ea23742c03c324df6a","200":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5930073029012025000000-1.jpg?ixlib=js-2.3.2\u0026w=200\u0026h=125\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.79\u0026fp-y=0.85\u0026fp-z=1\u0026crop=focalpoint\u0026s=887c48f80cd750ad49bb8b97b01f76fb","300":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5930073029012025000000-1.jpg?ixlib=js-2.3.2\u0026w=300\u0026h=187\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.79\u0026fp-y=0.85\u0026fp-z=1\u0026crop=focalpoint\u0026s=03831bd692d6af4a63ef1dcc3eed5331","400":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5930073029012025000000-1.jpg?ixlib=js-2.3.2\u0026w=400\u0026h=250\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.79\u0026fp-y=0.85\u0026fp-z=1\u0026crop=focalpoint\u0026s=5a5c028416a02030752bf878cade0760","500":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5930073029012025000000-1.jpg?ixlib=js-2.3.2\u0026w=500\u0026h=312\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.79\u0026fp-y=0.85\u0026fp-z=1\u0026crop=focalpoint\u0026s=ce42bfd40167a5badaac6dbdc920a2b3","600":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5930073029012025000000-1.jpg?ixlib=js-2.3.2\u0026w=600\u0026h=375\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.79\u0026fp-y=0.85\u0026fp-z=1\u0026crop=focalpoint\u0026s=6c851833f5239bd86fc8a19df6f96633","700":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5930073029012025000000-1.jpg?ixlib=js-2.3.2\u0026w=700\u0026h=437\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.79\u0026fp-y=0.85\u0026fp-z=1\u0026crop=focalpoint\u0026s=af26ab7ccb96f06f9c7fe44cf74e30d0","800":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5930073029012025000000-1.jpg?ixlib=js-2.3.2\u0026w=800\u0026h=500\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.79\u0026fp-y=0.85\u0026fp-z=1\u0026crop=focalpoint\u0026s=93ec97d54fe1ff45fa11b78c526a790f","original":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5930073029012025000000-1.jpg?ixlib=js-2.3.2\u0026w=1200\u0026h=750\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.79\u0026fp-y=0.85\u0026fp-z=1\u0026crop=focalpoint\u0026s=fd4bc73bdb2e4824a4b030e41f3550f2"},"images2x":{"use2x":false},"alt":"半導体分野の国際学会「IEDM 2024」では、縦型GaNパワー素子に関する研究成果が相次いで発表された（写真：須田淳）","credit":"","aspectRatio":1.6,"isSharable":true},"topics":[{"id":"C2001006","label":"ハードウエア","topicType":"prime-subsection","isHonseki":true,"type":"subsection"},{"id":"C2004001","label":"グローバルトレンド","topicType":"prime-topic","isHonseki":false,"type":"topic"},{"id":"C2001001","label":"電機","topicType":"prime-subsection","isHonseki":false,"type":"subsection"},{"id":"C2001009","label":"特集","topicType":"prime-subsection","isHonseki":false,"type":"subsection"},{"id":"C200100C","label":"半導体","topicType":"prime-subsection","isHonseki":false,"type":"subsection"}],"snippet":"炭化ケイ素（SiC）よりも低損失な窒化ガリウム（GaN）パワー素子の実現が見えてきた。「縦型」と呼ばれる構造を採用し、SiCパワー素子を上回る特性を示し始めた。半導体技術の国際学会「IEDM 2024」（2024年12月7〜11日、米サンフランシスコ）では、「ポストSiC」として期待されている縦型GaNパワー素子に関する研究開発成果が多数、発表された。\n\n縦型のパワー素子では、電流がチップ表面に対","hasVideo":false,"shouldOpenExternalLink":{"externalLink":false},"origServiceCategory":null,"isFree":false,"operationTags":[]}]},{"displayDate":"2025年1月29日(水)","articles":[{"id":"DGXZQOUC283DT0Y5A120C2000000","title":"パワー半導体を安く　SiCやGaN、ウエハー加工に新潮流","createdAt":"2025-01-29T05:00:00+09:00","updatedAt":null,"featuredImage":{"id":"DSXZQO5925137028012025000000","images":{"100":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5925137028012025000000-1.jpg?ixlib=js-2.3.2\u0026w=100\u0026h=62\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=472e6f6939b26f2803ba1a03cc3e4b13","200":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5925137028012025000000-1.jpg?ixlib=js-2.3.2\u0026w=200\u0026h=125\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=bb2793a9e2da9239f877aaecce349fa2","300":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5925137028012025000000-1.jpg?ixlib=js-2.3.2\u0026w=300\u0026h=187\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=f3fb45746540e1ed8566a39f1bd61125","400":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5925137028012025000000-1.jpg?ixlib=js-2.3.2\u0026w=400\u0026h=250\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=4a8800fc9f2cf980d26fc4136c2faaa9","500":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5925137028012025000000-1.jpg?ixlib=js-2.3.2\u0026w=500\u0026h=312\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=82029ed1ed3fb81220c6d6f380791f97","600":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5925137028012025000000-1.jpg?ixlib=js-2.3.2\u0026w=600\u0026h=375\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=28bc120cb9c70afce6e500277c2bb0c0","700":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5925137028012025000000-1.jpg?ixlib=js-2.3.2\u0026w=700\u0026h=437\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=928514d4dbb903057263ab4082e2920c","800":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5925137028012025000000-1.jpg?ixlib=js-2.3.2\u0026w=800\u0026h=500\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=ed1ff767363e3df768e1cf326766e5fc","original":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5925137028012025000000-1.jpg?ixlib=js-2.3.2\u0026w=1188\u0026h=742\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=ef8e65366e8bd90e9044400dd3cc1c7b"},"images2x":{"use2x":false},"alt":null,"credit":"","aspectRatio":1.6,"isSharable":true},"topics":[{"id":"C2001006","label":"ハードウエア","topicType":"prime-subsection","isHonseki":true,"type":"subsection"},{"id":"C2004001","label":"グローバルトレンド","topicType":"prime-topic","isHonseki":false,"type":"topic"},{"id":"C2001001","label":"電機","topicType":"prime-subsection","isHonseki":false,"type":"subsection"},{"id":"C2001009","label":"特集","topicType":"prime-subsection","isHonseki":false,"type":"subsection"},{"id":"C200100C","label":"半導体","topicType":"prime-subsection","isHonseki":false,"type":"subsection"}],"snippet":"炭化ケイ素（SiC）や窒化ガリウム（GaN）は、シリコン（Si）に比べて低損失なパワー半導体として注目されているが、ウエハー（基板）コストが高価という課題を抱えている。そこで、「基板を薄くスライスする」「複数回再利用する」などコスト削減に向けた研究が盛んだ。こうした成果が広まれば、SiCやGaNのパワー素子を安価に調達できるようになる。\n\n半導体技術の国際学会「IEDM 2024」（2024年12","hasVideo":false,"shouldOpenExternalLink":{"externalLink":false},"origServiceCategory":null,"isFree":false,"operationTags":[]}]},{"displayDate":"2025年1月28日(火)","articles":[{"id":"DGXZQOUC271KZ0X20C25A1000000","title":"次世代メモリー、AI向けに進化　鍵は強誘電体や化合物","createdAt":"2025-01-28T05:00:00+09:00","updatedAt":null,"featuredImage":{"id":"DSXZQO5918842027012025000000","images":{"100":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5918842027012025000000-1.jpg?ixlib=js-2.3.2\u0026w=100\u0026h=62\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=f7f68232f2657f0c1ed333cadcc784bb","200":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5918842027012025000000-1.jpg?ixlib=js-2.3.2\u0026w=200\u0026h=125\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=e649525ac38de79331501041001722ad","300":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5918842027012025000000-1.jpg?ixlib=js-2.3.2\u0026w=300\u0026h=187\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=03147ea3165ce2bfc644706f8a4da9be","400":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5918842027012025000000-1.jpg?ixlib=js-2.3.2\u0026w=400\u0026h=250\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=8ac91ca2b0acef293cc54f6af8193e57","500":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5918842027012025000000-1.jpg?ixlib=js-2.3.2\u0026w=500\u0026h=312\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=caecbf199a909512afba9860558e0d2d","600":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5918842027012025000000-1.jpg?ixlib=js-2.3.2\u0026w=600\u0026h=375\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=f3c6cf2c8b55edd5d3ea11b0977de1cd","700":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5918842027012025000000-1.jpg?ixlib=js-2.3.2\u0026w=700\u0026h=437\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=56e95f1e8b0850d536bb8b216659e570","800":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5918842027012025000000-1.jpg?ixlib=js-2.3.2\u0026w=800\u0026h=500\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=47cf32b344ed2b6205fe43ae2686b499","original":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5918842027012025000000-1.jpg?ixlib=js-2.3.2\u0026w=1200\u0026h=750\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.5\u0026fp-y=0.5\u0026fp-z=1\u0026crop=focalpoint\u0026s=6723d17593343c17eb8d04ecb6c15783"},"images2x":{"use2x":false},"alt":"サムスン電子は「IEDM 2024」で強誘電体を用いた次世代メモリー技術を発表した。写真は同社のNAND型フラッシュメモリー工場（出所：サムスン電子）","credit":"","aspectRatio":1.6,"isSharable":true},"topics":[{"id":"C2001006","label":"ハードウエア","topicType":"prime-subsection","isHonseki":true,"type":"subsection"},{"id":"C2004001","label":"グローバルトレンド","topicType":"prime-topic","isHonseki":false,"type":"topic"},{"id":"C2001001","label":"電機","topicType":"prime-subsection","isHonseki":false,"type":"subsection"},{"id":"C2001009","label":"特集","topicType":"prime-subsection","isHonseki":false,"type":"subsection"},{"id":"C200100C","label":"半導体","topicType":"prime-subsection","isHonseki":false,"type":"subsection"}],"snippet":"半導体技術の国際学会「IEDM 2024」（2024年12月7〜11日、米サンフランシスコ）では例年同様、半導体メモリーに関して多数の研究が発表され盛況だった。韓国Samsung Electronics（サムスン電子）や中国科学院、キオクシアなどがメモリーデバイスの研究開発の今後の方向性を示す論文を披露した。強誘電体を使うメモリーや次世代DRAMに関する発表が多かったのが今回の特徴といえる。\n\n","hasVideo":false,"shouldOpenExternalLink":{"externalLink":false},"origServiceCategory":null,"isFree":false,"operationTags":[]}]},{"displayDate":"2025年1月27日(月)","articles":[{"id":"DGXZQOUC244ZE0U5A120C2000000","title":"TSMC、2nm半導体の歩留まり9割　25年下期に量産開始","createdAt":"2025-01-27T05:00:00+09:00","updatedAt":null,"featuredImage":{"id":"DSXZQO5912383024012025000000","images":{"100":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5912383024012025000000-1.jpg?ixlib=js-2.3.2\u0026w=100\u0026h=62\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.74\u0026fp-y=0.2\u0026fp-z=1\u0026crop=focalpoint\u0026s=1e41e90828a1a9b08c0f441634d2f03c","200":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5912383024012025000000-1.jpg?ixlib=js-2.3.2\u0026w=200\u0026h=125\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.74\u0026fp-y=0.2\u0026fp-z=1\u0026crop=focalpoint\u0026s=b1cbd026035599f62ea99d2e9bc72028","300":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5912383024012025000000-1.jpg?ixlib=js-2.3.2\u0026w=300\u0026h=187\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.74\u0026fp-y=0.2\u0026fp-z=1\u0026crop=focalpoint\u0026s=dbbe43c50721f75394dac226e01729f3","400":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5912383024012025000000-1.jpg?ixlib=js-2.3.2\u0026w=400\u0026h=250\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.74\u0026fp-y=0.2\u0026fp-z=1\u0026crop=focalpoint\u0026s=0116a60d85253d7077eb6be1314fe084","500":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5912383024012025000000-1.jpg?ixlib=js-2.3.2\u0026w=500\u0026h=312\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.74\u0026fp-y=0.2\u0026fp-z=1\u0026crop=focalpoint\u0026s=d30309c61fbee7ec33de74fbc78a0a5a","600":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5912383024012025000000-1.jpg?ixlib=js-2.3.2\u0026w=600\u0026h=375\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.74\u0026fp-y=0.2\u0026fp-z=1\u0026crop=focalpoint\u0026s=1ec1f6ac74d4160869d8c2e3517e1e01","700":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5912383024012025000000-1.jpg?ixlib=js-2.3.2\u0026w=700\u0026h=437\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.74\u0026fp-y=0.2\u0026fp-z=1\u0026crop=focalpoint\u0026s=38b6d9339daf34ec79eca68f9201cab2","800":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5912383024012025000000-1.jpg?ixlib=js-2.3.2\u0026w=800\u0026h=500\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.74\u0026fp-y=0.2\u0026fp-z=1\u0026crop=focalpoint\u0026s=693e25e7493483c8a1b9db5f7938789b","original":"https://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO5912383024012025000000-1.jpg?ixlib=js-2.3.2\u0026w=1200\u0026h=750\u0026auto=format%2Ccompress\u0026fit=crop\u0026bg=FFFFFF\u0026fp-x=0.74\u0026fp-y=0.2\u0026fp-z=1\u0026crop=focalpoint\u0026s=527b8fb3d1c69dba4b3079f235b422bd"},"images2x":{"use2x":false},"alt":"TSMCは2024年10月に日本で開催したプライベートイベントで、2nm世代技術など微細化の進捗を説明した（出所：TSMC）","credit":"","aspectRatio":1.6,"isSharable":true},"topics":[{"id":"C2001006","label":"ハードウエア","topicType":"prime-subsection","isHonseki":true,"type":"subsection"},{"id":"C2001001","label":"電機","topicType":"prime-subsection","isHonseki":false,"type":"subsection"},{"id":"C2001009","label":"特集","topicType":"prime-subsection","isHonseki":false,"type":"subsection"},{"id":"C200100C","label":"半導体","topicType":"prime-subsection","isHonseki":false,"type":"subsection"}],"snippet":"台湾積体電路製造（TSMC）は半導体技術の国際学会「IEDM 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