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CSPSD 2024成都前瞻|镓仁半导体邀您同聚“2024功率半导体器件与集成电路会议”_产业_新闻资讯_半导体产业网

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href="#comment"><i class="icon icon-comments-anchor"></i><span>0</span></a> <a class="share-weibo" href="http://service.weibo.com/share/share.php?title=CSPSD+2024%E6%88%90%E9%83%BD%E5%89%8D%E7%9E%BB%7C%E9%95%93%E4%BB%81%E5%8D%8A%E5%AF%BC%E4%BD%93%E9%82%80%E6%82%A8%E5%90%8C%E8%81%9A%E2%80%9C2024%E5%8A%9F%E7%8E%87%E5%8D%8A%E5%AF%BC%E4%BD%93%E5%99%A8%E4%BB%B6%E4%B8%8E%E9%9B%86%E6%88%90%E7%94%B5%E8%B7%AF%E4%BC%9A%E8%AE%AE%E2%80%9D&url=http%3A%2F%2Fwww.casmita.com%2Fnews%2F202404%2F24%2F15168.html&pic=" target="_blank"><i class="icon icon-weibo"></i><span>微博</span></a> <a class="share-qzone" href="https://sns.qzone.qq.com/cgi-bin/qzshare/cgi_qzshare_onekey?url=http%3A%2F%2Fwww.casmita.com%2Fnews%2F202404%2F24%2F15168.html&title=CSPSD+2024%E6%88%90%E9%83%BD%E5%89%8D%E7%9E%BB%7C%E9%95%93%E4%BB%81%E5%8D%8A%E5%AF%BC%E4%BD%93%E9%82%80%E6%82%A8%E5%90%8C%E8%81%9A%E2%80%9C2024%E5%8A%9F%E7%8E%87%E5%8D%8A%E5%AF%BC%E4%BD%93%E5%99%A8%E4%BB%B6%E4%B8%8E%E9%9B%86%E6%88%90%E7%94%B5%E8%B7%AF%E4%BC%9A%E8%AE%AE%E2%80%9D" target="_blank"><i class="icon icon-qzone"></i><span>Qzone</span></a> <a class="share-wechat"><i class="icon icon-wechat"></i><span>微信</span></a> </div> <div class="content-box"> <h1 class="title" id="title">CSPSD 2024成都前瞻|镓仁半导体邀您同聚“2024功率半导体器件与集成电路会议”</h1> <div class="info"> <span style="padding-right:1em">日期:2024-04-24</span> <span id="hits">阅读:321</span> </div> <div class="introduce">核心提示:4月26-28日,2024功率半导体器件与集成电路会议(CSPSD 2024)将于成都召开。会议是在电子科技大学和第三代半导体产业技术创新战</div><div id="content"><div class="content" id="article"><p>&nbsp;4月26-28日,&ldquo;2024功率半导体器件与集成电路会议(CSPSD 2024)&rdquo;将于成都召开。</p> <p>会议是在电子科技大学和第三代半导体产业技术创新战略联盟指导下,极智半导体产业网联合电子薄膜与集成器件国家重点实验室、成都信息工程大学、电子科技大学集成电路研究中心、第三代半导体产业共同主办&rdquo;,论坛会议内容将涵盖宽禁带碳化硅和氮化镓为代表的高压及低压等电力电子器件、功率集成电路、封装等几大主题,将覆盖晶圆造、芯片设计、芯片加工、模块封装、测试分析、软件工具、设备制造、整机应用等产业链各环节。&nbsp;</p> <p>期间,杭州镓仁半导体有限公司将出席会议并邀请业界同仁相聚,共同交流,洽谈合作。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202404/24/120056861.jpg" alt="LOGO 红黑 中英" width="450" height="253" /></p> <p>&nbsp;杭州镓仁半导体有限公司成立于2022年9月,是一家专注于氧化镓等宽禁带半导体材料研发、生产和销售的科技型企业。公司依托浙江大学硅及先进半导体材料全国重点实验室、浙江大学杭州国际科创中心,已形成一支以中科院院士为首席顾问,具备丰富行业经验的研发、生产、运营团队。&nbsp;</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202404/24/120106101.jpg" alt="镓仁半导体" width="556" height="794" /></p> <p>镓仁半导体引领行业创新,成功首创铸造法等氧化镓单晶生长新技术,并实现6英寸单晶衬底及2英寸(010)单晶衬底的生产技术突破。公司已掌握氧化镓生长、加工、外延等全链条的核心技术,获得十余项国际、国内发明专利,助力国内氧化镓相关产业摆脱国际垄断和封锁。为客户提供拥有完全自主知识产权的高品质氧化镓衬底产品。&nbsp;</p> <p>公司产品包括不同尺寸、晶向和电阻率的氧化镓抛光片,可定制的氧化镓籽晶、晶锭等。产品主要应用于面向国家电网、新能源汽车、轨道交通、5G通信等领域的电力电子器件。</p> <p><b>公司产品一览表</b></p> <div align="center"><img src="http://www.casmita.com/file/upload/202404/24/113825211.jpg" alt="产品1" width="642" height="378" /></div> <p><b>产品展示</b></p> <p align="center"><img src="http://www.casmita.com/file/upload/202404/24/113538491.jpg" alt="产品2" width="530" height="340" />&nbsp;</p> <p>&nbsp;<strong microsoft="" font-size:="" text-indent:="" word-break:="" text-size-adjust:="" style="color: rgb(51, 51, 51); font-family: ">会议时间:2024年4月26-28日</strong></p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: "><strong style="word-break: break-all; text-size-adjust: none;">会议地点:四川&middot;成都&middot;成都金韵酒店六层</strong></p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: "><strong style="word-break: break-all; text-size-adjust: none;">组织机构:</strong></p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: ">指导单位:</p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: ">电子科技大学</p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: ">第三代半导体产业技术创新战略联盟(CASA)</p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: "><strong style="word-break: break-all; text-size-adjust: none;">主办单位:</strong></p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: ">电子薄膜与集成器件全国重点实验室</p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: ">成都信息工程大学</p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: ">电子科技大学集成电路研究中心</p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: ">极智半导体产业网(www.casmita.com)</p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: ">第三代半导体产业</p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: ">中国电源学会元器件专业委员会</p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: "><strong style="word-break: break-all; text-size-adjust: none;">承办单位</strong></p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: ">北京麦肯桥新材料生产力促进中心有限公司</p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: "><strong style="word-break: break-all; text-size-adjust: none;">协办支持:</strong></p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: ">成都氮矽科技有限公司</p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: "><strong style="word-break: break-all; text-size-adjust: none;">程序委员会:</strong></p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: ">大会主席:张波</p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: ">程序委员会主席:罗小蓉</p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: ">副主席:赵璐冰 周琦</p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: ">程序委员会:邓小川 龙世兵 王来利 明鑫 杨树 刘斯扬 郭清 魏进 金锐 周春华 刘成 蒋其梦 高巍 包琦龙 潘岭峰 叶怀宇 刘雯 张召富 李虞锋 魏杰等</p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: "><b style="word-break: break-all; text-size-adjust: none;">拟参与单位:</b></p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: ">电子科技大学、成都信息工程大学、中芯国际、三安半导体、浙江大学、中国科学技术大学、东南大学、西安电子科技大学、西安交通大学、清华大学、西安理工大学、山东天岳、科友半导体、国星光电、ULVAC、华虹半导体、斯达半导体、蓉矽半导体、阳光电源、扬杰科技、英飞凌、北京大学、厦门大学、中科院半导体所、南京大学、中科院微电子所、长飞半导体、华为、海思半导体、锴威特、基本半导体、中电科四十六所、中电科五十五所、天津大学、华大九天、西门子、博世、三环集团、中科院微电子所、中镓半导体、日立、江苏宏微、苏州晶湛、百识电子、国家电网、华大半导体、意法半导体、中博芯、西安爱科赛博 、小鹏汽车、复旦大学、东莞天域、比亚迪半导体、西安西驰电气、理想汽车、英诺赛科、士兰微、芯迈半导体、中国科学院电工所、立昂微电子、长川科技、众硅电子、莱普科技、海威华芯、麦科信、安徽大学、云镓半导体、高芯(河南)半导体&hellip;&hellip;</p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: "><b style="word-break: break-all; text-size-adjust: none;">活动参与:</b></p> <p microsoft="" text-size-adjust:="" text-indent:="" color:="" font-size:="" style="word-break: break-all; font-family: 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