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class="clearfix with-navigation"> <div id="content" class="column"><div class="section">  <div id="content-area"> <div class="panel-display zen-two-sidebars clearfix"> <div class="panel-content"><div class="panel-content-inner inside panel-panel"> <div id="rightcorner"></div> <div class="panel-pane pane-node-content"> <h2 class="title">SEMI® Semiconductor Packaging Materials Market Research / Market Report</h2> <div id="node-28916" class="node node-type-page build-mode-full clearfix"> <div class="content"> <div class="heading1"><p><font face="Arial" size="4"><strong>Semiconductor Packaging Materials Market Research</strong></font></p></div><table cellspacing="0" cellpadding="5" bordercolor="#ffffff" bgcolor="#ffffff"><tbody><tr><td width="192" valign="top" bgcolor="#ffffff" bordercolor="#ffffff"><p><font face="Arial" size="2"><u><a href="/web/20140629151057/http://semi.org/en/MarketInfo/PackagingMarket/index.htm#P7_85">Summary</a><a href="/web/20140629151057/http://semi.org/en/MarketInfo/PackagingMarket/index.htm#P23_1319"> <br/>Featured Articles</a></u></font><a name="P2_65"></a> </p></td><td width="153" valign="top" bgcolor="#ffffff" bordercolor="#ffffff"><p><font face="Arial" size="2"><u><a href="/web/20140629151057/http://semi.org/en/MarketInfo/PackagingMarket/index.htm#P38_2338">Products</a></u></font> </p></td><td width="105" valign="top" bgcolor="#ffffff" bordercolor="#ffffff">  </td><td width="132" valign="top" bgcolor="#ffffff" bordercolor="#ffffff"><p><font face="Arial" size="2">Follow Us On</font><a href="https://web.archive.org/web/20140629151057/http://www.twitter.com/SEMI_mktstats" target="_top"><img src="/web/20140629151057im_/http://semi.org/sites/semi.org/files/cms/groups/public/documents/web_content/_export/CTR_022288_55_000086_DC_SNIPPET_LAYOUT/120417-1.jpg" width="78" height="19" border="0"/><br/></a></p></td></tr></tbody></table><div class="heading2"><p><font face="Arial" size="3"><strong><a name="P7_85"></a>Summary</strong></font> </p></div><p><font face="Arial" size="2">The electronics market sector is increasingly driven by consumer spending, where electronic products require more than performance and speed. Product look and feel, functionality, time to market, and cost are becoming critical factors, and packaging plays major role in delivering solutions to meet these needs. <br/><br/>Consumer electronics are changing how semiconductor devices are thinned, die attached, bonding wire and encapsulated, with materials playing a major role enabling the development of newer packaging technologies. </font></p><div class="heading3"><p><font face="Arial" size="2"><strong>Typical Semiconductor Packaging Materials</strong></font> </p></div><table cellspacing="0" cellpadding="5" bordercolor="#ffffff" bgcolor="#ffffff"><tbody><tr><td width="258" valign="top" bgcolor="#ffffff" bordercolor="#ffffff"><ul type="disc" compact="compact"><li><font face="Arial" size="2"></font><font face="Arial" size="2">Organics substrates</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Leadframes</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Mold Compounds</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Underfill materials</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Bonding wire</font></li></ul></td><td width="270" valign="top" bgcolor="#ffffff" bordercolor="#ffffff"><ul type="disc" compact="compact"><li><font face="Arial" size="2"></font><font face="Arial" size="2">Liquid encapsulants</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Solder balls</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Wafer level package dielectrics</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Thermal interface materials</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Die attach materials</font></li></ul></td></tr></tbody></table><p><font face="Arial" size="2">A key business issue with a consumer electronics driven market is that semiconductor manufacturers and packaging subcontractors are experiencing severe pricing pressure from their customers. Thus, manufacturers are pushing cost reduction at a faster pace to offset erosion in semiconductor average selling prices (ASP). <br/><br/>For the latest info, please view the info on this page as well as some of our products we have available for this market segment.</font> </p><div class="heading2"><p><font face="Arial" size="3"><strong><a name="P23_1319"><br/></a>Feature Articles & Presentations</strong></font></p></div><ul compact="compact" type="disc"><li><span style="font-size: small;"><a href="https://web.archive.org/web/20140629151057/http://www.semi.org/en/node/48581">Semiconductor Plastic Packaging Materials Market to Approach $21B by 2017</a> (January 2014)</span></li><li><span style="font-size: small;"><a href="https://web.archive.org/web/20140629151057/http://www.semi.org/en/node/48491">Substrate and Interconnect Materials Trends in Packaging</a> (January 2014)</span></li><li><span style="font-family: arial, helvetica, sans-serif; font-size: small;"><a href="https://web.archive.org/web/20140629151057/http://www.semi.org/en/node/47336" target="_blank">Semiiconductor Materials Market to Approach $50 Billion in 2014</a> (October 2013)</span></li><li><span style="font-size: small; font-family: arial, helvetica, sans-serif;"><a href="https://web.archive.org/web/20140629151057/http://www.semi.org/en/node/47746" target="_blank">Strategic Materials Conference presentations (.pdf) now available to SEMI Members</a> (October 2013)</span></li><li><a href="https://web.archive.org/web/20140629151057/http://www.semi.org/en/node/44761" target="_blank" style="font-family: arial, helvetica, sans-serif; font-size: small;">A Glimpse into the Semiconductor Packaging Market in China</a><span style="font-family: arial, helvetica, sans-serif; font-size: small;"> (February 2013)</span></li><li><a href="https://web.archive.org/web/20140629151057/http://www.semi.org/en/node/41966" target="_blank" style="font-size: small;">A Changing Packaging Materials Market</a><span style="font-size: small;"> (June 2012)</span></li><li><a href="https://web.archive.org/web/20140629151057/http://www.semi.org/en/node/40336" target="_blank" style="font-size: small;">2012 Market Outlook for Laminate and Leadframe Materials</a><span style="font-size: small;"> (January 2012)</span></li><li><a href="https://web.archive.org/web/20140629151057/http://www.semi.org/en/node/39801" target="_blank" style="font-size: small;">Market Growth for Semiconductor Packaging Materials</a><span style="font-size: small;"> (December 2011)</span></li><li><a href="https://web.archive.org/web/20140629151057/http://www.semi.org/en/node/38571/" target="_blank" style="font-family: Arial; font-size: small;">New Global Semiconductor Packaging Materials Outlook Report Published!!!</a><span style="font-family: Arial; font-size: small;">  (December 2011)</span></li><li><a href="https://web.archive.org/web/20140629151057/http://www.semi.org/en/node/38166" target="_blank" style="font-family: Arial; font-size: small;">Semiconductor Packaging Equipment Market Outlook</a><span style="font-family: Arial; font-size: small;"> (July 2011)</span></li><li><u style="font-family: Arial; font-size: small;"><a href="/web/20140629151057/http://semi.org/en/MarketInfo/ctr_041176" target="_top">Foundry/Assembly Partnerships Move the Industry Forward in TSV Technology</a></u><span style="font-family: Arial; font-size: small;"> (Nov 2010)</span></li><li><a href="https://web.archive.org/web/20140629151057/http://www.slideshare.net/ehallSEMI/recent-developments-in-advanced-packaging-materials-and-markets" target="_top" style="font-family: Arial; font-size: small;"><u>Recent Developments in Advanced Packaging Materials</u></a><span style="font-family: Arial; font-size: small;">– SEMI Theater (Jul 2010)</span></li><li><u style="font-family: Arial; font-size: small;"><a href="/web/20140629151057/http://semi.org/en/MarketInfo/CTR_034574" target="_top">January 2010 Global Leadrame Shipments</a></u><span style="font-family: Arial; font-size: small;"> (Feb 2010)</span></li><li><u style="font-family: Arial; font-size: small;"><a href="/web/20140629151057/http://semi.org/en/MarketInfo/CTR_034255" target="_top">Productivity Transfer Propels Further Growth of China Packaging Industry</a></u><span style="font-family: Arial; font-size: small;"> (Feb 2010)</span></li><li><u style="font-family: Arial; font-size: small;"><a href="/web/20140629151057/http://semi.org/en/Press/CTR_034053" target="_top">Semiconductor Industry Opinions Concerning the Selection of Bonding Wire Material</a></u><span style="font-family: Arial; font-size: small;"> (Jan 2010)</span></li><li><u style="font-family: Arial; font-size: small;"><a href="/web/20140629151057/http://semi.org/en/MarketInfo/PackagingMarket/ctr_033627" target="_top">Japanese Companies Continue to Dominate Packaging Materials Market</a></u><span style="font-family: Arial; font-size: small;"> (Jan 2010)</span></li><li><u style="font-family: Arial; font-size: small;"><a href="/web/20140629151057/http://semi.org/en/MarketInfo/ctr_033179" target="_top">Growing Packaging Materials Market under Pressure</a></u><span style="font-family: Arial; font-size: small;"> (Dec 2009)</span></li><li><u style="font-family: Arial; font-size: small;"><a href="/web/20140629151057/http://semi.org/en/Press/CTR_033081" target="_top">Plastic Packaging Materials Market to Reach $20.1 Billion by 2013</a></u><span style="font-family: Arial; font-size: small;"> (Nov 2009)</span></li><li><a href="/web/20140629151057/http://semi.org/cms/groups/public/documents/web_content/ctr_032268.pdf" target="_top" style="font-family: Arial; font-size: small;"><u>Trends in Advanced Packaging</u></a><span style="font-family: Arial; font-size: small;">– TechSearch Inc. (Jul 2009)</span></li><li><a href="/web/20140629151057/http://semi.org/en/MarketInfo/ctr_029418" target="_top" style="font-family: Arial; font-size: small;"><u>Leadframe Unit Shipments Trends Show Signs of Recovery</u></a><span style="font-family: Arial; font-size: small;"> (Apr 2009)</span></li><li><u style="font-family: Arial; font-size: small;"><a href="/web/20140629151057/http://semi.org/en/Press/CTR_028959" target="_top">Semiconductor Materials Post Record Revenue for Fourth Straight Year</a></u><span style="font-family: Arial; font-size: small;"> (Mar 2009)</span></li></ul><div class="heading2"><p><strong style="font-family: Arial; font-size: medium;"><br/>Products</strong></p></div><table cellspacing="0" cellpadding="5" bordercolor="#ffffff" bgcolor="#ffffff"><tbody><tr><td width="128" valign="top" rowspan="2"><p><a href="/web/20140629151057/http://semi.org/en/node/38571/" target="_top"><img src="/web/20140629151057im_/http://semi.org/sites/semi.org/files/cms/groups/public/documents/web_content/_export/CTR_022288_55_000086_DC_SNIPPET_LAYOUT/120417-3.jpg" width="114" height="148" border="0"/></a> </p></td><td width="454" valign="top" colspan="2"><p><font face="Arial" size="2"><u><a href="https://web.archive.org/web/20140629151057/http://www.semi.org/en/node/45446" target="_blank">Global Semiconductor Packaging Materials Outlook 2013/2014</a></u> <br/>This report is a comprehensive market research study that examines semiconductor packaging technology trends. Packaging materials markets are quantified, new opportunities are highlighted, and forecasts through 2017 are presented.</font> </p></td></tr><tr><td width="321" valign="top">  </td><td width="133" valign="top"><p><a href="https://web.archive.org/web/20140629151057/http://www.semi.org/en/node/45446" target="_blank"><img src="/web/20140629151057im_/http://semi.org/sites/semi.org/files/cms/groups/public/documents/web_content/_export/CTR_022288_55_000086_DC_SNIPPET_LAYOUT/120417-4.jpg" width="109" height="49" border="0"/></a> </p></td></tr></tbody></table><table cellspacing="0" cellpadding="5" bordercolor="#ffffff" bgcolor="#ffffff"><tbody><tr><td width="128"> </td><td width="321"> </td><td width="133"> </td></tr><tr><td width="128" valign="top" rowspan="2"><p><img src="/web/20140629151057im_/http://semi.org/en/sites/semi.org/files/images/IRS_CSPMO.jpg" alt="SEMI_CSPMO" width="114" height="148"/></p></td><td width="454" valign="top" colspan="2"><p><font face="Arial" size="2"><u><a href="/web/20140629151057/http://semi.org/en/Store/MarketInformation/Photovoltaics/ctr_034164" target="_top">China Semiconductor Packaging Market Outlook</a></u> <br/>This report provides an outlook of the semiconductor packaging industry in China as well as a summary of the packaging materials and equipment for this important market. The report also highlights the material and equipment supply chain in China. The report also includes a database or list of packaging companies, wafer bumping fabs, materials suppliers, and local equipment manufacturers in China.</font> </p></td></tr><tr><td width="321" valign="top">  </td><td width="133" valign="top"><p><a href="/web/20140629151057/http://semi.org/en/Store/MarketInformation/Photovoltaics/ctr_034164" target="_top"><img src="/web/20140629151057im_/http://semi.org/sites/semi.org/files/cms/groups/public/documents/web_content/_export/CTR_022288_55_000086_DC_SNIPPET_LAYOUT/120417-4.jpg" width="109" height="49" border="0"/></a> </p></td></tr></tbody></table><table cellspacing="0" cellpadding="5" bordercolor="#ffffff" bgcolor="#ffffff"><tbody><tr><td width="134"> </td><td width="315"> </td><td width="133"> </td></tr><tr><td width="134" valign="top" rowspan="2"><p><font face="Arial" size="2"><a href="https://web.archive.org/web/20140629151057/http://www.semi.org/cms/groups/public/documents/web_content/ctr_033139.pdf" target="_top"><img src="/web/20140629151057im_/http://semi.org/sites/semi.org/files/cms/groups/public/documents/web_content/_export/CTR_022288_55_000086_DC_SNIPPET_LAYOUT/120417-6.jpg" width="120" height="166" border="0"/> </a></font></p></td><td width="448" valign="top" colspan="2"><p><font face="Arial" size="2"><a href="https://web.archive.org/web/20140629151057/http://www.semi.org/cms/groups/public/documents/web_content/ctr_033139.pdf" target="_top"><u>3D Integration: A Progress Report</u></a> <br/>A Progress Report was created to help accelerate the adoption of 3D integration using TSV interconnect technology by identifying the crucial barriers preventing widespread acceptance. It offers a comprehensive snapshot of the progress made thus far, while also shining a light on what is left to be addressed before first market adoption, and then volume production can be achieved.</font> </p></td></tr><tr><td width="315" valign="top">  </td><td width="133" valign="top"><p><font face="Arial" size="2"><a href="https://web.archive.org/web/20140629151057/http://www.semi.org/cms/groups/public/documents/web_content/ctr_033139.pdf" target="_top"><u>Download Now</u></a></font> </p></td></tr></tbody></table> </div> </div>  </div> </div></div>  <div class="panel-sidebar-first"><div class="panel-sidebar-first-inner inside panel-panel"> <div id="left-navigation" class="panel-pane pane-block pane-menu-primary-links"> <div class="pane-content"> <div id="submenu-tree-left"> <div class="menu_block_wrapper menu-block-1 menu-name-primary-links parent-mlid-0 menu-level-1"> <ul class="menu"><li class="expanded first menu-mlid-5346"><a 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