<?xml version="1.0" encoding="UTF-8"?> <article key="pdf/9998149" mdate="2014-04-03 00:00:00"> <author>Peter Krupa and Svetoz谩r Malinari膷</author> <title>Using the Transient Plane Source Method for Measuring Thermal Parameters of Electroceramics</title> <pages>735 - 740</pages> <year>2014</year> <volume>8</volume> <number>5</number> <journal>International Journal of Mechanical and Mechatronics Engineering</journal> <ee>https://publications.waset.org/pdf/9998149</ee> <url>https://publications.waset.org/vol/89</url> <publisher>World Academy of Science, Engineering and Technology</publisher> <abstract>Transient plane source method has been used to measure the thermal diffusivity and thermal conductivity of a compact isostatic electroceramics at room temperature. The samples were fired at temperatures from 100 up to 1320 degrees Celsius in steps of 50. Bulk density and specific heat capacity were also measured with their corresponding standard uncertainties. The results were compared with further thermal analysis (dilatometry and thermogravimetry). Structural processes during firing were discussed. </abstract> <index>Open Science Index 89, 2014</index> </article>