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The first iteration of this chip, RD50-MPW1, suffered from high leakage current, low breakdown voltage and crosstalk. In order to mitigate these shortcomings, an improved version with improved pixel geometry was designed. The RD50-MPW2 integrates a matrix of 8 $\times$ 8 pixels with analog front-end, but no digital readout. It was delivered in early 2020 and characterized within lab-measurements, an irradiation campaign and test beams. To read out the chips the Caribou DAQ system is used with a custom chipboard as well as specific firmware and software modules. A third iteration of the chip, the RD50-MPW3, has been submitted to LFoundry in December 2021 and is expected to be delivered in May 2022. It will keep the well working analog part of its predecessor, completed by an in-pixel digital logic and an optimized peripheral readout for effective pixel configuration and fast serial data transmission. The chip will comprise a matrix of 64 $\times$ 64 pixels arranged in 32 double-columns. We will present an overview of the RD50 HV-CMOS activities focusing on the measurement results of RD50-MPW2 chip, as well as the design and readout of the RD50-MPW3. Sieberer, Patrick; Irmler, Christian; Steininger, Helmut; Bergauer, Thomas" /> <meta name="keywords" content="CERN-RD50, Depleted monolithic active pixel sensor, Future hadron colliders, High voltage-CMOS technology, High voltage pixel detector, Monolithic CMOS detector" /> <script type="text/javascript" src="https://cds.cern.ch/js/jquery.min.js"></script>  <link rel="stylesheet" href="https://cds.cern.ch/img/webnews.css" type="text/css" />  <script type="text/javascript" src="https://cds.cern.ch/js/webnews.js?v=20131009"></script> <meta property="fb:app_id" content="137353533001720"/>  <meta content="Elsevier B.V. : Design and characterization of depleted monolithic active pixel sensors within the RD50 collaboration" name="citation_title" /> <meta content="Sieberer, Patrick" name="citation_author" /> <meta content="Bergauer, Thomas" name="citation_author" /> <meta content="Irmler, Christian" name="citation_author" /> <meta content="Steininger, Helmut" name="citation_author" /> <meta content="10.1016/j.nima.2022.167020" name="citation_doi" /> <meta content="Nucl. Instrum. Methods Phys. Res., A" name="citation_journal_title" /> <meta content="1039" name="citation_volume" /> <meta content="167020" name="citation_firstpage" /> <meta content="2022" name="citation_publication_date" /> <meta name="citation_online_date" content="2022/10/06"> <meta content="10.1016/j.nima.2022.167020" name="citation_doi" />  <meta content="Design and characterization of depleted monolithic active pixel sensors within the RD50 collaboration" property="og:title" /> <meta content="Elsevier B.V." property="og:title" /> <meta content="website" property="og:type" /> <meta content="website" property="og:type" /> <meta content="https://cds.cern.ch/record/2835873" property="og:url" /> <meta content="CERN Document Server" property="og:site_name" /> <meta content="Elsevier B.V." property="og:description" /> <meta content="The CERN RD50 CMOS working group is designing and characterizing depleted monolithic active pixel sensors (DMAPS) for use in high radiation environments fabricated in the LFoundry 150 nm HV-CMOS process. The first iteration of this chip, RD50-MPW1, suffered from high leakage current, low breakdown voltage and crosstalk. In order to mitigate these shortcomings, an improved version with improved pixel geometry was designed. The RD50-MPW2 integrates a matrix of 8 $\times$ 8 pixels with analog front-end, but no digital readout. It was delivered in early 2020 and characterized within lab-measurements, an irradiation campaign and test beams. To read out the chips the Caribou DAQ system is used with a custom chipboard as well as specific firmware and software modules. A third iteration of the chip, the RD50-MPW3, has been submitted to LFoundry in December 2021 and is expected to be delivered in May 2022. It will keep the well working analog part of its predecessor, completed by an in-pixel digital logic and an optimized peripheral readout for effective pixel configuration and fast serial data transmission. The chip will comprise a matrix of 64 $\times$ 64 pixels arranged in 32 double-columns. We will present an overview of the RD50 HV-CMOS activities focusing on the measurement results of RD50-MPW2 chip, as well as the design and readout of the RD50-MPW3." property="og:description" />  <meta content="summary" name="twitter:card" /> <meta content="summary" name="twitter:card" /> <style></style> </head> <body class="CERN32Document32Server search" lang="hr">  <div id="cern-toolbar"> <h1><a href="http://cern.ch" title="CERN">CERN <span>Accelerating science</span></a></h1> <ul> <li class="cern-accountlinks"><a class="cern-account" href="https://cds.cern.ch/youraccount/login?ln=hr&referer=https%3A//cds.cern.ch/record/2835873/export/hm%3Fln%3Dhr" title="Sign in to your CERN account">Sign in</a></li> <li><a class="cern-directory" href="http://cern.ch/directory" title="Search CERN resources and browse the directory">Directory</a></li> </ul> </div>   <div role="banner" class="clearfix" id="header"> <div class="header-inner inner"> <hgroup class="clearfix"> <h2 id="site-name"> <a rel="home" title="Home" href="/"><span>CERN Document Server</span></a> </h2> <h3 id="site-slogan">Access articles, reports and multimedia content in HEP</h3> </hgroup> <div role="navigation" id="main-navigation" class="cdsmenu"> <h2 class="element-invisible">Main menu</h2><ul class="links inline clearfix"> <li class="menu-386 first active-trail"><a class="active-trail" href="https://cds.cern.ch/?ln=hr">Pretraži</a></li> <li class="menu-444 "><a class="" title="" href="https://cds.cern.ch/submit?ln=hr">Prihvati</a></li> <li class="menu-426 "><a class="" href="https://cds.cern.ch/help/?ln=hr">Pomoć</a></li> <li class="leaf hassubcdsmenu"> <a hreflang="en" class="header" href="https://cds.cern.ch/youraccount/display?ln=hr">Personaliziraj</a> <ul class="subsubcdsmenu"><li><a href="https://cds.cern.ch/youralerts/list?ln=hr">Your alerts</a></li><li><a href="https://cds.cern.ch/yourbaskets/display?ln=hr">Your baskets</a></li><li><a href="https://cds.cern.ch/yourcomments?ln=hr">Your comments</a></li><li><a href="https://cds.cern.ch/youralerts/display?ln=hr">Your searches</a></li></ul></li> </ul> </div> </div> </div>  <table class="navtrailbox"> <tr> <td class="navtrailboxbody"> <a href="/?ln=hr" class="navtrail">Početna stranica</a> > <a class="navtrail" href="/record/2835873">Design and characterization of depleted monolithic active pixel sensors within the RD50 collaboration</a> > HTML MARC </td> </tr> </table> </div> <div class="pagebody"><div class="pagebodystripemiddle"> <pre style="margin: 1em 0px;">002835873 001__ 2835873 002835873 003__ SzGeCERN 002835873 005__ 20221117152456.0 002835873 0247_ $$2DOI$$9Elsevier B.V.$$a10.1016/j.nima.2022.167020$$qpublication 002835873 0248_ $$aoai:cds.cern.ch:2835873$$pcerncds:CERN 002835873 035__ $$9https://inspirehep.net/api/oai2d$$aoai:inspirehep.net:2145759$$d2022-10-05T13:17:59Z$$h2022-10-06T04:00:09Z$$mmarcxml 002835873 035__ $$9Inspire$$a2145759 002835873 041__ $$aeng 002835873 100__ $$aSieberer, Patrick$$mpatrick.sieberer@oeaw.ac.at$$uVienna, OAW 002835873 245__ $$9Elsevier B.V.$$aDesign and characterization of depleted monolithic active pixel sensors within the RD50 collaboration 002835873 260__ $$c2022 002835873 300__ $$a5 p 002835873 520__ $$9Elsevier B.V.$$aThe CERN RD50 CMOS working group is designing and characterizing depleted monolithic active pixel sensors (DMAPS) for use in high radiation environments fabricated in the LFoundry 150 nm HV-CMOS process. The first iteration of this chip, RD50-MPW1, suffered from high leakage current, low breakdown voltage and crosstalk. In order to mitigate these shortcomings, an improved version with improved pixel geometry was designed. The RD50-MPW2 integrates a matrix of 8 $\times$ 8 pixels with analog front-end, but no digital readout. It was delivered in early 2020 and characterized within lab-measurements, an irradiation campaign and test beams. To read out the chips the Caribou DAQ system is used with a custom chipboard as well as specific firmware and software modules. A third iteration of the chip, the RD50-MPW3, has been submitted to LFoundry in December 2021 and is expected to be delivered in May 2022. It will keep the well working analog part of its predecessor, completed by an in-pixel digital logic and an optimized peripheral readout for effective pixel configuration and fast serial data transmission. The chip will comprise a matrix of 64 $\times$ 64 pixels arranged in 32 double-columns. We will present an overview of the RD50 HV-CMOS activities focusing on the measurement results of RD50-MPW2 chip, as well as the design and readout of the RD50-MPW3. 002835873 542__ $$3publication$$dElsevier B.V.$$g2022 002835873 595__ $$aFor annual report 002835873 65017 $$2SzGeCERN$$aDetectors and Experimental Techniques 002835873 6531_ $$9Elsevier B.V.$$aCERN-RD50 002835873 6531_ $$9Elsevier B.V.$$aDepleted monolithic active pixel sensor 002835873 6531_ $$9Elsevier B.V.$$aFuture hadron colliders 002835873 6531_ $$9Elsevier B.V.$$aHigh voltage-CMOS technology 002835873 6531_ $$9Elsevier B.V.$$aHigh voltage pixel detector 002835873 6531_ $$9Elsevier B.V.$$aMonolithic CMOS detector 002835873 690C_ $$aARTICLE 002835873 690C_ $$aCERN 002835873 700__ $$aIrmler, Christian$$uVienna, OAW 002835873 700__ $$aSteininger, Helmut$$uVienna, OAW 002835873 700__ $$aBergauer, Thomas$$uVienna, OAW 002835873 710__ $$gCERN-RD50 Collaboration 002835873 773__ $$c167020$$mpublication$$pNucl. Instrum. Methods Phys. Res., A$$v1039$$y2022 002835873 773__ $$wC22-02-21 002835873 960__ $$a13 002835873 962__ $$b2801323$$k167020$$nonline20220221 002835873 980__ $$aARTICLE 002835873 980__ $$aConferencePaper</pre></div></div> <footer id="footer" class="pagefooter clearfix">  <div class="pagefooterstripeleft"> CERN Document Server :: <a class="footer" href="https://cds.cern.ch/?ln=hr">Pretraži</a> :: <a class="footer" href="https://cds.cern.ch/submit?ln=hr">Prihvati</a> :: <a class="footer" href="https://cds.cern.ch/youraccount/display?ln=hr">Personaliziraj</a> :: <a class="footer" href="https://cds.cern.ch/help/?ln=hr">Pomoć</a> :: <a class="footer" href="https://cern.service-now.com/service-portal?id=privacy_policy&se=CDS-Service" target="_blank">Privacy Notice</a> :: <a class="footer" href="https://repository.cern/content-policy" target="_blank">Content Policy</a> :: <a class="footer" href="https://repository.cern/terms" target="_blank">Terms and Conditions</a> <br /> Powered by <a class="footer" href="http://invenio-software.org/">Invenio</a> <br /> Održava <a class="footer" href="https://cern.service-now.com/service-portal?id=service_element&name=CDS-Service">CDS Service</a> - Need help? 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