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type="text/javascript">DM_redirect("https://web.archive.org/web/20140626154027/http://m.semi.org");</script> </div> </div>  </div> </div> </div></div>  <div id="main-wrapper"><div id="main" class="clearfix with-navigation"> <div id="content" class="column"><div class="section">  <div id="content-area"> <div class="panel-display zen-two-sidebars clearfix"> <div class="panel-content"><div class="panel-content-inner inside panel-panel"> <div id="rightcorner"></div> <div class="panel-pane pane-node-content"> <h2 class="title">SEMI® Semiconductor Capital Equipment Market</h2> <div id="node-26556" class="node node-type-page build-mode-full clearfix"> <div class="content"> <div class="article" id="rightColRegNoBorders">  <font face="Arial" size="4"><strong>Semiconductor Capital Equipment Market</strong></font><div class="contentRow"><div class="tableContentArea"><table height="31" width="625" cellpadding="5" cellspacing="0"><tbody><tr><td width="193" bordercolor="#ffffff" valign="top" bgcolor="#ffffff"><p><font face="Arial" size="2"><u><a href="/web/20140626154027/http://www.semi.org/en/MarketInfo/EquipmentMarket/index.htm#P7_74">Summary</a><a href="/web/20140626154027/http://www.semi.org/en/MarketInfo/EquipmentMarket/index.htm#P34_1133"> <br/>Resources</a></u></font> </p></td><td width="152" bordercolor="#ffffff" valign="top" bgcolor="#ffffff"><p><font face="Arial" size="2"><u><a href="/web/20140626154027/http://www.semi.org/en/MarketInfo/EquipmentMarket/index.htm#P50_2912">Products</a></u></font> </p></td><td width="104" bordercolor="#ffffff" valign="top" bgcolor="#ffffff">  </td><td width="131" bordercolor="#ffffff" valign="top" bgcolor="#ffffff"><p><font face="Arial" size="2">Follow Us On</font><a href="https://web.archive.org/web/20140626154027/http://www.twitter.com/SEMI_mktstats" target="_top"><img src="/web/20140626154027im_/http://www.semi.org/sites/semi.org/files/cms/groups/public/documents/web_content/_export/CTR_022314_99_000086_DC_SNIPPET_LAYOUT/122786-1.jpg" width="78" height="19" border="0"/><br/></a></p></td></tr></tbody></table><div class="heading2"><p><font face="Arial" size="3"><strong><a name="P7_74"></a>Summary</strong></font> </p></div><p><font face="Arial" size="2">Semiconductor equipment plays a vital role in the manufacturing of integrated devices (I.C.s) are typically located in a manufacturing facility called a fab. The types or categories of semiconductor equipment consist of the following:</font> </p><table height="140" width="638" cellpadding="5" cellspacing="0"><tbody><tr><td width="295" valign="top"><ul compact="compact" type="disc"><li><font face="Arial" size="2"></font><font face="Arial" size="2">Wafer Manufacturing/Wafer Processing</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Fab Facilities Equipment</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Mask/Reticle Equipment</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Surface Conditioning/Clean and Dry</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Resist processing Equipment</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Expose and Write</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Etch Equipment</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Ion Implant Equipment</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Sputter Equipment</font> </li></ul></td><td width="320" valign="top"><ul compact="compact" type="disc"><li><font face="Arial" size="2"></font><font face="Arial" size="2">Thermal Processing Equipment</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Chemical Mechanical Planarization (CMP)</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Chemical Vapor Deposition (CVP)</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Inspection Measurement</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Assembly and Packaging Equipment</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">SOC & Logic Test Equipment</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Memory Test Equipment</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Handlers</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Probe Equipment</font> </li></ul></td></tr></tbody></table><p><font face="Arial" size="2"><br/></font></p><div class="heading2"><p><font face="Arial" size="3"><strong><a name="P34_1133"></a>Resources</strong></font> </p></div><table cellpadding="5" cellspacing="0"><tbody><tr><td width="31" valign="top"><p><img src="/web/20140626154027im_/http://www.semi.org/sites/semi.org/files/cms/groups/public/documents/web_content/_export/CTR_022314_99_000086_DC_SNIPPET_LAYOUT/122786-2.jpg" alt="Member Only Content" width="17" height="17" border="0"/> </p></td><td width="559" valign="top"><p><font face="Arial" size="2"><a href="https://web.archive.org/web/20140626154027/http://ams.semi.org/ebusiness/CustomerService/MemberDownloadDocument.aspx?ID=1698" target="_top"><u>SEMI Equipment Brief: Test Equipment (PDF)</u></a> <br/>There are various types of electrical and reliability tests conducted at different stages of assembly and for different purposes once the wafer fabrication process is finished. Tests include die sort test on wafers, electrical and environmental testing, and burn-in on packaged devices.</font> </p></td></tr><tr><td width="31" valign="top"><p><img src="/web/20140626154027im_/http://www.semi.org/sites/semi.org/files/cms/groups/public/documents/web_content/_export/CTR_022314_99_000086_DC_SNIPPET_LAYOUT/122786-2.jpg" alt="Member Only Content" width="17" height="17" border="0"/> </p></td><td width="559" valign="top"><p><font face="Arial" size="2"><a href="https://web.archive.org/web/20140626154027/http://ams.semi.org/ebusiness/CustomerService/MemberDownloadDocument.aspx?ID=1699" target="_top"><u>SEMI Equipment Brief: Wafer Fab Brief (PDF)</u></a> <br/>Semiconductor fabrication consists of a series of processes in which a device structure is manufactured by applying a series of layers onto a substrate, most commonly on silicon. This involves the deposition and removal of various thin film layers. The areas of the thin film that are to be deposited or removed are controlled through photolithography. Each deposition and removal process is generally followed by cleaning as well as inspection steps.</font> </p></td></tr><tr><td width="31" valign="top"><p><img src="/web/20140626154027im_/http://www.semi.org/sites/semi.org/files/cms/groups/public/documents/web_content/_export/CTR_022314_99_000086_DC_SNIPPET_LAYOUT/122786-2.jpg" alt="Member Only Content" width="17" height="17" border="0"/> </p></td><td width="559" valign="top"><p><font face="Arial" size="2"><a href="https://web.archive.org/web/20140626154027/http://ams.semi.org/ebusiness/CustomerService/MemberDownloadDocument.aspx?ID=1697" target="_top"><u>SEMI Equipment Brief: Other Front-End Equipment Brief (PDF)</u></a> <br/>Other Front-End equipment is a “catch-all” phrase for equipment that is used in frontend manufacturing but not in wafer processing. It includes: Wafer Manufacturing equipment, Photomask/Reticle equipment and Fabrication Facility equipment</font> </p></td></tr><tr><td width="31" valign="top"><p><img src="/web/20140626154027im_/http://www.semi.org/sites/semi.org/files/cms/groups/public/documents/web_content/_export/CTR_022314_99_000086_DC_SNIPPET_LAYOUT/122786-2.jpg" alt="Member Only Content" width="17" height="17" border="0"/> </p></td><td width="559" valign="top"><p><font face="Arial" size="2"><a href="https://web.archive.org/web/20140626154027/http://ams.semi.org/ebusiness/CustomerService/MemberDownloadDocument.aspx?ID=1696" target="_top"><u>SEMI Equipment Brief: Assembly and Packaging (PDF)</u></a> <br/>There are two main purposes for assembling the bare semiconductor device into a package. First, the package provides mechanical and environmental protection to the bare die. Second, the package provides an electrical connection between the die and the printed circuit board (PCB). Nowadays, there are a tremendous number of package types, form factors, and process techniques used in assembly and packaging</font> </p></td></tr><tr><td colspan="2" width="590" valign="top"><p><font face="Arial" size="2"><img src="/web/20140626154027im_/http://www.semi.org/sites/semi.org/files/cms/groups/public/documents/web_content/_export/CTR_022314_99_000086_DC_SNIPPET_LAYOUT/122786-2.jpg" alt="Member Only Content" width="17" height="17" border="0"/> = are only available to SEMI members.</font> </p><p><font face="Arial" size="2">SEMI members: Please <u><a href="https://web.archive.org/web/20140626154027/http://ams.semi.org/ebusiness/UserIdentification.aspx" target="_top">create a profile</a></u> to access resources. If you already have a profile, please log-in with your credentials.<br/> <br/>Not a SEMI member? <u><a href="/web/20140626154027/http://www.semi.org/en/Membership/BecomeaMember/index.htm" target="_top">Click here</a></u> to learn more about SEMI membership</font> </p></td></tr></tbody></table><div class="heading2"><p><font face="Arial" size="3"><strong><a name="P50_2912"></a>Products</strong></font> </p></div><p><font face="Arial" size="2">SEMI Industry Research and Statistics delivers powerful market data that enables you to:</font> </p><ul compact="compact" type="disc"><li><font face="Arial" size="2"></font><font face="Arial" size="2">Stay ahead of your competition by being more quickly informed</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Obtain more frequent input for business planning, strategic planning and forecasting</font> </li><li><font face="Arial" size="2"></font><font face="Arial" size="2">Get a better understanding of this cyclic industry</font> </li></ul><table cellpadding="5" cellspacing="0"><tbody><tr><td width="128" rowspan="2" valign="top"><p><a href="/web/20140626154027/http://www.semi.org/en/Store/MarketInformation/equipment/ctr_027202" target="_top"><img src="/web/20140626154027im_/http://www.semi.org/sites/semi.org/files/cms/groups/public/documents/web_content/_export/CTR_022314_99_000086_DC_SNIPPET_LAYOUT/122786-3.jpg" width="104" height="126" border="0"/></a> </p></td><td colspan="2" width="454" valign="top"><p><font face="Arial" size="2"><u><a href="/web/20140626154027/http://www.semi.org/en/Store/MarketInformation/equipment/ctr_027202" target="_top">Equipment Market Data Subscription (EMDS)</a></u> <br/>A complete source for semiconductor equipment market information, including China and includes the SEMI Book-to-Bill Report, the Worldwide SEMS Report and the SEMI Equipment Forecast. These reports help you understand market trends and benchmark current business activity.</font> </p></td></tr><tr><td width="321" valign="top">  </td><td width="133" valign="top"><p><a href="/web/20140626154027/http://www.semi.org/en/Store/MarketInformation/equipment/ctr_027202" target="_top"><img src="/web/20140626154027im_/http://www.semi.org/sites/semi.org/files/cms/groups/public/documents/web_content/_export/CTR_022314_99_000086_DC_SNIPPET_LAYOUT/122786-4.jpg" width="109" height="49" border="0"/></a> </p></td></tr></tbody></table><table cellpadding="5" cellspacing="0"><tbody><tr><td width="128" rowspan="2" valign="top"><p><font face="Arial" size="2"><a href="/web/20140626154027/http://www.semi.org/en/Store/MarketInformation/fabdatabase/ctr_027238" target="_top"><img src="/web/20140626154027im_/http://www.semi.org/sites/semi.org/files/cms/groups/public/documents/web_content/_export/CTR_022314_99_000086_DC_SNIPPET_LAYOUT/122786-5.jpg" width="100" height="126" border="0"/> </a></font></p></td><td colspan="2" width="454" valign="top"><p><font face="Arial" size="2"><a href="/web/20140626154027/http://www.semi.org/en/Store/MarketInformation/fabdatabase/ctr_027238" target="_top"><u>World Fab Forecast</u></a> <br/>The SEMI World Fab Forecast provides high level summaries, charts, and graphs; in-depth analyses of semiconductor capital equipment spending, capacity, technology nodes and wafer size, down to the detail of each fab; and forecast for the next 18 months.</font> </p></td></tr><tr><td width="321" valign="top">  </td><td width="133" valign="top"><p><a href="/web/20140626154027/http://www.semi.org/en/Store/MarketInformation/fabdatabase/ctr_027238" target="_top"><img src="/web/20140626154027im_/http://www.semi.org/sites/semi.org/files/cms/groups/public/documents/web_content/_export/CTR_022314_99_000086_DC_SNIPPET_LAYOUT/122786-4.jpg" width="109" height="49" border="0"/></a> </p></td></tr></tbody></table><table cellpadding="5" cellspacing="0"><tbody><tr><td width="128" rowspan="2" valign="top"><p><font face="Arial" size="2"><a href="/web/20140626154027/http://www.semi.org/en/Store/marketinformation/equipment/ctr_027213" target="_top"><u><img src="/web/20140626154027im_/http://www.semi.org/sites/semi.org/files/cms/groups/public/documents/web_content/_export/CTR_022314_99_000086_DC_SNIPPET_LAYOUT/122786-3.jpg" width="104" height="126" border="0"/> </u></a></font></p></td><td colspan="2" width="454" valign="top"><p><font face="Arial" size="2"><u><a href="/web/20140626154027/http://www.semi.org/en/Store/marketinformation/equipment/ctr_027213" target="_top">Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Historical Report (1991-2011)</a></u> <br/>The WWSEMS report provides monthly historical data of the global equipment bookings for 24 categories in North America, Japan, Europe, Korea, Taiwan, China and Rest of World (ROW). Japanese headquartered companies provide inputs through SEMI’s partner, the Semiconductor Equipment Association of Japan (SEAJ).</font> </p></td></tr><tr><td width="321" valign="top">  </td><td width="133" valign="top"><p><a href="/web/20140626154027/http://www.semi.org/en/Store/marketinformation/equipment/ctr_027213" target="_top"><img src="/web/20140626154027im_/http://www.semi.org/sites/semi.org/files/cms/groups/public/documents/web_content/_export/CTR_022314_99_000086_DC_SNIPPET_LAYOUT/122786-4.jpg" width="109" height="49" border="0"/></a> </p></td></tr></tbody><tbody><tr><td width="128" rowspan="2" valign="top"><p><font face="Arial" size="2"><a href="/web/20140626154027/http://www.semi.org/en/Store/marketinformation/equipment/ctr_027212" target="_top"><u><img src="/web/20140626154027im_/http://www.semi.org/sites/semi.org/files/cms/groups/public/documents/web_content/_export/CTR_022314_99_000086_DC_SNIPPET_LAYOUT/122786-6.jpg" width="106" height="132" border="0"/> </u></a></font></p></td><td colspan="2" width="454" valign="top"><p><font face="Arial" size="2"><a href="/web/20140626154027/http://www.semi.org/Store/MarketInformation/equipment/ctr_027212" target="_blank">Historical Book-to-Bill Report (1991 - 2011)</a> <br/>The SEMI Historical Book-to-Bill provides global bookings and billings by month for North American-based semiconductor equipment manufacturers for the period from 1991 to 2011.</font> </p></td></tr><tr><td width="321" valign="top">  </td><td width="133" valign="top"><p><a href="/web/20140626154027/http://www.semi.org/en/Store/marketinformation/equipment/ctr_027212" target="_top"><img src="/web/20140626154027im_/http://www.semi.org/sites/semi.org/files/cms/groups/public/documents/web_content/_export/CTR_022314_99_000086_DC_SNIPPET_LAYOUT/122786-4.jpg" width="109" height="49" border="0"/></a> </p></td></tr><tr><td rowspan="2"><span style="font-size: 12pt; font-family: "Times New Roman";"><img src="/web/20140626154027im_/http://www.semi.org/sites/semi.org/files/SESTG_marketstudy_cover_web.jpg" alt="SESTG 2011 report" width="127" height="164"/></span></td><td colspan="2"><p><a href="/web/20140626154027/http://www.semi.org/node/36941">The Secondary Semiconductor Equipment Market study</a></p><p>The Secondary Semiconductor Equipment Market study provides data and analysis that defines the secondary equipment, services and technology markets.</p></td></tr><tr><td style="width: 321px;"> </td><td><a href="/web/20140626154027/http://www.semi.org/node/36941" target="_top"><img src="/web/20140626154027im_/http://www.semi.org/sites/semi.org/files/cms/groups/public/documents/web_content/_export/CTR_022314_99_000086_DC_SNIPPET_LAYOUT/122786-4.jpg" width="109" height="49" border="0"/></a></td></tr></tbody></table><p> </p><p> </p></div></div></div> </div> </div>  </div> </div></div>  <div class="panel-sidebar-first"><div class="panel-sidebar-first-inner inside panel-panel"> <div 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