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class="introduce">核心提示:中瓷电子拟收购中电科十三所氮化镓基站射频芯片业务、博威集成和国联万众部分股权或全部股权。</div><div id="content"><div class="content" id="article"><div><strong>半导体产业网消息:</strong>2022年1月16日,中瓷电子(003031)发布公告:公司拟筹划以发行A股股份的方式购买中国电科十三所氮化镓通信基站射频芯片业务相关的经营性资产及负债(以下简称“氮化镓通信基站射频芯片业务”),以及中国电科十三所等股东持有的河北博威集成电路有限公司(以下简称“博威公司”)和北京国联万众半导体科技有限公司(以下简称“国联万众”)的部分股权或全部股权。</div> <div> </div> <div>中瓷电子2021年1月4日正式登陆A股市场。中瓷电子是专业从事电子陶瓷系列产品研发、生产和销售的高新技术企业,主要产品包括光通信器件外壳、无线功率器件外壳、红外探测器外壳、大功率激光器外壳、声表晶振类外壳、3D光传感器模块外壳、5G通信终端模块外壳、氮化铝陶瓷基板、陶瓷元件、集成式加热器等。</div> <div> </div> <div>中瓷电子的电子陶瓷外壳类产品是高端半导体元器件中实现内部芯片与外部电路连接的重要桥梁,对半导体元器件性能具有重要作用和影响。在陶瓷外壳系列产品方面,中瓷电子是国内能与国际知名企业进行竞争的少数厂商之一,是我国替代进口电子陶瓷外壳的主要代表企业,是高新技术企业,在国内电子陶瓷行业具有重要影响力。</div> <div> </div> <div>此前披露的招股说明书显示,公司现阶段产品主要应用于光通信、无线通信等领域,未来三年将有效拓展消费电子领域。中瓷电子控股股东中国电科十三所,实际控制人为中国电科。</div> <div> </div> <div>据了解,中电科十三所氮化镓基站射频芯片业务是国内主流供应商,实际控制人为中国电科;博威集成(中电科十三所持股84.16%)是国内领先的射频、微波芯片供应商,本次交易前,中国电科十三所持有博威公司84.16%的股份,为博威公司的控股股东,实际控制人为中国电科。2020年上半年,总资产达7.20亿元,净资产达3.06亿元,净利润1.16亿元;国联万众(中电科十三所持股44.83%)是国内初创的GaN和SiC优质半导体资产,2020年上半年,总资产达4.25亿元,净资产达2.48亿元,净利润97万元。本次交易前,中国电科十三所持有国联万众44.83%的股份,为国联万众的控股股东,实际控制人为中国电科。<br /> <br /> 中瓷电子表示,由于博威公司、国联万众的股东较多,本次交易的交易对方范围尚未最终确定,相关方案尚未最终确定。本次交易构成关联交易,预计可能构成《上市公司重大资产重组管理办法》规定的重大资产重组,本次交易不会导致公司实际控制人发生变更。经公司向深圳证券交易所申请,公司股票自2022年1月17日开市起停牌,预计停牌时间不超过10个交易日。<br /> <br /> <div>财报显示,中瓷电子2021年前三季度营业收入为7.96亿元,同比增长31.27%;归属上市公司股东净利润为9989.12万元,同比增长24.47%。</div> <div> </div> <div><strong>东吴证券:背靠中电科十三所,国产电子陶瓷外壳最强音</strong></div> <div> </div> <div>东吴证券报告分析称,中电科十三所为第一大股东,国产电子陶瓷外壳最强者业绩快速增长:中瓷电子布局通信器件用电子陶瓷外壳、工业激光器用电子陶瓷外壳、消费电子陶瓷外壳及基板、汽车电子件四大类陶瓷产品,是国内规模最大的高端电子陶瓷外壳生产企业。公司业绩快速增长, 2016-2020 年营收复合增速高达 37%, 2016-2020 年归母净利润复合增速高达 38%。截至 2022 年 1 月 15 日,中国电子科技集团第十三研究所持有公司 49.68%的股份,为公司第一大股东。中电科十三所是我国重要的高端核心电子器件供应基地、半导体新器件新技术创新基地,为中瓷电子技术研发,产业应用甚至是未来收并购提供强力支持。</div> <div> </div> <div>陶瓷材料是高端电子元器件封装核心材料,国产化空间广阔: 电子陶瓷广泛应用于电子元器件制造中,是电子元器件制造不可或缺的基础材料。在微电子封装领域,陶瓷外壳相比于金属和塑料外壳, 具有更好的耐湿性、线热膨胀率和热导率,在电热机械性能方面更为稳定,是高端电子器件封装的主要部件。</div> <div> </div> <div>在全球陶瓷封装市场, 中国厂商营收市场份额较低,根据 QY Research 数据, 2019 年日本京瓷和日本 NGK/NTK 营收占比分别高达 43.16%和 38.43%,中瓷电子占比 3.52%, 为中国厂商第二,第一名潮州三环集团也仅占 5.04%。电子陶瓷外壳主要用于航天军工等高端元器件应用场景,技术壁垒较高。在政策支持、需求强劲、海外巨头垄断、国产化需求迫切多个因素下,电子陶瓷国产化前景广阔。</div> <div> </div> <div>自身竞争优势明显, 大股东中电科十三所支持,未来有望成为世界一流电子陶瓷厂商: 电子陶瓷的技术壁垒体现在电子陶瓷新材料研发生产、半导体外壳仿真设计、生产工艺三个方面,三方面都需要长时间的研发投入和经验积累。 中瓷电子技术国内领先,材料方面,中瓷电子已经自主掌握三种陶瓷体系;设计方面,公司已经拥有先进的设计手段和设计软件平台,例如已经可以设计开发 400G 光通信器件外壳,与国外同类产品技术水平相当;工艺技术方面, 公司已经具有全套的多层陶瓷外壳制造技术。</div> <div> </div> <div>另外,公司大股东中国电子科技集团公司第十三研究所半导体技术国内领先,优质资产林立。自建所以来, 十三所在半导体领域先后创造了 60 多项国内第一,取得了 3100 多项科研成果, 下属八个专业部、三个研究室,七条中试线和七个控股高新技术产业公司,未来有望给予公司技术、并购以及产业生态相关支持,助力公司快速发展。</div> </div></div> </div> <div class="award"><div onclick="Go('http://www.casmita.com/member/award.php?mid=21&itemid=7108');">打赏</div></div><div id="comment" style="display:;"> <div 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