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CASICON 成都站│2024功率半导体器件与集成电路会议（CSPSD 2024）_2024功率半导体器件与集成电路会议（CSPSD 2024）_CSPSD 2024 成都站
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2024）”在成都开幕。本次会议在电子科技大学和第三代半导体产业技术创新战略联盟指导下，由电子薄膜与集成器件国家重点实验室、电子科技大学集成电路研究中心、成都信息工程大学、极智半导体产业网、第三代半导体产业、中国电源学会元器件专业委员会共同主办。来自全国各地高校科研院所的学术界专家、学者和产业界领袖200余位嘉宾代表出席本次论坛。围绕硅基、化合物功率器件，以碳化硅和氮化镓为代表的高压及低压等电力电子器件、功率集成电路、封装等主题，深入探讨交流最新技术进展与发展趋势，分享前沿研究成果，携手促进功率半导体器件与集成电路技术与应用发展。电子科技大学教授周琦主持了论坛开幕式环节。</p></div> </div> <div class="block"> <h2 class="b-title">大会报道</h2> <div class="b-box clearfix"> <div class="grid_1"> <div class="lis-tit-img"> <a href="http://www.casmita.com/news/202404/27/15190.html" target="_blank" class="lis-tit-img_thumb"><img src="http://www.casmita.com/file/upload/202404/27/172028761.jpg" border="0"></a> <div class="lis-tit-img_desc"><a href="http://www.casmita.com/news/202404/27/15190.html" target="_blank" class="lis-tit-img_tit"><span style="color:#0000FF">【CSPSD 2024】2024功率半导体器件与集成电路会议在成都开幕</span></a><p class="lis-tit-img_txt"><p><span style="color: rgb(51, 51, 51); font-family: " microsoft="" font-size:="" text-indent:="">来自全国各地高校科研院所的学术界专家、学者和产业界领袖200余位嘉宾代表出席本次论坛。围绕硅基、化合物功率器件，以碳化硅和氮化镓为代表的高压及低压等电力电子器件、功率集成电路、封装等主题，深入探讨交流最新技术进展与发展趋势，分享前沿研究成果，携手促进功率半导体器件与集成电路技术与应用发展。电子科技大学教授周琦主持了论坛开幕式环节。</span></p></p></div> </div> </div> <div class="grid_1"> <div class="lis-tit-img"> <a href="http://www.casmita.com/news/202404/29/15195.html" target="_blank" class="lis-tit-img_thumb"><img src="http://www.casmita.com/file/upload/202404/30/075420182.jpg" border="0"></a> <div class="lis-tit-img_desc"><a href="http://www.casmita.com/news/202404/29/15195.html" target="_blank" class="lis-tit-img_tit"><span style="color:#0000FF">CSPSD 2024论坛1：聚焦硅基、化合物功率器件设计及集成应用发展</span></a><p class="lis-tit-img_txt"><p><span style="color: rgb(51, 51, 51); font-family: " microsoft="" font-size:="" text-indent:="">会议除开幕大会，还设置了两大平行论坛。其中“硅基、化合物功率器件设计及集成应用”平行论坛上，实力派嘉宾代表们深入研讨，分享相关技术最新研究成果，探讨发展趋势与前沿，观点交互，碰撞激发新的思路，共同促进产业技术发展。电子科技大学教授周琦，西安电子科技大学教授周弘，氮矽半导体总经理罗鹏，莱普科技副总经理潘岭峰，重庆邮电大学教授黄义，电子科技大学教授明鑫共同主持了该分论坛。</span></p></p></div> </div> </div> <div class="grid_1"> <div class="lis-tit-img"> <a href="http://www.casmita.com/news/202404/29/15196.html" target="_blank" class="lis-tit-img_thumb"><img src="http://www.casmita.com/file/upload/202404/29/080641882.jpg" border="0"></a> <div class="lis-tit-img_desc"><a href="http://www.casmita.com/news/202404/29/15196.html" target="_blank" class="lis-tit-img_tit"><span style="color:#0000FF">CSPSD 2024论坛2：追踪高压器件设计、集成及封装应用发展趋势</span></a><p class="lis-tit-img_txt"><p><span style="color: rgb(51, 51, 51); font-family: " microsoft="" font-size:="" text-indent:="">由电子科技大学和第三代半导体产业技术创新战略联盟指导，电子薄膜与集成器件国家重点实验室、电子科技大学集成电路研究中心、成都信息工程大学、极智半导体产业网、第三代半导体产业、中国电源学会元器件专业委员会共同主办。期间，“高压器件设计、集成及封装应用”平行论坛上，来自全国各地的科研及产业界代表们深入研讨，追踪高压器件设计、集成及封装应用技术发展与前沿趋势。电子科技大学教授邓小川，大连理工大学教授王德君，电子科技大学研究员张金平，南方科技大学副教授叶怀宇，中国科学院上海微系统与信息技术研究所研究员程新红，东南大学集成电路学院副教授魏家行共同主持了该分论坛。</span></p></p></div> </div> </div> </div> </div> <div class="block"> <h2 class="b-title">会议通知</h2> <div class="b-box clearfix"> <div class="grid_1"> <div class="lis-tit-img"> <a href="http://www.casmita.com/news/202404/18/15116.html" target="_blank" class="lis-tit-img_thumb"><img src="" border="0"></a> <div class="lis-tit-img_desc"><a href="http://www.casmita.com/news/202404/18/15116.html" target="_blank" class="lis-tit-img_tit">27位演讲嘉宾公布！2024功率半导体器件与集成电路会议4月26-28日成都见！</a><p class="lis-tit-img_txt">27位演讲嘉宾公布！2024功率半导体器件与集成电路会议4月26-28日成都见！</p></div> </div> </div> <div class="grid_1"> <div class="lis-tit-img"> <a href="http://www.casmita.com/news/202404/19/15128.html" target="_blank" class="lis-tit-img_thumb"><img src="" border="0"></a> <div class="lis-tit-img_desc"><a href="http://www.casmita.com/news/202404/19/15128.html" target="_blank" class="lis-tit-img_tit">CSPSD2024专家学者名企云集，33位演讲嘉宾聚焦前沿，4月26-28日成都见！</a><p class="lis-tit-img_txt">CSPSD2024专家学者名企云集，32位演讲嘉宾聚焦前沿，4月26-28日成都见！</p></div> </div> </div> <div class="grid_1"> <div class="lis-tit-img"> <a href="http://www.casmita.com/news/202404/16/15085.html" target="_blank" class="lis-tit-img_thumb"><img src="" border="0"></a> <div class="lis-tit-img_desc"><a href="http://www.casmita.com/news/202404/16/15085.html" target="_blank" class="lis-tit-img_tit">15位演讲嘉宾主题公布！2024功率半导体器件与集成电路会议4月26-28日成都见！</a><p class="lis-tit-img_txt">为更好的推动国内功率半导体及集成电路学术及产业交流，在电子科技大学和第三代半导体产业技术创新战略联盟指导下，极智半导体产</p></div> </div> </div> <div class="grid_1"> <div class="lis-tit-img"> <a href="http://www.casmita.com/news/202404/15/15068.html" target="_blank" class="lis-tit-img_thumb"><img src="" border="0"></a> <div class="lis-tit-img_desc"><a href="http://www.casmita.com/news/202404/15/15068.html" target="_blank" class="lis-tit-img_tit">首批报告嘉宾公布！2024功率半导体器件与集成电路会议4月26-28日成都见！</a><p class="lis-tit-img_txt">为更好的推动国内功率半导体及集成电路学术及产业交流，在电子科技大学和第三代半导体产业技术创新战略联盟指导下，极智半导体产</p></div> </div> </div> <div class="grid_1"> <div class="lis-tit-img"> <a href="http://www.casmita.com/news/202404/12/15045.html" target="_blank" class="lis-tit-img_thumb"><img src="" border="0"></a> <div 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