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padding: 0px 8px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; letter-spacing: 0.544px; text-align: justify; font-size: 15px; overflow-wrap: break-word !important;"> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">半导体封装领域，为了实现超越摩尔定律（More Than Moore）模式，2.5D和3D封装已成为增长最快的先进封装技术之一。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">事实上，能与2.5D和3D封装同日而语的技术还包括：异构集成、扇出型、FOWLP、FOPLP、硅通孔、玻璃封装、封装天线、共封装光学器件、RDL等等。这些技术正在为人工智能、高性能计算（HPC）、数据中心、自动驾驶汽车、5G和消费电子等领域带来更大的性能提升。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">不过，寸有所长尺有所短，我们来看看行业专家对2.5D和3D先进封装及相关技术的一些观点。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> </section><section powered-by="xiumi.us" style="margin: 10px 0px 0px; 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display: inline-block; width: 44px; height: 44px; vertical-align: top; overflow: hidden; border-width: 0px; border-radius: 52px; border-style: none; border-color: rgb(0, 0, 0); background-color: rgb(255, 224, 139);"><svg viewbox="" style="float:left;line-height:0;width:0;vertical-align:top;"></svg></section></section></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; display: inline-block; vertical-align: top; width: auto; min-width: 10%; flex: 0 0 auto; height: auto; align-self: flex-start;"><section powered-by="xiumi.us" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; text-align: left; transform: translate3d(-19px, 0px, 0px);"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; display: inline-block; width: 44px; height: 44px; vertical-align: top; overflow: hidden; border-width: 0px; border-radius: 52px; border-style: none; border-color: rgb(0, 0, 0); background-color: rgb(238, 249, 248);"><svg viewbox="" style="float:left;line-height:0;width:0;vertical-align:top;"></svg></section></section></section></section><section powered-by="xiumi.us" style="margin: -35px 0px 10px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; font-size: 16px; letter-spacing: 0.544px; text-align: center; transform: translate3d(1px, 0px, 0px); overflow-wrap: break-word !important;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; color: rgb(7, 70, 155);"> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; clear: both; min-height: 1em;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important;">半导体封装的演进</strong><span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> </section></section><section powered-by="xiumi.us" style="margin: 0px; padding: 0px 8px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; letter-spacing: 0.544px; text-align: justify; font-size: 15px; overflow-wrap: break-word !important;"> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">最早的半导体封装是1D PCB级别，现在已发展到晶圆级别的先进3D混合键合，实现了个位数微米的互连间距和1000GB/s带宽的高能效指标。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">引领这一演变的四个关键参数有四个：一是功率，实现效率的优化；二是性能，提高带宽，缩短通信长度；三是面积，满足HPC芯片所需的要求，以3D集成实现更小尺寸；四是成本，通过不断减少替代材料，提高制造效率。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">2.5D和3D封装技术融入了各种封装工艺。在2.5D封装中，根据中介层材料的不同，分为硅基、有机基和玻璃基中介层；而在3D封装中，微泵技术的发展进一步实现了更小的间距尺寸。另外，通过采用混合键合技术（如直接连接Cu-Cu）可实现个位数的间距尺寸，标志着该领域的一次重大进步。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> </section><section powered-by="xiumi.us" style="margin: 10px 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; font-size: 16px; letter-spacing: 0.544px; text-align: center; line-height: 0; 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padding: 0px 8px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; letter-spacing: 0.544px; text-align: justify; font-size: 15px; overflow-wrap: break-word !important;"> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; text-align: center; overflow-wrap: break-word !important;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; font-size: 14px;"><em style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important;">半导体封装的演进</strong></em></span><span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> </section><section powered-by="xiumi.us" style="margin: 10px 0px 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; font-size: 16px; letter-spacing: 0.544px; text-align: center; justify-content: center; transform: translate3d(10px, 0px, 0px); display: flex; flex-flow: row; overflow-wrap: break-word !important;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; display: inline-block; vertical-align: top; width: auto; min-width: 10%; flex: 0 0 auto; height: auto; align-self: flex-start;"><section powered-by="xiumi.us" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; display: inline-block; width: 44px; height: 44px; vertical-align: top; overflow: hidden; border-width: 0px; border-radius: 52px; border-style: none; border-color: rgb(0, 0, 0); background-color: rgb(255, 224, 139);"><svg viewbox="" style="float:left;line-height:0;width:0;vertical-align:top;"></svg></section></section></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; display: inline-block; vertical-align: top; width: auto; min-width: 10%; flex: 0 0 auto; height: auto; align-self: flex-start;"><section powered-by="xiumi.us" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; text-align: left; transform: translate3d(-19px, 0px, 0px);"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; display: inline-block; width: 44px; height: 44px; vertical-align: top; overflow: hidden; border-width: 0px; border-radius: 52px; border-style: none; border-color: rgb(0, 0, 0); background-color: rgb(238, 249, 248);"><svg viewbox="" style="float:left;line-height:0;width:0;vertical-align:top;"></svg></section></section></section></section><section powered-by="xiumi.us" style="margin: -35px 0px 10px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; font-size: 16px; letter-spacing: 0.544px; text-align: center; transform: translate3d(1px, 0px, 0px); overflow-wrap: break-word !important;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; color: rgb(7, 70, 155);"> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; clear: both; min-height: 1em;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important;">2.5D封装的三个关键</strong><span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> </section></section><section powered-by="xiumi.us" style="margin: 0px; padding: 0px 8px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; letter-spacing: 0.544px; text-align: justify; font-size: 15px; overflow-wrap: break-word !important;"> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">事实上，不管是哪种先进封装，都会有其自身的优缺点。2.5D封装主要有硅、有机和新近出现的玻璃等材质。在硅基板上，可以将芯片与中介层连接，中介层与芯片之间利用硅通孔连接；有机封装则利用有机基板作为基材，具有成本低、可弯曲等特点。另外，耐高温、透光性好的玻璃基板也可用作封装基材。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">IDTechEx的Yu-Han Chang博士和James Jeffs博士认为，硅中介层利用全无源硅晶圆，在基于扇出的模塑化合物或具有空腔的衬底中采用局部硅桥形式，通常用于HPC集成的2.5D封装，以满足最精细的路由功能。但与有机材料等替代品相比，硅在材料和制造方面面临着成本的挑战及封装面积的限制。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">为了解决这一问题，局部硅桥的形式日渐增加，只在精细功能至关重要的地方战略性地使用硅。“预计硅桥结构将得到更多使用，特别是在硅中介层面临面积限制的情况下。”他们表示。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">有机材料具有低于硅的介电常数，有助于降低封装中的RC（阻容）延迟，是硅更具成本效益的替代品。这些优势推动了基于有机物的2.5D封装。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">不过，有机物的一个主要缺点是，与硅基封装相比，其相同水平互连功能的减少限制了其在HPC应用中的采用。在成本方面，有机RDL（再分配层）适用于成本敏感的产品，板级封装将进一步利用成本效益，而玻璃封装有望成为硅的廉价替代品。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> </section><section powered-by="xiumi.us" style="margin: 10px 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; font-size: 16px; letter-spacing: 0.544px; text-align: center; line-height: 0; overflow-wrap: break-word !important;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; vertical-align: middle; display: inline-block; line-height: 0;"><img data-s="300,640" data-src="https://mmbiz.qpic.cn/sz_mmbiz_png/UL9tPXYCuLXwlN5No9vKh9Meg4qdqDdBmyx3efTUXdtLnJuQQ8icLKAdhyBjK7Eib89FOzgZ8icnxsibic7ibOaiaiaxyg/640?wx_fmt=png" data-ratio="0.4888366627497062" data-w="851" data-original-style="vertical-align: middle;max-width: 100%;width: 100%;box-sizing: border-box;" data-index="1" src="/d/file/jszc/2024-03-01/5ae549962f7428faec2771ff304682a6.png" _width="100%" __sec_open_place_holder__="true" crossorigin="anonymous" alt="图片" data-fail="0" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; vertical-align: middle; overflow-wrap: break-word !important; height: auto !important; visibility: visible !important;" width="708" /></section></section><section powered-by="xiumi.us" style="margin: 0px; padding: 0px 8px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; letter-spacing: 0.544px; text-align: justify; font-size: 15px; overflow-wrap: break-word !important;"> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; text-align: center; overflow-wrap: break-word !important;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; font-size: 14px;"><em style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important;">2.5D封装技术发展趋势</strong></em></span><span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">要进一步提高半导体封装的性能，需要综合考虑多个方面：<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">一是介电材料：作为半导体封装中的重要组成部分，其性能直接影响封装的电气性能和可靠性。选择具有高绝缘性、低介电常数和介质损耗的介电材料有助于提高封装性能。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">二是RDL：RDL是半导体封装中的一种关键技术，可以将芯片引脚重新分布，以适应封装的需求。通过优化RDL层的厚度、材料和工艺，可以提高封装的电气性能和可靠性。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">L/S（线宽和线间距）：L/S是半导体封装中描述互连特征的参数。减小L/S可以增加互连密度，提高封装性能。不过，过小的L/S可能导致制造难度和可靠性问题，因此需要在两者之间进行权衡。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">凸点尺寸：凸点是芯片与封装基板之间的连接点。减小凸点尺寸可以提高封装的电气性能和可靠性，同时也需要保证凸点的强度和连接的稳定性。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">芯片尺寸和形状：减小芯片尺寸可以提高封装密度，但也需要考虑芯片的散热性能和电气性能；而采用复杂形状的芯片可能增加封装的复杂性和难度。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">封装类型：选择合适的封装类型也是提高半导体封装性能的关键。例如，2.5D和3D封装技术可以提高芯片性能、降低功耗、缩小体积和降低成本。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">制造工艺：优化制造工艺可以提高封装的可靠性和稳定性。例如，采用先进的材料、设备和工艺可以减小缺陷和不良率，提高生产效率。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> </section><section powered-by="xiumi.us" style="margin: 10px 0px 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; font-size: 16px; letter-spacing: 0.544px; text-align: center; justify-content: center; transform: translate3d(10px, 0px, 0px); display: flex; flex-flow: row; overflow-wrap: break-word !important;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; display: inline-block; vertical-align: top; width: auto; min-width: 10%; flex: 0 0 auto; height: auto; align-self: flex-start;"><section powered-by="xiumi.us" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; display: inline-block; width: 44px; height: 44px; vertical-align: top; overflow: hidden; border-width: 0px; border-radius: 52px; border-style: none; border-color: rgb(0, 0, 0); background-color: rgb(255, 224, 139);"><svg viewbox="" style="float:left;line-height:0;width:0;vertical-align:top;"></svg></section></section></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; display: inline-block; vertical-align: top; width: auto; min-width: 10%; flex: 0 0 auto; height: auto; align-self: flex-start;"><section powered-by="xiumi.us" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; text-align: left; transform: translate3d(-19px, 0px, 0px);"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; display: inline-block; width: 44px; height: 44px; vertical-align: top; overflow: hidden; border-width: 0px; border-radius: 52px; border-style: none; border-color: rgb(0, 0, 0); background-color: rgb(238, 249, 248);"><svg viewbox="" style="float:left;line-height:0;width:0;vertical-align:top;"></svg></section></section></section></section><section powered-by="xiumi.us" style="margin: -35px 0px 10px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; font-size: 16px; letter-spacing: 0.544px; text-align: center; transform: translate3d(1px, 0px, 0px); overflow-wrap: break-word !important;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; color: rgb(7, 70, 155);"> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; clear: both; min-height: 1em;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important;">3D封装的两大技术</strong><span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> </section></section><section powered-by="xiumi.us" style="margin: 0px; padding: 0px 8px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; letter-spacing: 0.544px; text-align: justify; font-size: 15px; overflow-wrap: break-word !important;"> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">对于3D封装，Yu-Han Chang博士和James Jeffs博士认为，第一个重要技术是微泵。此前，基于热压键合（TCB）工艺的微泵技术已经比较成熟，在各种产品中都一直在用。其技术路线在于不断扩大凸点间距。不过，这个过程中有一个关键挑战，因为较小的焊球尺寸会导致金属间化合物（IMC）形成增加，降低导电性和机械性能。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">此外，紧密的触点间隙还可能导致焊球桥接，在回流期间存在芯片故障风险。由于焊料和IMC的电阻率比铜高，在高性能组件封装中的应用面临限制。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">第二个重要技术是混合键合，包括通过将介电材料（SiO2）与嵌入金属（Cu）结合以创建永久互连。Cu-Cu混合键合的间距低于10μm（通常约为1µm左右），其优点包括扩展I/O、增加带宽、增强3D垂直堆叠、提高功率效率，由于没有底部填充也可以减少寄生和热阻。其挑战在于，这种先进技术的制造复杂性和更高的成本。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> </section><section powered-by="xiumi.us" style="margin: 10px 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; font-size: 16px; letter-spacing: 0.544px; text-align: center; line-height: 0; overflow-wrap: break-word !important;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; vertical-align: middle; display: inline-block; line-height: 0;"><img data-s="300,640" data-src="https://mmbiz.qpic.cn/sz_mmbiz_png/UL9tPXYCuLXwlN5No9vKh9Meg4qdqDdB792Md07Jq20c5Y8ribPbPu1gCNB3DnjaBbRHPrW4LLoAKQq8TCOkc4Q/640?wx_fmt=png" data-ratio="0.4458293384467881" data-w="1043" data-original-style="vertical-align: middle;max-width: 100%;width: 100%;box-sizing: border-box;" data-index="2" src="/d/file/jszc/2024-03-01/c0c337f8bd1368ba47ee2025083be490.png" _width="100%" __sec_open_place_holder__="true" crossorigin="anonymous" alt="图片" data-fail="0" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; vertical-align: middle; overflow-wrap: break-word !important; height: auto !important; visibility: visible !important;" width="708" /></section></section><section powered-by="xiumi.us" style="margin: 0px; padding: 0px 8px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; letter-spacing: 0.544px; text-align: justify; font-size: 15px; overflow-wrap: break-word !important;"> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; text-align: center; overflow-wrap: break-word !important;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; font-size: 14px;"><em style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important;">凸点制造技术的发展</strong></em></span><span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">Cu-Cu混合键合是一种无凸点键合方法，它利用铜金属之间的直接键合，不需要使用凸点或其他中介层。在Cu-Cu混合键合中，铜金属之间的直接键合是通过表面处理和热压键合技术实现的。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">与传统的凸点键合方法相比，Cu-Cu混合键合不需要制造凸点，因此可以简化制造工艺，降低成本并提高封装密度，还可以提供更稳定的电气连接和更好的热传导性能。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">例如，三星手机用的Cu-Cu混合键合背照式CMOS图像传感器采用内存+逻辑3D堆叠，实现了堆叠DRAM裸片的高带宽存储器（HBM）。其好处是更大的I/O和更大的带宽、更多3D垂直堆叠、高功率效率、无填充不足减少了寄生，以及降低了热阻。当然，这种方法有一定制造难度，成本也比较高。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> </section><section powered-by="xiumi.us" style="margin: 10px 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; font-size: 16px; letter-spacing: 0.544px; text-align: center; line-height: 0; overflow-wrap: break-word !important;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; vertical-align: middle; display: inline-block; line-height: 0;"><img data-s="300,640" data-src="https://mmbiz.qpic.cn/sz_mmbiz_png/UL9tPXYCuLXwlN5No9vKh9Meg4qdqDdBl4uIMDVNsmUiciavM7A6YmwLGlhJ1KuHbgD237lCibcI6KQVyZvzc3nlg/640?wx_fmt=png" data-ratio="0.7599093997734995" data-w="883" data-original-style="vertical-align: middle;max-width: 100%;width: 100%;box-sizing: border-box;" data-index="3" src="/d/file/jszc/2024-03-01/4588ccfbb698f9bff8b8ec8d68bf74ef.png" _width="100%" __sec_open_place_holder__="true" crossorigin="anonymous" alt="图片" data-fail="0" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; vertical-align: middle; overflow-wrap: break-word !important; height: auto !important; visibility: visible !important;" width="708" /></section></section><section powered-by="xiumi.us" style="margin: 0px; padding: 0px 8px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; letter-spacing: 0.544px; text-align: justify; font-size: 15px; overflow-wrap: break-word !important;"> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; text-align: center; overflow-wrap: break-word !important;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; font-size: 14px;"><em style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important;">不同封装技术的最小凸点间距</strong></em></span><span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> </section><section powered-by="xiumi.us" style="margin: 10px 0px 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; font-size: 16px; letter-spacing: 0.544px; text-align: center; justify-content: center; transform: translate3d(10px, 0px, 0px); display: flex; flex-flow: row; overflow-wrap: break-word !important;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; display: inline-block; vertical-align: top; width: auto; min-width: 10%; flex: 0 0 auto; height: auto; align-self: flex-start;"><section powered-by="xiumi.us" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; display: inline-block; width: 44px; height: 44px; vertical-align: top; overflow: hidden; border-width: 0px; border-radius: 52px; border-style: none; border-color: rgb(0, 0, 0); background-color: rgb(255, 224, 139);"><svg viewbox="" style="float:left;line-height:0;width:0;vertical-align:top;"></svg></section></section></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; display: inline-block; vertical-align: top; width: auto; min-width: 10%; flex: 0 0 auto; height: auto; align-self: flex-start;"><section powered-by="xiumi.us" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; text-align: left; transform: translate3d(-19px, 0px, 0px);"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; display: inline-block; width: 44px; height: 44px; vertical-align: top; overflow: hidden; border-width: 0px; border-radius: 52px; border-style: none; border-color: rgb(0, 0, 0); background-color: rgb(238, 249, 248);"><svg viewbox="" style="float:left;line-height:0;width:0;vertical-align:top;"></svg></section></section></section></section><section powered-by="xiumi.us" style="margin: -35px 0px 10px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; font-size: 16px; letter-spacing: 0.544px; text-align: center; transform: translate3d(1px, 0px, 0px); overflow-wrap: break-word !important;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; color: rgb(7, 70, 155);"> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; clear: both; min-height: 1em;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important;">先进半导体封装技术趋势谁来驱动？</strong><span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> </section></section><section powered-by="xiumi.us" style="margin: 0px; padding: 0px 8px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; letter-spacing: 0.544px; text-align: justify; font-size: 15px; overflow-wrap: break-word !important;"> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">与单片IC相比，先进半导体封装有助于加快产品上市并降低成本。先进互连技术则可以提供低功耗、低延迟和高带宽连接，同时使集成电路良率更高，系统性能更好，还可以在同一封装中异构集成不同的硅IC或组件。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">HPC芯片集成是推进先进封装的一大动力。处理器-内存差需要提高内存带宽来弥合，2.5D封装的HBM可以做到这一点。新兴的Al训练HPC也需要更多带宽，在逻辑上3D堆叠SRAM可进一步提升带宽，堆叠也能继续缩小3D键合间距，满足更高的带宽要求。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> </section><section powered-by="xiumi.us" style="margin: 10px 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; font-size: 16px; letter-spacing: 0.544px; text-align: center; line-height: 0; overflow-wrap: break-word !important;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; vertical-align: middle; display: inline-block; line-height: 0;"><img data-s="300,640" data-src="https://mmbiz.qpic.cn/sz_mmbiz_png/UL9tPXYCuLXwlN5No9vKh9Meg4qdqDdBobl0ObEqVMkIF6kAahv3Y2nhUwQmwYT9RptjXAYu5WOxetDYWhKxJg/640?wx_fmt=png" data-ratio="0.38454106280193234" data-w="1035" data-original-style="vertical-align: middle;max-width: 100%;width: 100%;box-sizing: border-box;" data-index="4" src="/d/file/jszc/2024-03-01/8e5771e36007bcf9784d4d0391b5626f.png" _width="100%" __sec_open_place_holder__="true" crossorigin="anonymous" alt="图片" data-fail="0" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; vertical-align: middle; overflow-wrap: break-word !important; height: auto !important; visibility: visible !important;" width="708" /></section></section><section powered-by="xiumi.us" style="margin: 0px; padding: 0px 8px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; letter-spacing: 0.544px; text-align: justify; font-size: 15px; overflow-wrap: break-word !important;"> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; text-align: center; overflow-wrap: break-word !important;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; font-size: 14px;"><em style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important;">HPC芯片集成趋势</strong></em></span><span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">由于HPC先进封装的互连长度很短，将存储器3D堆叠在逻辑之上或反之亦然，这被认为是实现超高带宽的最佳方法。不过，其局限性包括逻辑IC中用于功率和信号的大量硅通孔（TSV）需要大量占位面积，管理逻辑IC存在高散热问题。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">针对这些问题，发展路径有两条：一是利用TSV实现3D堆叠，主要用于存储器，使逻辑IC的I/O数量减少；二是开发2.5D封装技术，以有效耗散来自暴露的逻辑IC的热量。这些短期解决方案可在充分实现3D堆叠的潜力之前实现同构和异构集成。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">另一大动力是数据中心服务器加速器，包括GPU小芯片封装（如GPU+GPU、GPU+Cache）、GPU+HBM集成（GPU+HBM）、FPGA小芯片集成等。2022年，相关封装单元的出货量为1920万个，根据预测，到2034年将超过2022年七倍以上。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> </section><section powered-by="xiumi.us" style="margin: 10px 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; font-size: 16px; letter-spacing: 0.544px; text-align: center; line-height: 0; overflow-wrap: break-word !important;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; vertical-align: middle; display: inline-block; line-height: 0;"><img data-s="300,640" data-src="https://mmbiz.qpic.cn/sz_mmbiz_png/UL9tPXYCuLXwlN5No9vKh9Meg4qdqDdBSP88EfGGZOuLZVfQFpp3tjoXQibKQj4icYaxJRrRDu4kCnAL9F1U1yZQ/640?wx_fmt=png" data-ratio="0.6519208381839348" data-w="859" data-original-style="vertical-align: middle;max-width: 100%;width: 100%;box-sizing: border-box;" data-index="5" src="/d/file/jszc/2024-03-01/30f1a7c48111f57ae86c84e4a0550a9c.png" _width="100%" __sec_open_place_holder__="true" crossorigin="anonymous" alt="图片" data-fail="0" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; vertical-align: middle; overflow-wrap: break-word !important; height: auto !important; visibility: visible !important;" width="708" /></section></section><section powered-by="xiumi.us" style="margin: 0px; padding: 0px 8px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; letter-spacing: 0.544px; text-align: justify; font-size: 15px; overflow-wrap: break-word !important;"> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; text-align: center; overflow-wrap: break-word !important;"><span style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; font-size: 14px;"><em style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important;">数据中心服务器加速器封装单元出货量走势</strong></em></span><span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> </section><section powered-by="xiumi.us" style="margin: 10px 0px 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; font-size: 16px; letter-spacing: 0.544px; text-align: center; justify-content: center; transform: translate3d(10px, 0px, 0px); display: flex; flex-flow: row; overflow-wrap: break-word !important;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; display: inline-block; vertical-align: top; width: auto; min-width: 10%; flex: 0 0 auto; height: auto; align-self: flex-start;"><section powered-by="xiumi.us" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; display: inline-block; width: 44px; height: 44px; vertical-align: top; overflow: hidden; border-width: 0px; border-radius: 52px; border-style: none; border-color: rgb(0, 0, 0); background-color: rgb(255, 224, 139);"><svg viewbox="" style="float:left;line-height:0;width:0;vertical-align:top;"></svg></section></section></section><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; display: inline-block; vertical-align: top; width: auto; min-width: 10%; flex: 0 0 auto; height: auto; align-self: flex-start;"><section powered-by="xiumi.us" style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; text-align: left; transform: translate3d(-19px, 0px, 0px);"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; display: inline-block; width: 44px; height: 44px; vertical-align: top; overflow: hidden; border-width: 0px; border-radius: 52px; border-style: none; border-color: rgb(0, 0, 0); background-color: rgb(238, 249, 248);"><svg viewbox="" style="float:left;line-height:0;width:0;vertical-align:top;"></svg></section></section></section></section><section powered-by="xiumi.us" style="margin: -35px 0px 10px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; font-size: 16px; letter-spacing: 0.544px; text-align: center; transform: translate3d(1px, 0px, 0px); overflow-wrap: break-word !important;"><section style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; color: rgb(7, 70, 155);"> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important; clear: both; min-height: 1em;"><strong style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; overflow-wrap: break-word !important;">先进封装的未来挑战</strong><span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> </section></section><section powered-by="xiumi.us" style="margin: 0px; padding: 0px 8px; outline: 0px; max-width: 100%; box-sizing: border-box; color: rgba(0, 0, 0, 0.9); font-family: system-ui, -apple-system, BlinkMacSystemFont, "Helvetica Neue", "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei UI", "Microsoft YaHei", Arial, sans-serif; letter-spacing: 0.544px; text-align: justify; font-size: 15px; overflow-wrap: break-word !important;"> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">未来，先进封装的挑战主要来自一些新技术，如玻璃封装。2023年9月，英特尔公布了其基于玻璃的测试载具封装，引起了人们极大的兴趣。玻璃基板具有耐高温、透光性好等特点，包括可调的热膨胀系数（CTE）、高尺寸稳定性和光滑平坦的表面，这些特性使其成为一种很有前途的中介层候选者，其布线特性有可能与硅媲美。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">不过，尽管大量研究显示了玻璃封装的好处，但用它作为封装基板的规模仍然很小。制造问题已无法回避，玻璃的一个关键优势是其光滑平坦的表面，可以更容易地在顶部沉积高密度RDL层。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">不过，几家公司都提到，他们采购的玻璃基板的平整度无法与硅晶圆相比。当在顶部沉积RDL层时，平整度是巨大的挑战。还有标准化问题，涉及材料、工艺、设备、测试和可靠性等。只有建立一套标准化的体系，才能确保产品的质量和可靠性。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">又如CPO（共封装光学）技术，它是一种将光模块和电芯片封装在一起的技术，具有低功耗、高带宽的特点。其最大的挑战是成本，除了光学元件成本和研发成本，还包括BOM（物料清单）成本、装配吞吐量成本和良率优化成本。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;"> <span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="margin: 0px; padding: 0px; outline: 0px; max-width: 100%; box-sizing: border-box; clear: both; min-height: 1em; overflow-wrap: break-word !important;">其中最关键的是随着带宽需求的不断增长，光纤和插座的成本越来越高。解决方案是开发生态系统，优化光学元件设计；加强产业链合作，优化生产流程，提高光纤制造的吞吐量和产量，降低生产成本。当然，对于玻璃封装技术，这方面也同样不容忽视。<span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> </section><span style="display:none">bzGSMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <center><img src="/AD/SMTfgx.gif"/ "/AD/smtjscn.jpg"/></center> <p><br> </p> <style> #cyPoll .vote_txtlist dd{ left: 50%; } </style>  <div class="toolbar"> <div class="share_box"> <div class="bdsharebuttonbox bdshare-button-style1-32 pull-left" data-bd-bind="1455719711329"> <a href="#" class="bds_more" data-cmd="more"></a><a href="#" class="bds_qzone" data-cmd="qzone" title="分享到QQ空间"></a><a href="#" class="bds_tsina" data-cmd="tsina" title="分享到新浪微博"></a><a href="#" class="bds_tqq" data-cmd="tqq" title="分享到腾讯微博"></a><a href="#" class="bds_renren" data-cmd="renren" title="分享到人人网"></a><a href="#" class="bds_weixin" data-cmd="weixin" title="分享到微信"></a> <script>window._bd_share_config={"common":{"bdSnsKey":{},"bdText":"","bdMini":"2","bdMiniList":false,"bdPic":"","bdStyle":"0","bdSize":"32"},"share":{},"image":{"viewList":["qzone","tsina","tqq","renren","weixin"],"viewText":"分享到：","viewSize":"16"},"selectShare":{"bdContainerClass":null,"bdSelectMiniList":["qzone","tsina","tqq","renren","weixin"]}};with(document)0[(getElementsByTagName('head')[0]||body).appendChild(createElement('script')).src='http://bdimg.share.baidu.com/static/api/js/share.js?v=89860593.js?cdnversion='+~(-new Date()/36e5)];</script> </div> <a href="/e/member/fava/add/?classid=3&id=2959" target="_blank" class="pull-right shoucang">+收藏</a> </div> </div> <div class="blank20"></div> <div class="interested-article-box"> <span class="span-mark-author">相关文章</span> <div class="article-list-box"> <div class="article-box transition"><a target="_blank" href="/jszc/3096.html"><img src="/d/file/jszc/2024-12-18/40692e2e7b8c0d1fa3e8285e4b351f8b.jpg" width="213" height="124"></a> <div class="article-title"><a target="_blank" href="/jszc/3096.html">关于控制器SMT生产过程锡珠的产生与预防分析研究</a> </div> </div> <div class="article-box transition"><a target="_blank" href="/jszc/3093.html"><img src="/d/file/jszc/2024-12-03/e71644c3c21d1af378d044e084cc7f03.gif" width="213" height="124"></a> <div class="article-title"><a target="_blank" href="/jszc/3093.html">智能制造技术在SMT工艺流程中的应用研究</a> </div> </div> <div class="article-box transition"><a target="_blank" href="/jszc/3089.html"><img src="/d/file/jszc/2024-11-27/fa0418621b6f009e8e59a2af5f37ea9e.png" width="213" height="124"></a> <div class="article-title"><a target="_blank" href="/jszc/3089.html">AI时代，华天科技热仿真分析为芯片散热保驾护航</a> </div> </div> </div> </div> <div class="blank20"></div> <div class="friend">网友评论</div> <script type="text/javascript" src="/js/jquery.js"></script> <script type="text/javascript" src="/js/jNotify.jquery.min.js"></script> <script type="text/javascript" src="/js/pl.js"></script> <link href="/js/pl.css" rel="stylesheet" type="text/css" /> <div class="scpinglun" id="scpinglun"> <div class="navmenu"> <a href="javascript:void()" class="selected pltab">评论(<abbr class="plnum"><script type="text/javascript" src="/e/public/ViewClick/?classid=3&id=2959&down=2"></script></abbr>)</a> </div> <div class="allplbox"> <div class="plbox"> <form method="post" name="saypl" id="saypl" onSubmit="return CheckPl(document.saypl)"> <input name="username" type="hidden" id="username" value="adminsmtrx@A@"/> <textarea name="saytext" id="saytext"></textarea> <input name="id" type="hidden" id="id" value="2959" /> <input name="classid" type="hidden" id="classid" value="3" /> <input name="enews" type="hidden" id="enews" value="AddPl" /> <input name="repid" type="hidden" id="repid" value="0" /> <input type="hidden" name="ecmsfrom" value="/jszc/2959.html" id="ecmsfrom"> <div class="plsub"><span><a href="javascript:void()" onclick="addface()"><em class="ico_face"></em>添加表情</a><div class="face"></div></span><input name="" type="button" value="评论" class="button small blue yh" onclick="addPl();"/></div> </form> </div> <div class="allpl"> 全部评论(<abbr class="plnum"><script type="text/javascript" src="/e/public/ViewClick/?classid=3&id=2959&down=2"></script></abbr>) </div> <ul class="pllist scpllist" id="infocommentarea"> </ul>  </div> </div> <script src="/e/data/js/ajax.js"></script> <script src="/e/extend/infocomment/commentajax.php?classid=3&id=2959"></script>  </div> </div> <div class="wrap_right pull-right"> <div class="content_R"> <div class="top" style="padding:0px;"> <div style="width:360px; 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