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white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px">“这是创新最好的时代，技术巨变颠覆生活方式，人工智能的发展将为晶圆厂带来发展的黄金机遇”。格芯(Globalfoundries，原名：格罗方德)CEO桑杰•贾(Sanjay Jha)在接受第一财经记者专访时表示。<span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px">根据IC Insights的数据，2016年格芯以11%的市场占有率居于全球第二大晶圆代工厂的位置，全年营收55.45亿美元。台积电仍以近300亿美元的营收占据龙头老大地位。<span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px">伴随着数字时代的到来，“信息”成为人类社会发展的根本推动力，作为“连接万物”的计算机物质基础的半导体芯片也将迎来新的增长机遇。<span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px">对于全球最大的半导体市场——中国，桑杰•贾颇为看好。格芯已宣布斥资100亿美元在成都建立首个中国晶圆厂。<span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px">桑杰•贾认为，未来十年将会是晶圆厂发展的黄金时代。原因是人工智能的发展三个最基本的条件是“支持互联、低功耗、智能”，而晶圆厂是基础架构中技术的核心，比如目前主流的工艺FinFET(鳍式场效应晶体管)能够满足电子器件小型化、高集成化发展过程中的内存需求。<span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px"><img alt="" src="http://imgcdn.yicai.com/uppics/images/2017/07/636348850940482480.jpg" style="max-width: 100%; border-top: 0px; border-right: 0px; background: rgb(239,239,239); border-bottom: 0px; margin: 8px auto; border-left: 0px; display: block; border-radius: 0px" /><span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px"> <span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px"><strong style="font-weight: 400">斥资百亿建厂</strong><span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px">格芯今年2月宣布投资100亿美元，在成都建立首个中国晶圆厂，以满足物联网芯片的需求。<span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px">记者了解到，目前工厂的一期工程已经开工，相关工艺技术和部分设备转自新加坡工厂，到明年上半年就将完成格芯规模最大的12英寸晶圆生产线，计划于下半年开始实现量产，月产能预计2万片;二期工程是2018年开始将从德国转移技术，导入22纳米SOI(绝缘层上硅)工艺，计划2019年投产，投产后预计产能达到每月约6.5万片。<span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px">“未来五年内，70%增长会在物联网芯片领域。”桑杰•贾对第一财经记者说道。FD-SOI(全耗尽型绝缘层上硅)是格芯自主研发的工艺技术，相比主流的FinFET技术，FD-SOI的基板较贵，但工序较为简便，生产效率高，因此SOI工艺在在传感器、射频芯片和物联网方面颇具市场潜力。<span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px">在集成电路制造工艺方面，由Intel主导的FinFET一直大行其道。而近年来， FD-SOI和RF-SOI越来越受到人们的关注，其技术优势和应用前景也越发地被看好。格芯及其合作伙伴，包括三星、索尼等，在FD-SOI方面的投入力度越来越大，颇有与FinFET分庭抗礼之势。<span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px">以射频芯片为例，由于在成本、集成度上的优势，RF-SOI已经在手机射频芯片的斩获80%-90%的市场份额。采用RF-SOI可以使同一张硅芯片上实现更多逻辑与控制的集成。<span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px">据桑杰•贾透露，就在格芯宣布在成都建厂后不久，另一家半导体厂商也计划在成都投资建新厂。记者了解到，贾所说的厂商很可能是中国企业紫光。一位熟悉紫光的人士对第一财经记者表示，紫光计划在成都建12寸晶圆厂。不过紫光方面一位高层对此予以否认，并表示：“格芯在中国做什么，和我们没什么关系。”<span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px">针对在中国的投资，桑杰•贾向第一财经记者说道：“几年前中国还没有全球前十的芯片制造商，但今天已经有两三家了，所以我们要加大中国的研发投入。而且在人工智能、物联网、自动驾驶等领域，我们的客户都在中国。”<span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px">不过，此前有业内人士向第一财经记者透露，成都一开始并非是格芯的首选，格芯此前与中国数个城市进行合资设厂的谈判，去年还同重庆谈判数月，但项目最后没能落地。而最终选择成都，也是因为成都政府给了投资等优惠政策。<span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px"><strong style="font-weight: 400">弯道超车</strong><span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px">Gartner分析师盛陵海对第一财经记者表示：“格芯一期的项目基本上是把新加坡老厂的产线转移过来，因此成都政府更加看重的是二期22纳米FD-SOI的项目。”不过，他认为这个工艺的市场需求不大，格芯更希望是借着中国的资金和需求占领市场。<span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px">盛陵海续指，因为国内有向FD-SOI技术进行投资，希望能够借该技术弯道超车，目前虽然FD-SOI 的技术仍然具有低功耗的优势，但是无法成为主流工艺。<span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px">AMD 2008年分拆了制造业务，并将其命名为Foundry Company，由阿布扎比金融机构ATIC持股55.6%，AMD持股44.4%。<span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px">Foundry Company后来改名为GlobalFoundries，并且启动了独立进程。新增晶圆工厂和对新加坡特许半导体(Chartered Semiconductor)的收购都加强了GlobalFoundries在晶圆领域的地位。而与ARM等企业加强合作也已经成为该公司的重要战略。<span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px">格芯对此向第一财经回应称：“这是在公司整体战略的计划之内，并没有任何意外的财务状况。因为半导体代工厂需要巨大的投资，要不断的进行工艺研发，才能持续产生差异化。比如说公司的双路线图策略，不单只是在14nm和7nm有巨大的研发，还启动了FD-SOI工艺研发，提供针对移动行业的需求。双路线图策略加大了研发投入，所以亏损在计划中，外界不需要担心。”<span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px">更有消息称，格芯大股东想要找中国投资人接盘。对此，一位中芯国际一位人士对第一财经记者表示：“SOI是格芯最后的卖点，需要好好包装一下。”<span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px">在摩尔定律放缓的背景下，传统的芯片制造商都遇到了新的挑战。桑杰•贾对第一财经记者表示：“摩尔定律是经济法则，只是由于复杂性变化的速率不如以前那么快，但是创新并没有少。现在的问题是应用，以及找到实现这些应用的解决方案。”<span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px">据悉，格芯已经宣布7纳米技术将于2018制成，然后会随着成本的降低实现量产。“7纳米后我们会投入5纳米芯片的研制。5纳米预计最早将于2022年面世。” 桑杰•贾告诉第一财经记者。<span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px">在数据大爆炸的时代，数据中心以及数据中心的分析将成为未来发展的核心关键。无论是数据收集，还是对数据的分析和传输，半导体芯片都在其中发挥着无可替代的关键作用。<span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; white-space: normal; word-spacing: 0px; text-transform: none; color: rgb(80,80,80); padding-bottom: 0px; text-align: justify; padding-top: 0px; font: 18px/27px helvetica; padding-left: 0px; margin: 0px 0px 20px; widows: 1; letter-spacing: normal; padding-right: 0px; background-color: rgb(255,255,255); text-indent: 0px; -webkit-text-stroke-width: 0px">桑杰•贾对第一财经记者表示：“硬件和软件的边界逐渐消融为创新提供了机遇。比如在人工智能的发展过程中，会使用到CNN神经网络，深度学习网络等等这些过去没有的技术，也让芯片架构发生变化。传统的半导体厂商应该努力去迎合科技发展所创造的新需求。”<span style="display:none">mYASMT技术网-China表面贴装技术-SMT表面贴装-SMT技术网【官网】</span></p> <p style="word-wrap: break-word; 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