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width="668" height="445" alt="" /></p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/20/180907201.jpg" width="668" height="445" alt="" /></p> <p align="center">超宽禁带半导体技术分会I /II现场</p> <p>其中，超宽禁带半导体技术分会I /II 上，20个主旨报告，围绕氧化镓和氮化铝、氧化镓高导热异质集成射频器件、氧化镓PECVD外延生长及光电信息感知器件、Ga₂O₃气体传感器、氧化镓PECVD外延生长、金刚石衬底和器件、六角氮化硼薄膜制备、GaN HEMT应用、金刚石辐射探测器级材料制备和器件性能等主题内容展开探讨。 </p> <p style="text-align: center;"> <img src="http://www.casmita.com/file/upload/202411/20/180935711.jpg" width="668" height="445" alt="" /></p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/20/180950571.jpg" width="668" height="445" alt="" /></p> <p align="center">碳化硅功率器件及其封装技术分会现场</p> <p>碳化硅功率器件及其封装技术分会，12个主旨报告，探讨SiC 功率 MOSFET老化检测、宽禁带器件高温高可靠封装技术、高可靠SiC MOSFET管芯、SiC MOSFET 微型化、高性能AlN陶瓷基板及金属化技术、大功率碳化硅MOSFET模块研制、SiC基电力电子及射频芯片技术、碳化硅超级结功率器件技术、SiC功率器件的光激发等技术进展。</p> <p style="text-align: center;">  <img src="http://www.casmita.com/file/upload/202411/20/181011231.jpg" width="668" height="445" alt="" /></p> <p align="center">氮化镓功率电子器件技术分会I现场</p> <p>氮化镓功率电子器件技术分会I，8个主旨报告，重点探讨硅基和氮化镓基功率半导体的辐射效应，GaN p-MISFET先进制造技术、垂直结构GaN、Si基GaN器件及系统、6英寸GaN/Si CMOS 1P2M单片异质集成整套芯片工艺、GaN HEMT人工神经网络物理模型等主题。</p> <p style="text-align: center;"> <img src="http://www.casmita.com/file/upload/202411/20/181033411.jpg" width="668" height="445" alt="" /></p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/20/181049821.jpg" width="668" height="445" alt="" /></p> <p align="center">碳化硅衬底、外延生长及其相关设备技术分会现场</p> <p>碳化硅衬底、外延生长及其相关设备技术分会，8个主题报告，重点关注SiC单晶的坩埚结构及PVT生长工艺条件，碳化硅单晶缺陷研究，SiC功率器件的装备与工艺、硅晶圆厂中的SiC制造、化合物半导体外延大规模量产、用于SiC功率器件外延生长的CVD设备、大直径碳化硅外延等相关技术进展。</p> <p align="center"><img src="http://www.casmita.com/file/upload/202411/20/181108461.jpg" width="668" height="445" alt="" /> </p> <p align="center">氮化物衬底、外延生长及其相关设备技术分会现场</p> <p>氮化物衬底、外延生长及其相关设备技术分会上，11个主题报告，围绕氮化铝基半导体材料及器件、氮化铝单晶材料、AlN基高压高频功率器件、硅衬底GaN基光电材料外延、氮化镓基光电子及功率器件、氨热法氮化镓单晶生长、大尺寸氮化镓单晶生长、高温PVD氮化铝缓冲层技术、等离子体辅助分子束外延生长AlN薄膜等相关技术展开深入的分享探讨交流。</p> <p align="center"><img src="http://www.casmita.com/file/upload/202411/20/181138151.jpg" width="668" height="445" alt="" /> </p> <p align="center">氮化镓射频电子器件分会现场</p> <p>氮化镓射频电子器件分会上，10个主旨报告，围绕下一代高端生态半导体、移动终端射频功放应用、面向6G和Wi-Fi 7 的高频和宽带射频滤波器、同质外延氮化镓射频电子器件、特色射频半导体、蓝宝石上AlGaN/GaN异质结双极晶体管、微波无线能量收集、大功率微波限幅器等技术主题展开探讨。</p> <p style="text-align: center;"> <img src="http://www.casmita.com/file/upload/202411/20/181204681.jpg" width="668" height="445" alt="" /></p> <p align="center">光医疗技术创新应用论坛现场</p> <p>光医疗技术创新应用论坛上，7大主旨报告，重点探讨光学技术糖足微循环监测与干预应用、全色域光源光疗愈应用，公共场所空气现场消毒技术、光医疗领域应用、LED可穿戴医疗中技术等创新应用相关的最新进展。</p> <p style="text-align: center;"> <img src="http://www.casmita.com/file/upload/202411/20/181227861.jpg" width="668" height="445" alt="" /></p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/20/181323751.jpg" width="668" height="445" alt="" /></p> <p align="center">LED健康照明与光品质技术论坛现场</p> <p>LED健康照明与光品质技术论坛上，11个主旨报告，围绕基于视锥响应的光度学与色度学、人因+智慧全龄健康照明、光源质量与照明设计、特种照明、光照环境非视觉效应计算、光生物影响研究等技术深入交流探讨。 </p> <p><b>四大产业峰会聚焦热点应用进展</b></p> <p>当前，第三代半导体产业驶入发展“快车道”，第三代半导体材料、器件正在快速实现从技术研发到规模化量产，技术进步和市场需求的双重驱动下，其发展前景非常乐观。不同领域的应用规模不断增长，前景看好。 </p> <p>19-20日，第四届车用半导体创新合作峰会、智慧照明设计及应用创新峰会、Mini/Micro-LED技术产业应用峰会、第三代半导体标准与检测研讨会等四大产业峰会围绕着当前第三代半导体几大热点应用领域，来自重点企业、实力派专家齐聚，展开重点探讨，互通信息，分享交流，共谋商机。</p> <p style="text-align: center;"> <img src="http://www.casmita.com/file/upload/202411/20/181304211.jpg" width="668" height="445" alt="" /></p> <p align="center">第四届车用半导体创新合作峰会现场</p> <p>电动汽车和智能网联汽车的普及，对高性能半导体芯片的需求大幅增加。新能源汽车的普及也推动了车用半导体市场的扩展&zwnj;，对半导体的需求量大幅增加。第四届车用半导体创新合作峰会上，来自安世半导体、株洲中车时代、士兰微电子、芯聚能、英飞凌、长城汽车等代表性企业的实力派嘉宾们，重点分绿色出行和绿色能源发展、轨道交通、新一代主驱应用、车规SiC产品与应用、国产化芯片等相关领域，第三代半导体技术的机遇与挑战。</p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/20/181342311.jpg" width="668" height="375" alt="" /></p> <p align="center">智慧照明设计及应用创新峰会现场</p> <p>消费者对照明的智能化和高端化需求不断增加&zwnj;，智慧照明在智慧城市建设和智能家居领域发挥重要作用。智慧照明设计及应用创新峰会上，实战派的专家们围绕着居住空间中照明、DALI 数字化演化进程和商用照明、智慧杆站和户外照明的数智化发展、健康光与自然光的拟合算法及应用、智能照明与健康等主题展开交流探讨。</p> <p style="text-align: center;"><b> <img src="http://www.casmita.com/file/upload/202411/20/181405571.jpg" width="668" height="445" alt="" /></b></p> <p style="text-align: center;"><b><img src="http://www.casmita.com/file/upload/202411/20/181421951.jpg" width="668" height="445" alt="" /></b></p> <p align="center">Mini/Micro-LED技术产业应用峰会现场</p> <p>Mini LED和Micro LED技术在高端显示领域占据重要地位，并且随着技术的不断成熟和成本的降低，市场份额将进一步扩大，成为未来显示技术的主流趋势。Mini/Micro-LED技术产业应用峰会上，产业链不同环节代表性专家们，围绕着MicroLED的量产策略、Micro-LED智慧显示、显示用Micro-LED芯片与集成技术、 0.18cc全彩Micro-LED光机、多元Mini-LED显示技术、玻璃基TFT Micro-LED拼接屏、无损Micro-LED芯片技术、CSP芯片级封装在Mini-LED背光中的应用，微纳光学器件制造、先进半导体键合集成技术等展开深入的交流探讨。 </p> <p style="text-align: center;"> <img src="http://www.casmita.com/file/upload/202411/20/181450341.jpg" width="668" height="445" alt="" /></p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/20/181505411.jpg" width="668" height="445" alt="" /></p> <p align="center">第三代半导体标准与检测研讨会现场</p> <p>科学的检测标准和方法对于推动产业高质量发展、保障产品质量和可靠性、促进技术创新和应用、提升市场信任以及支持国家战略需求具有重要意义。第三代半导体标准与检测研讨会上，来自相关科研机构、企业的专家们，分享探讨了面向宽禁带半导体GaN应用的紫外脉冲激光辐照实验技术、GaN HEMT功率器件寿命预测SPICE模型研究、动态应力下GaN功率器件阈值电压不稳定性机理研究、基于SiC MOSFET可靠性标准的产品验证与失效机制、面向SiC/GaN功率器件失效分析的测试技术等研究内容和进展。</p> <p style="text-align: center;"> <img src="http://www.casmita.com/file/upload/202411/20/181533871.jpg" width="668" height="445" alt="" /></p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/20/181550671.jpg" width="668" height="445" alt="" /></p> <p align="center">《强芯沙龙·会客厅》现场</p> <p>此外，作为论坛同期重要配套活动之一，《强芯沙龙·会客厅》首次线下开展，20-21日，将连开四场，并特邀四位第三代半导体产业技术创新战略联盟副秘书长坐镇主持，围绕海外业务拓展与贸易风险、投融资与信贷、知识产权与专利运营、平台建设与人才培养四大主题展开探讨。采用线上同步直播，线上线下联动的方式互动，大咖面对面，精彩主题报告及高质量对话，共议产业发展痛点，寻求破解之道。 </p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/20/210952441.jpg" width="668" height="445" alt="" /></p> <p>20日的会客厅主题探讨中，“海外业务拓展与贸易风险”主题环节，第三代半导体产业技术创新战略联盟副秘书长冯亚东主持下，经济学人智库高级经济学家徐天辰，马来西亚投资发展局(MIDA) 上海办公室主任Steven Cheng，马来西亚雪兰莪州CSSB-CEOEn. Mohd Zapi，上海特易信息科技有限公司副总经理马爱玲等嘉宾，围绕着“出海”重点，分享主题报告，展开深度对话。 </p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/20/211012901.jpg" alt="座谈" width="668" height="445" /></p> <p>在“投融资与信贷”主题环节，第三代半导体产业技术创新战略联盟副秘书长耿博主持下，中科创星董事总经理张思申，中信银行苏州分行投资银行部主管李梦龙，元旭半导体科技股份有限公司董事长助理杨帆，芯三代半导体科技(苏州)股份有限公司执行总监韩跃斌等专家、企业代表参与主题分享和深度对话。 </p> <p style="text-align: center;"><img src="http://www.casmita.com/file/upload/202411/20/211029861.jpg" alt="座谈" width="668" height="445" /></p> <p>在“知识产权与专利运营”主题环节，第三代半导体产业技术创新战略联盟副秘书长高伟主持下，北京熙说信息科技有限公司博士、研究员马志勇，北京北方华创微电子装备有限公司合规副总裁宋巧丽，北京芯创智源知识产权咨询服务有限公司咨询业务总监徐俊，天启黑马信息科技有限公司资深检索分析师张纵纵等专家，等围绕着知识产权的风险与应对相关内容，参与主题分享与深度对话。</p> <p>本届论坛为期三天，21日精彩内容将继续展开，将有九场专题活动，百余位专家，聚焦技术创新及产业化应用热点动向，第六届先进半导体技术应用创新展（CASTAS）同期火热进行中，敬请关注！</p></div> </div> <div class="award"><div onclick="Go('http://www.casmita.com/member/award.php?mid=21&itemid=17228');">打赏</div></div><div id="comment" style="display:;"> <div class="block-head"><a 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