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href="https://ca.wikipedia.org/wiki/System_in_package" title="System in package – Catalan" lang="ca" hreflang="ca" data-title="System in package" data-language-autonym="Català" data-language-local-name="Catalan" class="interlanguage-link-target"><span>Català</span></a></li><li class="interlanguage-link interwiki-de badge-Q70894304 mw-list-item" title=""><a href="https://de.wikipedia.org/wiki/System-in-Package" title="System-in-Package – German" lang="de" hreflang="de" data-title="System-in-Package" data-language-autonym="Deutsch" data-language-local-name="German" class="interlanguage-link-target"><span>Deutsch</span></a></li><li class="interlanguage-link interwiki-fa mw-list-item"><a href="https://fa.wikipedia.org/wiki/%D8%B3%D8%A7%D9%85%D8%A7%D9%86%D9%87_%D8%AF%D8%B1_%DB%8C%DA%A9_%D8%A8%D8%B3%D8%AA%D9%87" title="سامانه در یک بسته – Persian" lang="fa" hreflang="fa" data-title="سامانه در یک بسته" data-language-autonym="فارسی" data-language-local-name="Persian" class="interlanguage-link-target"><span>فارسی</span></a></li><li class="interlanguage-link interwiki-fr mw-list-item"><a href="https://fr.wikipedia.org/wiki/System_in_package" title="System in package – French" lang="fr" hreflang="fr" data-title="System in package" data-language-autonym="Français" data-language-local-name="French" class="interlanguage-link-target"><span>Français</span></a></li><li class="interlanguage-link interwiki-ko mw-list-item"><a href="https://ko.wikipedia.org/wiki/%EC%8B%9C%EC%8A%A4%ED%85%9C_%EC%9D%B8_%ED%8C%A8%ED%82%A4%EC%A7%80" title="시스템 인 패키지 – Korean" lang="ko" hreflang="ko" data-title="시스템 인 패키지" data-language-autonym="한국어" data-language-local-name="Korean" class="interlanguage-link-target"><span>한국어</span></a></li><li class="interlanguage-link interwiki-nl mw-list-item"><a href="https://nl.wikipedia.org/wiki/System-in-package" title="System-in-package – Dutch" lang="nl" hreflang="nl" data-title="System-in-package" data-language-autonym="Nederlands" data-language-local-name="Dutch" class="interlanguage-link-target"><span>Nederlands</span></a></li><li class="interlanguage-link interwiki-ja mw-list-item"><a href="https://ja.wikipedia.org/wiki/SiP" title="SiP – Japanese" lang="ja" hreflang="ja" data-title="SiP" data-language-autonym="日本語" data-language-local-name="Japanese" class="interlanguage-link-target"><span>日本語</span></a></li><li class="interlanguage-link interwiki-zh mw-list-item"><a href="https://zh.wikipedia.org/wiki/%E5%B0%81%E8%A3%9D%E9%AB%94%E7%B3%BB" title="封裝體系 – Chinese" lang="zh" hreflang="zh" data-title="封裝體系" data-language-autonym="中文" data-language-local-name="Chinese" class="interlanguage-link-target"><span>中文</span></a></li> </ul> <div class="after-portlet after-portlet-lang"><span class="wb-langlinks-edit wb-langlinks-link"><a href="https://www.wikidata.org/wiki/Special:EntityPage/Q1457198#sitelinks-wikipedia" title="Edit interlanguage links" class="wbc-editpage">Edit links</a></span></div> </div> </div> </div> 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package</a>)</span></div></div> <div id="mw-content-text" class="mw-body-content"><div class="mw-content-ltr mw-parser-output" lang="en" dir="ltr"><div class="shortdescription nomobile noexcerpt noprint searchaux" style="display:none">Electronic component</div> <style data-mw-deduplicate="TemplateStyles:r1251242444">.mw-parser-output .ambox{border:1px solid #a2a9b1;border-left:10px solid #36c;background-color:#fbfbfb;box-sizing:border-box}.mw-parser-output .ambox+link+.ambox,.mw-parser-output .ambox+link+style+.ambox,.mw-parser-output .ambox+link+link+.ambox,.mw-parser-output .ambox+.mw-empty-elt+link+.ambox,.mw-parser-output .ambox+.mw-empty-elt+link+style+.ambox,.mw-parser-output .ambox+.mw-empty-elt+link+link+.ambox{margin-top:-1px}html body.mediawiki .mw-parser-output .ambox.mbox-small-left{margin:4px 1em 4px 0;overflow:hidden;width:238px;border-collapse:collapse;font-size:88%;line-height:1.25em}.mw-parser-output .ambox-speedy{border-left:10px solid #b32424;background-color:#fee7e6}.mw-parser-output .ambox-delete{border-left:10px solid #b32424}.mw-parser-output .ambox-content{border-left:10px solid #f28500}.mw-parser-output .ambox-style{border-left:10px solid #fc3}.mw-parser-output .ambox-move{border-left:10px solid #9932cc}.mw-parser-output .ambox-protection{border-left:10px solid #a2a9b1}.mw-parser-output .ambox .mbox-text{border:none;padding:0.25em 0.5em;width:100%}.mw-parser-output .ambox .mbox-image{border:none;padding:2px 0 2px 0.5em;text-align:center}.mw-parser-output .ambox .mbox-imageright{border:none;padding:2px 0.5em 2px 0;text-align:center}.mw-parser-output .ambox .mbox-empty-cell{border:none;padding:0;width:1px}.mw-parser-output .ambox .mbox-image-div{width:52px}@media(min-width:720px){.mw-parser-output .ambox{margin:0 10%}}@media print{body.ns-0 .mw-parser-output .ambox{display:none!important}}</style><table class="box-More_citations_needed plainlinks metadata ambox ambox-content ambox-Refimprove" role="presentation"><tbody><tr><td class="mbox-image"><div class="mbox-image-div"><span typeof="mw:File"><a href="/wiki/File:Question_book-new.svg" class="mw-file-description"><img alt="" src="//upload.wikimedia.org/wikipedia/en/thumb/9/99/Question_book-new.svg/50px-Question_book-new.svg.png" decoding="async" width="50" height="39" class="mw-file-element" srcset="//upload.wikimedia.org/wikipedia/en/thumb/9/99/Question_book-new.svg/75px-Question_book-new.svg.png 1.5x, //upload.wikimedia.org/wikipedia/en/thumb/9/99/Question_book-new.svg/100px-Question_book-new.svg.png 2x" data-file-width="512" data-file-height="399" /></a></span></div></td><td class="mbox-text"><div class="mbox-text-span">This article <b>needs additional citations for <a href="/wiki/Wikipedia:Verifiability" title="Wikipedia:Verifiability">verification</a></b>.<span class="hide-when-compact"> Please help <a href="/wiki/Special:EditPage/System_in_a_package" title="Special:EditPage/System in a package">improve this article</a> by <a href="/wiki/Help:Referencing_for_beginners" title="Help:Referencing for beginners">adding citations to reliable sources</a>. Unsourced material may be challenged and removed.<br /><small><span class="plainlinks"><i>Find sources:</i> <a rel="nofollow" class="external text" href="https://www.google.com/search?as_eq=wikipedia&q=%22System+in+a+package%22">"System in a package"</a> – <a rel="nofollow" class="external text" href="https://www.google.com/search?tbm=nws&q=%22System+in+a+package%22+-wikipedia&tbs=ar:1">news</a> <b>·</b> <a rel="nofollow" class="external text" href="https://www.google.com/search?&q=%22System+in+a+package%22&tbs=bkt:s&tbm=bks">newspapers</a> <b>·</b> <a rel="nofollow" class="external text" href="https://www.google.com/search?tbs=bks:1&q=%22System+in+a+package%22+-wikipedia">books</a> <b>·</b> <a rel="nofollow" class="external text" href="https://scholar.google.com/scholar?q=%22System+in+a+package%22">scholar</a> <b>·</b> <a rel="nofollow" class="external text" href="https://www.jstor.org/action/doBasicSearch?Query=%22System+in+a+package%22&acc=on&wc=on">JSTOR</a></span></small></span> <span class="date-container"><i>(<span class="date">February 2014</span>)</i></span><span class="hide-when-compact"><i> (<small><a href="/wiki/Help:Maintenance_template_removal" title="Help:Maintenance template removal">Learn how and when to remove this message</a></small>)</i></span></div></td></tr></tbody></table> <figure class="mw-default-size" typeof="mw:File/Thumb"><a href="/wiki/File:System_in_package.png" class="mw-file-description"><img src="//upload.wikimedia.org/wikipedia/commons/thumb/5/51/System_in_package.png/220px-System_in_package.png" decoding="async" width="220" height="220" class="mw-file-element" srcset="//upload.wikimedia.org/wikipedia/commons/thumb/5/51/System_in_package.png/330px-System_in_package.png 1.5x, //upload.wikimedia.org/wikipedia/commons/thumb/5/51/System_in_package.png/440px-System_in_package.png 2x" data-file-width="700" data-file-height="700" /></a><figcaption>CAD drawing of a SiP multi-chip which contains a processor, memory and storage on a single substrate</figcaption></figure> <p>A <b>system in a package</b> (<b>SiP</b>) or <b>system-in-package</b> is a number of <a href="/wiki/Integrated_circuit" title="Integrated circuit">integrated circuits</a> (ICs) enclosed in one <a href="/wiki/Chip_carrier" title="Chip carrier">chip carrier</a> package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system. The ICs may be stacked using <a href="/wiki/Package_on_package" class="mw-redirect" title="Package on package">package on package</a>, placed side by side, and/or embedded in the substrate.<sup id="cite_ref-1" class="reference"><a href="#cite_note-1"><span class="cite-bracket">[</span>1<span class="cite-bracket">]</span></a></sup> The SiP performs all or most of the functions of an <a href="/wiki/Electronic_system" class="mw-redirect" title="Electronic system">electronic system</a>, and is typically used when <a href="/wiki/Integrated_circuit_design" title="Integrated circuit design">designing</a> components for <a href="/wiki/Mobile_phone" title="Mobile phone">mobile phones</a>, <a href="/wiki/Portable_media_player" title="Portable media player">digital music players</a>, etc.<sup id="cite_ref-2" class="reference"><a href="#cite_note-2"><span class="cite-bracket">[</span>2<span class="cite-bracket">]</span></a></sup> <a href="/wiki/Die_(integrated_circuit)" title="Die (integrated circuit)">Dies</a> containing integrated circuits may be stacked vertically on the package substrate. They are internally connected by fine <a href="/wiki/Wire" title="Wire">wires</a> that are bonded to the package substrate. Alternatively, with a <a href="/wiki/Flip_chip" title="Flip chip">flip chip</a> technology, solder bumps are used to join stacked chips together and to the package substrate, or even both techniques can be used in a single package. SiPs are like <a href="/wiki/System_on_a_chip" title="System on a chip">systems on a chip</a> (SoCs) but less tightly integrated and not on a single <a href="/wiki/Die_(integrated_circuit)" title="Die (integrated circuit)">semiconductor die</a>.<sup id="cite_ref-3" class="reference"><a href="#cite_note-3"><span class="cite-bracket">[</span>3<span class="cite-bracket">]</span></a></sup> </p><p>SIPs can be used either to reduce the size of a system, improve performance or to reduce costs.<sup id="cite_ref-4" class="reference"><a href="#cite_note-4"><span class="cite-bracket">[</span>4<span class="cite-bracket">]</span></a></sup><sup id="cite_ref-5" class="reference"><a href="#cite_note-5"><span class="cite-bracket">[</span>5<span class="cite-bracket">]</span></a></sup> The technology evolved from multi chip module (MCM) technology, the difference being that SiPs also use <a href="/wiki/Three-dimensional_integrated_circuit" title="Three-dimensional integrated circuit">die stacking</a>, which stacks several chips or dies on top of each other.<sup id="cite_ref-6" class="reference"><a href="#cite_note-6"><span class="cite-bracket">[</span>6<span class="cite-bracket">]</span></a></sup><sup id="cite_ref-auto_7-0" class="reference"><a href="#cite_note-auto-7"><span class="cite-bracket">[</span>7<span class="cite-bracket">]</span></a></sup> </p> <meta property="mw:PageProp/toc" /> <div class="mw-heading mw-heading2"><h2 id="Technology">Technology</h2><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=System_in_a_package&action=edit&section=1" title="Edit section: Technology"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <p>SiP dies can be stacked vertically or tiled horizontally, with techniques like <a href="/wiki/Chiplet" title="Chiplet">chiplets</a> or <a href="/wiki/Quilt_packaging" title="Quilt packaging">quilt packaging</a>. SiPs connect the dies with standard off-chip <a href="/wiki/Wire_bonding" title="Wire bonding">wire bonds</a> or solder bumps, unlike slightly denser <a href="/wiki/Three-dimensional_integrated_circuit" title="Three-dimensional integrated circuit">three-dimensional integrated circuits</a> which connect stacked silicon dies with conductors running through the die using <a href="/wiki/Through-silicon_via" title="Through-silicon via">through-silicon vias</a>. Many different 3D packaging techniques have been developed for stacking many fairly standard chip dies into a compact area.<sup id="cite_ref-8" class="reference"><a href="#cite_note-8"><span class="cite-bracket">[</span>8<span class="cite-bracket">]</span></a></sup> </p><p>SiPs can contain several chips or dies—such as a specialized <a href="/wiki/Central_processing_unit" title="Central processing unit">processor</a>, <a href="/wiki/DRAM" class="mw-redirect" title="DRAM">DRAM</a>, <a href="/wiki/Flash_memory" title="Flash memory">flash memory</a>—combined with <a href="/wiki/Passive_components" class="mw-redirect" title="Passive components">passive components</a>—<a href="/wiki/Resistor" title="Resistor">resistors</a> and <a href="/wiki/Capacitor" title="Capacitor">capacitors</a>—all mounted on the same <a href="/wiki/Substrate_(electronics)" class="mw-redirect" title="Substrate (electronics)">substrate</a>. This means that a complete functional unit can be built in a single package, so that few external components need to be added to make it work. This is particularly valuable in space constrained environments like <a href="/wiki/MP3_player" class="mw-redirect" title="MP3 player">MP3 players</a> and <a href="/wiki/Mobile_phone" title="Mobile phone">mobile phones</a> as it reduces the complexity of the <a href="/wiki/Printed_circuit_board" title="Printed circuit board">printed circuit board</a> and overall design. Despite its benefits, this technique decreases the yield of fabrication since any defective chip in the package will result in a non-functional packaged integrated circuit, even if all other modules in that same package are functional. </p><p>SiPs are in contrast to the common system on a chip (SoC) integrated circuit architecture which integrates components based on function into a single <a href="/wiki/Die_(integrated_circuit)" title="Die (integrated circuit)">circuit die</a>. An SoC will typically integrate a CPU, <a href="/wiki/Graphics_processing_unit" title="Graphics processing unit">graphics</a> and memory interfaces, <a href="/wiki/Hard_disk_drive" title="Hard disk drive">hard-disk</a> and <a href="/wiki/USB" title="USB">USB</a> connectivity, <a href="/wiki/Random-access_memory" title="Random-access memory">random-access</a> and <a href="/wiki/Read-only_memory" title="Read-only memory">read-only</a> <a href="/wiki/Computer_memory" title="Computer memory">memories</a>, and secondary storage and/or their controllers on a single die. In comparison an SiP would connect these modules as <a href="/wiki/Discrete_components" class="mw-redirect" title="Discrete components">discrete components</a> in one or more chip packages or dies. An SiP resembles the common traditional <a href="/wiki/Motherboard" title="Motherboard">motherboard</a>-based <a href="/wiki/Personal_computer" title="Personal computer">PC</a> <a href="/wiki/Computer_architecture" title="Computer architecture">architecture</a>, as it separates components based on function and connects them through a central interfacing circuit board. An SiP has a lower grade of integration in comparison to an SoC. Hybrid integrated circuits (HICs) are somewhat similar to SiPs, however they tend to handle analog signals<sup id="cite_ref-9" class="reference"><a href="#cite_note-9"><span class="cite-bracket">[</span>9<span class="cite-bracket">]</span></a></sup> whereas SiPs usually handle digital signals,<sup id="cite_ref-10" class="reference"><a href="#cite_note-10"><span class="cite-bracket">[</span>10<span class="cite-bracket">]</span></a></sup><sup id="cite_ref-11" class="reference"><a href="#cite_note-11"><span class="cite-bracket">[</span>11<span class="cite-bracket">]</span></a></sup><sup id="cite_ref-12" class="reference"><a href="#cite_note-12"><span class="cite-bracket">[</span>12<span class="cite-bracket">]</span></a></sup><sup id="cite_ref-13" class="reference"><a href="#cite_note-13"><span class="cite-bracket">[</span>13<span class="cite-bracket">]</span></a></sup><sup id="cite_ref-14" class="reference"><a href="#cite_note-14"><span class="cite-bracket">[</span>14<span class="cite-bracket">]</span></a></sup> because of this HICs use older or less advanced technology (tend to use single layer circuit boards or substrates, not use die stacking, do not use flip chip or BGA for connecting components or dies, use only wire bonding for connecting dies or Small outline integrated circuit packages, use Dual in-line packages, or Single in-line packages for interfacing outside the Hybrid IC instead of BGA, etc.).<sup id="cite_ref-15" class="reference"><a href="#cite_note-15"><span class="cite-bracket">[</span>15<span class="cite-bracket">]</span></a></sup> </p><p>SiP technology is primarily being driven by early market trends in <a href="/wiki/Wearable_computer" title="Wearable computer">wearables</a>, mobile devices and the <a href="/wiki/Internet_of_things" title="Internet of things">internet of things</a> which do not demand the high numbers of produced units as in the established consumer and business SoC market. As the internet of things becomes more of a reality and less of a vision, there is innovation going on at the system on a chip and SiP level so that <a href="/wiki/Microelectromechanical_systems" class="mw-redirect" title="Microelectromechanical systems">microelectromechanical</a> (MEMS) sensors can be integrated on a separate die and control the connectivity.<sup id="cite_ref-16" class="reference"><a href="#cite_note-16"><span class="cite-bracket">[</span>16<span class="cite-bracket">]</span></a></sup> </p><p>SiP solutions may require multiple <a href="/wiki/Integrated_circuit_packaging" title="Integrated circuit packaging">packaging</a> technologies, such as <a href="/wiki/Flip_chip" title="Flip chip">flip chip</a>, <a href="/wiki/Wire_bonding" title="Wire bonding">wire bonding</a>, <a href="/wiki/Wafer-level_packaging" title="Wafer-level packaging">wafer-level packaging</a>, <a href="/wiki/Through-silicon_via" title="Through-silicon via">Through-silicon vias</a> (TSVs), chiplets and more.<sup id="cite_ref-17" class="reference"><a href="#cite_note-17"><span class="cite-bracket">[</span>17<span class="cite-bracket">]</span></a></sup><sup id="cite_ref-auto_7-1" class="reference"><a href="#cite_note-auto-7"><span class="cite-bracket">[</span>7<span class="cite-bracket">]</span></a></sup> </p> <div class="mw-heading mw-heading2"><h2 id="Suppliers">Suppliers</h2><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=System_in_a_package&action=edit&section=2" title="Edit section: Suppliers"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <style data-mw-deduplicate="TemplateStyles:r1184024115">.mw-parser-output .div-col{margin-top:0.3em;column-width:30em}.mw-parser-output .div-col-small{font-size:90%}.mw-parser-output .div-col-rules{column-rule:1px solid #aaa}.mw-parser-output .div-col dl,.mw-parser-output .div-col ol,.mw-parser-output .div-col ul{margin-top:0}.mw-parser-output .div-col li,.mw-parser-output .div-col dd{page-break-inside:avoid;break-inside:avoid-column}</style><div class="div-col"> <ul><li><a href="/wiki/Advanced_Micro_Devices" class="mw-redirect" title="Advanced Micro Devices">Advanced Micro Devices</a></li> <li><a href="/wiki/Amkor_Technology" title="Amkor Technology">Amkor Technology</a></li> <li><a href="/wiki/Atmel" title="Atmel">Atmel</a></li> <li>AMPAK Technology Inc.</li> <li>NANIUM, S.A.</li> <li><a href="/wiki/ASE_Group" title="ASE Group">ASE Group</a></li> <li>CeraMicro</li> <li>ChipSiP Technology</li> <li><a href="/wiki/Cypress_Semiconductor" title="Cypress Semiconductor">Cypress Semiconductor</a></li> <li>STATS ChipPAC Ltd</li> <li><a href="/wiki/Toshiba" title="Toshiba">Toshiba</a></li> <li><a href="/wiki/Renesas" class="mw-redirect" title="Renesas">Renesas</a></li> <li><a href="/wiki/SanDisk" title="SanDisk">SanDisk</a></li> <li><a href="/wiki/Samsung" title="Samsung">Samsung</a></li> <li><a href="/wiki/Silicon_Labs" title="Silicon Labs">Silicon Labs</a></li> <li>Octavo Systems</li> <li><a href="/wiki/Nordic_Semiconductor" title="Nordic Semiconductor">Nordic Semiconductor</a></li> <li>JCET</li> <li><a href="/w/index.php?title=Desay_Sip&action=edit&redlink=1" class="new" title="Desay Sip (page does not exist)">Desay Sip</a></li> <li><a href="/w/index.php?title=Universal_Scientific_Industrial&action=edit&redlink=1" class="new" title="Universal Scientific Industrial (page does not exist)">Universal Scientific Industrial</a> (USI)</li></ul> </div> <div class="mw-heading mw-heading2"><h2 id="See_also">See also</h2><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=System_in_a_package&action=edit&section=3" title="Edit section: See also"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <ul><li><a href="/wiki/Advanced_packaging_(semiconductors)" title="Advanced packaging (semiconductors)">Advanced packaging (semiconductors)</a></li> <li><a href="/wiki/Multi-chip_module" title="Multi-chip module">Multi-chip module</a></li> <li><a href="/wiki/System_on_a_chip" title="System on a chip">System on a chip</a> (SoC)</li> <li><a href="/wiki/Hybrid_integrated_circuit" title="Hybrid integrated circuit">Hybrid integrated circuit</a> (HIC)</li></ul> <div class="mw-heading mw-heading2"><h2 id="References">References</h2><span class="mw-editsection"><span class="mw-editsection-bracket">[</span><a href="/w/index.php?title=System_in_a_package&action=edit&section=4" title="Edit section: References"><span>edit</span></a><span class="mw-editsection-bracket">]</span></span></div> <style data-mw-deduplicate="TemplateStyles:r1239543626">.mw-parser-output .reflist{margin-bottom:0.5em;list-style-type:decimal}@media screen{.mw-parser-output .reflist{font-size:90%}}.mw-parser-output .reflist .references{font-size:100%;margin-bottom:0;list-style-type:inherit}.mw-parser-output .reflist-columns-2{column-width:30em}.mw-parser-output .reflist-columns-3{column-width:25em}.mw-parser-output .reflist-columns{margin-top:0.3em}.mw-parser-output .reflist-columns ol{margin-top:0}.mw-parser-output .reflist-columns li{page-break-inside:avoid;break-inside:avoid-column}.mw-parser-output .reflist-upper-alpha{list-style-type:upper-alpha}.mw-parser-output .reflist-upper-roman{list-style-type:upper-roman}.mw-parser-output .reflist-lower-alpha{list-style-type:lower-alpha}.mw-parser-output .reflist-lower-greek{list-style-type:lower-greek}.mw-parser-output .reflist-lower-roman{list-style-type:lower-roman}</style><div class="reflist"> <div class="mw-references-wrap mw-references-columns"><ol class="references"> <li id="cite_note-1"><span class="mw-cite-backlink"><b><a href="#cite_ref-1">^</a></b></span> <span class="reference-text"><a rel="nofollow" class="external text" href="https://thor.inemi.org/webdownload/Industry_Forums/Productronica_2005/Floor_Pres/SIP.pdf">INEMI System in Package Technology</a>, <i>thor.inemi.org,</i> June 2005, Retrieved 2024-01-24</span> </li> <li id="cite_note-2"><span class="mw-cite-backlink"><b><a href="#cite_ref-2">^</a></b></span> <span class="reference-text"> By Pushkar Apte, W. R. Bottoms, William Chen and George Scalise, IEEE Spectrum. “<a rel="nofollow" class="external text" href="https://spectrum.ieee.org/advanced-chip-packaging-satisfies-smartphone-needs">Advanced Chip Packaging Satisfies Smartphone Needs</a>.” February 8, 2011. Retrieved July 31, 2015.</span> </li> <li id="cite_note-3"><span class="mw-cite-backlink"><b><a href="#cite_ref-3">^</a></b></span> <span class="reference-text"><a rel="nofollow" class="external text" href="https://anysilicon.com/system-in-package-sip-a-success-story/">System-in-Package (SiP), a success story</a> // AnySilicon, February 21, 2020</span> </li> <li id="cite_note-4"><span class="mw-cite-backlink"><b><a href="#cite_ref-4">^</a></b></span> <span class="reference-text"><style data-mw-deduplicate="TemplateStyles:r1238218222">.mw-parser-output cite.citation{font-style:inherit;word-wrap:break-word}.mw-parser-output .citation q{quotes:"\"""\"""'""'"}.mw-parser-output .citation:target{background-color:rgba(0,127,255,0.133)}.mw-parser-output .id-lock-free.id-lock-free a{background:url("//upload.wikimedia.org/wikipedia/commons/6/65/Lock-green.svg")right 0.1em center/9px no-repeat}.mw-parser-output .id-lock-limited.id-lock-limited a,.mw-parser-output .id-lock-registration.id-lock-registration a{background:url("//upload.wikimedia.org/wikipedia/commons/d/d6/Lock-gray-alt-2.svg")right 0.1em center/9px no-repeat}.mw-parser-output .id-lock-subscription.id-lock-subscription a{background:url("//upload.wikimedia.org/wikipedia/commons/a/aa/Lock-red-alt-2.svg")right 0.1em center/9px no-repeat}.mw-parser-output .cs1-ws-icon a{background:url("//upload.wikimedia.org/wikipedia/commons/4/4c/Wikisource-logo.svg")right 0.1em center/12px no-repeat}body:not(.skin-timeless):not(.skin-minerva) .mw-parser-output .id-lock-free a,body:not(.skin-timeless):not(.skin-minerva) .mw-parser-output .id-lock-limited a,body:not(.skin-timeless):not(.skin-minerva) .mw-parser-output .id-lock-registration a,body:not(.skin-timeless):not(.skin-minerva) .mw-parser-output .id-lock-subscription a,body:not(.skin-timeless):not(.skin-minerva) .mw-parser-output .cs1-ws-icon a{background-size:contain;padding:0 1em 0 0}.mw-parser-output .cs1-code{color:inherit;background:inherit;border:none;padding:inherit}.mw-parser-output .cs1-hidden-error{display:none;color:var(--color-error,#d33)}.mw-parser-output .cs1-visible-error{color:var(--color-error,#d33)}.mw-parser-output .cs1-maint{display:none;color:#085;margin-left:0.3em}.mw-parser-output .cs1-kern-left{padding-left:0.2em}.mw-parser-output .cs1-kern-right{padding-right:0.2em}.mw-parser-output .citation .mw-selflink{font-weight:inherit}@media screen{.mw-parser-output .cs1-format{font-size:95%}html.skin-theme-clientpref-night .mw-parser-output .cs1-maint{color:#18911f}}@media screen and (prefers-color-scheme:dark){html.skin-theme-clientpref-os .mw-parser-output .cs1-maint{color:#18911f}}</style><cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://anysilicon.com/system-in-package-sip-a-success-story/">"System-in-Package (SiP), a success story"</a>. 21 February 2020.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=unknown&rft.btitle=System-in-Package+%28SiP%29%2C+a+success+story&rft.date=2020-02-21&rft_id=https%3A%2F%2Fanysilicon.com%2Fsystem-in-package-sip-a-success-story%2F&rfr_id=info%3Asid%2Fen.wikipedia.org%3ASystem+in+a+package" class="Z3988"></span></span> </li> <li id="cite_note-5"><span class="mw-cite-backlink"><b><a href="#cite_ref-5">^</a></b></span> <span class="reference-text"><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://pocketnow.com/iwatch-system-in-package/">"Here's why System-in-Package is a big deal for Apple's upcoming iWatch, and everything else"</a>. 30 April 2014.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=unknown&rft.btitle=Here%27s+why+System-in-Package+is+a+big+deal+for+Apple%27s+upcoming+iWatch%2C+and+everything+else&rft.date=2014-04-30&rft_id=https%3A%2F%2Fpocketnow.com%2Fiwatch-system-in-package%2F&rfr_id=info%3Asid%2Fen.wikipedia.org%3ASystem+in+a+package" class="Z3988"></span></span> </li> <li id="cite_note-6"><span class="mw-cite-backlink"><b><a href="#cite_ref-6">^</a></b></span> <span class="reference-text"><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://www.3dincites.com/2017/08/mcm-sip-soc-and-heterogeneous-integration-defined-and-explained/">"MCM, SiP, SoC, and Heterogeneous Integration Defined and Explained"</a>. 7 August 2017.</cite><span 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title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=unknown&rft.btitle=SiP+is+the+new+SoC+%40+56thDAC&rft.date=2024-02-21&rft_id=https%3A%2F%2Fsemiwiki.com%2Feda%2Fcadence%2F272958-sip-is-the-new-soc-56th-dac%2F&rfr_id=info%3Asid%2Fen.wikipedia.org%3ASystem+in+a+package" class="Z3988"></span></span> </li> <li id="cite_note-8"><span class="mw-cite-backlink"><b><a href="#cite_ref-8">^</a></b></span> <span class="reference-text">By R. Wayne Johnson, Mark Strickland and David Gerke, NASA Electronic Parts and Packaging Program. “<a rel="nofollow" class="external text" href="https://nepp.nasa.gov/docuploads/EA7E7EA1-BD30-4DA4-BD615FEA1A7F5AE9/3D%20Packaging%20Report%20071805.pdf">3-D Packaging: A Technology Review</a>.” June 23, 2005. Retrieved July 31, 2015.</span> </li> <li id="cite_note-9"><span class="mw-cite-backlink"><b><a href="#cite_ref-9">^</a></b></span> <span class="reference-text"><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://www.pcmag.com/encyclopedia/term/hybrid-microcircuit">"Definition of hybrid microcircuit"</a>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=unknown&rft.btitle=Definition+of+hybrid+microcircuit&rft_id=https%3A%2F%2Fwww.pcmag.com%2Fencyclopedia%2Fterm%2Fhybrid-microcircuit&rfr_id=info%3Asid%2Fen.wikipedia.org%3ASystem+in+a+package" class="Z3988"></span></span> </li> <li id="cite_note-10"><span class="mw-cite-backlink"><b><a href="#cite_ref-10">^</a></b></span> <span class="reference-text"><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://www.anandtech.com/show/9381/the-apple-watch-review/3">"The Apple Watch Review"</a>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=unknown&rft.btitle=The+Apple+Watch+Review&rft_id=https%3A%2F%2Fwww.anandtech.com%2Fshow%2F9381%2Fthe-apple-watch-review%2F3&rfr_id=info%3Asid%2Fen.wikipedia.org%3ASystem+in+a+package" class="Z3988"></span></span> </li> <li id="cite_note-11"><span class="mw-cite-backlink"><b><a href="#cite_ref-11">^</a></b></span> <span class="reference-text"><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://www.ifixit.com/Teardown/Apple+Watch+Teardown/40655">"Apple Watch Teardown"</a>. 23 April 2015.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=unknown&rft.btitle=Apple+Watch+Teardown&rft.date=2015-04-23&rft_id=https%3A%2F%2Fwww.ifixit.com%2FTeardown%2FApple%2BWatch%2BTeardown%2F40655&rfr_id=info%3Asid%2Fen.wikipedia.org%3ASystem+in+a+package" class="Z3988"></span></span> </li> <li id="cite_note-12"><span class="mw-cite-backlink"><b><a href="#cite_ref-12">^</a></b></span> <span class="reference-text"><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://appleinsider.com/articles/15/05/07/analysis-of-apple-watchs-s1-chip-reveals-30-individual-components-in-very-unique-package/amp/">"Analysis of Apple Watch's S1 chip reveals 30 individual components in 'very unique' package"</a>. 7 May 2015.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=unknown&rft.btitle=Analysis+of+Apple+Watch%27s+S1+chip+reveals+30+individual+components+in+%27very+unique%27+package&rft.date=2015-05-07&rft_id=https%3A%2F%2Fappleinsider.com%2Farticles%2F15%2F05%2F07%2Fanalysis-of-apple-watchs-s1-chip-reveals-30-individual-components-in-very-unique-package%2Famp%2F&rfr_id=info%3Asid%2Fen.wikipedia.org%3ASystem+in+a+package" class="Z3988"></span></span> </li> <li id="cite_note-13"><span class="mw-cite-backlink"><b><a href="#cite_ref-13">^</a></b></span> <span class="reference-text"><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://www.allaboutcircuits.com/technical-articles/introduction-to-microelectromechanical-systems-microphone-technology/">"Introduction to MEMS Microphone Technology—Analog vs Digital Microphones - Technical Articles"</a>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=unknown&rft.btitle=Introduction+to+MEMS+Microphone+Technology%E2%80%94Analog+vs+Digital+Microphones+-+Technical+Articles&rft_id=https%3A%2F%2Fwww.allaboutcircuits.com%2Ftechnical-articles%2Fintroduction-to-microelectromechanical-systems-microphone-technology%2F&rfr_id=info%3Asid%2Fen.wikipedia.org%3ASystem+in+a+package" class="Z3988"></span></span> </li> <li id="cite_note-14"><span class="mw-cite-backlink"><b><a href="#cite_ref-14">^</a></b></span> <span class="reference-text"> All components in the Apple S1 SIP have digital interfaces for example amplifiers, the STM32 microcontroller, gyroscopes, MEMS microphones, power management ICs, NFC chips which can be seen by looking at their datasheets or datasheets of similar products from the same manufacturers like <a rel="nofollow" class="external free" href="https://www.analog.com/media/en/technical-documentation/data-sheets/MAX98390.pdf">https://www.analog.com/media/en/technical-documentation/data-sheets/MAX98390.pdf</a> <a rel="nofollow" class="external free" href="https://www.renesas.com/us/en/document/dst/da9080-datasheet">https://www.renesas.com/us/en/document/dst/da9080-datasheet</a> <a rel="nofollow" class="external free" href="https://www.st.com/resource/en/datasheet/lsm6dsox.pdf">https://www.st.com/resource/en/datasheet/lsm6dsox.pdf</a> www.sensors.ch/doc/wearables_eloy_markets.pdf www.alldatasheet.com/datasheet-pdf/pdf/1132058/BOARDCOM/BCM4334X.html</span> </li> <li id="cite_note-15"><span class="mw-cite-backlink"><b><a href="#cite_ref-15">^</a></b></span> <span class="reference-text"><link rel="mw-deduplicated-inline-style" href="mw-data:TemplateStyles:r1238218222"><cite id="CITEREFKoYangLauLi2018" class="citation journal cs1">Ko, Cheng-Ta; Yang, Henry; Lau, John; Li, Ming; Li, Margie; Lin, Curry; Lin, J. W.; Chang, Chieh-Lin; Pan, Jhih-Yuan; Wu, Hsing-Hui; Chen, Yu-Hua; Chen, Tony; Xu, Iris; Lo, Penny; Fan, Nelson (2018-10-01). <a rel="nofollow" class="external text" href="https://jmep.scholasticahq.com/article/40215">"Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration"</a>. <i>Journal of Microelectronics and Electronic Packaging</i>. <b>15</b> (4): 141–147. <a href="/wiki/Doi_(identifier)" class="mw-redirect" title="Doi (identifier)">doi</a>:<a rel="nofollow" class="external text" href="https://doi.org/10.4071%2Fimaps.734552">10.4071/imaps.734552</a>. <a href="/wiki/ISSN_(identifier)" class="mw-redirect" title="ISSN (identifier)">ISSN</a> <a rel="nofollow" class="external text" href="https://search.worldcat.org/issn/1551-4897">1551-4897</a>. <a href="/wiki/S2CID_(identifier)" class="mw-redirect" title="S2CID (identifier)">S2CID</a> <a rel="nofollow" class="external text" href="https://api.semanticscholar.org/CorpusID:226940879">226940879</a>.</cite><span title="ctx_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.jtitle=Journal+of+Microelectronics+and+Electronic+Packaging&rft.atitle=Design%2C+Materials%2C+Process%2C+and+Fabrication+of+Fan-Out+Panel-Level+Heterogeneous+Integration&rft.volume=15&rft.issue=4&rft.pages=141-147&rft.date=2018-10-01&rft_id=https%3A%2F%2Fapi.semanticscholar.org%2FCorpusID%3A226940879%23id-name%3DS2CID&rft.issn=1551-4897&rft_id=info%3Adoi%2F10.4071%2Fimaps.734552&rft.aulast=Ko&rft.aufirst=Cheng-Ta&rft.au=Yang%2C+Henry&rft.au=Lau%2C+John&rft.au=Li%2C+Ming&rft.au=Li%2C+Margie&rft.au=Lin%2C+Curry&rft.au=Lin%2C+J.+W.&rft.au=Chang%2C+Chieh-Lin&rft.au=Pan%2C+Jhih-Yuan&rft.au=Wu%2C+Hsing-Hui&rft.au=Chen%2C+Yu-Hua&rft.au=Chen%2C+Tony&rft.au=Xu%2C+Iris&rft.au=Lo%2C+Penny&rft.au=Fan%2C+Nelson&rft_id=https%3A%2F%2Fjmep.scholasticahq.com%2Farticle%2F40215&rfr_id=info%3Asid%2Fen.wikipedia.org%3ASystem+in+a+package" class="Z3988"></span></span> </li> <li id="cite_note-16"><span class="mw-cite-backlink"><b><a href="#cite_ref-16">^</a></b></span> <span class="reference-text">By Ed Sperling, Semiconductor Engineering. “<a rel="nofollow" class="external text" href="http://semiengineering.com/why-packaging-matters/">Why Packaging Matters</a>.” November 19, 2015. Retrieved March 16, 2016.</span> </li> <li id="cite_note-17"><span class="mw-cite-backlink"><b><a href="#cite_ref-17">^</a></b></span> <span class="reference-text">By Tech Search International and Chip Scale Review Staff, Chip Scale Review. “<a rel="nofollow" class="external text" href="http://fbs.advantageinc.com/chipscale/may-jun_2016/files/assets/basic-html/page-1.html">Major OSATs positioned for growth opportunities in SiP</a>.” May/June Issue. 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class="navbox-group" style="width:1%">Components</th><td class="navbox-list-with-group navbox-list navbox-odd hlist" style="width:100%;padding:0"><div style="padding:0 0.25em"> <ul><li><a href="/wiki/Microprocessor" title="Microprocessor">Microprocessor</a> <ul><li><a href="/wiki/Central_processing_unit" title="Central processing unit">cores</a></li> <li><a href="/wiki/Chipset" title="Chipset">controllers</a></li></ul></li> <li><a href="/wiki/Graphics_processing_unit" title="Graphics processing unit">Graphics processing unit</a> (GPU)</li> <li><a href="/wiki/Image_processor" title="Image processor">Image processor</a></li> <li><a href="/wiki/Media_processor" title="Media processor">Media processor</a></li> <li><a href="/wiki/AI_accelerator" title="AI accelerator">AI accelerator</a></li> <li><a href="/wiki/Application-specific_integrated_circuit" title="Application-specific integrated circuit">ASIC</a></li></ul> </div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%">Types</th><td class="navbox-list-with-group navbox-list navbox-even hlist" style="width:100%;padding:0"><div style="padding:0 0.25em"> <ul><li><a href="/wiki/Network_on_a_chip" title="Network on a chip">Network on a chip</a> (NoC)</li> <li><a href="/wiki/Multiprocessor_system_on_a_chip" class="mw-redirect" title="Multiprocessor system on a chip">Multiprocessor SoC</a> (MPSoC)</li> <li><a href="/wiki/Programmable_system_on_a_chip" class="mw-redirect" title="Programmable system on a chip">Programmable SoC</a> (PSoC)</li> <li><a href="/wiki/Microcontroller" title="Microcontroller">Microcontroller</a> (MCU)</li></ul> </div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%">Alternatives</th><td class="navbox-list-with-group navbox-list navbox-odd hlist" style="width:100%;padding:0"><div style="padding:0 0.25em"> <ul><li><a href="/wiki/Multi-chip_module" title="Multi-chip module">Multi-chip module</a> (MCM)</li> <li><a class="mw-selflink selflink">System in a package</a> (SiP)</li> <li><a href="/wiki/Package_on_a_package" title="Package on a package">Package on a package</a> (PoP)</li></ul> </div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%">Related</th><td class="navbox-list-with-group navbox-list navbox-even hlist" style="width:100%;padding:0"><div style="padding:0 0.25em"> <ul><li><a href="/wiki/Processor_(computing)" title="Processor (computing)">Processor</a> <ul><li><a href="/wiki/Microprocessor_chronology" title="Microprocessor chronology">chronology</a></li> <li><a href="/wiki/Processor_design" title="Processor design">design</a></li></ul></li> <li><a href="/wiki/Complex_programmable_logic_device" title="Complex programmable logic device">CPLD</a></li> <li><a href="/wiki/Digital_signal_processor" title="Digital signal processor">Digital signal processor</a> (DSP)</li> <li><a href="/wiki/Embedded_system" title="Embedded system">Embedded systems</a></li> <li><a href="/wiki/Field-programmable_gate_array" title="Field-programmable gate array">FPGA</a></li> <li><a href="/wiki/List_of_system_on_a_chip_suppliers" title="List of system on a chip suppliers">List of SoC suppliers</a></li> <li><a href="/wiki/Mobile_computing" title="Mobile computing">Mobile computing</a></li> <li><a href="/wiki/Unified_memory" class="mw-redirect" title="Unified memory">Unified memory</a></li></ul> </div></td></tr></tbody></table></div>    </div><noscript><img src="https://login.wikimedia.org/wiki/Special:CentralAutoLogin/start?type=1x1" alt="" width="1" height="1" style="border: none; position: absolute;"></noscript> <div class="printfooter" data-nosnippet="">Retrieved from "<a dir="ltr" href="https://en.wikipedia.org/w/index.php?title=System_in_a_package&oldid=1256832041">https://en.wikipedia.org/w/index.php?title=System_in_a_package&oldid=1256832041</a>"</div></div> <div id="catlinks" class="catlinks" data-mw="interface"><div id="mw-normal-catlinks" class="mw-normal-catlinks"><a href="/wiki/Help:Category" 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